BAS3010S... Low VF Schottky Diode • Forward current: 1 A • Reverse voltage: 30 V • Low forward voltage and smallest package form factor (1.0 x 0.6 x < 0.4 mm) for mobile phone battery charger application • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101 BAS3010S-03LRH 2 3 1 Type Package Configuration Marking BAS3010S-03LRH* TSLP-3-7 single 1S * Preliminary data Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage2) VR 30 V Forward current2)3) IF 1 A Repetitive peak forward current3) IFRM 3.5 IFSM 5 (tp ≤ 1 ms, D ≤ 0.25) Non-repetitive peak surge forward current3) (t ≤ 10 ms) 150 Junction temperature Tj Operating temperature range Top -55 ... 125 Storage temperature Tstg -65 ... 150 °C 1Pb-containing 2For package may be available upon special request TA > 25°C the derating of VR and IF has to be considered. 3Only valid if pin 1 and 2 are connected in parallel 1 2007-08-16 BAS3010S... Thermal Resistance Parameter Symbol Junction - soldering point1) RthJS Value Unit ≤ 38 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current2) IR VR = 5 V - - 15 VR = 10 V - - 30 VR = 30 V - - 300 - - - IF = 100 mA - 340 390 IF = 350 mA - 400 450 IF = 1000 mA - 570 650 - 10 15 Forward voltage2) VF AC Characteristics Diode capacitance CT Unit µA mV pF VR = 5 V, f = 1 MHz 1For calculation of RthJA please refer to Application Note Thermal Resistance 2Pulsed test: tp = 300 µs; D = 0.01 2 2007-08-16 BAS3010S... Diode capacitance CT = ƒ (VR) Reverse current IR = ƒ (TA) f = 1MHz VR = Parameter 10 -2 35 A pF 10 -3 IR CT 25 20 10 -4 15 10 30 V 20 V 10 V 5V 10 -5 5 0 0 5 10 15 20 V 10 -6 0 30 25 50 75 °C 100 VR 150 TA Reverse current IR = ƒ(VR ) Forward Voltage VF = ƒ (TA) TA = Parameter IF = Parameter 10A-2 0.65 10 -3 TA = + 125°C 10 -4 TA = + 85°C V 0.5 10 -5 VF IR IF = 1A 0.55 TA = + 25°C 10 0.45 -6 0.4 IF = 350 mA 10 -7 0.35 10 -8 TA = - 40°C 10 -9 10 -10 0 IF = 100 mA 0.3 0.25 5 10 15 20 V 0.2 -50 30 VR -25 0 25 50 75 100 °C 150 TA 3 2007-08-16 BAS3010S... Forward current IF = ƒ (VF) TA = Parameter 10 1 A 10 0 IF 10 -1 10 -2 TA= +125°C +85°C +25°C - 40°C 10 -3 10 -4 10 -5 10 -6 0 0.1 0.2 0.3 0.4 V 0.6 VF 4 2007-08-16 Package TSLP-3-7 BAS3010S... Package Outline Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.5 ±0.035 3 0.65 ±0.05 3 2 2 1 0.35 ±0.05 Pin 1 marking 2 x 0.15 ±0.035 2 x 0.25 ±0.035 1 1) 1 ±0.05 0.05 MAX. 1) Cathode 2) marking 0.25 ±0.035 1) Top view 1) 1) Dimension applies to plated terminal 2) Only for diodes, cathode marking on pin 3 Foot Print 0.275 0.6 R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout Type code Type code Pin 1 marking Cathode marking Standard Only for diodes, cathode marking on pin 3 Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Pin 1 marking 0.76 Cathode marking 5 0.5 8 1.16 1.16 Only for diodes, cathode marking on pin 3 4 8 Standard 4 0.76 2007-08-16 BAS3010S... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-08-16