Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MINIQFN-6L
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
85/85
165
27,720
85 °C, 85 % RH
0
0.00
BOND INT
80
40,000
200 °C + N2
0
0.00
HAST
165
16,500
130 °C, 85 % RH
0
0.00
Pressure Pot
165
15,840
121°, 15 PSIG
0
0.00
Solder DUNK
55
165
260 °C, 10 SEC
0
0.00
Temp Cycle
165
82,500
- 65 °C to 150 °C
0
0.00
Document Number: 73797
28-Mar-07
www.vishay.com
1