Data Sheet, Nov. 2008 Control integrated Power System (CIPOS™) IKCS12F60AA IKCS12F60AC http://www.infineon.com/cipos Power Management & Drives N e v e r s t o p t h i n k i n g . CIPOS™ IKCS12F60AA IKCS12F60AC Revision History: Previous Version: Page 4 10 14 2009-04 2.2 Subjects (major changes since last revision) High temperature stress tests duration Changed VIT,HYS Updated Zth-diagram of Diode Rev. 2.3 Authors: W. Frank, W. Brunnbauer Edition 2007-07 Published by Infineon Technologies AG 85579 Neubiberg, Germany © Infineon Technologies AG 4/6/09. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office or representatives (http://www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office or representatives. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. TrenchStop® is a registered trademark of Infineon Technologies AG. CIPOS™, CoolMOS™, CoolSET™, DuoPack™ and thinQ!™ are trademarks of Infineon Technologies AG. Data Sheet 2/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Table of Contents CIPOS™ Control integrated Power System..................................................................................................4 Features........................................................................................................................................................4 Target Applications .....................................................................................................................................4 Description...................................................................................................................................................4 System Configuration .................................................................................................................................4 Internal Electrical Schematic...........................................................................................................................5 Pin Assignment.................................................................................................................................................6 Pin Description ............................................................................................................................................6 /HIN1,2,3 and /LIN1,2,3 (Low side and high side control pins, Pin 15 - 20) .............................................. 6 EN (enable, Pin 24) .................................................................................................................................... 7 ITRIP (Over-current detection function, Pin 21) ......................................................................................... 7 VDD, VSS (control side supply and reference, Pin 22, 23)........................................................................ 7 VB1,2,3 and VS1,2,3 (High side supplies, Pin 1, 2, 4, 5, 7, 8)................................................................... 7 VRU, VRV, VRW (low side emitter, Pin 12, 13, 14) ................................................................................... 7 V+ (positive bus input voltage, Pin 10)....................................................................................................... 7 Absolute Maximum Ratings ............................................................................................................................8 Module Section ............................................................................................................................................8 IGBT and Diode Section .............................................................................................................................8 Control Section............................................................................................................................................9 Recommended Operation Conditions............................................................................................................9 Static Parameters ...........................................................................................................................................10 Dynamic Parameters ......................................................................................................................................11 Integrated Components .................................................................................................................................12 Circuit of a Typical