TEMPFET® BTS 129 Features ● ● ● ● N channel Enhancement mode Temperature sensor with thyristor characteristic The drain pin is electrically shorted to the tab 1 Pin 1 2 3 G D S Type VDS ID RDS(on) Package Ordering Code BTS 129 60 V 27 A 0.05 Ω TO-220AB C67078-A5013-A2 2 3 Maximum Ratings Parameter Symbol Values Unit Drain-source voltage VDS 60 V Drain-gate voltage, RGS = 20 kΩ VDGR 60 Gate-source peak voltage, aperiodic Vgs ± 20 Continuous drain current, TC = 25 °C ID 27 ISO drain current TC = 85 °C, VGS = 10 V, VDS = 0.5 V ID-ISO 7.5 A Pulsed drain current, TC = 25 °C ID puls 108 Short circuit current, Tj = – 55 ... + 150 °C ISC 80 Short circuit dissipation, Tj = – 55 ... + 150 °C PSCmax 1200 Power dissipation Ptot 75 Operating and storage temperature range Tj, Tstg – 55 ... + 150 °C DIN humidity category, DIN 40 040 – E – IEC climatic category, DIN IEC 68-1 – 55/150/56 Thermal resistance Chip-case Chip-ambient Rth JC Rth JA ≤ 1.67 ≤ 75 W K/W 1 19.02.04 TEMPFET® BTS 129 Electrical Characteristics at Tj = 25 °C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. 60 – – 2.5 3.0 3.5 Static Characteristics Drain-source breakdown voltage VGS = 0, ID = 0.25 mA V(BR)DSS Gate threshold voltage VGS = VDS, ID = 1 mA VGS(th) Zero gate voltage drain current VGS = 0 V, VDS = 60 V Tj = 25 °C Tj = 150 °C I DSS Gate-source leakage current VGS = 20 V, VDS = 0 Tj = 25 °C Tj = 150 °C I GSS Drain-source on-state resistance VGS = 10 V, ID =17 A RDS(on) V µA – – 1 100 10 300 – – 10 2 100 4 – 0.04 0.05 8.0 13.0 18.0 700 940 1250 – 500 750 – 180 270 Turn-on time ton, (ton = td(on) + tr) td(on) VCC = 30 V, VGS = 10 V, ID = 3 A, RGS = 50 Ω t – 25 40 – 60 90 Turn-off time toff, (toff = td(off) + tf) td(off) VCC = 30 V, VGS = 10 V, ID = 3 A, RGS = 50 Ω t – 100 130 – 75 95 nA µA Ω Dynamic Characteristics Forward transconductance VDS ≥ 2 × ID × RDS(on)max, ID = 17 A gfs Input capacitance VGS = 0, VDS = 25 V, f = 1 MHz Ciss Output capacitance VGS = 0, VDS = 25 V, f = 1 MHz Coss Reverse transfer capacitance VGS = 0, VDS = 25 V, f = 1 MHz Crss r f 2 S pF ns 19.02.04 TEMPFET® BTS 129 Electrical Characteristics (cont’d) at Tj = 25 °C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. Reverse Diode Continuous source current IS – – 27 Pulsed source current I SM – – 108 Diode forward on-voltage I F = 27 A, VGS = 0 V VSD Reverse recovery time I F = I S, diF/dt = 100 A/µs, VR = 30 V t rr Reverse recovery charge I F = I S, diF/dt = 100 A/µs, VR = 30 V Q rr A V – 1.3 1.8 ns – 150 – µC – 1.0 – 0.7 1.4 1.5 – – 10 – – 10 – – 600 0.05 0.05 0.1 0.2 0.5 0.3 150 – – 0.5 – 2.5 Temperature Sensor Forward voltage ITS(on) = 10 mA, Tj = – 55 ... + 150 °C Sensor override, tp ≤ 100 µs Tj = – 55 ... + 160 °C VTS(on) Forward current Tj = – 55 ... + 150 °C Sensor override, tp ≤ 100 µs Tj = – 55 ... + 160 °C ITS(on) Holding current, VTS(off) = 5 V, Tj = 25 °C Tj = 150 °C IH Switching temperature VTS = 5 V TTS(on) Turn-off time VTS = 5 V, ITS(on) = 2 mA toff 3 V mA °C µs 19.02.04 TEMPFET® BTS 129 Examples for short-circuit protection at Tj = – 55 ... + 150 °C, unless otherwise specified. Parameter Symbol Examples Unit 1 2 – Drain-source voltage VDS 15 30 – Gate-source voltage VGS 8.1 5.9 – Short-circuit current ISC ≤ 80 ≤ 37 – A Short-circuit dissipation PSC 1200 1100 – W Response time Tj = 25 °C, before short circuit tSC(off) ms 25 Short-circuit protection ISC = f (VDS) Parameter: VGS Diagram to determine ISC for Tj = – 55 ... + 150 °C V 25 – Max. gate voltage VGS(SC) = f (VDS) Parameter: Tj = – 55 ... + 150 °C 4 19.02.04 TEMPFET® BTS 129 Safe operating area ID = f (VDS) Parameter: D = 0.01, TC = 25 °C Typical output characteristics ID = f (VDS) Parameter: tp = 80 µs 60 ΙD BTS 129 SIT00562 Ptot = 75W A VGS = 20V 10V 8V 9V 50 7.5V 40 7V 6.5V 30 6V 20 5.5V 5V 10 0 4.5V 4V 0 1 2 3 4 V 5 V DS Drain-source on-state resistance RDS(on) = f (Tj) Parameter: ID = 17 A, VGS = 10 V (spread) Typ. drain-source on-state resistance RDS(on) = f (ID) Parameter: VGS 5 19.02.04 TEMPFET® BTS 129 Typ. transfer characteristic ID = f (VGS) Parameter: tp = 80 µs, VDS = 25 V Typ. transconductance gfs = f (ID) Parameter: tp = 80 µs, VDS = 25 V Gate threshold voltage VGS(th) = f (Tj) Parameter: VDS = VGS, ID = 1 mA Continuous drain current ID = f (TC) Parameter: VGS ≥ 10 V 6 19.02.04 TEMPFET® BTS 129 Typ. gate-source leakage current IGSS = f (TC) Parameter: VGS = 20 V, VDS = 0 Typ. capacitances C = f (VDS) Parameter: VGS = 0, f = 1 MHz Forward characteristics of reverse diode IF = f (VSD) Parameter: Tj, tp = 80 µs Transient thermal impedance ZthJC = f (tp) Parameter: D = tp/T 7 19.02.04 TEMPFET® BTS 129 TO 220 AB Standard 4.4 3.7 1.3 15.6 9.2 17.5 1) 2) 13.5 3) 4.6 1 12.8 2.8 9.9 9.5 Ordering Code C67078-A5013-A2 0.75 2.54 1.05 2.54 0.5 2.4 GPT05155 1) punch direction, burr max. 0.04 2) dip tinning 3) max. 14.5 by dip tinning press burr max. 0.05 8 19.02.04 TEMPFET® BTS 129 Edition 04.97 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2000. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 19.02.04