FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy Issue Date 26-Jul-2006 SUBJECT: ON Semiconductor Final Product/Process Change Notification #15611 TITLE: Final Notification - Qualification of the MAX809 MAX810 NCP803 on the ACMOS2 Technology PROPOSED FIRST SHIP DATE: 26-Sep-2006 AFFECTED CHANGE CATEGORY(S): Die Shrink AFFECTED PRODUCT DIVISION(S): Analog Power Management FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Edmond Gallard <edmond.gallard @onsemi.com> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is the final PCN to IPCN 15005 located at www.onsemi.com announcing the completion of the qualification and redesign of the MAX80, MAX810, and NCP803 on the previous qualified ACMOS2 technology process at ON Semiconductor's MOS7A facility. Die fabrication will continue at the current wafer fab site, ON Semiconductor MOS7A, in Aizu, Japan. Assembly and final test will continue at the current qualified site (ON Semiconductor, Seremban, Malaysia). Issue Date: 26-Jul-2006 Rev.07-02-05 Page 1 of 3 Final Product/Process Change Notification #15611 Device parameters will continue to meet all datasheet specifications and reliability will continue to meet or exceed ON Semiconductor standards. RELIABILITY DATA SUMMARY: Qualification testing included the following: Test Condition Interval SS Results ---------------------------------------------------HTOL Ta=145C 168 hours 1x80 0/80 PC MSL=1 NA 1x160 0/160 3IR@260C TC+PC -65/+150C 500 cycles 1x80 0/80 PC/UHAST TA=130C 96 hours 1x80 0/80 RH=85% PSIG=18.8 ED -40/25/85/125C NA 3 lots PASS ESD HBM (2000V) NA 2 lots PASS MM (200V) NA 2 lots PASS LU ClassII/85C NA 3 lots PASS ELECTRICAL CHARACTERISTIC SUMMARY: Samples and characterization data are available upon request. Datasheet specifications remain unchanged, with the exception that the guaranteed temperature range has been expanded to -40C to +125C. CHANGED PART IDENTIFICATION: Product with a date code after WW30 2006 may be sourced from either ACMOS1 or ACMOS2 die. AFFECTED DEVICE LIST PART MAX809SN160T1 MAX809SN232T1 MAX809RTR MAX809STR MAX809TTR MAX809JTR MAX809MTR MAX809HTR MAX809LTR MAX809SN490T1 MAX810RTR MAX810STR MAX810TTR MAX810MTR Issue Date: 26-Jul-2006 Rev.07-02-05 Page 2 of 3 Final Product/Process Change Notification #15611 AFFECTED DEVICE LIST PART MAX810LTR NCP803SN160T1 NCP803SN232T1 NCP803SN263T1 NCP803SN293T1 NCP803SN308T1 NCP803SN438T1 NCP803SN463T1 Issue Date: 26-Jul-2006 Rev.07-02-05 Page 3 of 3