Application.....................................................................................................................12 Characteristics................................................................................................................................................13 Test Circuits and Parameter Definiton .........................................................................................................15 Package Outline IKCS12F60AA ....................................................................................................................18 Package Outline IKCS12F60AC ....................................................................................................................19 Data Sheet 3/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC CIPOS™ Control integrated Power System Single In-Line Intelligent Power Module 3Φ-bridge 600V / 12A @ 25°C Features Description • • • • • The CIPOS™ module family offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. • • • • • • • • Fully isolated Single In-Line molded module TrenchStop® IGBTs with lowest VCE(sat) Optimal adapted antiparallel diode for low EMI Integrated bootstrap diode and capacitor Rugged SOI gate driver technology with stability against transient and negative voltage Temperature monitor and over temperature shutdown Overcurrent shutdown Undervoltage lockout at all channels Matched propagation delay for all channels Low side emitter pins accessible for all phase current monitoring (open emitter) Cross-conduction prevention Lead-free terminal plating; RoHS compliant Qualified according to JEDEC1 (high temperature stress tests for 1000h) for target applications This SIL-IPM is designed to control AC motors in variable speed drives for applications like air conditioning, compressors and washing machines. The package concept is specially adapted to power applications, which need extremely good thermal conduction and electrical isolation, but also EMI-save control and overload protection. The features of Infineon TrenchStop® IGBTs and antiparallel diodes are combined with a new optimized Infineon SOI gate driver for excellent electrical performance. System Configuration • 3 halfbridges with TrenchStop® IGBT & FWEmCon™ diodes • 3Φ SOI gate driver • Bootstrap diodes for high side supply • Integrated 100nF bootstrap capacitance Target Applications • Washing machines • Temperature sensor, passive components for adaptions • Consumer Fans and Consumer Compressors • Isolated heatsink • Creepage distance typ. 3.2mm Certification UL 1577 (UL file E314539) 1 J-STD-020 and JESD-022 Data Sheet 4/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Internal Electrical Schematic V+ (10) Tr1, U-HS D1 Tr3, V-HS D3 Tr5, W-HS D5 Tr2, U-LS D2 Tr4, V-LS D4 Tr6, W-LS D6 VRU (12) VRV (13) VRW (14) U, VS1 (8) V, VS2 (5) W, VS3 (2) RH1 RL1 RH2 RL2 RH3 RL3 VB3 (1) VB2 (4) VB1 (7) CbsH1 CbsH2 CbsH3 Dbs1Dbs3 Rbs VDD (22) VCC /HIN1 (15) /HIN2 (16) /HIN3 (17) /HIN1 /HIN2 /HIN3 /LIN1 (18) /LIN2 (19) /LIN3 (20) /LIN1 /LIN2 /LIN3 ITRIP (21) Driver-IC RTS R EN (24) C1 For integrated components see Table C2 VSS (23) Figure 1: Internal Schematic Data Sheet 5/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Pin Assignment Pin Number Pin Name Pin Description 1 VB3 high side floating IC supply voltage 2 W,VS3 motor output W, high side floating IC supply offset voltage 3 n.a. None 4 VB2 high side floating IC supply voltage 5 V,VS2 motor output V, high side floating IC supply offset voltage 6 n.a. None 7 VB1 high side floating IC supply voltage 8 U,VS1 motor output U, high side floating IC supply offset voltage 9 n.a. None 10 V+ positive bus input voltage 11 n.a. None 12 VRU low side emitter 13 VRV low side emitter 14 VRW low side emitter 15 /HIN1 input gate driver high side 1/U 16 /HIN2 input gate driver high side 2/V 17 /HIN3 input gate driver high side 3/W 18 /LIN1 input gate driver low side 1/U 19 /LIN2 input gate driver low side 2/V 20 /LIN3 input gate driver low side 3/W 21 ITRIP input overcurrent shutdown 22 VDD module control supply 23 VSS module negative supply 24 EN input logic enable, output temperature monitoring Pin Description /HIN1,2,3 and /LIN1,2,3 (Low side and high side control pins, Pin 15 - 20) These pins are active low and they are responsible for the control of the integrated IGBT The Schmitt-trigger input threshold of them are such to guarantee LSTTL and CMOS compatibility down to 3.3V controller outputs. Pull-up resistor of about 75 kOhm is internally provided to pre-bias inputs during supply start-up and a