INFINEON BTS5480SF

SPI Power Controller
SPOC - BTS5480SF
For Advanced Front Light Control
Data Sheet
Rev. 1.0, 2010-04-12
Automotive Power
SPOC - BTS5480SF
Table of Contents
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Assignment SPOC - BTS5480SF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4
4.1
4.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5
5.1
5.2
5.3
5.4
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13
14
15
16
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Power Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output ON-State Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Stage Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inverse Current Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Driver Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
17
17
19
20
21
22
26
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Current Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Current Protection at high VDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Current Protection for Short Circuit Type 2 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Temperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Voltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Loss of Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Loss of VBB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
27
27
29
29
30
32
32
33
33
34
36
8
8.1
8.2
8.3
8.4
8.5
8.6
Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diagnosis Word at SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Load Current Sense Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch Bypass Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Open Load in OFF-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
38
38
40
41
42
45
9
9.1
9.2
9.3
9.4
9.5
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Daisy Chain Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Protocol 8 Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
47
47
48
49
50
52
Data Sheet
2
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Table of Contents
9.6
Register Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
10
Application Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
11
Package Outlines SPOC - BTS5480SF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
12
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Data Sheet
3
Rev. 1.0, 2010-04-12
For Advanced Front Light Control
SPI Power Controller
1
SPOC - BTS5480SF
Overview
Features
•
•
•
•
•
•
•
•
•
8 bit serial peripheral interface for control and diagnosis
Integrated control for two external smart power switches
3.3 V and 5 V compatible logic pins
Very low stand-by current
Enhanced electromagnetic compatibility (EMC) for bulbs as well as
LEDs with increased slew rate
Stable behavior at under voltage
Device ground independent from load ground
Green Product (RoHS-Compliant)
AEC Qualified
PG-DSO-36-43
Description
The SPOC - BTS5480SF is a four channel high-side smart power switch in PG-DSO-36-43 package providing
embedded protective functions. It is especially designed to control standard exterior lighting in automotive
applications. In order to use the same hardware, the device can be configured to bulb or LED mode for channel 2
and channel 3. As a result, both load types are optimized in terms of switching and diagnosis behavior.
It is specially designed to drive exterior lamps up to 65W, 27W and 10W and HIDL.
Product Summary
VBB
VDD
VBB(LD)
IBB(STB)
RDS(ON,typ)
Operating Voltage Power Switch
Logic Supply Voltage
Supply Voltage for Load Dump Protection
Maximum Stand-By Current at 25 °C
Typical On-State Resistance at Tj = 25 °C
channel 0, 1
channel 2, 3
Maximum On-State Resistance at Tj = 150 °C
RDS(ON,max)
channel 0, 1
channel 2, 3
fSCLK(max)
SPI Access Frequency
4.5 … 28 V
3.0 … 5.5 V
40 V
4.5 µA
3.5 mΩ
11 mΩ
9 mΩ
28 mΩ
5 MHz
Type
Package
Marking
SPOC - BTS5480SF
PG-DSO-36-43
BTS5480SF
Data Sheet
4
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Overview
Configuration and status diagnosis are done via SPI. The SPI is daisy chain capable. The device provides a
current sense signal per channel that is multiplexed to the diagnosis pin IS. It can be enabled and disabled via SPI
commands. An over load and over temperature flag is provided in the SPI diagnosis word. A multiplexed switch
bypass monitor provides short-circuit to VBB diagnosis. In OFF state a current source can be switched to the output
of one selected channel in order to detect an open load.
The device provides an external driver capability for two external devices. For each external driver there are two
control outputs available: one output for controlling the input and one output for diagnosis enable input. The current
sense output of the external smart power drivers can be connected to the IS pin.
The SPOC - BTS5480SF provides a fail-safe feature via limp home input pin.
The power transistors are built by N-channel vertical power MOSFETs with charge pumps.
Protective Functions
•
•
•
•
•
•
•
•
•
Reverse battery protection with external components
ReversaveTM - Reverse battery protection by self turn on of channels 0, 1, 2 and 3
Short circuit protection
Over load protection
Thermal shutdown with latch and dynamic temperature sensor
Over current tripping
Over voltage protection
Loss of ground protection
Electrostatic discharge protection (ESD)
Diagnostic Functions
•
•
•
•
•
•
•
•
Multiplexed proportional load current sense signal (IS)
Enable function for current sense signal configurable via SPI
High accuracy of current sense signal at wide load current range
Current sense ratio (kILIS) configurable for LEDs or bulbs for channel 2 and 3
Very fast diagnosis in LED mode
Feedback on over temperature and over load via SPI
Multiplexed switch bypass monitor provides short circuit to VBB detection
Integrated, in two steps programmable current source for open load in OFF-state detection
Application Specific Functions
•
•
Fail-safe activation via LHI pin
Control of two additional loads with external smart power switches
Applications
•
•
•
•
High-side power switch for 12 V grounded loads in automotive applications
Especially designed for standard exterior lighting like high beam, low beam, indicator, parking light and
equivalent LEDs
Load type configuration via SPI (bulbs or LEDs) for optimized load control
Replaces electromechanical relays, fuses and discrete circuits
Data Sheet
5
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Block Diagram
2
Block Diagram
VBB
VDD
power
supply
IN1
temperature
sensor
driver
logic
IN2
IN3
clamp for
inductive
load
gate control
&
charge pump
load current
sense
over current
protection
channel 0 1
IS
LHI
CS
ESD
protection
current sense multiplexer
limp home
control
3
OUT3
OUT2
OUT1
switch bypass
monitor
OUT0
LED mode
control
EDO0
external driver
control
SCLK
SO
2
SPI
ESD
protection
EDD0
EDO1
EDD1
SI
GND
Figure 1
Data Sheet
Block Diagram SPOC - BTS5480SF
6
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Block Diagram
2.1
Terms
Figure 2 shows all terms used in this data sheet.
VBB
IBB
IDD
ISO
VDD
I SI
VSO
ICS
VSI
I SCLK
V CS
VSCLK
I LHI
VBB
VDD
S0
SI
CS
OUT0
I L0
VDS0
VOUT0
SCLK
OUT1
I L1
VDS1
VOUT1
LHI
VLHI
I L2
VDS2
OUT2
VOUT2
I IN1
I IN2
VIN1
I IN3
VIN2
IN1
OUT3
V DS3
I L3
VOUT3
IN2
IN3
EDO0
V IN3
EDD0
I IS
IS
EDO1
VIS
EDD1
I EDO0
I EDD0
I EDO1
I EDD1
VEDO0
VEDD0
VEDO1
VEDD1
GND
IGND
Terms_STD_EXT.emf
Figure 2
Terms
In all tables of electrical characteristics is valid: Channel related symbols without channel number are valid for each
channel separately (e.g. VDS specification is valid for VDS0 … VDS3).
All SPI register bits are marked as follows: ADDR.PARAMETER (e.g. HWCR.CL). In SPI register description, the
values in bold letters (e.g. 0) are default values.
Data Sheet
7
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment SPOC - BTS5480SF
(top view)
Figure 3
Data Sheet
VBB
VBB
1
36
2
35
OUT0
OUT0
OUT0
OUT0
OUT3
3
34
4
33
5
32
6
31
7
30
OUT3
VBB
LHI
SO
SI
8
29
9
28
10
27
11
26
12
25
SCLK
CS
GND
IN1
13
24
14
23
15
22
16
21
IN2
IN3
17
20
18
19
VBB
VBB
OUT1
OUT1
OUT1
OUT1
OUT2
OUT2
VBB
n.c.
EDO0
EDD0
EDO1
EDD1
GND
IS
n.c.
VDD
Pin Configuration PG-DSO-36-43
8
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
I/O
Function
1, 2, 9, 28, 35, 36 1)
VBB
–
Positive power supply for high-side power switch
19
VDD
–
Logic supply (5 V)
15, 22
GND
–
Ground connection
Power Supply Pins
Parallel Input Pins (integrated pull-down, leave unused pins unconnected)
16
IN1
I
Input signal of channel 1 (high active)
17
IN2
I
Input signal of channel 2 (high active)
18
IN3
I
Input signal of channel 3 (high active)
OUT0
O
Protected high-side power output of channel 0
OUT1
O
Protected high-side power output of channel 1
OUT2
O
Protected high-side power output of channel 2
OUT3
O
Protected high-side power output of channel 3
Power Output Pins
3, 4, 5, 6 2)
31, 32, 33, 34
29, 30
7, 8
2)
2)
2)
SPI & Diagnosis Pins
14
CS
I
Chip select of SPI interface (low active); Integrated pull up
13
SCLK
I
Serial clock of SPI interface
12
SI
I
Serial input of SPI interface (high active)
11
SO
O
Serial output of SPI interface
21
IS
O
Current sense output signal
Limp Home Pin (integrated pull-down, pull-down resistor recommended)
10
LHI
I
Limp home activation signal (high active)
External Driver Pins (integrated pull-down, leave unused external driver pins unconnected)
26
EDO0
O
External driver output for activation of external driver 0
24
EDO1
O
External driver output for activation of external driver 1
25
EDD0
O
External driver diagnosis enable signal of external driver 0
23
EDD1
O
External driver diagnosis enable signal of external driver 1
n.c.
–
not connected, internally not bonded
Not connected Pins
20, 27
1) All VBB pins have to be connected.
2) All outputs pins of each channel have to be connected.
Data Sheet
9
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Electrical Characteristics
4
Electrical Characteristics
4.1
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 to +150 °C; all voltages with respect to ground
(unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit Conditions
min.
max.
-0.3
28
V
–
-0.3
5.5
V
–
–
16
channel 0, 1
0
24
channel 2, 3
0
24
Supply Voltage
VBB
VDD
-Vbat(rev)
4.1.1
Power supply voltage
4.1.2
Logic supply voltage
4.1.3
Reverse polarity voltage according Figure 26
4.1.4
Supply voltage for short circuit protection (single VBB(SC)
pulse)
4.1.5
Supply voltage for load dump protection with
connected loads
VBB(LD)
–
40
4.1.6
Current through ground pin
–
25
4.1.7
Current through VDD pin
IGND
IDD
-25
12
TjStart = 25 °C
t ≤ 2 min. 2)
V
RECU = 20 mΩ
l = 0 or 5 m 3)
RCable = 6 mΩ/m
LCable = 1 µH/m
RCable = 16 mΩ/m
LCable = 1 µH/m
V
RI = 2 Ω 4)
t = 400 ms
mA t ≤ 2 min.
mA t ≤ 2 min.
