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PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
12-APR-2001
SUBJECT: Product/Process Change Notification #11162
TITLE: Replacement of selected Analog Microprocessor Reset Devices: MAX809LTR, MAX8
09STR
EFFECTIVE DATE: 19-Jul-2001
AFFECTED CHANGE CATEGORIES:
SUBCONTRACTOR FAB SITE
SUBCONTRACTOR TEST SITE
MARKING PROCESS
DESIGN CHANGE
AFFECTED PRODUCT DIVISION: Analog Products
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office.
or Don Warring <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office.
or Gilles Perez <[email protected]>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact Sales Office or Marquita Jones <[email protected]>
DISCLAIMER:
Initial Product/Process Change Notification (IPCN) -First Notification distributed to customers.
Distributed at least 120 days from the effective date of the change.
Final Product/Process Change Notification (FPCN) - Final Notification completing the notification
process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will
consider this change approved unless specific conditions of acceptance are provided in writing within
30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office.
Product/Process Change Notification #11162
Issue Date: 12 April, 2001
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DESCRIPTION AND PURPOSE
ON Semiconductor wishes to announce the redesign and manufacturing site change of the
MAX809LTR and MAX809STR devices. Parametric performance is unchanged with the
exception of supply current and maximum transient duration, both of which are improved in the
redesigned versions. There are no functional changes or specification changes other than the
improvements in supply current and maximum transient duration. The redesigned devices will be
fabricated at our ON Aizu-6 facility in Aizu,Japan and assembly and final test will be done at ON's
Seremban, Malaysia facility. Both the ON Aizu-6 and Seremban sites have been QS9000 certified.
ON Semiconductor will provide modified datasheets, samples, and reliability reports for the redesigned
devices upon request. Please contact your ON Sales representative or the personnel listed on this
notification if there is any additional information or technical support required to
transition to the redesigned devices. Production will be converted to the redesigned devices upon
expiration of this notification.
Redesigned material can be distinguished by the marking scheme:
MAX809LTR (OLD Device):J1
MAX809LTR (Redesigned Device):SPW
MAX809STR (OLD Device):J4
MAX809STR (Redesigned Device):SPT
QUALIFICATION PLAN: Available upon request.
RELIABILITY DATA SUMMARY: Available upon request.
ELECTRICAL CHARACTERISTIC SUMMARY:
Old device:
Supply Current
Typical(uA)
MAX809LTR: V CC < 5.5 V
24
MAX809STR: V CC < 3.6 V
17
Max (uA)
60
50
New Device:
Supply Current
Typical(uA) Max (uA)
V CC = 3.3 V
T A = -40DegC to +85DegC
0.5
1.2
T A = 85DegC to +105DegC
2.0
V CC = 5.5 V
Typical(uA) Max (uA)
T A = -40DegC to +85DegC
0.8
1.8
T A = 85DegC to +105DegC
2.5
Old device:
V CC to Reset Delay V CC = V TH to (V TH - 100 mV): 20usec
New device:
V CC to Reset Delay V CC = V TH to (V TH - 100 mV): 10usec
CHANGED PART IDENTIFICATION:
Marking will change. The current marking for the MAX809LTR is "J1". The new marking for
MAX809LTR will be "SPW". The current marking for the MAX809STR is "J4".
The new marking for MAX809STR will be "SPT".
AFFECTED DEVICE LIST:
PART
MAX809LTR
MAX809STR
Issue Date: 12 April, 2001
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