zener clamp is provided for pin protection purposes. Input schmitt-trigger and noise filter provide beneficial noise rejection to short input pulses. It is recommended for proper work of CiPoS™ not to provide input pulse-width lower than 1us. The integrated gate drive provides additionally a shoot through prevention capability which avoids the simultaneous on-state of two gate drivers of the same leg (i.e. HO1 and LO1, HO2 and LO2, HO3 and LO3). Figure 2: Input pin structure Data Sheet 6/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC A minimum deadtime insertion of typ 380ns is also provided, in order to reduce cross-conduction of the external power switches. EN (enable, Pin 24) The signal applied to pin EN controls directly the output stages. All outputs are set to LOW, if EN is at LOW logic level. The internal structure of the pin is the same as Figure 2 made exception of the switching levels of the Schmitt-Trigger, which are here VEN,TH+ = 2.1 V and VEN,TH- = 1.3 V. The typical propagation delay time is tEN = 900 ns. The IC shuts down all the gate drivers power outputs, when the VCC supply voltage is below VDDUV- = 10.4 V. This prevents the external power switches from critically low gate voltage levels during on-state and therefore from excessive power dissipation. VB1,2,3 and VS1,2,3 (High side supplies, Pin 1, 2, 4, 5, 7, 8) VB to VS is the high side supply voltage. The high side circuit can float with respect to VSS following the external high side power device emitter/source voltage. Due to the low power consumption, the floating driver stage is supplied by an integrated bootstrap circuit connected to VDD. This includes also Figure 3: Internal Circuit at pin EN This pin may also be used for reading out the temperature close to the gate drive IC. Please refer to section “Integrated Components” for the specification of the integrated parts. ITRIP (Over-current detection function, Pin 21) CiPoS™ provides an over-current detection function by connecting the ITRIP input with the motor current feedback. The ITRIP comparator threshold (typ 0.46V) is referenced to VSS ground. A input noise filter prevents the driver to detect false over-current events. Over-current detection generates a hard shut down of all outputs of the gate driver after the shutdown propagation delay of typically 900ns. The fault-clear time is set to typically to 4.7 ms. VDD, VSS (control side supply and reference, Pin 22, 23) VDD is the low side supply and it provides power both to input logic and to low side output power stage. Input logic is referenced to VSS ground as well as the under-voltage detection circuit. The under-voltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 12.1 V is at least present. Data Sheet 7/19 Figure 4: Input filter timing diagram integrated bootstrap capacitors of 100 nF at each floating supply, which are located very close to the gate drive circuit. The under-voltage detection operates with a rising supply threshold of typical VBSUV+ = 12.1 V and a falling threshold of VDDUV- = 10.4 V according to Figure 4. VS1,2,3 provide a high robustness against negative voltage in respect of VSS of -50 V. This ensures very stable designs even under rough conditions. VRU, VRV, VRW (low side emitter, Pin 12, 13, 14) The low side emitters are available for current measurements of each phase leg. It is recommended to keep the connection to pin VSS as short as possible in order to avoid unnecessary inductive voltage drops. V+ (positive bus input voltage, Pin 10) The high side IGBT are connected to the bus voltage. It is recommended, that the bus voltage does not exceed 500 V. Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Absolute Maximum Ratings (Tc = 25°C, if not stated otherwise) Module Section Description Condition Symbol Value Unit Min max Storage temperature range Tstg -40 125 °C Operating temperature control PCB1 TPCB - 125 °C - 260 °C 2500 - V Solder temperature Wave soldering, 1.6mm (0.063in.) from case for 10s Tsol Insulation test voltage RMS, f=50Hz, t =1min VISOL Mounting torque M3 screw and washer MS - 0.6 Nm Mounting pressure on surface Package flat on mounting surface - 150 N/mm² 3.1 - mm 19 µF Creepage distance External bootstrap capacitor NMC dS single capacitor charging, VDD = 15V Cbs,ext IGBT and Diode Section Description Max. blocking voltage DC output current 1 2 Condition VIN=5V, IC=0.25mA Tc = 25°C,TvJ < 150°C Tc = 80°C,TvJ < 150°C Symbol Value Unit min max VCES 600 - V Iu, Iv, Iw -12 -6 12 6 A -18 18 A - 5 µs Repetitive peak