FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 13-May-2004 SUBJECT: ON Semiconductor Final Product/Process Change Notification #13467 TITLE: Final PCN for Qualification of VHVIC 8 LEAD PDIP Products at AIT EFFECTIVE DATE: 13-Jul-2004 AFFECTED CHANGE CATEGORY: Subcontractor Assembly/Test Site AFFECTED PRODUCT DIVISION: Analog Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Representative or Ken Fergus <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Representative or Jack Cartwright <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Representative or Jack Cartwright <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is a Final Product Change Notice to make customers aware that Advanced Interconnect Technology (AIT), located in Batam, Indonesia is being qualified as a supplemental manufacturing source for ON Semiconductor's VHVIC 8 lead PDIP products. AIT is QS9000 and ISO9002 certified, and has been a qualified subcontractor for ON Semiconductor devices since 1990. AIT is the primary supplier to ON Semiconductor for Analog 8/14/16 lead PDIP and VHVIC 16 lead PDIP products. The VHVIC 8 lead PDIP package will be qualified to run specific devices that are currently processed at ASE's Penang, Malaysia location. This is not a transfer but a capacity expansion. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductor standards. Samples are available upon request. At the expiration of this PCN, the devices listed below may be processed at either manufacturing location depending on capacity and demand requirements. Issue Date: 13 May, 2004 Page 1 of 3 Final Product/Process Change Notification #13467 RELIABILITY DATA SUMMARY: RELIABILITY Plan: Package = 8 Lead PDIP, Devices = MC44608P40, NCP1200P60 Test Conditions Interval SS results A/clave HAST UHAST Temp Cycle BPS BS DSS Ta=121degC, P=15 psig, RH = 100% Ta=130degC, P=18.8 psig, RH = 85%, Ta=130degC, P=18.8 psig, RH = 85%, Ta=-65 to +150degC Bond Pull Strength Bond Shear Test Die Shear Strength 96 hrs 96 hrs 96 hrs 500 cyc 2x80, 2x80, 2x80, 2x80, 3x10 3x10 3x10 80 80 80 80 0/240 0/240 0/240 0/240 0/30 0/30 0/30 ELECTRICAL CHARACTERISTIC SUMMARY: Datasheet specifications will remain unchanged. Parts will continue to meet Jedec Standard Package Specifications. CHANGED PART IDENTIFICATION: Parts marked with Date Code 0423. AFFECTED DEVICE LIST(WITHOUT SPECIALS): PART MC33260P MC44608P100 MC44608P40 MC44608P75 NCP1200AP100 NCP1200AP100G NCP1200AP40 NCP1200AP40G NCP1200AP60 NCP1200P100 NCP1200P100G NCP1200P40 NCP1200P40G NCP1200P60 NCP1200P60G NCP1201P100 NCP1201P60 NCP1203P100 NCP1203P40 NCP1203P60 NCP1205P NCP1205PG NCP1207P NCP1212P NCP1216P100 NCP1216P133 NCP1216P65 NCP1217P100 NCP1217P133 Issue Date: 13 May, 2004 Page 2 of 3 Final Product/Process Change Notification #13467 NCP1217P65 NCP1230AP100 NCP1230AP133 NCP1230AP65 NCP1230P100 NCP1230P133 NCP1230P65 NCP1231P100 NCP1231P133 NCP1231P65 NCP1377BP NCP1377P NCP1378P NCP1390P NCP1601P NCP1653P Issue Date: 13 May, 2004 Page 3 of 3