DAC8560 DA C8 560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com 16-Bit, Ultra-Low Glitch, Voltage Output Digital-to-Analog Converter with 2.5V, 2ppm/°C Internal Reference Check for Samples: DAC8560 FEATURES DESCRIPTION • • • • The DAC8560 is a low-power, voltage output, 16-bit digital-to-analog converter (DAC). The DAC8560 includes a 2.5V, 2ppm/°C internal reference (enabled by default), giving a full-scale output voltage range of 2.5V. The internal reference has an initial accuracy of 0.02% and can source up to 20mA at the VREF pin. The device is monotonic, provides very good linearity, and minimizes undesired code-to-code transient voltages (glitch). The DAC8560 uses a versatile 3-wire serial interface that operates at clock rates up to 30MHz. It is compatible with standard SPI™, QSPI™, Microwire™, and digital signal processor (DSP) interfaces. 1 234 • • • • • • • • • • Relative Accuracy: 4LSB Glitch Energy: 0.15nV-s MicroPower Operation: 510μA at 2.7V Internal Reference: – 2.5V Reference Voltage (enabled by default) – 0.02% Initial Accuracy – 2ppm/°C Temperature Drift (typ) – 5ppm/°C Temperature Drift (max) – 20mA Sink/Source Capability Power-On Reset to Zero Power Supply: +2.7V to +5.5V 16-Bit Monotonic Over Temperature Range Settling Time: 10μs to ±0.003% FSR Low-Power Serial Interface with Schmitt-Triggered Inputs On-Chip Output Buffer Amplifier with Rail-to-Rail Operation Power-Down Capability Drop-In Compatible With DAC8531 /01 and DAC8550 /51 Temperature Range: –40°C to +105°C Available in a Tiny MSOP-8 Package The DAC8560 incorporates a power-on-reset circuit that ensures the DAC output powers up at zero-scale and remains there until a valid code is written to the device. The DAC8560 contains a power-down feature, accessed over the serial interface, that reduces the current consumption of the device to 1.2μA at 5V. The low-power consumption, internal reference, and small footprint make this device ideal for portable, battery-operated equipment. The power consumption is 2.6mW at 5V, reducing to 6μW in power-down mode. The DAC8560 is available in an MSOP-8 package. FUNCTIONAL BLOCK DIAGRAM APPLICATIONS • • • • • Process Control Data Acquisition Systems Closed-Loop Servo-Control PC Peripherals Portable Instrumentation VDD VFB VREF VOUT Ref (+) 16-Bit DAC 2.5V Reference 16 DAC Register 16 SYNC SCLK Shift Register PWD Control Resistor Network DIN GND 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI, QSPI are trademarks of Motorola, Inc. Microwire is a trademark of National Semiconductor. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2011, Texas Instruments Incorporated DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION (1) PRODUCT MAXIMUM RELATIVE ACCURACY (LSB) MAXIMUM DIFFERENTIAL NONLINEARITY (LSB) MAXIMUM REFERENCE DRIFT (ppm/°C) DAC8560A ±12 ±1 25 DAC8560B ±8 ±1 25 DAC8560C ±12 ±1 5 DAC8560D ±8 ±1 5 (1) PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING MSOP-8 DGK –40°C TO +105°C D860 For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) UNIT –0.3V to 6V VDD to GND Digital input voltage to GND –0.3V to +VDD + 0.3V VOUT to GND –0.3V to +VDD + 0.3V Operating temperature range –40°C to +105°C Storage temperature range –65°C to +150°C Junction temperature range (TJ max) +150°C Power dissipation (DGK) (TJ max – TA)/θJA Thermal impedance, θJA 206°C/W Thermal impedance, θJC 44°C/W ESD rating (1) 2 Human body