Final Product/Process Change Notification Document # : FPCN16790XDH Issue Date: 7 October 2015 Title of Change: Final PCN for wafer fab transfer from Gifu in Japan to United Microelectronics Corp (UMC) in Taiwan (Group DH). Proposed first ship date: 14 January 2016 Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]> Samples: Contact your local ON Semiconductor Sales Office Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]>. Type of notification: This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to implementation of the change. ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>. Change Part Identification: Affected products will be identified with date code. Change category: Wafer Fab Change Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Sites Affected: All site(s) not applicable Assembly Change Test Change Other _______________ Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ Material Change Product specific change ON Semiconductor site(s) : ON Gifu, Japan External Foundry/Subcon site(s) UNITED MICROELECTRONICS CORP Taiwan Description and Purpose: This is a Final Process Change Notification to announce the transfer of products from ON Semiconductor wafer fabrication sites located in Gifu Japan to the wafer fabrication United Microelectronics Corp (UMC) in Taiwan. The product design and electrical specifications will remain identical. A full electrical characterization over the temperature range will be performed for each product to check the device functionality and electrical specifications. Reliability Data Summary: Test Specification Condition Interval Results HTRB JESD22-A108 Ta=150°C, 100% max rated VDSS 1008 hrs 0/22 HTGB JESD22-A108 Ta=150°C, 100% max rated VGSS 1008 hrs 0/22 HTSL JESD22-A103 Ta=150°C 1008 hrs 0/22 IOL MIL-STD-750 (M1037) AEC-Q101 delta Tj=100°C 7500 cyc 0/22 TC JESD22-A104 Ta= -55°C to +150°C 200 cyc 0/22 3 JESD22-A110 85°C, 85% RH, 80% max rated VDSS 1008 hrs 0/22 AC JESD22-A118 121°C, 100% RH, 2.03×105Pa, unbiased 96 hrs 0/22 PC J-STD-020 JESD-A113 RSH JESD22- B106 Ta = 265C, 10 sec 0/22 SD JSTD002 Ta = 245C, 10 sec 0/22 H TRB TEM001092 Rev. E MSL 1 @ 260°C Page 1 of 2 Final Product/Process Change Notification Document # : FPCN16790XDH Issue Date: 7 October 2015 Electrical Characteristic Summary: There is no change in the electrical performance. Datasheet specifications remain unchanged. List of Affected Standard Parts: Part Number ATP212-TL-H TEM001092 Rev. E Qualification Vehicle ATP401-TL-H Page 2 of 2