FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 21-AUG-2002 SUBJECT: ON Semiconductor Final Product/Process Change Notification #12517 TITLE: Redesign of Analog Microprocessor Reset Monitors Devices EFFECTIVE DATE: 20-Oct-2002 AFFECTED CHANGE CATEGORY: SUBCONTRACTOR FAB SITE SUBCONTRACTOR TEST SITE MARKING PROCESS DESIGN CHANGE AFFECTED PRODUCT DIVISION: Analog Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Joe Duffalo <FFBH9W @onsemi.com> SAMPLES: Contact your local ON Semiconductor Sales Office or Bett Lofts <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Bett Lofts <[email protected]> DISCLAIMER: Final Product/Process Change Notification (FPCN) - Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: ON Semiconductor wishes to announce the redesign and manufacturing site change of the MAX809JTR, MAX809MTR, MAX809RTR, MAX809TTR, MAX810LTR, MAX810MTR, MAX810RTR, MAX810STR, MAX810TTR devices. Parametric performance is unchanged with the exception of supply current and maximum transient duration, both of which are improved in the redesigned versions. There are no functional changes or specification changes other than the improvements in supply current and maximum transient duration. The redesigned devices will be fabricated at our ON Aizu-6 facility in Aizu,Japan and assembly and final test will be done at ON's Seremban, Malaysia facility. Both the ON Aizu-6 and Seremban sites have been QS9000 certified. ON Semiconductor will provide modified datasheets, samples, and reliability reports for the redesigned devices upon request. Please contact your ON Sales representative or the personnel listed on this notification if there is any additional information or technical support required to transition to the redesigned devices. Production will be converted to the redesigned devices upon expiration of this notification. Issue Date: 21 Aug, 2002 Page 1 of 3 Final Product/Process Change Notification #12517 RELIABILITY DATA SUMMARY: Description The MAX809 and MAX810 are cost-effective system supervisor circuits designed to monitor VCC in digital systems and provide a reset signal to the host processor when necessary. No external components are required. The reset output is driven active within 20 msec of VCC falling through the reset voltage threshold. Reset is maintained active for a minimum of 140 msec after VCC rises above the reset threshold. The MAX810 has an active-high RESET output while the MAX809 has an activelow RESET output. Die Related Testing Lot Device A0714A MAX809SN320T1 A0714B MAX809SN320T1 A0714C MAX809SN320T1 Test Conditions Read Point HTOL Biased @ TJ=125DegC 1008 HTOL Biased @ TJ=125DegC 1008 HTOL Biased @ TJ=125DegC 1008 Package Related Testing Lot Device A0714A MAX809SN320T1 A0714A MAX809SN320T1 A0714B MAX809SN320T1 A0714C MAX809SN320T1 A0714A MAX809SN320T1 A0714B MAX809SN320T1 A0714C MAX809SN320T1 A0714A MAX809SN320T1 A0714B MAX809SN320T1 A0714C MAX809SN320T1 A0714A MAX809SN320T1 A0714B MAX809SN320T1 A0714C MAX809SN320T1 Test Conditions HTB TA = 175DegC PC MSL 1 @ 220DegC PC MSL 1 @ 220DegC PC MSL 1 @ 220DegC HAST-PC Biased@TA=130DegC;RH HAST-PC Biased@TA=130DegC;RH HAST-PC Biased@TA=130DegC;RH AC-PC TA =121DegC; RH =100% AC-PC TA =121DegC; RH =100% AC-PC TA =121DegC; RH =100% TC-PC TA=(-65DegC to +150DegC) TC-PC TA=(-65DegC to +150DegC) TC-PC TA=(-65DegC to +150DegC) Quality Indices Device Test MAX809SN320T1 ESD-HBM MAX809SN320T1 ESD-MM MAX809SN320T1 LUMAX809SN320T1 LU+ Results 2000 350 200 200 Fail 0 0 0 SS 80 80 80 Read Point 504 EP EP EP 96 96 96 96 96 96 1000 1000 1000 Fail 0 0 0 0 0 0 0 0 0 0 0 0 0 SS 80 240 240 240 80 80 80 80 80 80 80 80 80 Units V V mA mA Summary The device/devices qualified meets the most appropriate stress tests as outlined by ON Semiconductor's 12MSB17722C Reliability specification. The use of generic data for qualification is based on a matrix of specific requirements associated with the major characteristics of the device and manufacturing process. The devices under test (DUT) were comprised of representative samples from the qualification family. Manufacturing variability and its impact on reliability was assessed. The DUT were fabricated and assembled in the same production site and the same process for which the device and qualification family was manufactured in production. This product and its associated processes meet or exceed ON Semiconductor's Reliability requirements. The qualification data set in this report is applicable to other devices which are generically equivalent. Issue Date: 21 Aug, 2002 Page 2 of 3 Final Product/Process Change Notification #12517 ELECTRICAL CHARACTERISTIC SUMMARY: Old device: Supply Current Typ(uA) Max (uA) MAX809JTR,MAX809/810MTR, MAX810LTR: VCC < 5.5 V 24 60 MAX809/810RTR,MAX809/810TTR,MAX810STR: VCC < 3.6 V 17 50 New Device: Supply Current V CC = 3.3 V T A = -40DegC to +85DegC T A = 85DegC to +105DegC V CC = 5.5 V T A = -40DegC to +85DegC T A = +85DegC to +105DegC Typical(uA) Max (uA) 0.5 1.2 2.0 Typical(uA) Max (uA) 0.8 1.8 2.5 Old device: V CC to Reset Delay V CC = V TH to (V TH - 100 mV): 20usec New device: V CC to Reset Delay V CC = V TH to (V TH - 100 mV): 10usec CHANGED PART IDENTIFICATION: Redesigned material can be distinguished by the marking scheme: MAX809JTR (OLD Device):J6 MAX809JTR (Redesigned Device):SPR MAX809MTR (OLD Device):J2 MAX809MTR (Redesigned Device):SPV MAX809RTR (OLD Device):J5 MAX809RTR (Redesigned Device):SPS MAX809TTR (OLD Device):J3 MAX809TTR (Redesigned Device):SPU MAX810LTR (OLD Device):K1 MAX810LTR (Redesigned Device):SQB MAX810MTR (OLD Device):K2 MAX810MTR (Redesigned Device):SQA MAX810RTR (OLD Device):K3 MAX810RTR (Redesigned Device):SPX MAX810STR (OLD Device):K4 MAX810STR (Redesigned Device):SPY MAX810TTR (OLD Device):K5 MAX810TTR (Redesigned Device):SPZ AFFECTED DEVICE LIST (WITHOUT SPECIALS): PART MAX809JTR MAX809MTR MAX809RTR MAX809TTR MAX810LTR MAX810MTR Issue Date: 21 Aug, 2002 MAX810RTR MAX810STR MAX810TTR Page 3 of 3