INFINEON SDB06S60

SDB06S60
thinQ!¥ SiC Schottky Diode
Silicon Carbide Schottky Diode
• Worlds first 600V Schottky diode
Product Summary
• Revolutionary semiconductor
V
600
VRRM
material - Silicon Carbide
• Switching behavior benchmark
Qc
21
nC
• No reverse recovery
IF
6
A
D2PAK
• No temperature influence on
the switching behavior
• Ideal diode for Power Factor
Correction up to 1200W 1)
• No forward recovery
Type
Package
Ordering Code
Marking
Pin 1
Pin 2
Pin 3
SDB06S60
D2PAK
Q67040-S4370
D06S60
n.c.
C
A
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous forward current, TC=100°C
IF
RMS forward current, f=50Hz
IFRMS
Surge non repetitive forward current, sine halfwave IFSM
Value
6
Unit
A
8.4
21.5
TC=25°C, tp=10ms
IFRM
28
IFMAX
60
i 2t value, TC=25°C, tp=10ms
³i2dt
2.3
A²s
Repetitive peak reverse voltage
VRRM
600
V
Surge peak reverse voltage
VRSM
600
Power dissipation, TC=25°C
Ptot
57.6
W
Operating and storage temperature
Tj , Tstg
-55... +175
°C
Repetitive peak forward current
Tj=150°C, TC=100°C, D=0.1
Non repetitive peak forward current
tp=10µs, TC=25°C
Rev. 2.0
Page 1
2005-02-17
SDB06S60
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
-
2.6
Thermal resistance, junction - ambient, leaded
RthJA
-
-
62
SMD version, device on PCB:
RthJA
P-TO263-3-2: @ min. footprint
-
-
62
P-TO263-3-2: @ 6 cm 2 cooling area 2)
-
35
-
P-TO252-3-1: @ min. footprint
-
-
75
P-TO252-3-1: @ 6 cm 2 cooling area 2)
-
-
50
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min.
typ.
Unit
max.
Static Characteristics
Diode forward voltage
V
VF
IF=6A, Tj=25°C
-
1.5
1.7
IF=6A, Tj=150°C
-
1.7
2.1
Reverse current
µA
IR
V R=600V, T j=25°C
-
20
200
V R=600V, T j=150°C
-
50
1000
1CCM, V = 85VAC, T = 150°C, T =100°C, η = 93%, ∆ I = 30%
IN
j
C
IN
2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Rev. 2.0
Page 2
2005-02-17
SDB06S60
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Qc
-
21
-
nC
trr
-
n.a.
-
ns
AC Characteristics
Total capacitive charge
V R=400V, IF=6A, diF/dt=200A/µs, T j=150°C
Switching time
V R=400V, IF=6A, diF/dt=200A/µs, T j=150°C
Total capacitance
C
pF
V R=0V, T C=25°C, f=1MHz
-
300
-
V R=300V, T C=25°C, f=1MHz
-
20
-
V R=600V, T C=25°C, f=1MHz
-
15
-
Rev. 2.0
Page 3
2005-02-17
SDB06S60
1 Power dissipation
2 Diode forward current
Ptot = f (TC)
IF = f (TC)
parameter: Tj≤175 °C
6.5
60
A
W
5.5
50
5
4.5
40
IF
Ptot
45
35
4
3.5
30
3
25
2.5
20
2
15
1.5
10
1
5
0.5
0
0
20
40
60
80
100 120 140
0
0
°C 180
TC
20
40
60
80
100 120 140
°C 180
TC
3 Typ. forward characteristic
4 Typ. forward power dissipation vs.
IF = f (VF)
average forward current
parameter: Tj , tp = 350 µs
PF(AV)=f(IF) TC=100°C, d = tp/T
12
28
W
A
9
24
22
PF(AV)
10
150°C
125°C
100°C
25°C
-40°C
IF
8
7
20
18
16
6
14
5
12
10
4
8
3
6
2
4
1
0
0
2
0.5
1
1.5
V
2.5
0
0
2
4
6
8
A
12
IF(AV)
VF
Rev. 2.0
d=0.1
d=0.2
d=0.5
d=1
Page 4
2005-02-17
SDB06S60
5 Typ. reverse current vs. reverse voltage
6 Transient thermal impedance
I R=f(VR)
ZthJC = f (t p)
parameter : D = t p/T
2
10
10 1
µA
K/W
10 0
150°C
125°C
100°C
25°C
ZthJC
10 1
IR
SDP06S60
10 0
10 -1
D = 0.50
10
-1
10
-2
0.20
0.10
0.05
10
-2
10
-3
0.02
single pulse
0.01
10 -3
100 150 200 250 300 350 400 450 500
10 -4 -7
10
V 600
VR
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
7 Typ. capacitance vs. reverse voltage
8 Typ. C stored energy
C= f(V R)
EC=f(V R)
parameter: TC = 25 °C, f = 1 MHz
250
3.5
µJ
pF
EC
C
2.5
150
2
1.5
100
1
50
0.5
0 0
10
Rev. 2.0
10
1
10
2
3
10
V
VR
Page 5
0
0
100
200
300
400
V
600
VR
2005-02-17
SDB06S60
9 Typ. capacitive charge vs. current slope
Q c=f(diF /dt)
parameter: Tj = 150 °C
22
nC
IF*2
IF
18
Qc
16
IF*0.5
14
12
10
8
6
4
2
0
100 200 300 400 500 600 700 800 A/µs 1000
diF /dt
Rev. 2.0
Page 6
2005-02-17
SDB06S60
PG-TO220-3-45 (D2Pak): Outline
Dimensions in mm/inches
Rev. 2.0
page 7
2005-02-17
SDB06S60
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
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Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Rev. 2.0
Page 8
2005-02-17