INFINEON IPI45N06S3L-13

IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
OptiMOS®-T Power-Transistor
Product Summary
Features
V DS
• N-channel - Logic Level - Enhancement mode
55
R DS(on),max (SMD version)
• Automotive AEC Q101 qualified
13.1
ID
45
V
mΩ
A
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
PG-TO263-3-2
PG-TO262-3-1
PG-TO220-3-1
• Green package (RoHS compliant)
• Ultra low Rds(on)
• 100% Avalanche tested
Type
Package
Marking
IPB45N06S3L-13
PG-TO263-3-2
3N06L13
IPI45N06S3L-13
PG-TO262-3-1
3N06L13
IPP45N06S3L-13
PG-TO220-3-1
3N06L13
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current1)
ID
Conditions
T C=25 °C, V GS=10 V
T C=100 °C,
V GS=10 V2)
Value
45
Unit
A
37
Pulsed drain current2)
I D,pulse
T C=25 °C
180
Avalanche energy, single pulse
E AS
I D=27.5 A
95
mJ
Gate source voltage3)
V GS
±16
V
Power dissipation
P tot
65
W
Operating and storage temperature
T j, T stg
-55 ... +175
°C
T C=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 2.2
55/175/56
page 1
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
Parameter
Symbol
Values
Conditions
Unit
min.
typ.
max.
Thermal characteristics2)
Thermal resistance, junction - case
R thJC
-
-
2.3
Thermal resistance, junction ambient, leaded
R thJA
-
-
62
SMD version, device on PCB
R thJA
minimal footprint
-
-
62
6 cm2 cooling area4)
-
-
40
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D= 1 mA
55
-
-
Gate threshold voltage
V GS(th)
V DS=V GS, I D=30 µA
1.2
1.7
2.2
Zero gate voltage drain current
I DSS
V DS=55 V, V GS=0 V,
T j=25 °C
-
0.01
1
-
1
100
V DS=55 V, V GS=0 V,
T j=125 °C2)
V
µA
Gate-source leakage current
I GSS
V GS=16 V, V DS=0 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=5 V, I D=17 A
-
20.4
25.1
mΩ
V GS=5 V, I D=17 A,
SMD version
-
20.1
24.8
V GS=10 V, I D=26 A
-
11.4
13.4
V GS=10 V, I D=26 A,
SMD version
-
11.1
13.1
Rev. 2.2
page 2
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
Parameter
Symbol
Values
Conditions
Unit
min.
typ.
max.
-
3600
-
-
450
-
Dynamic characteristics2)
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
430
-
Turn-on delay time
t d(on)
-
13
-
Rise time
tr
-
46
-
Turn-off delay time
t d(off)
-
58
-
Fall time
tf
-
124
-
Gate to source charge
Q gs
-
19
-
Gate to drain charge
Q gd
-
9
-
Gate charge total
Qg
-
50
75
Gate plateau voltage
V plateau
-
4.9
-
V
-
-
5
A
-
-
180
0.6
0.9
1.3
V
-
20
-
ns
-
25
-
nC
V GS=0 V, V DS=25 V,
f =1 MHz
V DD=27.5 V,
V GS=10 V, I D=45 A,
R G=20 Ω
pF
ns
Gate Charge Characteristics2)
V DD=11 V, I D=45 A,
V GS=0 to 10 V
nC
Reverse Diode
Diode continous forward current2)
IS
Diode pulse current2)
I S,pulse
Diode forward voltage
V SD
Reverse recovery time2)
t rr
Reverse recovery charge2)
Q rr
T C=25 °C
V GS=0 V, I F=25 A,
T j=25 °C
V R=27.5 V, I F=I S,
di F/dt =100 A/µs
1)
Current is limited by bondwire; with an R thJC = 2.3 K/W the chip is able to carry 52 A at 25°C. For detailed
information see Application Note ANPS071E at www.infineon.com/optimos
2)
Defined by design. Not subject to production test.
3)
Qualified at -5V and +16V.