IL
EAS
-IL(LIM)
IL(LIM)
A
5)
mJ
6)
V
Power Stages
4.1.8
Load current
4.1.9
Maximum energy dissipation
single pulse
channel 0, 1
–
180
Tj(0) = 150 °C
IL(0) = 5 A
channel 2, 3
–
45
IL(0) = 2 A
IIS
-8
8
mA t ≤ 2 min.
VIN
IIN
-0.3
5.5
V
-0.75
-2.0
0.75
2.0
mA –
VCS
ICS
VSI
ISI
VSCLK
ISCLK
VSO
-0.3
VDD + 0.3 V
-2.0
2.0
Diagnosis Pin
4.1.10 Current through sense pin IS
Input Pins
4.1.11 Voltage at input pins
4.1.12 Current through input pins
–
t ≤ 2 min.
SPI Pins
4.1.13 Voltage at chip select pin
4.1.14 Current through chip select pin
4.1.15 Voltage at serial input pin
4.1.16 Current through serial input pin
4.1.17 Voltage at serial clock pin
4.1.18 Current through serial clock pin
4.1.19 Voltage at serial out pin
Data Sheet
10
–
mA t ≤ 2 min.
-0.3
VDD + 0.3 V
-2.0
2.0
-0.3
VDD + 0.3 V
-2.0
2.0
-0.3
VDD + 0.3 V
–
mA t ≤ 2 min.
–
mA t ≤ 2 min.
–
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Electrical Characteristics
Absolute Maximum Ratings (cont’d)1)
Tj = -40 to +150 °C; all voltages with respect to ground
(unless otherwise specified)
Pos.
Parameter
Symbol
4.1.20 Current through serial output pin SO
Limit Values
Unit Conditions
min.
max.
ISO
-2.0
2.0
mA t ≤ 2 min.
VLHI
ILHI
-0.3
5.5
V
-0.75
-2.0
0.75
2.0
mA –
Limp Home Pin
4.1.21 Voltage at limp home input pin
4.1.22 Current through limp home input pin
–
t ≤ 2 min.
External Driver Pins
4.1.23 Voltage at external driver output
-0.3
VDD + 0.3 V
4.1.24 Current through external driver output
VEDO
IEDO
4.1.25 Voltage at external driver diagnosis enable
VEDD
4.1.26 Current through external driver diagnosis enable IEDD
-1.0
1.0
-0.3
VDD + 0.3 V
-1.0
1.0
mA t ≤ 2 min.
-40
150
°C
–
–
60
K
–
-55
150
°C
–
kV
HBM 7)
–
–
–
mA t ≤ 2 min.
–
Temperatures
Tj
∆Tj
Tstg
4.1.27 Junction temperature
4.1.28 Dynamic temperature increase while switching
4.1.29 Storage temperature
ESD Susceptibility
VESD
4.1.30 ESD susceptibility HBM
OUT pins vs. VBB
other pins incl. OUT vs. GND
-4
-2
4
2
1) Not subject to production test, specified by design.
2) Device is mounted on an FR4 2s2p board according to Jedec JESD51-2,-5,-7 at natural convection; The product
(chip+package) was simulated on a 76.4 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).
Where applicable, a thermal via array under the package contacted the first inner copper layer.
3) In accordance to AEC Q100-012 and AEC Q101-006.
4) RI is the internal resistance of the load dump pulse generator.
5) Over current protection is a protection feature. Operation in over current protection is considered as “outside” normal
operating range. Protection features are not designed for continuous repetitive operation.
6) Pulse shape represents inductive switch off: ID(t) = ID(0) × (1 - t / tpulse); 0 < t < tpulse
7) ESD resistivity, HBM according to EIA/JESD 22-A 114B (1.5 kΩ, 100 pF)
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
11
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Electrical Characteristics
4.2
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos.
Parameter
4.2.1
Junction to Soldering Point
4.2.2
Junction to Ambient 1)
Symbol
1)
Limit Values
Unit
Conditions
Min.
Typ.
Max.
RthJSP
–
–
20
K/W
measured to pin 1,
2, 9, 28, 35, 36
RthJA
–
35
–
K/W
2)
1) Not subject to production test, specified by design.
2) Specified RthJA values is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product
(chip+package) was simulated on a 76.4 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).
Where applicable, a thermal via array under the package contacted the first inner copper layer.
Data Sheet
12
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Supply
5
Power Supply
The SPOC - BTS5480SF is supplied by two supply voltages VBB and VDD. The VBB supply line is used by the power
switches. The VDD supply line is used by the SPI related circuitry and for driving the SO line. A capacitor between
pins VDD and GND is recommended as shown in Figure 26.
There is a power-on reset function implemented for the VDD logic power supply. After start-up of the logic power
supply, all SPI registers are reset to their default values. The SPI interface including daisy chain function is active
as soon as VDD is provided in the specified range independent of VBB. First SPI data are the output register values
with TER = 1.
Specified parameters are valid for the supply voltage range according VBB(nor) or otherwise specified. For the
extended supply voltage range according VBB(ext) device functionality (switching, diagnosis and protection
functions) are still given, parameter deviations are possible.
5.1
Power Supply Modes
The following table shows all possible power supply modes for VBB, VDD and the pin LHI.
On via Limp Home Normal
operation
INx
mode
without SPI
Limp Home
mode with
SPI 1)
Power Supply Modes
Off
Off
SPI
on
Reset Off
VBB
VDD
0V
0V
0V
0V
13.5 V 13.5 V 13.5 V
13.5 V
13.5 V
0V
0V
5V
5V
0V
0V
0V
5V
5V
LHI
0V
5V
0V
5V
0V
0V
5V
0V
5V
2)
2)
✓
✓2)
Power stage, protection
–
–
–
–
–
✓
Limp home
–
–
–
–
–
–
✓
–
✓
SPI (logic)
–
–
✓
✓
reset
reset
reset
✓
reset3)
Stand-by current
–
–
–
–
✓
✓4)
–
✓5)
–
Idle current
–
–
–
–
–
–
–
✓6)
–
Diagnosis
–
–
–
–
–
–
–
✓
✓7)
1)
2)
3)
4)
5)
6)
7)
✓
SPI read only
Channel 1, 2 and/or 3 activated according to the state of INx
SPI reset only with applied VBB voltage
When INx = low
When DCR.MUX = 111b and INx = low
When all channels are in OFF-state and DCR.MUX ≠ 111b
Current sense disabled in limp home mode
5.1.1
Stand-by Mode and Device Wake-up Mechanisms
Stand-by mode is entered as soon as the current sense multiplexer (DCR.MUX) is in default (stand-by) position
and all input pins are not set. All error latches are cleared automatically in stand-by mode. As soon as stand-by
mode is entered, register HWCR.STB is set. To wake-up the device, the current sense multiplexer (DCR.MUX) is
programmed different to default (stand-by) position . The power-on wake up time tWU(PO) has to be considered.
Idle mode parameters are valid, when all channels are switched off, but the current sense multiplexer is not in
default position, and VDD supply is available.
Note: A transition from operation to stand-by mode does not reset the SPI registers. So, if VDD is present and SPI
is programmed, a changing to MUX = 111b does not reset the SPI registers. An activation of the channels via
the input pin INx will wake up the device with the former SPI register settings.
Data Sheet
13
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Supply
Activating one of the outputs via the input pins (INx = high) will wake-up the device out of stand-by mode. The
power stages are working without VDD supply according to the table above. The output turn-on times will be
extended by the stand-by channel wake up time tWU(STCH) as long as no other channel is active. If one channel is
active already before channel turn-on times ton (6.6.12) can be considered.
Note: In the operation with VDD = 0 V and INx = high a switching off of all input signals will turn the device in standby mode. In stand-by mode the error latches are cleared.
Limp home (LHI = high) applied for a time longer than tLH(ac) will wake-up the device out of stand-by mode after
the power-on wake up time tWU(PO) and it is working without VDD supply. Channels 1, 2 and 3 can be activated via
the input pins INx. The error latches can be cleared by a low-high transition at the according input pin.
5.2
Reset
There are several reset trigger implemented in the device. They reset the SPI registers including the over
temperature latches to their default values. The power stages will switch off, if they are activated via the SPI
register OUT.n. If the power stages are activated via the parallel input pins they are not affected by the reset
signals. The ERR-flags are cleared by those reset triggers. The over temperature protection and latches are
functional after a reset trigger.
Note: During a reset only the channels 1, 2 and 3 can be activated via the according input pins. The input assigned
mode is not available during a reset.
The first SPI transmission after any kind of reset contains at pin SO the read information from the standard
diagnosis, the transmission error bit TER is set.
Power-On Reset
The power-on reset is released, when VDD voltage level is higher than VDD(PO). The SPI interface can be accessed
after wake up time tWU(PO).
Reset Command
There is a reset command available to reset all register bits of the register bank and the diagnosis registers. As
soon as HWCR.RST = 1b, a reset is triggered equivalent to power-on reset. The SPI interface can be accessed
after transfer delay time tCS(td).
Limp Home Mode
The limp home mode will be activated as soon as the pin LHI is set to high for a time longer than tLH(ac). The SPI
write-registers are reset with applied VBB voltage. The outputs OUTx can be activated via the input pins also during
activated limp home mode. The error latches can be cleared by a low-high transition at the according input pin.
For application example see Figure 26. The SPI interface is operating normally, so the limp home register bit LHI
as well as the error flags can be read, but any write command will be ignored.
Data Sheet
14
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Supply
5.3
Electrical Characteristics
Electrical Characteristics Power Supply
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
5.3.1 Supply voltage range for normal operation
power switch
Symbol
VBB(nor)
5.3.2 Extended supply voltage range for operation VBB(ext)
power switch
Limit Values
min.
typ.
max.
