Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PPAK TSC75-6L (POWER IC) Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 55 5,500 130 °C, 85 % RH 0 0.00 Pressure Pot 55 5,280 121°, 15 PSIG 0 0.00 Solder DUNK 110 330 260 °C, 10 SEC 0 0.00 Temp Cycle 55 13,750 - 65 °C - 150 °C 0 0.00 Document Number: 74466 05-Dec-06 www.vishay.com 1