RH119 - SPEC NO. 05-08-5026

SPEC NO. 05-08-5026 REV. U
REV
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RH119, HIGH PERFORMANCE DUAL COMPARATOR
REVISION RECORD
DESCRIPTION
DATE
07/10/96
09/25/96
INITIAL RELEASE
DELETION OF PARAGRAPHS 3.12.1, 3.12.2, AND INCORPORATION OF PARAGRAPH 3.12.1 INTO
PARAGRAPH 3.12, PAGE 4. PARAGRAPH 4.4.3 MOVED FROM PAGE 5 TO PAGE 4.
• PAGE 2: ADDED PARAGRAPHS 3.2.1, 3.2.2, AND 3.2.3. PARAGRAPH 3.3.b, ADDED “SEE
PARAGRAPH 3.2”.
• PAGE 3: ADDED PARAGRAPHS 3.8.1, 3.8.2, AND 3.8.3.
• PAGE 4: 4.4.2, GROUP B INSPECTION, REDEFINED.
• PAGE 5: PARAGRAPH 4.4.3, GROUP D INSPECTION, REDEFINED. PARAGRAPH 4.5, SOURCE
INSPECTION, REDEFINED.
• PAGE 6: ADDED θja AND θjc TO FIGURE 1, TO5 CASE OUTLINE.
• PAGE 7: ADDED θja AND θjc TO FIGURE 2, CERAMIC DIP CASE OUTLINE.
• PAGE 8: ADDED θja AND θjc TO FIGURE 3, BOTTOM BRAZED FLATPACK CASE OUTLINE.
PAGE 4, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
ADDED OPTION 4, 10 LEAD GLASS SEALED FLATPACK.
PAGE 6, 7, 8, CHANGED θja AND θjc .
• PAGE 3: PARAGRAPHS 3.2.1, 3.2.2, 3.2.3, 3.2.4, FIGURES 1, 2, 3 AND 4 REMOVED.
• PAGE 4: PARAGRAPHS 3.7 AND PARAGRAPH 3.9 CHANGED VERBIAGE IN LINE 2 OF EACH
PARAGRAPH.
• PAGE 5: PARAGRAPHS 4.3, 4.4.1, 4.4.2.2 CHANGED VERBIAGE IN LINE 2 OF EACH
PARAGRAPH.
• PAGE 6: PARAGRAPHS 4.4.3.2 CHANGED VERBIAGE IN LINE 1.
PAGE 9: CHANGED θja FROM +225°C/W TO +170°C/W AND θjc FROM +40°C/W TO 18°C/W PER
PACKAGE ENGINEERING.
PAGE 9: CHANGED θja FROM +170°C/W TO +160°C/W PER PACKAGE ENGINEERING.
CHANGED DELTA IB LIMITS FROM 50na TO 100na. CONVERSION OF SPECIFICATION FROM
WORD PERFECT TO MSWORD.
• PAGE 2, AN ADDITIONAL REVISION RECORD PAGE WAS INSTALLED.
11/25/97
02/23/98
05/29/98
09/24/99
11/19/99
09/05/00
01/09/01
08/29/01
03/26/02
CONTINUED ON NEXT PAGE…..
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
APPLICATION
1
U
18
U
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
2
U
19
U
3
U
20
U
4
U
5
U
SIGNOFFS
6
U
7
U
DATE
8
U
9
U
10
U
11
U
12
U
13
U
14
U
15
U
16
U
17
U
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH119, HIGH PERFORMANCE
DUAL COMPARATOR
SIZE CAGE CODE DRAWING NUMBER REV
64155
05-08-5026
U
CONTRACT:
FOR OFFICIAL USE ONLY
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 1 of 20
SPEC NO. 05-08-5026 REV. U
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RH119, HIGH PERFORMANCE DUAL COMPARATOR
REVISION RECORD
DESCRIPTION
• PAGE 3:
PARAGRAPH 3.2, DELETED OPTION 3, RH119WB, RENUMBERED PARAGRAPH AND OPTIONS.
• PAGE 4:
PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.8, DELETED OPTION 3, RH119WB BURN-IN FIGURES, RENUMBERED
PARAGRAPHS AND OPTIONS.
PARAGRAPH 3.10.1, DELETED FIGURE 3, RH119WB CASE OUTLINE, RENUMBERED FIGURES.
PARAGRAPH 3.10.2, RENUMBERED TERMINAL CONNECTIONS FIGURES.