8
–
17
V
–
4.5
–
281)
V
Parameter
deviations possible
µA
VDD = 0 V
VLHI = 0 V
1)
Tj = 25 °C
1)
Tj ≤ 85 °C
VDD = 5 V
5.3.3 Stand-by current for whole device with loads IBB(STB)
5.3.4 Idle current for whole device with loads, all
channels off
IBB(idle)
5.3.5 Logic supply voltage
VDD
IDD
5.3.6 Logic supply current
5.3.7 Logic idle current
Unit Test Conditions
–
–
–
–
4.5
28
–
7
–
mA
DCR.MUX = 110
IDD(idle)
3.0
–
5.5
–
–
140
280
–
–
–
25
–
V
–
µA
VCS = VLHI = 0 V
RIS = 2.7 kΩ
VIS = 0 V
fSCLK = 0 Hz
fSCLK = 5 MHz
VCS = VDD
fSCLK = 0 Hz
µA
Chip in Standby
5.3.8 Operating current for whole device active
IGND
–
10
25
mA
fSCLK = 0 Hz
VLHI(L)
VLHI(H)
ILHI(L)
ILHI(H)
0
–
0.8
V
–
1.8
–
5.5
V
–
3
12
80
µA
1)
10
40
80
µA
VLHI = 5 V
VDD(PO)
tWU(PO)
tWU(STCH)
tLH(ac)
–
–
2.4
V
–
–
–
200
µs
1)
–
–
200
µs
1)
5
–
200
µs
1)
LHI Input Characteristics
5.3.9 L-input level at LHI pin
5.3.10 H-input level at LHI pin
5.3.11 L-input current through LHI pin
5.3.12 H-input current through LHI pin
VLHI = 0.4 V
Reset
5.3.13 Power-On reset threshold voltage
5.3.14 Power-On wake up time
5.3.15 Stand-by channel wake up time
5.3.16 Limp home acknowledgement time
1) Not subject to production test, specified by design.
Note: Characteristics show the deviation of parameter at the given supply voltage and junction temperature.
Data Sheet
15
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Supply
5.4
Command Description
HWCR
Hardware Configuration Register 1)
W/R 2)
RB 2)
ADDR 2)
read
1
1
write
1
1
3
2
1
0
0
LED3
LED2
STB
CL
0
LED3
LED2
RST
CL
1) Shaded cells not mentioned in this chapter.
2) W/R Write/Read, RB Register Bank, ADDR Address
Field
Bits
Type
Description
RST
1
w
Reset Command
0 1) Normal operation
1
Execute reset command
STB
1
r
Stand-by
0
Device is awake
1
Device is in stand-by mode
1) Bold letters indicate the default values.
Data Sheet
16
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6
Power Stages
The high-side power stages are built by N-channel vertical power MOSFETs (DMOS) with charge pumps. There
are four channels implemented in the device. Channels can be switched on via an input pin (please refer to
Section 6.2) or via SPI register OUT.
6.1
Output ON-State Resistance
The on-state resistance RDS(ON) depends on the supply voltage VBB as well as on the junction temperature Tj.
Figure 4 shows those dependencies. The behavior in reverse polarity mode is described in Section 7.5.
Tj = 25 °C
VBB = 13.5 V
50
50
Channel 0,1 (bulb)
45
Channel 2,3 (LED)
40
40
35
RDS(ON) [mΩ]
35
RDS(ON) [mΩ]
Channel 0, 1 (bulb)
channel 2,3 (bulb)
channel 2,3 (LED)
45
Channel 2,3 (bulb)
30
25
20
30
25
20
15
15
10
10
5
5
0
0
-50
0
50
100
0
150
Figure 4
Typical On-State Resistance
6.2
Input Circuit
5
10
15
20
25
30
VBB [V]
T j [°C]
The outputs of the SPOC - BTS5480SF can be activated either via the SPI register OUT.OUTn or via the dedicated
input pins. There are two different ways to use the input pins, the direct drive mode and the assigned drive mode.
The default setting is the direct drive mode. To activate the assigned drive mode the register bit IECR.INCG
needs to be set.
Additionally, there are two ways of using the input pins in combination with the OUT register by programming the
IECR.COL parameter.
•
•
IECR.COL = 0b: A channel is switched on either by the according OUT register bit or the input pin.
IECR.COL = 1b: A channel is switched on by the according OUT register bit only, when the input pin is high.
In this configuration, a PWM signal can be applied to the input pin and the channel is activated by the SPI
register OUT.
Data Sheet
17
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
Figure 5 shows the complete input switch matrix.
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
OR
&
Gate Driver 0
OR
IN1
Gate Driver 1
&
OR
IN2
Gate Driver 2
&
IN3
OR
OR
Gate Driver 3
&
OR
&
OR
&
INCG
External Driver
Output 0
External Driver
Output 1
&
COL
InputMatrix_STD_EXT .emf
Figure 5
Input Switch Matrix
The current sink to ground ensures that the input signal is low in case of an open input pin. The zener diode
protects the input circuit against ESD pulses.
6.2.1
Input Direct Drive
This mode is the default after the device’s wake up and reset. The input pins activate the channels during normal
operation (with default setting of bit IECR.INCG), stand-by mode and limp home mode. Channel 0 and the
external drivers can be activated only via the SPI-bit OUT.OUTn in direct drive mode. The inputs are linked directly
to the channels according to:
Table 1
Direct Drive Mode
Input Pin
Assigned channel, if IECR.INCG = 0b
IN1
Channel 1
IN2
Channel 2
IN3
Channel 3
Data Sheet
18
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6.2.2
Input Assigned Drive
To activate the assigned drive function the register bit IECR.INCG needs to be set. In this mode all output
channels can be activated via the input pins. Channel 2, 3 and the two external drivers are assigned to only one
input pin. The following mapping is used:
Table 2
Assigned Drive Mode
Input Pin
Assigned channel, if IECR.INCG = 1b
IN1
Channel 0
IN2
Channel 1
IN3
Channel 2, channel 3, external driver 0, external driver 1
6.3
Power Stage Output
The power stages are built to be used in high side configuration (Figure 6).
VBB
VDS
VBB
OUT
GND
VOUT
Output.emf
Figure 6
Power Stage Output
The power DMOS switches with a dedicated slope, which is optimized in terms of EMC emission. Defined slew
rates and edge shaping allow lowest EMC emissions during PWM operation at low switching losses.
6.3.1
Bulb and LED mode
Channel 2 and channel 3 can be configured in bulb and LED mode via the SPI registers HWCR.LEDn. During LED
mode following parameters are changed for an optimized functionality with LED loads: On-state resistance
RDS(ON), switching timings (tdelay(ON), tdelay(OFF), tON, tOFF), slew rates dV/dtON and dV/dtOFF, current protections IL(trip)
and current sense ratio kILIS.
Data Sheet
19
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6.3.2
Switching Resistive Loads
When switching resistive loads the following switching times and slew rates can be considered.
IN /
OUTx
t ON
V OUT
t delay(ON )
tOFF
tON(rise)
tdelay(OFF )
t
t OFF (f all)
90% of V BB
70% of V BB
70%
dV /
dtON
30% of V BB
dV /
dt OFF
30%
10% of V BB
t
Figure 7
Switching a Load (resistive)
6.3.3
Switching Inductive Loads
SwitchOn.emf
When switching off inductive loads with high-side switches, the voltage VOUT drops below ground potential,
because the inductance intends to continue driving the current. To prevent the destruction of the device due to
high voltages, there is a voltage clamp mechanism implemented, which limits that negative output voltage to a
certain level (VDS(CL) (6.6.2)). See Figure 6 for details. The device provides SmartClamp functionality. To increase
the energy capability, the clamp voltage VDS(CL) increases with the junction temperature Tj and load current IL.
Please refer also to Section 7.6. The maximum allowed load inductance is limited.
6.4
Inverse Current Behavior
During inverse currents (VOUT > VBB) the affected channel stays in ON- or in OFF-state. Furthermore, during
applied inverse currents no ERR-flag is set.
The functionality of unaffected channels is not influenced by inverse currents applied to other channels (except
effects due to junction temperature increase). Influences on the diagnostic function of unaffected channels are
possible only for the current sense ratio, please refer to ∆kILIS(IC) (8.5.3).
Note: No protection mechanism like temperature protection or current protection is active during applied inverse
currents. Inverse currents cause power losses inside the DMOS, which increase the overall device
temperature, which could lead to a switch off of the unaffected channels due to over temperature.
Data Sheet
20
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6.5
External Driver Control
Two external smart power drivers can be driven by the SPOC - BTS5480SF via the external driver control block.
For each external driver there are two control outputs available: one output for controlling the input (EDOx) and
one output for diagnosis enable input (EDDx). The current sense output of the external smart power drivers can
be connected to the IS pin. For details please refer to Figure 26.
The external driver outputs can be used only with applied VDD voltage. The external driver outputs are internally
pulled down. The external drivers can be activated via SPI-bits OUT.OUT4 and OUT.OUT5 or via the input pin
IN3 in assigned drive mode. The external drivers’ diagnostic enable signals can be activated via the SPI register
DCR.MUX. For being compliant to PROFET+ diagnostic functions, it is possible to configure pin EDD0 as DEN
and EDD1 as DSEL. Therefore, the bit IECR.PRO+ needs to be set. The DSEL will be set depending on the
multiplexer setting DCR.MUX.
Table 3
PROFET+ Compliancy
MUX Setting
DCR.MUX
EDD0 used as DEN
EDD1 used as DSEL
100b
1
0
101b
1
1
Note: The usable duty cycle range and diagnostic timings for the external drivers depend on the external driver’s
characteristics.
Data Sheet
21
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6.6
Electrical Characteristics
Electrical Characteristics Power Stages
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
Unit Test Conditions
min. typ. max.
Output Characteristics
RDS(ON)
6.6.1 On-state resistance
mΩ
–
9
IL = 7.5 A
1)
Tj = 25 °C
Tj = 150 °C
–
28
IL = 2.6 A
1)
Tj = 25 °C
Tj = 150 °C
–
100
IL = 0.6 A
1)
Tj = 25 °C
Tj = 150 °C
channel 0, 1
–
–
3.5
7
channel 2, 3
HWCR.LEDn = 0
–
–
11
22
HWCR.LEDn = 1
–
–
39
78
VDS(CL)
6.6.2 Output clamp
channel 0, 1
channel 2, 3
6.6.3 Output leakage current per channel in
stand-by
V
32
–
54
40
–
55
32
–
54
40
–
55
µA
IL(OFFSTB)
channel 0, 1
–
–
–
–
–
–
2
10
50
channel 2, 3
–
–
–
–
–
–
1
4
20
channel 2, 3
Data Sheet
22
–
–
–
–
–
–
60
80
530
–
–
–
–
–
–
45
50
230
OUT.OUTn = 0
DCR.MUX = 111
Tj = 25 °C
1)
Tj = 85 °C
1)
Tj = 105 °C
Tj = 25 °C
1)
Tj = 85 °C
1)
Tj = 105 °C
µA
6.6.4 Output leakage current per channel in idle IL(OFFidle)
mode
channel 0, 1
Tj = 25 °C
IL = 20 mA
1)
Tj = 150 °C
IL = 6 A
Tj = 25 °C
IL = 20 mA
1)
Tj = 150 °C
IL = 2 A
OUT.OUTn = 0
DCR.MUX ≠ 111
1)
1)
Tj = 85 °C
Tj = 105 °C
Tj = 150 °C
1)
Tj = 85 °C
1)
Tj = 105 °C
Tj = 150 °C
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
Electrical Characteristics Power Stages (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
6.6.5 Inverse current capability per channel
-IL(IC)
Limit Values
Unit Test Conditions
min. typ. max.