model (HBM) 4000V Charged device model (CDM) 1500V Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS VDD = 2.7V to 5.5V, –40°C to +105°C range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ±4 ±12 LSB STATIC PERFORMANCE (1) Resolution 16 Relative accuracy Measured by line passing through codes 485 and 64714 Differential nonlinearity 16-bit Monotonic DAC8560A, DAC8560C DAC8560B, DAC8560D Zero-code error Full-scale error Measured by line passing through codes 485 and 64714. Gain error PSRR Power supply rejection ratio ±4 ±8 LSB ±0.5 ±1 LSB ±5 ±12 mV ±0.2 ±0.5 % of FSR ±0.05 ±0.2 % of FSR ±4 Zero-code error drift Gain temperature coefficient Bits VDD = 5V ±1 VDD = 2.7V ±3 Output unloaded μV/°C ppm of FSR/°C 1 mV/V OUTPUT CHARACTERISTICS (2) Output voltage range Output voltage settling time 0 To ±0.003% FSR, 0200h to FD00h, RL = 2kΩ, 0pF < CL < 200pF RL = 2kΩ, CL = 500pF Slew rate Capacitive load stability RL = ∞ VREF 8 V 10 μs 12 1.8 V/μs 470 pF RL = 2kΩ 1000 Code change glitch impulse 1LSB change around major carry 0.15 nV-s Digital feedthrough SCLK toggling, SYNC high 0.15 nV-s DC output impedance At mid-code input Short-circuit current Power-up time 1 VDD = 5V 50 VDD = 3V 20 Coming out of power-down mode VDD = 5V 2.5 Coming out of power-down mode VDD = 3V 5 Ω mA μs AC PERFORMANCE (2) SNR 88 dB THD TA = +25°C, BW = 20kHz, VDD = 5V, fOUT = 1kHz, 1st 19 harmonics removed for SNR calculation –77 dB 79 dB 77 dB DAC output noise density TA = +25°C, at mid-code input, fOUT = 1kHz 170 nV/√Hz DAC output noise TA = +25°C, at mid-code input, 0.1Hz to 10Hz 50 μVPP SFDR SINAD (1) (2) Linearity calculated using a reduced code range of 485 to 64714; output unloaded. Ensured by design and characterization, not production tested. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 3 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) VDD = 2.7V to 5.5V, –40°C to +105°C range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REFERENCE OUTPUT Output voltage TA = +25°C 2.4975 2.5 2.5025 V Initial accuracy TA = +25°C –0.1 ±0.004 0.1 % DAC8560A, DAC8560B (3) 5 25 DAC8560C, DAC8560D (4) 2 5 Output voltage temperature drift Output voltage noise f = 0.1Hz to 10Hz Output voltage noise density (high-frequency noise) Load regulation, sourcing (5) Load regulation, sinking (5) 125 TA = +25°C, f = 1MHz, CL = 1μF 20 TA = +25°C, f = 1MHz, CL = 4μF 2 TA = +25°C TA = +25°C Output current load capability (6) Line regulation TA = +25°C Long-term stability/drift (aging) (5) TA = +25°C, time = 0 to 1900 hours Thermal hysteresis (5) μVPP 16 TA = +25°C, f = 1MHz, CL = 0μF First cycle nV/√Hz 30 μV/mA 15 μV/mA ±20 mA 10 μV/V 50 ppm 100 Additional cycles ppm/°C ppm 25 REFERENCE Internal reference current consumption External reference current VDD = 5.5V 360 VDD = 3.6V 348 External VREF = 2.5V, if internal reference is disabled Reference input range μA 20 0 Reference input impedance LOGIC INPUTS μA VDD 125 V kΩ (6) ±1 Input current VINL Logic input LOW voltage VINH Logic input HIGH voltage μA VDD = 5V 0.8 VDD = 3V 0.6 VDD = 5V 2.4 VDD = 3V 2.1 V V Pin capacitance 3 pF 5.5 V POWER REQUIREMENTS VDD 2.7 Normal mode IDD (7) All power-down modes Power dissipation Normal mode (7) All power-down modes VDD = 3.6V to 5.5V, VIH = VDD and VIL = GND 0.530 0.850 VDD = 2.7V to 3.6V, VIH = VDD and VIL = GND 0.510 0.840 VDD = 3.6V to 5.5V, VIH = VDD and VIL = GND 1.2 2.5 VDD = 2.7V to 3.6V, VIH = VDD and VIL = GND 0.7 2.2 VDD = 3.6V to 5.5V 2.6 4.7 VDD = 2.7V to 3.6V 1.5 3.0 VDD = 3.6V to 5.5V 6 14 VDD = 2.7V to 3.6V 2 8 mA μA mW μW TEMPERATURE RANGE –40 Specified performance (3) (4) (5) (6) (7) 4 +105 °C Reference is trimmed and tested at room temperature, and is characterized from –40°C to +120°C. Reference is trimmed and tested at two temperatures (+25°C and +105°C), and is characterized from –40°C to +120°C. Explained in more detail in the Application Information section of this data sheet. Ensured by design and characterization, not production tested. Input code = 32768, reference current included, no load. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com PIN CONFIGURATION MSOP-8 (Top View) VDD 1 VREF 2 8 GND 7 DIN DAC8560 VFB 3 6 SCLK VOUT 4 5 SYNC PIN DESCRIPTIONS PIN NAME 1 VDD Power supply input, 2.7V to 5.5V. DESCRIPTION 2 VREF Reference voltage input/output. 3 VFB Feedback connection for the output amplifier. For voltage output operation, tie to VOUT externally. 4 VOUT Analog output voltage from DAC. The output amplifier has rail-to-rail operation. 5 SYNC Level-triggered control input (active LOW). This is the frame synchronization signal for the input data. When SYNC goes LOW, it enables the input shift register, and data is sampled on subsequent falling clock edges. The DAC output updates following the 24th clock. If SYNC is taken HIGH before the 24th clock edge, the rising edge of SYNC acts as an interrupt, and the write sequence is ignored by the DAC8560. Schmitt-Trigger logic Input. 6 SCLK Serial clock input. Schmitt-Trigger logic input. 7 DIN 8 GND Serial data input. Data is clocked into the 24-bit input shift register on each falling edge of the serial clock input. Schmitt-Trigger logic Input. Ground reference point for all circuitry on the part. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 5 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com SERIAL WRITE OPERATION t9 t1 SCLK 1 24 t8 t3 t4 t2 t7 SYNC t6 t10 t5 DIN DB23 TIMING REQUIREMENTS (1) DB0 DB23 (2) VDD = 2.7V to 5.5V, all specifications –40°C to +105°C (unless otherwise noted) PARAMETER t1 (3) SCLK cycle time t2 SCLK HIGH time t3 SCLK LOW time t4 SYNC to SCLK rising edge setup time t5 Data setup time t6 Data hold time t7 SCLK falling edge to SYNC rising edge t8 Minimum SYNC HIGH time t9 24th SCLK falling edge to SYNC falling edge t10 SYNC rising edge to 24th SCLK falling edge (for successful SYNC interrupt) (1) (2) (3) 6 TEST CONDITIONS MIN VDD = 2.7V to 3.6V 50 VDD = 3.6V to 5.5V 33 VDD = 2.7V to 3.6V 13 VDD = 3.6V to 5.5V 13 VDD = 2.7V to 3.6V 22.5 VDD = 3.6V to 5.5V 13 VDD = 2.7V to 3.6V 0 VDD = 3.6V to 5.5V 0 VDD = 2.7V to 3.6V 5 VDD = 3.6V to 5.5V 5 VDD = 2.7V to 3.6V 4.5 VDD = 3.6V to 5.5V 4.5 VDD = 2.7V to 3.6V 0 VDD = 3.6V to 5.5V 0 VDD = 2.7V to 3.6V 50 VDD = 3.6V to 5.5V 33 VDD = 2.7V to 3.6V 100 VDD = 3.6V to 5.5V 100 VDD = 2.7V to 3.6V 15 VDD = 3.6V to 5.5V 15 TYP MAX UNIT ns ns ns ns ns ns ns ns ns ns All input signals are specified with tR = tF = 3ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Serial Write Operation timing diagram. Maximum SCLK frequency is 30MHz at VDD = 3.6V to 5.5V and 20MHz at VDD = 2.7V to 3.6V. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: Internal Reference At TA = +25°C, unless otherwise noted. INTERNAL REFERENCE VOLTAGE vs TEMPERATURE (Grades A and B) 2.503 2.503 2.502 2.502 2.501 2.501 VREF (V) VREF (V) INTERNAL REFERENCE VOLTAGE vs TEMPERATURE (Grades C and D) 2.500 2.499 2.500 2.499 2.498 2.498 10 Units Shown 2.497 -40 -20 0 20 40 60 100 13 Units Shown 2.497 -40 120 -20 0 20 Temperature (°C) 40 60 80 100 120 Temperature (°C) Figure 1. Figure 2. REFERENCE OUTPUT TEMPERATURE DRIFT (–40°C to +120°C, Grades C and D) REFERENCE OUTPUT TEMPERATURE DRIFT (–40°C to +120°, Grades A and B) 40 30 Typ: 5ppm/°C Max: 25ppm/°C Typ: 2ppm/°C Max: 5ppm/°C Population (%) Population (%) 30 20 20 10 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1 5.0 3 Temperature Drift (ppm/°C) 7 9 11 13 15 17 19 Temperature Drift (ppm/°C) Figure 3. Figure 4. REFERENCE OUTPUT TEMPERATURE DRIFT (0°C to +120°C, Grades C and D) LONG-TERM STABILITY/DRIFT (1) 200 40 Typ: 1.2ppm/°C Max: 3ppm/°C See the Applications Information section for more information 150 100 Drift (ppm) 30 Population (%) 5 20 50 0 -50 Average -100 10 -150 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 Figure 5. (1) 300 600 900 1200 1500 1800 Time (Hours) Temperature Drift (ppm/°C) 1900 20 Units Shown -200 0 Figure 6. Explained in more detail in the Application Information section of this data sheet. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 7 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: Internal Reference (continued) At TA = +25°C, unless otherwise noted. INTERNAL REFERENCE NOISE DENSITY vs FREQUENCY (2) 400 INTERNAL REFERENCE NOISE 0.1Hz TO 10Hz (2) See the Applications Information section for more information See the Applications Information section for more information 16mVPP VNOISE (4mV/div) Vn (nV/ÖHz) 300 VDD = 5V Reference Unbuffered CREF = 0mF 200 100 CREF = 4mF 0 10 100 1k 10k 100k Time (2s/div) 1M Frequency (Hz) Figure 7. Figure 8. INTERNAL REFERENCE VOLTAGE vs LOAD CURRENT (Grades C and D) INTERNAL REFERENCE VOLTAGE vs LOAD CURRENT (Grades A and B) 2.504 2.504 2.503 2.503 2.502 15mV/mA (sinking) 2.501 15mV/mA (sinking) -40°C +25°C 2.500 2.499 VREF (V) VREF (V) 2.502 -40°C +120°C 2.498 2.501 +25°C 2.500 2.499 30mV/mA (sourcing) 2.498 30mV/mA (sourcing) 2.497 2.497 2.496 -25 2.496 -25 -20 -15 -10 -5 0 5 10 15 20 25 +120°C -20 -15 -10 -5 ILOAD (mA) 15 20 INTERNAL REFERENCE VOLTAGE vs SUPPLY VOLTAGE (Grades C and D) INTERNAL REFERENCE VOLTAGE vs SUPPLY VOLTAGE (Grades A and B) 2.504 2.504 2.503 2.503 25 -40°C 2.502 -40°C < 10mV/V 2.501 +25°C 2.500 VREF (V) VREF (V) 10 Figure 10. 2.499 2.501 < 10mV/V +25°C 2.500 2.499 +120°C 2.498 2.498 2.497 +120°C 2.497 2.0 8 5 Figure 9. 2.502 (2) 0 ILOAD (mA) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 VDD (V) VDD (V) Figure 11. Figure 12. 4.5 5.0 5.5 6.0 Explained in more detail in the Application Information section of this data sheet. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 5V At TA = +25°C, external reference used, and DAC output not loaded, unless otherwise noted. 6 4 2 0 -2 -4 -6 LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (+25°C) LE (LSB) 1.0 1.0 0.5 0.5 0 -0.5 -1.0 0 -0.5 6 4 2 0 -2 -4 -6 8192 16384 24576 32768 40960 49152 57344 65536 0 8192 16384 24576 32768 40960 49152 Digital Input Code Digital Input Code Figure 13. Figure 14. LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (+105°C) ZERO-SCALE ERROR vs TEMPERATURE 10 VDD = 5V, External VREF = 4.99V 57344 65536 VDD = 5.0V Internal VREF = 2.5V 5 Error (mV) LE (LSB) VDD = 5V, External VREF = 4.99V -1.0 0 1.0 DLE (LSB) 6 4 2 0 -2 -4 -6 VDD = 5V, External VREF = 4.99V DLE (LSB) DLE (LSB) LE (LSB) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (–40°C) 0 0.5 0 -0.5 -5 -40 -1.0 0 8192 16384 24576 32768 40960 49152 57344 65536 0 40 80 120 Temperature (°C) Digital Input Code Figure 15. Figure 16. FULL-SCALE ERROR vs TEMPERATURE SOURCE AND SINK CURRENT CAPABILITY 10 3.0 VDD = 5.0V Internal VREF = 2.5V 2.5 5 VDD = 5V Internal Reference Enabled DAC Loaded with FFFFh VOUT (V) Error (mV) 2.0 0 1.5 1.0 0.5 DAC Loaded with 0000h -5 -40 0 0 40 80 120 0 Temperature (°C) 5 10 15 20 ISOURCE/SINK (mA) Figure 17. Figure 18. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 9 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 5V (continued) At TA = +25°C, external reference used, and DAC output not loaded, unless otherwise noted. SOURCE AND SINK CURRENT CAPABILITY POWER-SUPPLY CURRENT vs DIGITAL INPUT CODE 650 6 VDD = 5.5V Internal VREF = 2.5V 5 VDD = 5V Internal Reference Disabled External VREF = 4.99V DAC Loaded with FFFFh 600 IDD (mA) VOUT (V) 4 3 550 2 500 1 DAC Loaded with 0000h 450 0 0 700 650 5 10 15 0 20 8192 16384 24576 32768 40960 49152 57344 65536 ISOURCE/SINK (mA) Digital Input Code Figure 19. Figure 20. POWER-SUPPLY CURRENT vs TEMPERATURE POWER-SUPPLY CURRENT vs POWER-SUPPLY VOLTAGE 510 VDD = 5.5V Internal VREF = 2.5V VDD = 2.7V to 5.5V Internal VREF Included 505 IDD (mA) IDD (mA) 600 550 500 495 500 490 450 400 -40 485 0 40 80 120 2.7 3.1 3.5 3.9 Temperature (°C) 4.7 Figure 21. Figure 22. POWER-DOWN CURRENT vs POWER-SUPPLY VOLTAGE POWER-SUPPLY CURRENT vs LOGIC INPUT VOLTAGE 2500 1.4 5.1 5.5 VDD = 5.5V, Internal VREF Included, Sweep from 0V to 5V SCLK Input (all other digital inputs = GND) Sweep from 5V to 0V VDD = 2.7V to 5.5V 1.2 2000 1.0 IDD (mA) Power-Down Current (mA) 4.3 VDD (V) 0.8 0.6 1500 1000 0.4 500 0.2 0 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 0 VDD (V) 2 3 4 5 VLOGIC (V) Figure 23. 10 1 Figure 24. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 5V (continued) At TA = +25°C, external reference used, and DAC output not loaded, unless otherwise noted. POWER-SUPPLY CURRENT HISTOGRAM TOTAL HARMONIC DISTORTION vs OUTPUT FREQUENCY 80 70 -40 VDD = 5.5V Internal VREF = 2.5V VDD = 5V, External VREF = 4.9V -1dB FSR Digital Input, fS = 225kSPS Measurement Bandwidth = 20kHz -50 -60 50 THD (dB) Occurrences 60 40 30 THD -70 2nd Harmonic -80 20 10 -90 0 -100 3rd Harmonic 450 475 500 525 550 575 600 0 IDD (mA) 1 2 3 4 Figure 25. Figure 26. FULL-SCALE SETTLING TIME: 5V RISING EDGE FULL-SCALE SETTLING TIME: 5V FALLING EDGE Trigger Pulse 5V/div VDD = 5V Ext VREF = 4.096V From Code: 0000h To Code: FFFFh Rising Edge 1V/div 5 fOUT (kHz) Zoomed Rising Edge 1mV/div Trigger Pulse 5V/div VDD = 5V Ext VREF = 4.096V From Code: FFFFh To Code: 0000h Falling Edge 1V/div Time (2ms/div) Zoomed Falling Edge 1mV/div Time (2ms/div) Figure 27. Figure 28. HALF-SCALE SETTLING TIME: 5V RISING EDGE HALF-SCALE SETTLING TIME: 5V FALLING EDGE Trigger Pulse 5V/div Trigger Pulse 5V/div VDD = 5V Ext VREF = 4.096V From Code: CFFFh To Code: 4000h Rising Edge 1V/div VDD = 5V Ext VREF = 4.096V From Code: 4000h To Code: CFFFh Zoomed Rising Edge 1mV/div Falling Edge 1V/div Time (2ms/div) Zoomed Falling Edge 1mV/div Time (2ms/div) Figure 29. Figure 30. