Preliminary Data Sheet No. PD60186-C IR2170(S) OVER CURRENT SENSING IC Features • • • • • • • Product Summary Floating channel up to +600V Monolithic integration Overcurrent sensing through shunt resistor Low IQBS allows the boot strap power supply Independent fast 1µsec overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition VOFFSET 600Vmax IQBS 1mA Overcurrent trip signal delay 1.5usec (typ) Overcurrent trip level • Open Drain outputs +/-260mV (typ.) Packages Description IR2170(S) is the monolithic over current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, detects overcurrent condition, and transfers the signal to the low side. IR’s proprietary high voltage isolation technology is implemented to enable the high bandwidth sig8-Lead SOIC nal processing. The dedicated overcurrent trip (OC) 8-Lead PDIP signal facilitates IGBT short circuit protection. The OC output pulse width can be programmed by the external resistor and capacitor. The open-drain outputs make easy for any interface from 3.3V to 15V. Typical Application DC Bus (up to 600V) +15V 1Ω Vdd VB 1k (typ) VCC OC + VIN+ 10 uF 0.47 uF VIN- 10 nF COM (AGND) VS (DGND) RSENSE To Motor Phase IR2170 (Circuit Common = DC Bus Negative) (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. IR2170(S) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition VS High side offset voltage Min. Max. -0.3 600 Units VBS High side floating supply voltage -0.3 25 VCC Low side and logic fixed supply voltage -0.3 25 VIN Maximum input voltage between VIN+ and VIN- -5 5 VOC Overcurrent output voltage COM -0.3 VCC +0.3 VIN- VIN- input voltage (note 1) VS -5 VB+ 0.3 dV/dt PD RthJA Allowable offset voltage slew rate Package power dissipation @ TA ≤ +25°C Thermal resistance, junction to ambient — 50 8 lead SOIC — .625 8 lead PDIP — 1.0 8 lead SOIC — 200 8 lead PDIP — 125 TJ Junction temperature — 150 TS Storage temperature -55 150 TL Lead temperature (soldering, 10 seconds) — 300 V V/ns W °C/W °C Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol Definition VB High side floating supply voltage VS High side floating supply offset voltage Min. Max. VS +13.0 VS +20 Units note 2 600 COM VCC Low side and logic fixed supply voltage 9.5 20 VIN Input voltage between VIN+ and VIN- -260 +260 mV TA Ambient temperature -40 125 °C VOC Overcurrent output voltage V CC V Note 2: Logic operation for Vs of -5 to +600V. Logic state held for Vs of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details). 2 www.irf.com IR2170(S) DC Electrical Characteristics VCC = VBS = 15V, and T A = 25oC unless otherwise specified. Symbol Definition Min. Typ. Max. Units Test Conditions VOC+ Overcurrent trip positive input voltage — VOC- Overcurrent trip negative input voltage — 260 -260 — — ILK Offset supply leakage current — — 50 IQBS Quiescent VBS supply current — 1 2 IQCC Quiescent VCC supply current — — 0.5 IOCC OC output sink current 10 — — 1 — — mV µA VB = VS = 600V VS = 0V mA VO = 1V VO = 0.1V AC Electrical Characteristics VCC = VBS = 15V, and TA = 25oC unless otherwise specified. Symbol Definition Proagation delay characteristics Min. Typ. Max. Units Test Conditions tdoc Propagation delay time of OC 1 1.5 — twoc Low true pulse width of OC — 1 — µsec +260mV Vin -260mV OC twoc tdoc Figure 1. OC Waveform www.irf.com 3 IR2170(S) Lead Definitions Symbol Description VCC Low side and logic supply voltage COM Low side logic ground VIN+ Positive sense input VIN- Negative sense input VB High side supply VS High side return OC N.C. No connection Overcurrent output (negative logic) Lead Assignments 4 1 VCC 2 NC 3 COM 4 OC VIN+ 8 1 VCC 8 lead SOIC VIN- 7 2 NC VB 6 3 COM VS 5 4 OC IR2170S VIN+ 8 8 lead PDIP VIN- 7 IR2170 VB 6 VS 5 www.irf.com IR2170(S) Case outlines 01-6014 01-3003 01 (MS-001AB) 8-Lead PDIP D DIM B 5 A FOOTPRINT 6 8 7 6 5 H E 1 2 3 0.25 [.010] 4 A 6.46 [.255] MIN .0532 .0688 1.35 1.75 A1 .0040 .0098 0.10 0.25 b .013 .020 0.33 0.51 c .0075 .0098 0.19 0.25 D .189 .1968 4.80 5.00 E .1497 .1574 3.80 4.00 e .050 BASIC 3X 1.27 [.050] e1 0.25 [.010] A1 1.27 BASIC .025 BASIC 0.635 BASIC .2284 .2440 5.80 6.20 K .0099 .0196 0.25 0.50 L .016 .050 0.40 1.27 y 0° 8° 0° 8° K x 45° A C 8X b 8X 1.78 [.070] MAX H e1 6X e MILLIMETERS MAX A 8X 0.72 [.028] INCHES MIN y 0.10 [.004] 8X L 8X c 7 C A B NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 8-Lead SOIC 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 01-6027 01-0021 11 (MS-012AA) 10/24/2002 www.irf.com 5