STK5C4U3XXJGEVB STK5C4U3xx Series Evaluation Board User'sManual www.onsemi.com Introduction By using this board, STK5C4U3xx series (DIPS) can be evaluated. ONPN of EVAL Board ONPN of IPM Io STK5C4U332JGEVB STK5C4U332J−E 3A EVAL BOARD USER’S MANUAL Surface Back side Figure 1. Evaluation Board Photos © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 1 1 Publication Order Number: EVBUM2296/D STK5C4U3XXJGEVB CIRCUIT DIAGRAM Evaluation board + − 2.2 F / 630 V 470 F / 450 V U + − 38. VCC1 22 F / 50 V + − 0.1 F V W + − + − 2. VDD 34. VB1 32. VS1,U 28. VB2 26. VS2,V 220 F / 35 V VSS − + 1. VSS + STK5C4U3xxJ−E VDD 0.1 F 3. HIN1 HIN1 4. HIN2 HIN2 5. HIN3 HIN3 6. LIN1 LIN1 7. LIN2 LIN2 8. LIN3 LIN3 22. VB3 100Ω 100 pF 20. VS3,W 9. FAULT VEXT 20 k RF 10. ITRIP Shunt resistor − 19. W- ITRIP 11. ENABLE ENABLE 12. RCIN 18. V- Fault RCIN 13. TH1 17. U- 14. TH2 TH 200 Figure 2. Circuit Diagram www.onsemi.com 2 10 nF STK5C4U3XXJGEVB PIN DESCRIPTION Figure 3. Pin Description 1 Figure 4. Pin Description 2 www.onsemi.com 3 STK5C4U3XXJGEVB OPERATION PROCEDURE Figure 5. Connection Example Step 4. By inputting signal to the logic part, IPM control is started. (Therefore, please set electric charge to the boot-strap capacitor of upper side to turn on lower side IGBT before running.) Step 1. Please connect IPM, each power supply, logic parts, and the motor to the evaluation board, and confirm that each power supply is OFF at this time. Step 2. Please impress the power supply of DC 15 V. Step 3. Please perform a voltage setup according to specifications, and impress the power supply between the “+” and the “−” terminal. NOTE: When turning off the power supply part and the logic part, please carry out in the reverse order to above steps. www.onsemi.com 4 STK5C4U3XXJGEVB LAYOUT (TOP VIEW) Figure 6. Layout − Surface Figure 7. Layout − Back Side Length: 124 mm Side: 170 mm Thickness: 1.6 mm Rigid double−sided substrate (Material: FR−4) Both sides resist coating Copper foil thickness: 70 m www.onsemi.com 5 STK5C4U3XXJGEVB BILL OF MATERIALS Table 1. BILL OF MATERIALS Tolerance Designator Qty Description Value 4 Shunt resistor 27 m / 2W R2 1 Setting fault clear time / resistor R3 1 Setting time constant / resistor 200 / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD2000F Yes R4 − R6 3 Fault, ENABLE, TH pull−up / resistor 20 k / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD2002F Yes R7 − R12 6 Signal input low pass filter / resistor 100 / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD1000F Yes C1, C2 2 Aluminum electrolytic capacitor, Plus − Minus 470 F / 450 V ±20% Through− hole Rubycon 450MXC470MEFCSN35X50 Yes C3 1 Film capacitor Plus − Minus, Snubber 2.2 F / 630 V ±5% Through− hole PANASONIC ECQE6225JT Yes C4 1 Aluminum electrolytic capacitor, VDD − VSS 220 F / 35 V ±20% Through− hole Nippon Chemi−Con EKMG350ELL221MHB5D Yes C5 − C7, C11 4 VBx − VSx, VDD − VSS / capacitor 0.1 F / 50 V ±10% SMD 1608 MURATA GRM188B31H104K Yes C8 − C10 3 VBx − VSx / capacitor 22 F / 25 V ±20% SMD 3225 MURATA GRM32ER71E226ME15 Yes C13 1 Setting time constant / capacitor 10 nF / 50 V ±10% SMD 1608 MURATA GRM188B11H103K Yes C14 − C19 6 Signal input low pass filter / capacitor 100 pF / 50 V ±5% SMD 1608 MURATA GRM1882C1H101J Yes CN1 1 Header − 18 Pin Through− hole 2.54 pitch HIROSE ELECTRIC A2−18PA−2.54DSA(71) Yes VSS, VDD, U−, RCIN, ITRIP, VEXT, TH, ENABLE, FAULT, HIN1−3, LIN1−3, +, − 17 Test Pins Through− hole Mac8 ST−1−3 Yes U, V, W, +, − 5 Faston terminal (Tab) Through− hole IC1 1 Inverter IPM DIP−38 optional Manufacturer SMD 6432 SUSUMU Substitution Allowed R1−1 − R1−4 ±1% Footprint Manufacturer Part Number KRL3264E−C−R027−F (for 332) SMD 1608 NOTE All Components are lead free. www.onsemi.com 6 Yes Yes Yes ON Semiconductor STK5C4U3xxJ−E No STK5C4U3XXJGEVB HEAT SINK MOUNTING Table 2. MOUNTING CONDITION Item Recommended Condition Pitch 26.0 ± 0.1 mm (Please refer to Package Outline Diagram) Screw Diameter: M3 Bind machine screw, Truss machine screw, Pan machine screw Washer Heat Sink Plane washer Don’t use spring washer. The size is D = 7 mm, d = 3.2 mm and t = 0.5 mm (Figure 9) JIS B 1256 Material: copper or Aluminum Warpage (the surface that contacts IPM): −50 ∼ 50 m Screw holes must be countersunk. No contamination on the heat sink surface that contacts IPM. Torque Final tightening: 0.4 ∼ 0.6 Nm Temporary tightening: 50 ∼ 60% of final tightening Grease Silicone grease Thickness: 50 ∼ 100 m Uniformly apply silicone grease to whole back. (Figure 10) Figure 8. Mounting Composition t D d Figure 9. Size of Washer Procedure for the Heat Sink Mounting 1st step: Tighten the screws until the torque of temporary tightening while maintaining the balance of left (1) and right (2). nd 2 step: Tighten them until the torque of final tightening. Figure 10. 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