1)
A
No influences on
switching functionality of
unaffected channels, kILIS
influence according
∆kILIS(IC) (8.5.3)
channel 0, 1
6
–
–
channel 2, 3
2
–
–
0
–
0.8
V
–
1.8
–
5.5
V
–
3
12
80
µA
1)
10
40
80
µA
VIN = 5 V
Input Characteristics
6.6.6 L-input level
6.6.7 H-input level
6.6.8 L-input current
6.6.9 H-input current
Data Sheet
VIN(L)
VIN(H)
IIN(L)
IIN(H)
23
VIN = 0.4 V
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
Electrical Characteristics Power Stages (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
Unit Test Conditions
min. typ. max.
Timings
6.6.10 Turn-ON delay to 10% VBB
1)
VBB = 13.5 V
channel 0, 1
–
25
–
–
channel 2, 3
–
–
20
12
–
–
HWCR.LEDn = 0
HWCR.LEDn = 1
6.6.11 Turn-OFF delay to 90% VBB
µs
tdelay(OFF)
1)
VBB = 13.5 V
channel 0, 1
–
75
–
–
channel 2, 3
–
–
50
20
–
–
HWCR.LEDn = 0
HWCR.LEDn = 1
6.6.12 Turn-ON time to
90% VBB including turn-ON delay
µs
tON
VBB = 13.5 V
DCR.MUX ≠ 111
channel 0, 1
–
–
100
RL = 2.2 Ω
channel 2, 3
–
–
100
–
–
50
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
6.6.13 Turn-OFF time to
10% VBB including turn-OFF delay
µs
tOFF
VBB = 13.5 V
channel 0, 1
–
–
150
RL = 2.2 Ω
channel 2, 3
–
–
110
–
–
50
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
6.6.14 Turn-ON rise time from 10% to
90% VBB
µs
tON(rise)
VBB = 13.5 V
DCR.MUX ≠ 111
channel 0, 1
–
–
55
RL = 2.2 Ω
channel 2, 3
–
–
55
–
–
11
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
6.6.15 Turn-OFF fall time from 90% to
10% VBB
Data Sheet
µs
tdelay(ON)
µs
tOFF(fall)
VBB = 13.5 V
channel 0, 1
–
–
55
RL = 2.2 Ω
channel 2, 3
–
–
55
–
–
11
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
24
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
Electrical Characteristics Power Stages (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
6.6.16 Turn-ON/OFF matching
|tON tOFF|
Limit Values
Unit Test Conditions
min. typ. max.
µs
VBB = 13.5 V
channel 0, 1
–
–
90
RL = 2.2 Ω
channel 2, 3
–
–
70
–
–
50
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
dV/ dtON
6.6.17 Turn-ON slew rate
30% to 70% VBB
V/µs VBB = 13.5 V
channel 0, 1
0.2
0.7
2.0
RL = 2.2 Ω
channel 2, 3
0.2
0.9
2.5
0.6
2.5
6.0
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
-dV/
dtOFF
6.6.18 Turn-OFF slew rate
70% to 30% VBB
V/µs VBB = 13.5 V
channel 0, 1
0.2
0.7
2.0
RL = 2.2 Ω
channel 2, 3
0.2
0.9
2.5
0.6
2.5
6.0
HWCR.LEDn = 0
RL = 6.8 Ω
HWCR.LEDn = 1
RL = 33 Ω
0
–
0.4
V
VDD - –
0.4V
VDD
V
tEDO(en)
tEDO(dis)
VEDD(L)
–
–
4
µs
–
–
4
µs
0
–
0.4
V
6.6.24 H level external driver diagnosis enable
voltage
VEDD(H)
VDD - –
0.4V
VDD
V
6.6.25 External driver diagnosis enable enable
time
tEDD(en)
–
–
4
µs
6.6.26 External driver diagnosis enable disable
time
tEDD(dis)
–
–
4
µs
External Driver Control
6.6.19 L level external driver output voltage
6.6.20 H level external driver output voltage
6.6.21 External driver output enable time
6.6.22 External driver output disable time
6.6.23 L level external driver diagnosis enable
voltage
VEDO(L)
VEDO(H)
IEDO = -0.5 mA
IEDO = 0.5 mA
VDD = 4.3 V
1)
CL = 20 pF
1)
CL = 20 pF
IEDD = -0.5 mA
IEDD = 0.5 mA
VDD = 4.3 V
1)
CL = 20 pF
1)
CL = 20 pF
1) Not subject to production test, specified by design.
Data Sheet
25
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Power Stages
6.7
Command Description
OUT
Output Configuration Registers
W/R
RB
5
4
3
2
1
0
read/write
0
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
3
2
1
0
LED3
LED2
RST
CL
3
2
1
0
COL
INCG
CSL
PRO+
Field
Bits
Type
Description
OUTn
n = 5 to 0
n
rw
Set Output Mode for Channel n
0
Channel n is switched off
1
Channel n is switched on
HWCR
Hardware Configuration Register
W/R
RB
ADDR
read/write
1
1
0
Field
Bits
Type
Description
LEDn
n = 3 to 2
n
rw
Set LED Mode for Channel n
0
Channel n is in bulb mode
1
Channel n is in LED mode
IECR
Input, External Drive and Current Source Configuration Register
W/R
RB
read/write
1
ADDR
0
1
Field
Bits
Type
Description
PRO+
0
rw
Configuration of EDD0 and EDD1 to be compliant to PROFET+
0
Normal mode
1
EDD0=DEN, EDD1=DSEL
INCG
2
rw
Input Drive Configuration
0
Direct drive mode
1
Assigned drive mode
COL
3
rw
Input Combinatorial Logic Configuration
0
Input signal OR-combined with according OUT register bit
1
Input signal AND-combined with according OUT register bit
Data Sheet
26
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
7
Protection Functions
The device provides embedded protective functions, which are designed to prevent IC destruction under fault
conditions described in this data sheet. Fault conditions are considered as “outside” normal operating range.
Protective functions are neither designed for continuous nor for repetitive operation.
7.1
Over Current Protection
The maximum load current IL is switched off in case of exceeding the over current trip level IL(trip) by the device
itself. Depending on the total short circuit impedance higher current over shoots may occur. A limited auto-restart
function is implemented. The number of restarts is dependent of the VDS voltage. Please refer to following figures
for details.
normal
operation
over current
IN /
OUTx
t
V DS
V DS(Vtrip)
t
IL
I L(trip)
Switch off by over
current switch off
Latch OFF due
maximum number of
retries reached
Tj
T j(SC)
T j(startn) + ∆T j(res)
T j(start2) + ∆T j(res)
Tj(start1) + ∆Tj(res)
Tj(start1)
IIS
t
Restart by dynamic
temperature sensor
n=1
n = n retry
t
t
ERR
*
* ERR-flag will be reset by standard
diagnosis readout during restart
t
CL = 1
over load
removed
CurrentTrippingDeltaT_nretry.emf
Figure 8
Data Sheet
Over current protection with latch due to reaching maximum number of retries nretry
27
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
normal
operation
over current
IN /
OUTx
t
V DS
V DS(Vtrip)
t
Switch off by over
current switch off
IL
I L(trip)
Latch OFF due to
over temperature
Tj
T j(SC)
T j(startn) + ∆T j(res)
t
Restart by dynamic
temperature sensor
T j(start2) + ∆T j(res)
Tj(start1) + ∆Tj(res)
Tj(start1)
n < nretry
n=1
IIS
t
t
ERR
*
* ERR-flag will be reset by standard
diagnosis readout during restart
CL = 1
over load
removed
t
CurrentTrippingDeltaT_OT.emf
Figure 9
Over current protection with latch due to reaching over temperature Tj(SC)
The ERR-flag will be set during over current shut down. It can be reset by reading the ERR-flag. If the channel is
still in over current shut down, the ERR-flag will be set again. During the automatic restart of the channel the ERRflag can be cleared by reading the ERR-flag. It will be set again as soon as the over current protection is activated
again.
The number of restarts nretry is depending on the VDS voltage according to the following figure and Chapter 7.2.
IL(trip)
IL
n = n retry(LV)
n = nretry(MV)
no retry
IL(Vtrip)
5
10
15
20
VDS
CurrentTrippingVsVDS.emf
Figure 10
Number of retries and trip levels dependent of VDS
The retry latch or over temperature latch is cleared by SPI command HWCR.CL = 1b. If the input pin or the bit in
the SPI register OUT is still set, the channel will be turned on immediately after the command HWCR.CL = 1b.
Data Sheet
28
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
7.2
Over Current Protection at high VDS
The SPOC - BTS5480SF provides an over current protection for VDS > VDS(Vtrip) (7.9.5). For VDS > VDS(Vtrip) and
IL > IL(Vtrip) during turn on the channel switches off and latches immediately. For details please refer to parameter
IL(VTRIP) (7.9.4).
The current trip level IL(Vtrip) is below the current trip level IL(trip) at VDS = 7V. The ratio between IL(trip) and IL(Vtrip) is
defined by the parameter ∆kTR (7.9.6).
The over current latch is cleared by SPI command HWCR.CL = 1b. If the input pin or the bit in the SPI register
OUT is still set, the channel will be turned on immediately after the command HWCR.CL = 1b.
IN /
OUTx
normal
operation
high V DS over current
t
VDS
VDS(Vtrip)
t
IL
I L(Vtrip)
t
I IS
t
ERR
over load
removed
CL = 1
t
CurrentTrippingHighVDS.emf
Figure 11
Over current protection in case of high VDS voltages
7.3
Over Current Protection for Short Circuit Type 2 Protection
After activation of the channels without over temperature shutdown and after the delay time tdelay(trip) (7.9.2) the
over current protection threshold IL(trip) is reduced to IL(Itrip). The delay time tdelay(trip) is reset by an dynamic
temperature sensor or over current shutdown and any INor OUTx. In case of a short circuit to GND event with
IL > IL(Itrip) (7.9.3), which occurs in the on state, the channel is switched off and latched immediately. For more
details, please refer to the figure Figure 12.
The current trip level IL(Itrip) is below the current trip level IL(trip) at VDS = 7V. The ratio between IL(trip) and IL(Itrip) is
defined by the parameter ∆kTR (7.9.6).