collector current tp limited by TvJmax Iu, Iv, Iw Short circuit withstand time2 (SCSOA) VDD = 15V,VDC ≤ 400V, Tj ≤ 150°C tsc IGBT reverse bias safe operating area (RBSOA) VDD = 15V,VDC ≤ 500V, Tj = 150°C, IC = 6A VCEmax = 600V Power dissipation per IGBT Tc = 25°C Ptot - 35 W Operating junction temperature range IGBT Diode TvjI TvjD -40 -40 150 150 °C Full Square Monitored by pin 24 Allowed number of short circuits: <1000; time between short circuits: >1s. Data Sheet 8/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Description Condition Symbol Unit Value min typ max Single IGBT thermal resistance, junction-case RthJC - - 3.0 Single diode thermal resistance, junction-case RthJCD - - 4.2 K/W Control Section Description Condition Value Symbol Unit min max Module supply voltage VDD -1 20 V High side floating supply voltage (VB vs. VS) VBS -1 20 V VDD-VBS-6 VDD-VBS-50 600 V Vin -1 10 V Operating junction temperature1 TJ,IC - 125 °C Max. switching frequency fPWM - 20 kHz High side floating IC supply offset voltage tp < 500ns Input voltage LIN, HIN, EN, ITRIP VS1,2,3 Recommended Operation Conditions All voltages are absolute voltages referenced to VSS -Potential unless otherwise specified. Description Symbol Unit Value min max High side floating supply offset voltage VS -3 500 High side floating supply voltage (VB vs. VS) VBS 12.5 17.5 Low side power supply VDD 12.5 17.5 Logic input voltages LIN,HIN,EN,ITRIP VIN 0 5 1 V Monitored by pin 24 Data Sheet 9/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Static Parameters (Tc = 25°C, if not stated otherwise) Description Condition Symbol Collector-Emitter blocking voltage VIN = 5V, IC = 0.25mA V(BR)CES Collector-Emitter saturation voltage VDD = 15V, Iout = +/- 6A 25°C 150°C VCE(sat) VIN =5V, Iout = +/- 6A 25°C 150°C VF VCE = 600V, VIN = 5V Tj = 25°C Tj = 150°C VDD = 15V, tSC ≤ 5µs VDC = 400V, TvJ = 150°C ICES Diode forward voltage Zero gate voltage collector current of IGBT Short circuit collector current1 IC(SC) 2 Unit Value min typ max 600 - - - 1.6 1.9 2.1 - - 1.65 1.6 2.05 - - - 40 1000 - 40 - A V µA Logic "0" input voltage (LIN,HIN) VIH 1.7 2.1 2.4 V Logic "1" input voltage (LIN,HIN) VIL 0.7 0.9 1.1 V EN positive going threshold VEN,TH+ 1.9 2.1 2.3 V EN negative going threshold VEN,TH- 1.1 1.3 1.5 V ITRIP positive going threshold VIT,TH+ 360 460 540 mV ITRIP input hysteresis VIT,HYS 45 75 - mV VDD and VBS supply undervoltage positive going threshold VDDUV+ VBSUV+2 11.0 12.1 12.8 V VDD and VBS supply undervoltage negative going threshold VDDUVVBSUV-2 9.5 10.4 11.0 V VCC and VBS supply undervoltage lockout hysteresis VDDUVH VBSUVH2 1.2 1.7 - V 9.0 10.1 13.0 V Input clamp voltage (/HIN, /LIN, EN, ITRIP) IIN = 4 mA VINCLAMP Quiescent VBx supply current (VBx only) VHIN = low IQB - 360 550 µA Quiescent VDD supply current (VDD only) VIN = float IQDD - 2.0 3.0 mA Input bias current VIN = 5V IIN+ - 55 100 µA Input bias current VIN = 0V IIN- - 110 200 µA ITRIP Input bias current VITRIP = 5V IITRIP+ - 75 120 µA EN Input bias current VEN = 5V IEN+ - 180 300 µA Leakage current of high side Tj,IC = 125°C, VS = 600V ILVS2 - 30 - µA 1 Allowed number of short circuits: <1000; time between short circuits: >1s. 2 Test is not subject of product test, verified by characterisation Data Sheet 10/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Dynamic Parameters (Tc = 25°C, if not stated otherwise) Description Condition Symbol Unit Value min typ max Turn-on propagation delay High side or low side VLIN,HIN = 0V; Iout = 6A, VDC = 300V td(on) - 617 - ns Turn-on rise time High side or low side Iout = 6A, VDC = 300V VLIN,HIN = 5V tr - 21 - ns Turn-off propagation delay High side or low side VLIN,HIN = 5V; Iout = 6A, VDC = 300V td(off) - 832 - ns Turn-off fall time High side or low side Iout = 6A, VDC = 300V VLIN,HIN = 0V tf - 29 - ns Shutdown propagation delay ENABLE VEN = 0V, Iu, Iv, Iw = 6A tEN - 900 - ns Shutdown propagation delay ITRIP VITRIP = 1V, Iu, Iv, Iw = 6A tITRIP - 900 - ns Input filter time ITRIP VITRIP = 1V tITRIPmin 155 210 380 ns Input filter time at LIN for turn on and off and input filter time at HIN for turn on only VLIN,HIN = 0 V & 5V tFILIN 120 270 - ns Input filter time at HIN for turn off VHIN = 5V tFILIN1 - 220 - ns Input filter time at HIN for turn off VHIN = 5 V tFILIN2 - 400 - ns tFILEN 300 430 - ns tFLTCLR - 4.7 - ms Min. deadtime between low side and high side DTPWM - 1 - µs Deadtime of gate drive circuit DTIC - 380 - ns - 145 195 - - 122 160 - - 31 81 - Input filter time EN Fault clear