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.2
page 3
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
1 Power dissipation
2 Drain current
P tot = f(T C); V GS ≥ 4 V
I D = f(T C); V GS ≥ 4 V
70
50
60
40
50
30
I D [A]
P tot [W]
40
30
20
20
10
10
0
0
0
50
100
150
200
0
50
T C [°C]
100
150
200
T C [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D = f(V DS); T C = 25 °C; D = 0
Z thJC = f(t p)
parameter: t p
parameter: D =t p/T
1000
101
0.5
0
1 µs
100
10
0.1
Z thJC [K/W]
I D [A]
10 µs
100 µs
1 ms
10-1
0.05
10
10-2
single pulse
10-3
1
0.1
1
10
100
10-6
10-5
10-4
10-3
10-2
10-1
100
t p [s]
V DS [V]
Rev. 2.2
10-7
page 4
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D = f(V DS); T j = 25 °C
R DS(on) = f(I D); T j = 25 °C
parameter: V GS
parameter: V GS
180
35
10 V
8 V10V
4.5 V
8V
5V
160
140
30
7V
120
R DS(on) [mΩ]
I D [A]
6.5 V
100
6V
80
5.5 V
25
5.5 V
20
60
6V
5V
6.5 V
40
15
4.5 V
7V
8V
20
10 V
0
10
0
5
10
15
0
10
20
V DS [V]
30
40
50
I D [A]
7 Typ. transfer characteristics
8 Typ. drain-source on-state resistance
I D = f(V GS); V DS = 4 V
R DS(on) = f(T j); I D = 45 A; V GS = 10 V
parameter: T j
100
25
-55 °C
80
20
I D [A]
60
175 °C
40
R DS(on) [mΩ]
25 °C
15
10
20
0
5
0
1
2
3
4
5
6
V GS [V]
Rev. 2.2
-60
-20
20
60
100
140
180
T j [°C]
page 5
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
9 Typ. gate threshold voltage
10 Typ. capacitances
V GS(th) = f(T j); V GS = V DS
C = f(V DS); V GS = 0 V; f = 1 MHz
parameter: I D
104
3
Ciss
2.5
300µA
C [pF]
V GS(th) [V]
2
1.5
30µA
Coss
3
10
Crss
1
0.5
0
-60
-20
20
60
100
140
0
180
5
10
T j [°C]
15
20
25
30
V DS [V]
11 Typical forward diode characteristicis
12 Typ. avalanche characteristics
IF = f(VSD)
I AV = f(t AV)
parameter: T j
parameter: T j(start)
100
103
102
25°C
I F [A]
I AV [A]
100°C
150°C
10
101
175 °C
25 °C
100
1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
V SD [V]
Rev. 2.2
1
10
100
1000
t AV [µs]
page 6
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
13 Typical avalanche energy
14 Drain-source breakdown voltage
E AS = f(T j);
V BR(DSS) = (T j); I D = 1 mA
parameter: I D
66
300
15 A
64
250
62
60
25 A
V BR(DSS) [V]
E AS [mJ]
200
150
58
56
54
45 A
100
52
50
50
48
0
46
0
50
100
150
200
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
15 Typ. gate charge
16 Gate charge waveforms
V GS = f(Q gate); I D = 45 A pulsed
parameter: V DD
12
11V
44V
VG
10
Qg
V GS [V]
8
6
4
Qgat
2
Qg
Qg
0
0
20
40
60
80
Q gate [nC]
Rev. 2.2
page 7
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2007
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including
without limitation warranties of non‑infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please
contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information
on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the
express written approval of Infineon Technologies, if a failure of such components can reasonably
be expected to cause the failure of that life-support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be
implanted in the human body, or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
Rev. 2.2
page 8
2007-09-06
IPB45N06S3L-13
IPI45N06S3L-13, IPP45N06S3L-13
Revision History
Version
Changes
Date
Data Sheet 2.1
15.12.2006 Removal of ordering code
Data Sheet 2.1
Implementation of avalanche
15.12.2006 current single pulse
Data Sheet 2.1
Change of Rdson @ 5V to
15.12.2006 25.1mOhm
Data Sheet 2.1
15.12.2006 Update of Infineon address
Data Sheet 2.1
Removal of foot note 3, avalanche
15.12.2006 diagrams
Data Sheet 2.1
15.12.2006 Implementation of Qrr and trr typ
Data Sheet 2.1
15.12.2006 Update of disclaimer
Data Sheet 2.1
Implementation of RoHS and AEC
15.12.2006 logo, update of feature list
Data Sheet 2.2
Removal of avalanche current
06.09.2007 single pulse
Rev. 2.2
page 9
2007-09-06