The over current latch is cleared by SPI command HWCR.CL = 1b. If the input pin or the bit in the SPI register
OUT is still set, the channel will be turned on immediately after the command HWCR.CL = 1b.
Data Sheet
29
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
IN /
OUTx
normal
operation
normal
operation
over current
t
IL
IL(Itrip)
t
IIS
t
ERR
t > tdelay(trip)
over load
removed
t
CL = 1
CurrentTrippingLowVDS .emf
Figure 12
Shut Down by Over Current due to Short Circuit Type 2
7.4
Over Temperature Protection
Each channel has its own temperature sensor. If the temperature at the channel exceeds the thermal shutdown
temperature Tj(SC), the channel will switch off and latch to prevent destruction (also in case of VDD = 0V). In order
to reactivate the channel, the temperature at the output must drop by at least the thermal hysteresis ∆Tj and the
over temperature latch must be cleared by SPI command HWCR.CL = 1b. If the input pin or the bit in the SPI
register OUT is still set, the channel will be turned on immediately after the command HWCR.CL = 1b.
IN /
OUTx
t
IL
I L(trip)
t
Tj
Tj(start1) + ∆Tj(SW)
Latch OFF due to
over temperature
Latch OFF due to
over temperature
T j(SC)
Tj(start1)
t
I IS
t
ERR
CL = 1
CL = 1 t
OverLoad.emf
Figure 13
Shut Down by Over Temperature
7.4.1
Dynamic Temperature Sensor Protection
Additionally, each channel has its own dynamic temperature sensor. The dynamic temperature sensor improves
short circuit robustness by limiting sudden increases in the junction temperature. The dynamic temperature sensor
turns off the channel if its sudden temperature increase exceeds the dynamic temperature sensor threshold
∆Tj(SW). The number of automatic reactivations is limited by nretry (7.9.7). If this number of retries is exceeded the
channel turns off and latches. The retry latch is cleared by SPI command HWCR.CL = 1b. If the input pin or the
bit in the SPI register OUT is still set, the channel will be turned on immediately after the command HWCR.CL = 1b.
For the condition n < nretrythe counter of automatic reactivations will be reset by every low to high transition on the
input pin or the bit in SPI register OUT.
Please refer to Figure 12 for details.
Data Sheet
30
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
normal
operation
over load
IN /
OUTx
t
VDS
VDS(Vtrip)
t
IL
IL(trip)
Latch OFF due
maximum number of
retries reached
Tj
T j(SC)
T j(startn) + ∆T j(res)
Tj(start1) + ∆Tj(SW)
T j(start1) + ∆T j(res)
Tj(start1)
I IS
Switch off by dynamic
temperature sensor
t
Restart by dynamic
temperature sensor
∆T jSW
n=1
t
n = nretry
t
ERR
*
* ERR-flag will be reset by standard
diagnosis readout during restart
t
CL = 1
over load
removed
DeltaT_nretry.emf
Figure 14
Data Sheet
Dynamic Temperature Sensor Operations with latch due to reaching maximum number of
retries nretry
31
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
normal
operation
over load
IN /
OUTx
t
VDS
VDS(Vtrip)
t
IL
IL(trip)
Latch OFF due to
over temperature
Tj
T j(SC)
T j(startn) + ∆T j(res)
Switch off by dynamic
temperature sensor
Tj(start1) + ∆Tj(SW)
T j(start1) + ∆T j(res)
Tj(start1)
t
Restart by dynamic
temperature sensor
∆T jSW
t
n < nretry
n=1
I IS
t
ERR
*
* ERR-flag will be reset by standard
diagnosis readout during restart
CL = 1
over load
removed
t
DeltaT_OT.emf
Figure 15
Dynamic Temperature Sensor Operations with latch due to reaching over temperature Tj(SC)
The ERR-flag will be set during dynamic temperature sensor shut down. It can be reset by reading the ERR-flag.
If the channel is still in dynamic temperature sensor shut down, the ERR-flag will be set again. During the
automatic restart of the channel the ERR-flag can be cleared by reading the ERR-flag. It will be set again as soon
as the dynamic temperature sensor is activated again.
7.5
Reverse Polarity Protection
In reverse polarity mode, power dissipation is caused by the intrinsic body diode of each DMOS channel as well
as each ESD diode of the logic pins. The reverse current through the channels has to be limited by the connected
loads.The current through the ground pin, sense pin IS, the logic power supply pin VDD, the SPI pins, input pins,
external driver pins and the limp home input pin has to be limited as well (please refer to the maximum ratings
listed on Page 10).
For reducing the power loss during reverse polarity ReversaveTM functionality is implemented for all channels.
They are turned on to almost forward condition in reverse polarity condition, see parameter RDS(REV).
Note: No protection mechanism like temperature protection or current protection is active during reverse polarity.
7.6
Over Voltage Protection
In the case of supply voltages between VBB(SC) max and VBB(CL) the output transistors are still operational and follow
the input or the OUT register. Parameters are not warranted and lifetime is reduced compared to normal mode.
In addition to the output clamp for inductive loads as described in Section 6.3, there is a clamp mechanism
available for over voltage protection for the logic and all channels.
Data Sheet
32
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
7.7
Loss of Ground
In case of complete loss of the device ground connections, but connected load ground, the SPOC - BTS5480SF
securely changes to or stays in OFF-state.
7.8
Loss of VBB
In case of loss of VBB connection in on-state, all inductances of the loads have to be demagnetized through the
ground connection or through an additional path from VBB to ground. For example, a suppressor diode is
recommended between VBB and GND.
Data Sheet
33
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
7.9
Electrical Characteristics
Electrical Characteristics Protection Functions
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
Unit Test Conditions
min.
typ.
max.
71
–
67
–
90
–
120
–
100
VDS < 7 V
Tj = -40 °C
1)
Tj = 25 °C
Tj = 150 °C
29
–
23
–
30
–
44
–
39
Tj = -40 °C
1)
Tj = 25 °C
Tj = 150 °C
–
8.5
–
12
–
11
HWCR.LEDn = 1
Tj = -40 °C
1)
Tj = 25 °C
Tj = 150 °C
–
14
Over Load Protection
IL(trip)
7.9.1 Load current trip level
A
channel 0, 1
channel 2, 3
HWCR.LEDn = 0
7
–
5.5
Over Current Protection
7.9.2 Over current tripping activation time
7.9.3 Load current trip level after tdelay(trip)
tdelay(trip) 7
IL(Itrip)
channel 0, 1
ms
1)
A
40
35
–
–
78
70
Tj = -40 °C
Tj = 150 °C
17
15.5
–
–
35
30
Tj = -40 °C
Tj = 150 °C
3.8
3.8
–
–
9
8
Tj = -40 °C
Tj = 150 °C
channel 2, 3
HWCR.LEDn = 0
HWCR.LEDn = 1
7.9.4 Load current trip level at high VDS
IL(Vtrip)
A
1)
40
35
–
–
78
70
Tj = -40 °C
Tj = 150 °C
17
15.5
–
–
35
30
Tj = -40 °C
Tj = 150 °C
3.8
3.8
–
–
9
8
Tj = -40 °C
Tj = 150 °C
VDS(Vtrip) 15
–
–
1.5
–
channel 0, 1
channel 2, 3
HWCR.LEDn = 0
HWCR.LEDn = 1
7.9.5 Over current tripping at high VDS
activation level
7.9.6 Current trip at VDS = 7 V to current trip at ∆kTR
VDS = 20 V ratio
Data Sheet
1.2
34
V
1)
1)
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
Electrical Characteristics Protection Functions (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
Unit Test Conditions
min.
typ.
max.
–
32
–
1)
VDS = 9 V
nretry(MV) –
7.9.8 Number of automatic retries at over
current or dynamic temperature sensor
shut down at medium VDS
8
–
1)
VDS = 13 V
Tj(SC)
7.9.10 Thermal hysteresis of thermal shutdown ∆Tj
7.9.11 Dynamic temperature increase
∆Tj(SW)
150
175
195
°C
1)
–
10
–
K
1)
–
60
–
K
1)
–
20
–
K
1)
mΩ
1)
Over Temperature Protection
7.9.7 Number of automatic retries at over
nretry(LV)
current or dynamic temperature sensor
shut down at low VDS
7.9.9 Thermal shut down temperature
limitation while switching
7.9.12 Dynamic temperature sensor restart
∆Tj(res)
Reverse Battery
RDS(REV)
7.9.13 On-state resistance
IL = -7.5 A
Tj = 25 °C
Tj = 150 °C
IL = -2.6 A
Tj = 25 °C
Tj = 150 °C
channel 0, 1
–
–
4.7
9.5
–
–
–
–
14.7
29.5
–
–
VBB = -13.5 V
channel 2, 3
Over Voltage
VBB(CL)
7.9.14 Over voltage protection
V
VBB to GND
40
55
70
channel 0, 1
32
–
54
40
–
55
32
–
54
40
–
55
channel 2, 3
IGND = 5 mA
Tj = 25 °C
IL = 20 mA
1)
Tj = 150 °C
IL = 6 A
Tj = 25 °C
IL = 20 mA
1)
Tj = 150 °C
IL = 2 A
1) Not subject to production test, specified by design.
Data Sheet
35
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Protection Functions
7.10
Command Description
HWCR
Hardware Configuration Register
W/R
RB
write
1
ADDR
1
0
3
2
1
0
LED
LED
RST
CL
Field
Bits
Type
Description
CL
0
rw
Clear Latch
0
Thermal and over current latches are untouched
1
Command: Clear all thermal and over current latches
Standard Diagnosis
7
6
5
4
3
2
1
0
TER
0
LHI
SBM
ERR3
ERR2
ERR1
ERR0
Field
Bits
Type
Description
ERRn
n = 0 to 3
3:0
r
Error Flag for Channel n
0
No error
1
Error occurred
Data Sheet
36
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
8
Diagnosis
For diagnosis purpose, the SPOC - BTS5480SF provides a current sense signal at pin IS and the diagnosis word
via SPI. There is a current sense multiplexer implemented that is controlled via SPI. The sense signal can also be
disabled by SPI command. A switch bypass monitor allows to detect a short circuit between the output pin and the
battery voltage.
In OFF-state a current source is able to be switched on for a selected channel with the DCR.CSOL bit. This allows
open load / short circuit detection to VBB in OFF-state. The current value can be configured to a low or a high value
by programming the bit IECR.CSL. Please refer to parameter IL(OL) (8.5.15).
Note: Please note: All below stated parameters and functions are valid for the internal channels. The behavior of
the current sense of the two external channel is restricted to the behavior of the external drivers.