PARAGRAPH 3.10.3, RENUMBERED LEAD MATERIAL AND FINISH DEVICE OPTIONS.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
Second” TO “…dosage rate of less than or equal to 10 Rads per second”.
• PAGE 5:
PARAGRAPH 3.11.3, FIGURE 14 CHANGED TO FIGURE 13.
PARAGRAPHS 4.1 THROUGH 4.4.2 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
• PAGE 6:
PARAGRAPHS 4.4.2.1 THROUGH 4.4.3 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
• PAGE 7:
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
• DELETED CASE OUTLINE, TERMINAL CONNECTION, AND STATIC / DYNAMIC BURN-IN
FIGURES FOR RH119WB (BOTTOM BRAZED PACKAGE).
• PAGES 8 THROUGH 18, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
• PAGE 11, MOVED FIGURES TO BETTER FIT ON THE PAGE.
• PAGE 19, TABLES I, II AND CORRESPONDING NOTES ALL ON ONE PAGE.
• PAGE 1:
REMOVED REDUNDANT INFORMATION ALREADY SPECIFIED IN REVISION J REGARDING THE
CONVERSION FROM WORD PERFECT TO MICROSOFT WORD.
CORRECTED CAGE CODE FROM 94155 TO 64155.
• PAGE 3: CORRECTED DEVICE TYPE OPTION 2 FROM RH119J14 TO RH119J.
• PAGE 20:
TABLE IV, ELECTRICAL TEST REQUIREMENTS: SUBGROUPS 5 AND 6 WERE ADDED TO THE
FINAL ELECTRICAL TEST REQUIREMENTS AND GROUP A TEST REQUIREMENTS.
• PAGE 18, TABLES I AND II CHANGED TO MATCH THE DATASHEET. OUTPUT LEAKAGE
CURRENT CHANGED VOUT 35V TO V = 35V.
• ENTIRE SPECIFICATION REVISED TO M. SPEC VERBIAGE REDUCED TO PAGES 3 – 6
MAKING THE SPEC 19 PAGES INSTEAD OF 20 PAGES.
• PAGE 9, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD
LOCATION.
• PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC
• PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED TO
3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
• PAGE 4, PARAGRAPH 3.10.3 ADDED OPTION 3 IS ALLOY 42 FOR FLATPACK.
• TABLE 1: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) OUTPUT LEAKAGE
CURRENT CHANGED FROM Vin < 5mV, TO Vin > 5mV. FIGURE 7 STATIC B/I CHANGED NOTES:
2 FROM Tj = 194°C MAX. AT 150°C AMBIENT TO Ta = 125°C. CHANGED NOTES: 3 FROM Tj =
169°C MAX. AT 125°C AMBIENT TO Tj = +166°C MAX AT 150°C/W. CHANGED NOTES: 4 FROM
BURN-IN VOLTAGES:V1 = +18V TO + 19.8V. V2 = -18V TO -19.8V. TO Tc = +149°CMIN AT
40°C/W. ADDED NOTE: 5 BURN-IN VOLTAGES: V1 = +15V TO +16.5V. V2 = -15V TO -16.5V.
DATE
03/26/02
05/30/02
12/03/02
5/19/03
03/15/05
01/07/08
CONTINUED ON NEXT PAGE
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LINEAR TECHNOLOGY CORPORATION
Page 2 of 20
SPEC NO. 05-08-5026 REV. U
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RH119, HIGH PERFORMANCE DUAL COMPARATOR
REVISION RECORD
DESCRIPTION
FIGURE 9 STATIC B/I CHANGED NOTE: 2 FROM Tj = 182°C MAX AT Ta OF 150°C TO Ta = +125°C.
CHANGED NOTE: 3 FROM Tj = 157°C MAX AT Ta OF 125°C TO Tj = +154°C MAX AT 95°C/W.
CHANGED NOTE: 4 FROM BURN-IN VOLTAGES: V1 = +18V TO +19.8V. V2 = -18V TO -19.8V. TO
Tc = +140°C MIN AT 25°C/W. ADDED NOTE 5 BURN-IN VOLTAGE: V1 = +15V TO +16.5V. V2 = -15
TO -16.5V FIGURE 11 STATIC B/I CHANGED NOTE: 2 FROM Tj = 197°C MAX FOR Ta OF 150°C TO
Ta = +125°C. NOTE: 3 CHANGED FROM Tj = 172°C MAX FOR Ta OF 125°C TO Tj = +170°C MAX AT
170°C/W. CHANGED NOTE: 4 FROM BURN-IN VOLTAGES: V1 = +18V TO +19.8V. V2 = -18V TO 19.8V. TO Tc = +153°C MIN AT 40°C/W. ADDED NOTE 5 BURN-IN VOLTAGE: V1 = +15V TO
+16.5V. V2 = -15 TO -16.5V. PER PRODUCT ENG.
