DISCRETE SEMICONDUCTORS DATA SHEET M3D184 BZA100 18-fold ESD transient voltage suppressor Product specification Supersedes data of 1996 Mar 21 1997 Dec 02 Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor BZA100 FEATURES DESCRIPTION • SO20 SMD package allows 18 separate voltage regulator diodes in a common anode configuration 18-fold monolitic transient voltage suppressor. Its 18-fold junction common anode design protects 18 separate lines using only one package. This device is ideal for situations where board space is a premium. • Working voltage: typ. 6.8 V • Forward voltage: max. 1.3 V • Maximum reverse peak power dissipation: 27.5 W at tp = 1 ms • Maximum clamping voltage at peak pulse current: 11 V at 2.5 A PINNING handbook, 4 columns • Low leakage current: max. 2 µA • ESD rating >8 kV, according IEC 801-2. APPLICATIONS • Where transient overvoltage protection in voltage and ESD sensitive equipment is required such as: k1 1 20 k18 k2 2 19 k17 k3 3 18 k16 k4 4 17 k15 k5 5 PIN DESCRIPTION cathode (k1 to k5) 1 to 5 6 and 16 common anode (a1; a2) 7 to 15 cathode (k6 to k14) 17 to 20 cathode (k15 to k18) 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 16 a2 SO20 a1 6 15 k14 k6 7 14 k13 k7 8 13 k12 k8 9 12 k11 k9 10 11 k10 MBG396 – Computers – Printers – Business machines – Communication systems Fig.1 Pin configuration for SO20 (SOT163-1) and symbol. – Medical equipment. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT IZ working current − note 1 mA IF continuous forward current − 200 mA IFSM non-repetitive peak forward current tp = 1 ms; square pulse − 4 A IZSM non-repetitive peak reverse current tp = 1 ms; square pulse; see Fig.2 − 2.5 A Ptot total power dissipation see Fig.3 up to Ts = 60 °C; note 2 − 1.6 W up to Tamb = 25 °C; note 3 − 1.25 W − 27.5 W PZSM non-repetitive peak reverse power dissipation tp = 1 ms; square pulse; see Fig.4 Tstg storage temperature −65 +150 °C Tj operating junction temperature − 150 °C Notes 1. DC working current limited by Ptot max. 2. One or more diodes loaded; Ts is the temperature at the soldering point. 3. One or more diodes loaded; device mounted on a printed-circuit board with Rth a-s = 43.5 K/W. 1997 Dec 02 2 Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor BZA100 THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-s thermal resistance from junction to soldering point Rth j-a thermal resistance from junction to ambient CONDITIONS VALUE UNIT one or more diodes loaded 56.5 K/W 100 K/W MAX. UNIT ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. Per diode VZ working voltage VF VZSM IZ = 5 mA 6.4 6.8 7.2 V forward voltage IF = 200 mA − − 1.3 V non-repetitive peak reverse voltage tp = 1 ms; IZSM = 2.5 A − − 11 V IR reverse current VR = 5.25 V − − 2 µA rdif differential resistance IZ = 1 mA − − 40 Ω IZ = 5 mA − − 8 Ω − 3 − mV/K VR = 0; f = 1 MHz − − 120 pF VR = 5.25 V; f = 1 MHz − − 60 pF SZ temperature coefficient of working voltage IZ = 5mA Cd diode capacitance see Fig.5 1997 Dec 02 3 Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor BZA100 GRAPHICAL DATA MBG393 MBG394 10 2.4 handbook, halfpage handbook, halfpage Ptot (W) IZSM (A) 1.6 1 0.8 10−1 10−1 1 10 0 10 2 t (ms) 103 p 0 50 100 Ts (oC) 150 All diodes loaded. Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Fig.3 Power derating curve. MBG395 2 10halfpage handbook, MBG392 100 handbook, halfpage Cd (pF) PZSM (W) 80 10 60 1 10−1 1 10 40 10 2 t (ms) 103 p 0 2 4 VR (V) 6 PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Tj = 25 °C; f = 1 MHz. Fig.4 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). 1997 Dec 02 Fig.5 4 Diode capacitance as a function of reverse voltage; typical values. Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor BZA100 PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1997 Dec 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 5 Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor BZA100 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Dec 02 6 Philips Semiconductors Product specification 18-fold ESD transient voltage suppressor NOTES 1997 Dec 02 7 BZA100 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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