Please refer to Figure 16 for details on diagnosis function:
VBB
IIS0
latch
temperature
sensor
T
CSOL
IL(OL)
gate
control
OR
over current
protection
OUT3
OUT2
OUT1
OUT0
latch
load
current
sense
ERR0
channel 0
VBB
DCR.MUX
V DS(SB)
DCR.
SBM
current sense multiplexer
IS
RIS
Diagnosis_STD.emf
Figure 16
Data Sheet
Block diagram: Diagnosis
37
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
For diagnosis feedback at different operation modes, please see following table.
Table 4
Operation Modes 1)
Operation Mode
Input Level Output
OUT.OUTn Level VOUT
Current
Sense IIS
Error Flag
ERRn2)
SBM
DCR.SBM
Normal Operation (OFF)
L/0
GND
(OFF-state) GND
Z
0
1
Z
0
1
Short Circuit to GND
Thermal shut down
Z
Z
0
x
Short Circuit to VBB
VBB
Z
0
0
Open Load
Z
Z
0
03)
Inverse Current
> VBB
Z
0
04)
Normal Operation (ON)
Short Circuit to GND
H/1
(ON-state)
Dynamic Temperature Sensor shut down
Over Current shut down
~ VBB
IL / kILIS
0
0
~ GND
Z
1
1
Z
Z
1
Z
Z
x
1
5)
x
6)
x
Thermal shut down
Z
Z
1
Short Circuit to VBB
VBB
< IL / kILIS
0
0
Open Load
VBB
Z
0
0
Inverse Current
> VBB
Z
0
0
1)
2)
3)
4)
5)
6)
L = low level, H = high level, Z = high impedance, potential depends on leakage currents and external circuit x = undefined
The error flags are latched until they are transmitted in the standard diagnosis word via SPI
If the current sense multiplexer is set to Channel 0 to 3 and DRC.CSOL bit set
If the current sense multiplexer is set to Channel 0 to 3
The over current latch off flag is set latched and can be cleared by SPI command HWCR.CL
The over temperature flag is set latched and can be cleared by SPI command HWCR.CL
8.1
Diagnosis Word at SPI
The standard diagnosis at the SPI interface provides information about each channel. The error flags, an OR
combination of the over temperature flags and the over load monitoring signals are provided in the SPI standard
diagnosis bits ERRn.
The over load monitoring signals are latched in the error flags and cleared each time the standard diagnosis is
transmitted via SPI. In detail, they are cleared between the second and third raising edge of the SCLK signal.
The over temperature flags, which cause an overheated channel to latch off, are latched directly at the gate control
block. The over current flags, which cause an channel 0 or 1 driving a too high current to switch off, are latched
like the over temperature flags. Those latches are cleared by SPI command HWCR.CL.
Please note: The over temperature and over current information is latched twice. When transmitting a clear latch
command (HWCR.CL), the error flag is cleared during command transmission of the next SPI frame and ready for
latching after the third raising edge of the SCLK signal. As a result, the first standard diagnosis information after a
CL command will indicate a failure mode at the previously affected channels although the thermal latches have
been cleared already. In case of continuous over load, the error flags are set again immediately because of the
over load monitoring signal.
8.2
Load Current Sense Diagnosis
There is a current sense signal available at pin IS which provides a current proportional to the load current of one
selected channel. The selection is done by a multiplexer which is configured via SPI.
Data Sheet
38
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
Current Sense Signal
The current sense signal (ratio kILIS = IL / IS) is provided during on-state as long as no failure mode occurs.The
ratio kILIS can be adjusted to the load type (LED or bulb) via SPI register HWCR for channel 2 and 3. The accuracy
of the ratio kILIS depends on the load current.Usually a resistor RIS is connected to the current sense pin. It is
recommended to use resistors 1.5 kΩ < RIS < 5 kΩ. A typical value is 2.7 kΩ.
60000
kilis Tj = -40 °C
kilis typ Tj = 25 °C
kilis Tj = 25 °C, 150 °C
50000
k ilis value
40000
30000
20000
10000
0
0
1
2
3
4
5
6
7
8
Load current IL [A]
Figure 17
Current Sense Ratio kILIS Channel 0, 1 1)
4000
kilis bulb Tj = 25 °C, 150 °C
kilis bulb typ Tj = 25 °C
3500
kilis bulb Tj = -40 °C
kilis LED Tj = 25 °C, 150 °C
3000
kilis LED typ Tj = 25 °C
kilis LED Tj = -40 °C
k ilis value
2500
2000
1500
1000
500
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Load current IL [A]
Figure 18
Current Sense Ratio kILIS Channel 2, 3 2)
In case of off-state, over current, dynamic temperature sensor shut down (n < nretry), dynamic temperature sensor
latch (n = nretry) as well as over temperature, the current sense signal of the affected channel is switched off. To
distinguish between over temperature or over current and over load, the SPI diagnosis word can be used.
Whereas the over load and dynamic temperature sensor shut down (n < nretry) flag is cleared every time the
diagnosis is transmitted. The over temperature, dynamic temperature sensor latch (n = nretry) and over current flag
is cleared by a dedicated SPI command (HWCR.CL).
1) The curves show the behavior based on characterization data. The marked points are guaranteed in this Data Sheet in
Section 8.5 (Position 8.5.1).
2) The curves show the behavior based on characterization data. The marked points are guaranteed in this Data Sheet in
Section 8.5 (Position 8.5.1).
Data Sheet
39
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
Details about timings between the current sense signal IIS and the output voltage VOUT and the load current IL can
be found in Figure 19.
OUTx
OFF
ON
OFF
tON
V OUT
tOFF
t
t
IL
tsIS(ON)
IIS
tsIS(LC)
tdIS(OFF)
t
t
SenseTiming .emf
Figure 19
Timing of Current Sense Signal
Current Sense Multiplexer
There is a current sense multiplexer implemented in the SPOC - BTS5480SF that routes the sense current of the
selected channel to the diagnosis pin IS. The channel is selected via SPI register DCR.MUX. The sense current
also can be disabled by SPI register DCR.MUX. For details on timing of the current sense multiplexer, please refer
to Figure 20.
The current sense diagnosis enable signal for the external smart power drivers also can be selected via the SPI
register DCR.MUX. For being compliant to PROFET+ diagnostic functions, it is possible to configure pin EDD0 as
DEN and EDD1 as DSEL. Therefore, the bit IECR.PRO+ needs to be set.
CS
DCR.MUX 110
000
010
110
tsIS(MUX)
IIS
tdIS(MUX)
t
tsIS(EN)
t
MuxTiming.emf
Figure 20
Timing of Current Sense Multiplexer
8.3
Switch Bypass Diagnosis
To detect short circuit to VBB, there is a switch bypass monitor implemented for all internal channels. In case of
short circuit between the output pin OUT and VBB in ON-state, the current will flow through the power transistor as
well as through the short circuit (bypass) with undefined ratio. As a result, the current sense signal will show lower
values than expected by the load current. In OFF-state, the output voltage will stay close to VBB potential which
means a small VDS.
The switch bypass monitor compares the voltage VDS across the power transistor of that channel, which is selected
by the current sense multiplexer (DCR.MUX) with threshold VDS(SB). The result of comparison can be read in SPI
register DCR.SBM or in the standard diagnosis.
Data Sheet
40
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
8.4
Open Load in OFF-State
For performing a dedicated open load in OFF-state detection a current source can be switched in parallel to the
DMOS according to the Figure 16. The current source current can be programmed in two steps by the bit
IECR.CSL.
The following procedure is recommended to use:
•
•
•
•
Select the dedicated channel with the multiplexer
Enable the open load current with the DCR.CSOL bit
Read the DCR.SBM or the standard diagnosis
Disable the open load current with the DCR.CSOL bit
Data Sheet
41
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
8.5
Electrical Characteristics
Electrical Characteristics Diagnosis
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
min.
typ.
Unit
Test Conditions
max.
Load Current Sense
8.5.1 Current sense ratio
kILIS
Tj = -40 °C
channel 0, 1:
2190
3990
4690
5130
5490
0.600 A
1.3 A
2.6 A
4.0 A
7.5 A
5840
6140
6350
6430
6480
50010
12510
9210
8510
7710
channel 2, 3 (bulb):
HWCR.LEDn = 0
990
1240
1400
1540
1540
0.300 A
0.600 A
1.3 A
2.6 A
4.0 A
1670
1750
1800
1830
1840
3710
2710
2210
2110
2110
channel 2, 3 (LED):
–
–
–
–
–
HWCR.LEDn = 1
165
300
350
385
400
0.050 A
0.150 A
0.300 A
0.600 A
1.0 A
8.5.2 Current sense ratio
–
–
–
–
–
400
440
450
460
500
1305
675
580
555
555
kILIS
–
–
–
–
–
Tj = 25 °C to 150 °C
channel 0, 1:
3120
4420
5030
5130
5490
0.600 A
1.3 A
2.6 A
4.0 A
7.5 A
5840
6140
6350
6430
6480
10960
10010
8660
8240
7710
channel 2, 3 (bulb):
HWCR.LEDn = 0
990
1240
1400
1540
1540
0.300 A
0.600 A
1.3 A
2.6 A
4.0 A
1670
1750
1800
1830
1840
2690
2300
2100
2110
2110
channel 2, 3 (LED):
–
–
–
–
–
HWCR.LEDn = 1
165
300
350
385
400
0.050 A
0.150 A
0.300 A
0.600 A
1.0 A
Data Sheet
–
–
–
–
–
42
400
440
450
460
500
805
640
580
555
555
–
–
–
–
–
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
Electrical Characteristics Diagnosis (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
min.
typ.
Unit
max.