• PAGE 5 PARAGRAPH 3.10.3 CHANGED OPTION 2 TO ALLOY 42 PACKAGE
REQUIREMENT.
• PAGE 6 PARAGRAPH 3.11.1 CHANGED VERBIAGE.
• PAGE 6, PARAGRAPH 4.4.2 CHANGED VERBIAGE.
• PAGE 10, FIGURE 3 NOTE 2 ADDED TO LEAD THICKNESS.
• PAGE 12, FIGURE 7, PAGE 14, FIGURE 9, PAGE 16, FIGURE 11, BURN IN CIRCUITS
AMENDED.
DATE
01/07/08
05/13/08
06/12/08
11/10/08
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 3 of 20
SPEC NO. 05-08-5026 REV. U
1.0
SCOPE:
1.1
2.0
RH119, HIGH PERFORMANCE DUAL COMPARATOR
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH119 High Performance
Comparator, processed to space level manufacturing flow.
3.2
Part Number:
3.3
3.2.1
Option 1 – RH119H (TO5 Metal Can, 10 Leads)
3.2.2
Option 2 – RH119J (Ceramic Dip, 14 Leads)
3.2.3
Option 3 – RH119W (Glass Sealed Flatpack, 10 Leads)
Part Marking Includes:
a.
LTC Logo
b.
LTC Part Number (See Paragraph 3.2)
c.
Date Code
d.
Serial Number
e.
ESD Identifier per MIL-PRF-38535, Appendix A
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LINEAR TECHNOLOGY CORPORATION
Page 4 of 20
SPEC NO. 05-08-5026 REV. U
3.4
RH119, HIGH PERFORMANCE DUAL COMPARATOR
The Absolute Maximum Ratings:
Supply Voltage
. . . . . .
Output to Negative Supply Voltage
Ground to Negative Supply Voltage
Ground to Positive Supply Voltage
Differential Input Voltage . . .
Differential Input Current
Input Voltage (See Note 1)
Output Short-Circuit Duration
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
. . . . . . . . . . 36V
. . . . . . . . . 36V
. . . . . . . . . 25V
. . . . . . . . . 18V
. . . . . . . . . . +5V
. . . . . . . . . . +5mA
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10 Sec
-55°C to +125°C
-65°C to +150°C
+300°C
Note 1: For supply voltages less than +15V, the maximum input voltage is equal to the supply voltage.
3.5
Electrostatic discharge sensitivity, ESDS, shall be Class 2.
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
3.7
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.8
Burn-In Requirement:
3.8.1
Option 1 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8
3.8.2
Option 2 (Ceramic Dip): Static Burn-In, Figure 9; Dynamic Burn-In, Figure 10
3.8.3
Option 3 (Glass Sealed Flatpack) : Static Burn-In, Figure 11; Dynamic Burn-In, Figure 12
3.9
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after each
burn-in, and the delta rejects are included in the PDA calculation.
3.10
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.11
3.10.1
Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1, Figure 2, and Figure 3.
3.10.2
Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5,
and Figure 6.
3.10.3
Lead Material and Finish: The lead material and finish for Device Options 1, shall be Kovar.
Option 2, 3 is Alloy 42. The lead finishes shall be hot solder dip (Finish letter A) in accordance
with MIL-PRF-38535.
Radiation Hardness Assurance (RHA):
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Page 5 of 20
SPEC NO. 05-08-5026 REV. U
3.11.1
3.11.2
3.11.3
4.0
RH119, HIGH PERFORMANCE DUAL COMPARATOR
The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as
a guideline.
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
Total dose bias circuit is specified in Figure 13.
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: To side glassivation thickness shall be a minimum of 4KÅ.
3.13
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
4.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
4.3
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in Table IV herein.
4.3.1
4.4
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2
(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior
to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack
is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or
may not be from devices built in the same package style as the current inspection lot. Attributes
and variables data for this subgroup will be provided upon request at no charge.
4.4.2.1
Group B, Subgroup 2c = 10%
Group B, Subgroup 3 = 10%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
whichever is the larger quantity)
Group B, Subgroup 4 = 5%
Group B, Subgroup 6 = 15%
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LINEAR TECHNOLOGY CORPORATION
Page 6 of 20
SPEC NO. 05-08-5026 REV. U
4.4.3
4.5
4.6
RH119, HIGH PERFORMANCE DUAL COMPARATOR
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each assembly
location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is
ordered.
