Silicon Switching Diode Array SMBD 2835 SMBD 2836 For high-speed switching applications ● Common anode ● Type Marking Ordering Code (tape and reel) SMBD 2835 SMBD 2836 sA3 sA2 Q68000-A8547 Q68000-A8436 Pin Configuration Package1) SOT-23 Maximum Ratings Parameter Symbol Values Unit SMBD 2835 SMBD 2836 Reverse voltage VR 30 50 Peak reverse voltage VRM 35 75 Forward current IF 200 mA Surge forward current, t = 1 µs IFS 4.5 A Total power dissipation, TS = 31 ˚C Ptot 330 mW Junction temperature Tj 150 ˚C Storage temperature range Tstg V – 65 … + 150 Thermal Resistance Junction - ambient2) Rth JA ≤ 500 Junction - soldering point Rth JS ≤ 360 1) 2) K/W For detailed information see chapter Package Outlines. Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu. Semiconductor Group 1 5.91 SMBD 2835 SMBD 2836 Electrical Characteristics at TA = 25 ˚C, unless otherwise specified. Parameter Values Symbol Unit min. typ. max. 35 75 – – – – – – – – – – 855 1000 1200 DC characteristics Breakdown voltage I(BR) = 100 µA V V(BR) SMBD 2835 SMBD 2836 Forward voltage IF = 10 mA IF = 50 mA IF = 100 mA VF Reverse current VR = 30 V VR = 50 V IR SMBD 2835 SMBD 2836 mV nA – – – – 100 100 AC characteristics Diode capacitance VR = 0, f = 1 MHz CD – – 4 pF Reverse recovery time IF = 10 mA, IR = 10 mA, RL = 100 Ω measured at IR = 1 mA trr – – 6 ns Test circuit for reverse recovery time Pulse generator: tp = 100 ns, D = 0.05 tr = 0.6 ns, Rj = 50 Ω Oscillograph: Semiconductor Group 2 R = 50 Ω tr = 0.35 ns C ≤ 1 pF SMBD 2835 SMBD 2836 Forward current IF = f (TA*; TS) * Package mounted on epoxy Reverse current IR = f (TA) Forward current IF = f (VF) TA = 25 ˚C Peak forward current IFM = f (t) TA = 25 ˚C Semiconductor Group 3 SMBD 2835 SMBD 2836 Forward voltage VF = f (TA) Semiconductor Group 4