1)
8.5.3 Current sense drift of unaffected channel ∆kILIS(IC)
during inverse current of other channels
channel 0, 1
-20 % –
-20 % –
20 %
20 %
-20 % –
-20 % –
20 %
20 %
-20 % –
-20 % –
20 %
20 %
VIS(LIM)
0.9 ×
VDD
1.1 ×
8.5.5 Maximum steady state current sense
output current
IIS(MAX)
5.5
–
–
8.5.6 Current sense leakage / offset current
IIS(en)
DCR.MUX ≠ 111
IL0, 1 = 7.5 A
IL1, 0 (IC) = 7.5 A
IL2, 3 (IC) = 2.6 A
HWCR.LEDn = 0
IL2, 3 = 2.6 A
IL0, 1 (IC) = 7.5 A
IL3, 2 (IC) = 2.6 A
HWCR.LEDn = 1
IL2, 3 = 0.6 A
IL0, 1 (IC) = 7.5 A
IL3, 2 (IC) = 2.6 A
channel 2, 3 (bulb)
channel 2, 3 (LED)
8.5.4 Current sense voltage limitation
channel 0, 1
channel 2, 3
8.5.7 Current sense leakage, while diagnosis
disabled
IIS(dis)
8.5.8 Current sense settling time after channel tsIS(ON)
activation
channel 0, 1
Test Conditions
VDD
V
DCR.MUX = 011
mA
IL3 = 2 A
RIS = 2.7 kΩ
1)
VIS = 0 V
VDD
–
–
–
–
76
76
–
–
1
µA
IL = 0 A
DCR.MUX ≠ 111
µA
DCR.MUX = 110
µs
–
–
150
VBB = 13.5 V
RIS = 2.7 kΩ
RL = 2.2 Ω
–
–
150
RL = 6.8 Ω
–
–
100
RL = 33 Ω
1)
VBB = 13.5 V
RIS = 2.7 kΩ
channel 2, 3
HWCR.LEDn = 0
HWCR.LEDn = 1
8.5.9 Current sense desettling time after
channel deactivation
µs
tdIS(OFF)
–
–
8.5.10 Current sense settling time after change tsIS(LC)
of load current
channel 0, 1
–
–
25
25
µs
–
–
30
–
–
30
–
–
30
channel 2, 3
Data Sheet
43
HWCR.LEDn = 0
HWCR.LEDn = 1
1)
VBB = 13.5 V
RIS = 2.7 kΩ
IL = 7.5 A to 4.0 A
HWCR.LEDn = 0
IL = 2.6 A to 1.3 A
HWCR.LEDn = 1
IL = 0.6 A to 0.3 A
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
Electrical Characteristics Diagnosis (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
8.5.11 Current sense settling time after current
sense activation
tsIS(EN)
8.5.12 Current sense settling time after
multiplexer channel change
tsIS(MUX)
Limit Values
min.
typ.
max.
–
–
25
Unit
Test Conditions
µs
RIS = 2.7 kΩ
DCR.MUX:
110 -> 000
–
–
30
µs
RIS = 2.7 kΩ
RL0 = 2.2 Ω
RL2 = 33 Ω
DCR.MUX:
010 -> 000
8.5.13 Current sense deactivation time
1)
tdIS(MUX)
–
–
25
µs
RIS = 2.7 kΩ
DCR.MUX:
000 -> 110
VDS(SB)
1.5
–
4
V
–
IL(OL)
100
3.0
–
–
450
7.5
µA
mA
IECR.CSL = 0
IECR.CSL = 1
Switch Bypass Monitor
8.5.14 Switch bypass monitor threshold
Open load in off current source
8.5.15 Current source in OFF-state
1) Not subject to production test, specified by design.
Data Sheet
44
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
8.6
Command Description
DCR
Diagnosis Control Register
W/R
RB
read
1
1
1
SBM
MUX
write
1
1
1
CSOL
MUX
Output state
OUT.OUTn
Field
Bits
Type
Description
0
(OFF-state)
MUX
2:0
r/w
Set Current Sense Multiplexer Configuration
000 IS pin is high impedance
001 IS pin is high impedance
010 IS pin is high impedance
011 IS pin is high impedance
100 IECR.PRO+ = 0: Diagnosis enable of external driver 0
activated (EDD0 = 1)
101 IECR.PRO+ = 0: Diagnosis enable of external driver 1
activated (EDD1 = 1)
100 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 0
101 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 1
110 IS pin is high impedance
111 Stand-by mode (IS pin is high impedance)
SBM
3
r
Switch Bypass Monitor 1)
0
VDS < VDS(SB)
1
VDS > VDS(SB)
MUX
2:0
r/w
Set Current Sense Multiplexer Configuration
000 Current sense of channel 0 is routed to IS pin
001 Current sense of channel 1 is routed to IS pin
010 Current sense of channel 2 is routed to IS pin
011 Current sense of channel 3 is routed to IS pin
100 IECR.PRO+ = 0: Diagnosis enable of external driver 0
activated (EDD0 = 1)
101 IECR.PRO+ = 0: Diagnosis enable of external driver 1
activated (EDD1 = 1)
100 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 0
101 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 1
110 IS pin is high impedance
111 Stand-by mode (IS pin is high impedance))
SBM
3
r
Switch Bypass Monitor 1)
0
VDS < VDS(SB)
1
VDS > VDS(SB)
1
(ON-state)
ADDR
3
2
1
0
1) Invalid in stand-by mode
Data Sheet
45
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Diagnosis
Field
Bits
Type
Description
CSOL
3
w
Current Source Switch for Open Load Detection
0
OFF
1
ON
Standard Diagnosis
CS
7
6
5
4
3
2
1
0
TER
0
LHI
SBM
0
ERR3
ERR2
ERR1
ERR0
Field
Bits
Type
Description
ERRn
n = 3 to 0
n
r
Error flag Channel n
0
normal operation
1
failure mode occurred
SBM
5
r
Switch Bypass Monitor 1)
0
VDS < VDS(SB)
1
VDS > VDS(SB)
1) Invalid in stand-by mode
IECR
Input, External Drive and Current Source Configuration Register
W/R
RB
read/write
1
ADDR
0
1
3
2
1
0
COL
INCG
CSL
PRO+
Field
Bits
Type
Description
PRO+
0
rw
Configuration of EDD0 and EDD1 to be compliant to PROFET+
0
Normal mode
1
EDD0=DEN, EDD1=DSEL
CSL
1
rw
Level for Current Source for Open Load Detection
0
Low level
1
High level
Data Sheet
46
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
9
Serial Peripheral Interface (SPI)
The serial peripheral interface (SPI) is a full duplex synchronous serial slave interface, which uses four lines: SO,
SI, SCLK and CS. Data is transferred by the lines SI and SO at the rate given by SCLK. The falling edge of CS
indicates the beginning of an access. Data is sampled in on line SI at the falling edge of SCLK and shifted out on
line SO at the rising edge of SCLK. Each access must be terminated by a rising edge of CS. A modulo 8 counter
ensures that data is taken only, when a multiple of 8 bit has been transferred. The interface provides daisy chain
capability.
SO
SI
CS
MSB
6
5
4
3
2
1
MSB
6
5
4
3
2
1
LSB
LSB
CS
SCLK
time
SPI.emf
Figure 21
Serial Peripheral Interface
9.1
SPI Signal Description
CS - Chip Select:
The system micro controller selects the SPOC - BTS5480SF by means of the CS pin. Whenever the pin is in low
state, data transfer can take place. When CS is in high state, any signals at the SCLK and SI pins are ignored and
SO is forced into a high impedance state.
CS High to Low transition:
•
•
The requested information is transferred into the shift register.
SO changes from high impedance state to high or low state depending on the logic OR combination between
the transmission error flag (TER) and the signal level at pin SI. As a result, even in daisy chain configuration,
a high signal indicates a faulty transmission. This information stays available to the first rising edge of SCLK.
TER
SI
OR
SO
1
0
SI
SPI
SO
S
CS
SCLK
S
TER.emf
Figure 22
Combinatorial Logic for TER Flag
CS Low to High transition:
•
•
Command decoding is only done, when after the falling edge of CS exactly a multiple (1, 2, 3, …) of eight SCLK
signals have been detected. In case of faulty transmission, the transmission error flag (TER) is set and the
command is ignored.
Data from shift register is transferred into the addressed register.
Data Sheet
47
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
SCLK - Serial Clock:
This input pin clocks the internal shift register. The serial input (SI) transfers data into the shift register on the falling
edge of SCLK while the serial output (SO) shifts diagnostic information out on the rising edge of the serial clock.
It is essential that the SCLK pin is in low state whenever chip select CS makes any transition.
SI - Serial Input:
Serial input data bits are shift-in at this pin, the most significant bit first. SI information is read on the falling edge
of SCLK. The input data consists of two parts, control bits followed by data bits. Please refer to Section 9.5 for
further information.
SO Serial Output:
Data is shifted out serially at this pin, the most significant bit first. SO is in high impedance state until the CS pin
goes to low state. New data will appear at the SO pin following the rising edge of SCLK. Please refer to Section 9.5
for further information.
9.2
Daisy Chain Capability
The SPI of SPOC - BTS5480SF provides daisy chain capability. In this configuration several devices are activated
by the same CS signal MCS. The SI line of one device is connected with the SO line of another device (see
Figure 23), in order to build a chain. The ends of the chain are connected with the output and input of the master
device, MO and MI respectively. The master device provides the master clock MCLK which is connected to the
SCLK line of each device in the chain.
Figure 23
SO
SPI
SI
SO
SPI
SCLK
SI
device 3
CS
SCLK
CS
MI
MCS
MCLK
SO
SPI
CS
SI
MO
device 2
SCLK
device 1
SPI_DaisyChain .emf
Daisy Chain Configuration
In the SPI block of each device, there is one shift register where one bit from SI line is shifted in each SCLK. The
bit shifted out occurs at the SO pin. After eight SCLK cycles, the data transfer for one device has been finished.
In single chip configuration, the CS line must turn high to make the device accept the transferred data. In daisy
chain configuration, the data shifted out at device 1 has been shifted in to device 2. When using three devices in
daisy chain, three times eight bits have to be shifted through the devices. After that, the MCS line must turn high
(see Figure 24).
Data Sheet
48
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
MI
MO
SO device 1
SO device 2
SO device 3
SI device 1
SI device 2
SI device 3
MCS
MCLK
time
SPI_DaisyChain2.emf
Figure 24
Data Transfer in Daisy Chain Configuration
9.3
Timing Diagrams
tCS(lead)
tCS(lag)
tCS(td)
tSCLK(P)
CS
0.7VDD
0.2VDD
tSCLK(H)
tSCLK(L)
0.7VDD
SCLK
tSI(su)
0.2VDD
tSI(h)
0.7VDD
SI
0.2VDD
tSO(en)
tSO(v)
tSO(dis)
0.7VDD
SO
0.2VDD
SPI Timing.emf
Figure 25
Data Sheet
Timing Diagram SPI Access
49
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
9.4
Electrical Characteristics
Electrical Characteristics Serial Peripheral Interface (SPI)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
Limit Values
min.
typ.
max.