4.4.3.1
Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2
All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The
quantity (accept number) or sample number and accept number of all other subgroups
are per MIL-STD-883, Method 5005, Table IV.
Source Inspection:
4.5.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal
visual.
4.5.2
The procuring activity has the right to perform source inspection at the supplier’s facility prior to
shipment for each lot of deliverables when specified as a customer purchase order line item. This
may include wafer lot acceptance and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1
Lot Serial Number Sheets identifying all devices accepted through final inspection by serial
number.
4.6.2
100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3
Burn-In Variables Data and Deltas (if applicable)
4.6.4
Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5
Generic Group D data (4.4.3 herein)
4.6.6
SEM photographs (3.13 herein)
4.6.7
Wafer Lot Acceptance Report (3.13 herein)
4.6.8
X-Ray Negatives and Radiographic Report
4.6.9
A copy of outside test laboratory radiation report if ordered
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted
on the Purchase Order Review Form as “No Charge Data”.
5.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices
shall be packaged in conductive material or packaged in anti-static material with an external conductive field
shielding barrier.
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LINEAR TECHNOLOGY CORPORATION
Page 7 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DEVICE OPTION # 1
(H) TO5 / 10 LEADS CASE OUTLINE
NOTE: 1. LEAD DIAMETER IS UNCONTROLLED BETWEEN
THE REFERENCE PLANE AND SEATING PLAN.
θja = +150°C/W
θjc = +40°C/W
2. FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS 0.016 – 0.024
(0.406 – 0.610)
FIGURE 1
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Page 8 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DEVICE OPTION # 2
(J14) CERAMIC DIP / 14 LEADS CASE OUTLINE
NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. 14 LEAD D MAX = .0785 (19.939)
θja = +95°C/W
θjc = +25°C/W
FIGURE 2
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Page 9 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DEVICE OPTION # 3
(W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR OFFCENTER LID, MENISCUS AND GLASS OVER RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH
WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +170°C/W
θjc = +40°C/W
FIGURE 3
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Page 10 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
TERMINAL CONNECTIONS
DEVICE OPTION #1, TO5 10 LEAD METAL CAN
DEVICE OPTION #2, 14 LEAD CERAMIC DIP
FIGURE 4
DEVICE OPTION #3, GLASS SEALED
10 LEAD FLATPACK
FIGURE 5
FIGURE 6
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LINEAR TECHNOLOGY CORPORATION
Page 11 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
STATIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 10 LEADS
FIGURE 7
θja = 150°C/W
θjc = 40°C/W
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LINEAR TECHNOLOGY CORPORATION
Page 12 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DYNAMIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 10 LEADS
FIGURE 8
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Page 13 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
STATIC BURN-IN CIRCUIT
OPTION #2, CERDIP / 14 LEADS
FIGURE 9
θja = 95°C/W
θjc = 25°C/W
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LINEAR TECHNOLOGY CORPORATION
Page 14 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DYNAMIC BURN-IN CIRCUIT
OPTION 2, CERDIP / 14 LEADS
FIGURE 10
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Page 15 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
STATIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 11
θja = 170°C/W
θjc = 40°C/W
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Page 16 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
DYNAMIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 12
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Page 17 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
TOTAL DOSE BIAS CIRCUIT
FIGURE 13
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Page 18 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 2
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 5
SEE ELECTRICAL CHARACTERISTICS NOTES ON NEXT PAGE.
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LINEAR TECHNOLOGY CORPORATION
Page 19 of 20
SPEC NO. 05-08-5026 REV. U
RH119, HIGH PERFORMANCE DUAL COMPARATOR
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TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
TA = 25°C, VCC = +15V
PARAMETER
VOS
+IIB
-IIB
ENDPOINT LIMIT
MIN
MAX
-4
+4
-0.1
+500
-0.1
+500
DELTA
MIN
-1
-100
-100
MAX
1
100
100
UNITS
mV
nA
nA
TABLE IV: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
FINAL ELECTRICAL TEST REQUIREMENTS (METHOD
5004)
GROUP A TEST REQUIREMENTS (METHOD 5005)
GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL
PARAMETERS (METHOD 5005)
SUBGROUP
1*, 2, 3, 4, 5, 6
1, 2, 3, 4, 5, 6
1, 2, 3
*PDA APPLIES TO SUBGROUP 1.
PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the
final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1 and
delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to determine
the percent for the lot.
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Page 20 of 20