time after ITRIP-fault VLIN,HIN = 0 V & 5V VITRIP = 0 V IGBT Turn-on Energy (includes reverse recovery of diode) Iout = 6A, VDC = 300V Tvj = 25°C Tvj = 150°C Eon IGBT Turn-off Energy Iout = 6A, VDC = 300V Tvj = 25°C Tvj = 150°C Eoff Iout = 6A, VDC = 300V Tvj = 25°C Tvj = 150°C Erec Diode recovery Energy Data Sheet 11/19 µJ µJ µJ Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Integrated Components Description Condition Symbol1 Value Unit min typ max Resistor (0.25 W) Rbs - 10 - Ω Resistor R - 24 - kΩ Resistor TNTC = 25°C RTS - 100 - B-Constant of NTC (Negative Temperature Coefficient) TNTC = 25°C B25 - 4250 - K Bootstrap diode forward voltage IFDbs = 100mA VFDbs - 1.9 2.05 V Capacitor C1 - 100 - nF Capacitor C2 - 2.2 - Bootstrap Capacitor CbsHx - 100 - Circuit of a Typical Application 1 Symbols according to Figure 1 Data Sheet 12/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Characteristics td(off) 1000ns td(off) 1000ns td(on) t, SWITCHING TIMES t, SWITCHING TIMES td(on) tr 100ns tf 100ns tf 10ns tr 0A 5A 10A 10ns 25°C 15A IC, COLLECTOR CURRENT Figure 5. Typical switching times as a function of collector current (inductive load, TJ=150°C, VCE = 300V, VDD = 15V Dynamic test circuit in Figure A) 50°C 75°C 100°C 125°C TvJ, JUNCTION TEMPERATURE Figure 6. Typical switching times as a function of junction temperature (inductive load, VDD= 15V, VCE = 300V, IC = 6A Dynamic test circuit in Figure A) Eon E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES Eon 1.25mJ 1.00mJ 0.75mJ 0.50mJ Eoff 0.25mJ 0.00mJ 0.15mJ Eoff 0.10mJ Erec 0.05mJ Erec 0A 5A 10A 0.00mJ 25°C 15A IC, COLLECTOR CURRENT Figure 7. Typical switching energy losses as a function of collector current (inductive load, TJ = 150°C, VCE = 300V, VDD = 15V Dynamic test circuit in Figure A) Data Sheet 13/19 50°C 75°C 100°C 125°C TvJ, JUNCTION TEMPERATURE Figure 8. Typical switching energy losses as a function of junction temperature (inductive load, VCE = 300V, VDD = 15V, IC = 6A Dynamic test circuit in Figure A) Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC 12V 8V 6V 4V Vdd = 2V 10.3V 15V 20V 0V 25°C 50°C 75°C 150°C 12A 9A 6A 0A 100°C 0V 1V 2V 3V ZthJC, TRANSIENT THERMAL RESISTANCE VCE, COLLECTOR EMITTER VOLTAGE Figure 10. Typical output characteristic of IGBT as a function of collector emitter voltage (VDD = 15V) 15A 12A 9A 6A VGE=25°C 125°C 3A 125°C 3A TC, CASE TEMPERATURE Figure 9. Typical voltage at pin EN as a function of case temperature IF, forward CURRENT VGE=25°C 15A IC, COLLECTOR CURRENT VEN, VOLTAGE AT PIN EN 10V 150°C 0A Single Pulse IGBT Diode 0 10 K/W -1 10 K/W -2 10 K/W 0V 1V 2V VF, forward VOLTAGE Figure 11. Typical diode forward current as a function of forward voltage Data Sheet 14/19 1µs 10µs 100µs 1ms 10ms 100ms 1s tP, PULSE WIDTH Figure 24. Transient thermal impedance as a function of pulse width (D=tP/T) Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA C, MAXIMUM EXT. BOOTSTRAP CAPACITOR IKCS12F60AC 100µF 10µF 1µF 10V 12V 14V 16V 18V VDD, SUPPLY VOLTAGE Figure 12. Maximum ext. bootstrap capacitor as a function of supply voltage VDD (TJ=25°C, single capacitor charging) Data Sheet 15/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Test Circuits and Parameter Definition t Erec Erec = ∫ vD ⋅i F dt 0 Figure A: Dynamic test circuit Leakage inductance Lσ =180nH Stray capacitance C σ =39pF Figure B: Definition of diodes switching characteristics Figure C: Definition of Enable and ITRIP propagation delay LIN1,2,3 HIN1,2,3 2.1V 0.9V td(off) td(on) tf iCU, iCV, iCW 90% vCEU, vCEV, vCEW 10% 90% 10% 2% tEoff t Eoff Eoff = tr ∫ vCEx ⋅i Cx dt 0 10% 2% tEon t Eon Eon = ∫ vCEx ⋅i Cx dt 0 Figure D: Switching times definition and switching energy definition Data Sheet 16/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC tFILIN tFILIN LIN HIN LIN on off on off high HO LO LO a) tFILIN1 low tFILIN2 toff,HINx HIN toff,HINx < tFILIN1 high HO b) HIN toff,HINx toFILIN1 < toff,HINx < tFILIN2 HO c) HIN toff,HINx toff,HINx > tFILIN2 HO Figure E: Short Pulse suppression Data Sheet 17/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Package Outline IKCS12F60AA Note: There may occur discolourations on the copper surface without any effect on the thermal properties. Data Sheet 18/19 Rev. 2.2, Nov. 2008 CIPOS™ IKCS12F60AA IKCS12F60AC Package Outline IKCS12F60AC Description Condition Weight Value Symbol mP Unit min typ max - 17 - g Note: There may occur discolourations on the copper surface without any effect on the thermal properties. Data Sheet 19/19 Rev. 2.2, Nov. 2008