Update Notification Document # : FPCN20386XB1 Issue Date: 6 April 2016 Title of Change: Reliability data Update to FPCN20386XB - Qualification of ON Semiconductor Vietnam (OSV) for the Assembly and Test of the listed SCR products in DPAK package. Proposed first ship date: 23 May 2016 or earlier upon customers approval Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]> Samples: Contact your local ON Semiconductor Sales Office or <[email protected]> Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]> Type of notification: ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>. Wafer Fab Change Change category: Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Sites Affected: All site(s) not applicable Assembly Change Test Change Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ Material Change Product specific change ON Semiconductor site(s) : ON Dong Nai Province, Vietnam ON Seremban, Malaysia Other _______________ External Foundry/Subcon site(s) Description and Purpose: This Update Notification is issued to customers to provide updated modification Reliability data of HTRB and HTFB test from the qualification vehicle of MCR12DSNT4G. FPCN 20386XB was issued on 15th Feb, 2016 to include additional SCR devices. This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of DPAK discrete packaged products, currently built at ON Semiconductor Seremban, Malaysia facility to ON Semiconductor Vietnam (OSV). Upon the expiration of this FPCN, SCR devices may be processed at either location. These products have been qualified to commodity/commercial requirements. These products will continue being Pb-free, Halide free and RoHS compliant. Reliability Data Summary: QV DEVICE NAME: MCR12DSNT4G PACKAGE: DPAK Test Specification Interval Sample size Results HTRB JESD22-A108 Ta= 100°C, Tj(est) =110C, 80% max rated V 1008 hrs 84 pcs/3 lots 0/252 HTFB JESD22-A108 Ta= 100°C, Tj(est) =110C, 80% max rated V 1008 hrs 84 pcs/3 lots 0/252 HTSL Ta= 150°C 1008 hrs 84 pcs/3 lots 0/252 Ta= +25°C, delta Tj= 100°C On/off = 2min 15000 cyc 84 pcs/3 lots 0/252 TC JESD22-A103 MIL-STD-750 (M1037) AEC-Q101 JESD22-A104 Ta= -65°C to +150°C 1000 cyc 84 pcs/3 lots 0/252 H3TRB JESD22-A101 85°C, 85% RH, 18.8psig, bias 1008 hrs 84 pcs/3 lots 0/252 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased PC J-STD-020 JESD-A113 RSH SD IOL TEM001153 Rev. C Condition 84 pcs/3 lots 0/252 MSL 1 @ 260°C 96 hrs 336 pcs/3 lots 0/1008 JESD22- B106 Ta= 265°C, 10 sec 30 pcs/3 lots 0/90 JSTD002 Ta= 245°C, 10 sec 15 pcs/3 lots 0/45 Page 1 of 2 Update Notification Document # : FPCN20386XB1 Issue Date: 6 April 2016 Electrical Characteristic Summary: Electrical characteristics are not impacted. List of Affected Standard Parts: Part Number TEM001153 Rev. C Qualification Vehicle MCR12DCMT4G MCR12DSNT4G MCR8DCNT4G MCR12DSNT4G MCR8DSNT4G MCR12DSNT4G Page 2 of 2