0
–
0.2*
Unit
Test Conditions
V
VDD = 4.3 V
Input Characteristics (CS, SCLK, SI)
9.4.1 L level of pin
VDD
CS VCS(L)
SCLK VSCLK(L)
SI VSI(L)
–
VDD
V
VDD = 4.3 V
50
120
180
kΩ
ICS = 100 µA
50
120
180
kΩ
–
0.4*
9.4.2 H level of pin
CS VCS(H)
SCLK VSCLK(H)
SI VSI(H)
RCS
9.4.3 Pull-up resistor at CS pin
9.4.4 Pull-down resistor at pin
VDD
ISCLK = 100 µA
ISI = 100 µA
SCLK RSCLK
SI RSI
Output Characteristics (SO)
9.4.5 L level output voltage
9.4.6 H level output voltage
VSO(L)
VSO(H)
0
–
0.4
V
VDD - –
VDD
V
0.4 V
ISO(OFF)
-10
–
10
µA
fSCLK
0
0
–
–
5
3
MHz
9.4.9 Serial clock period
tSCLK(P)
200
333
–
–
–
–
ns
9.4.10 Serial clock high time
tSCLK(H)
100
166
–
–
–
–
ns
9.4.11 Serial clock low time
tSCLK(L)
100
166
–
–
–
–
ns
9.4.12 Enable lead time (falling CS to rising
SCLK)
tCS(lead)
200
333
–
–
–
–
ns
200
333
–
–
–
–
ns
9.4.7 Output tristate leakage current
ISO = -0.5 mA
ISO = 0.5 mA
VDD = 4.3 V
VCS = VDD
Timings
9.4.8 Serial clock frequency
9.4.13 Enable lag time (falling SCLK to rising tCS(lag)
CS)
tCS(td)
200
333
–
–
–
–
ns
9.4.15 Data setup time (required time SI to
falling SCLK)
tSI(su)
20
33
–
–
–
–
ns
9.4.16 Data hold time (falling SCLK to SI)
tSI(h)
20
33
–
–
–
–
ns
50
VDD = 4.3 V
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
1)
VDD = 4.3 V
2)
VDD = 3.0 V
2)
9.4.14 Transfer delay time (rising CS to
falling CS)
Data Sheet
1)
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
Electrical Characteristics Serial Peripheral Interface (SPI) (cont’d)
Unless otherwise specified: VBB = 8 V to 17 V, VDD = 3.0 V to 5.5 V, Tj = -40 °C to +150 °C
typical values: VBB = 13.5 V, VDD = 4.3 V, Tj = 25 °C
Pos. Parameter
Symbol
9.4.17 Output enable time (falling CS to SO
valid)
tSO(en)
9.4.18 Output disable time (rising CS to SO
tri-state)
tSO(dis)
Limit Values
min.
9.4.19 Output data valid time with capacitive tSO(v)
load
typ.
Unit
Test Conditions
ns
2)
max.
–
–
–
–
200
333
–
–
–
–
200
333
–
–
–
–
100
166
ns
ns
CL = 20 pF
VDD = 4.3 V
VDD = 3.0 V
2)
CL = 20 pF
VDD = 4.3 V
VDD = 3.0 V
2)
CL = 20 pF
VDD = 4.3 V
VDD = 3.0 V
1) Not subject to production test, specified by design. SPI functional test is performed at fSCLK = 5 MHz.
2) Not subject to production test, specified by design.
Data Sheet
51
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
9.5
SPI Protocol 8 Bit
CS1)
7
6
5
4
3
2
1
0
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
x
x
x
x
x
0
Write OUT Register
SI
1
0
Read OUT Register
SI
0
0
Write Configuration and Control Registers
SI
1
1
ADDR
DATA
Read Configuration and Control Registers
SI
0
1
ADDR
x
x
x
0
Read Standard Diagnosis
SI
0
x
x
x
x
x
x
1
SBM
x
ERR3
ERR2
ERR1
ERR0
OUT4
OUT3
OUT2
OUT1
OUT0
Standard Diagnosis
SO
TER
0
LHI
Second Frame of Read Command
SO
TER
1
0
SO
TER
1
1
OUT5
ADDR
DATA
1) The SO pin shows this information between CS hi -> lo and first SCLK lo -> hi transition.
Note: Reading a register needs two SPI frames. In the first frame the RD command is sent. In the second frame
the output at SPI signal SO will contain the requested information. A new command can be executed in the
second frame. The standard diagnosis can be accessed either by sending the standard diagnosis read
command or it is transmitted after each write command.
Field
Bits
Type
Description
W/R
7
w
0
1
RB
6
r
Register Bank
0
Read / write to the OUTx channel
1
Read / write to the other register
TER
CS
r
Transmission Error
0
Previous transmission was successful (modulo 8 clocks received)
1
Previous transmission failed or first transmission after reset
OUTn
n = 5 to 0
n
rw
Output Control Register of Channel n
0
OFF
1
ON
ADDR
6:5
rw
Address
Pointer to register for read and write command
DATA
4:0
rw
Data
Data written to or read from register selected by address ADDR
ERRn
n = 3 to 0
n
r
Diagnosis of Channel n 1)
0
No failure
1
Over temperature, over current (only channel 0 and 1) over load or
short circuit
Data Sheet
Read
Write
52
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
Field
Bits
Type
Description
SBM
5
r
Switch Bypass Monitor 2)
0
VDS < VDS(SB)
1
VDS > VDS(SB)
LHI
6
r
Limp Home Enable 3)
0
H-input signal at LHI pin
1
L-input signal at LHI pin
1) No ERR-flags available for external drivers
2) Invalid in stand-by mode
3) Not latching information, read of LHI-status during falling CS
Data Sheet
53
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
9.6
Bit
Register Overview
7
6
5
4
3
2
1
0
Name
W/R
RB
5
4
3
2
1
0
default 1)
OUT
W/R
0
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
00H
Name
W/R
RB
IECR
W/R
1
0
1
COL
INCG
CSL
PRO+
00H
R
1
1
0
LED3
LED2
STB
CL
02H
LED2
RST
CL
HWCR
DCR
ADDR
default1)
DATA
W
1
1
0
LED3
R
1
1
1
SBM
MUX
07H
-
W
1
1
1
CSOL
MUX
-
1) The default values are set after reset.
Note: A readout of an unused register will return the standard diagnosis.
Field
Bits
Type
Description
PRO+
0
rw
Configuration of EDD0 and EDD1 to be Compliant to PROFET+
Concept
0
Normal mode
1
EDD0=DEN, EDD1=DSEL
CSL
1
rw
Level for Current Source for Open Load Detection
0
Low level
1
High level
INCG
2
rw
Input Drive Configuration
0
Direct drive mode
1
Assigned drive mode
COL
3
rw
Input Combinatorial Logic Configuration
0
Input signal OR-combined with according OUT register bit
1
Input signal AND-combined with according OUT register bit
CL
0
rw
Clear Latch
0
Thermal and over current latches are untouched
1
Command: Clear all thermal and over current latches
RST
1
w
Reset Command
0
Normal operation
1
Execute reset command
STB
1
r
Standby Mode
0
Device is awake
1
Device is in Standby mode
LEDn
n = 3 to 2
n
rw
Set LED Mode for Channel n
0
Channel n is in bulb mode
1
Channel n is in LED mode
Data Sheet
54
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Serial Peripheral Interface (SPI)
Field
Bits
Type
Description
MUX
2:0
rw
Set Current Sense Multiplexer Configuration in OFF-state
000 IS pin is high impedance
001 IS pin is high impedance
010 IS pin is high impedance
011 IS pin is high impedance
100 IECR.PRO+ = 0: Diagnosis enable of external driver 0 activated
(EDD0 = 1)
101 IECR.PRO+ = 0: Diagnosis enable of external driver 1 activated
(EDD1 = 1)
100 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 0
101 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 1
110 IS pin is high impedance
111 Stand-by mode (IS pin is high impedance)
Set Multiplexer Configuration in ON-state
000 Current sense of channel 0 is routed to IS pin
001 Current sense of channel 1 is routed to IS pin
010 Current sense of channel 2 is routed to IS pin
011 Current sense of channel 3 is routed to IS pin
100 IECR.PRO+ = 0: Diagnosis enable of external driver 0 activated
(EDD0 = 1)
101 IECR.PRO+ = 0: Diagnosis enable of external driver 1 activated
(EDD1 = 1)
100 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 0
101 IECR.PRO+ = 1: EDD0 = 1, EDD1 = 1
110 IS pin is high impedance
111 Stand-by mode (IS pin is high impedance))
SBM
3
r
Switch Bypass Monitor 1)
0
VDS < VDS(SB)
1
VDS > VDS(SB)
CSOL
3
w
Current Source Switch for Open Load Detection
0
OFF
1
ON
1) Invalid in stand-by mode
Data Sheet
55
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Application Description
10
Application Description
V bat
1
5V
68nF
500Ω
100nF
W D- OUT
VCC
GPIO
GPIO
VDD
VBB
IN1
IN2
8kΩ
8kΩ
IN3
OUT0
IS
OUT1
2.7k Ω
1nF
27W
10W
GND
µC
e . g. X C2 2 6 7
SPI
65W
OUT2
OUT3
1kΩ
AD
65W
3.9k Ω
CS
3.9k Ω
SCLK
SO
3.9k Ω
3.9k Ω
VDD
SPI
LHI
W D- OUT
8k Ω
10kΩ
SI
VBB
IN 1
VSS
external driver EDO0
control
EDD0
IN2
P RO FE T O UT1
Ch1
DE N
EDO1
DS E L
EDD1
IS
GND
P RO FE T O UT2
Ch2
G ND
10Ω
2
1
2
Figure 26
Data Sheet
For filtering and protec tion purpos es
For inc reas ed ISO- puls e robus tnes s
Circ uit_STD_EXT.emf
Application Circuit Example
56
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Package Outlines SPOC - BTS5480SF
2.65 MAX.
0.33 ±0.08
C
0.1
2)
0.17
M
0.7 ±0.2
C A-B D 36x
10.3 ±0.3
D
Bottom View
A
36
7.6 -0.2
8˚ MAX.
0.65
0.35 x 45˚
1)
0.23 +0.09
2.45 -0.2
Package Outlines SPOC - BTS5480SF
0.2 -0.1
11
19
19
36
Ejector Mark
1
18
18
B
1)
12.8 -0.2
1
Dimensions in mm
Index Marking
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
GPS01089
Figure 27
PG-DSO-36-43 (Plastic Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our Infineon Internet Page
“Products”: http://www.infineon.com/products.
Data Sheet
57
Rev. 1.0, 2010-04-12
SPOC - BTS5480SF
Revision History
12
Revision History
Revision
Date
Changes
1.0
2010-04-12
Initial Data Sheet
Data Sheet
58
Rev. 1.0, 2010-04-12
Edition 2010-04-12
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.