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 11 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 5V (continued) At TA = +25°C, external reference used, and DAC output not loaded, unless otherwise noted. VDD = 5V Ext VREF = 4.096V From Code: 7FFFh To Code: 8000h Glitch: 0.08nV-s GLITCH ENERGY: 5V, 1LSB STEP, FALLING EDGE VOUT (500mV/div) VOUT (500mV/div) GLITCH ENERGY: 5V, 1LSB STEP, RISING EDGE Time (400ns/div) Time (400ns/div) Figure 32. GLITCH ENERGY: 5V, 16LSB STEP, RISING EDGE GLITCH ENERGY: 5V, 16LSB STEP, FALLING EDGE VDD = 5V Ext VREF = 4.096V From Code: 8000h To Code: 8010h Glitch: 0.04nV-s Time (400ns/div) Figure 33. Figure 34. GLITCH ENERGY: 5V, 256LSB STEP, RISING EDGE GLITCH ENERGY: 5V, 256LSB STEP, FALLING EDGE VDD = 5V Ext VREF = 4.096V From Code: 8000h To Code: 80FFh Glitch: Not Detected Theoretical Worst Case VOUT (5mV/div) VOUT (5mV/div) VDD = 5V Ext VREF = 4.096V From Code: 8010h To Code: 8000h Glitch: 0.08nV-s VOUT (500mV/div) VOUT (500mV/div) Figure 31. Time (400ns/div) VDD = 5V Ext VREF = 4.096V From Code: 80FFh To Code: 8000h Glitch: Not Detected Theoretical Worst Case Time (400ns/div) Time (400ns/div) Figure 35. 12 VDD = 5V Ext VREF = 4.096V From Code: 8000h To Code: 7FFFh Glitch: 0.16nV-s Measured Worst Case Figure 36. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 5V (continued) At TA = +25°C, external reference used, and DAC output not loaded, unless otherwise noted. SIGNAL-TO-NOISE RATIO vs OUTPUT FREQUENCY 98 POWER SPECTRAL DENSITY VDD = 5V, External VREF = 4.9V -1dB FSR Digital Input, fS = 225kSPS Measurement Bandwidth = 20kHz 96 Gain (dB) SNR (dB) 94 92 90 88 86 84 0 1 2 3 4 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 VDD = 5V, External VREF = 4.9V fOUT = 1kHz, fS = 225kSPS Measurement Bandwidth = 20kHz 0 5 5 15 Figure 37. Figure 38. DAC OUTPUT NOISE DENSITY vs FREQUENCY (1) DAC OUTPUT NOISE DENSITY vs FREQUENCY (1) 1800 1000 Internal Reference Enabled No Load at VREF Pin See the Applications Information section for more information 1600 1400 1200 Full-Scale 1000 Midscale 800 Zero-Scale 600 20 Internal Reference Enabled 4mF vs No Load at VREF Pin See the Applications Information section for more information 800 Vn (nV/ÖHz) Vn (nV/ÖHz) 10 Frequency (kHz) fOUT (kHz) 400 600 400 CREF = 0mF 200 CREF = 4mF 200 0 0 10 100 1k 10k 100k 1M 10 100 1k 10k Frequency (Hz) Frequency (Hz) Figure 39. Figure 40. 100k 1M DAC OUTPUT NOISE 0.1Hz TO 10Hz VNOISE (10mV/div) DAC = Midscale Internal Reference Enabled 50mVPP Time (2s/div) Figure 41. (1) Explained in more detail in the Application Information section of this data sheet. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 13 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 3.6V At TA = +25°C, internal reference used, and DAC output not loaded, unless otherwise noted POWER-SUPPLY CURRENT vs TEMPERATURE 700 650 POWER-SUPPLY CURRENT HISTOGRAM 90 VDD = 3.6V Internal VREF = 2.5V VDD = 3.6V Internal VREF = 2.5V 80 70 Occurrences IDD (mA) 600 550 500 60 50 40 30 20 450 10 400 -40 0 0 40 80 120 450 Temperature (°C) 500 525 550 575 600 IDD (mA) Figure 42. 14 475 Figure 43. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 2.7V At TA = +25°C, internal reference used, and DAC output not loaded, unless otherwise noted 6 4 2 0 -2 -4 -6 LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (+25°C) 6 4 2 0 -2 -4 -6 VDD = 2.7V, Internal VREF = 2.5V LE (LSB) LE (LSB) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (–40°C) 1.0 DLE (LSB) DLE (LSB) 1.0 0.5 0 -0.5 -1.0 0 -0.5 6 4 2 0 -2 -4 -6 8192 16384 24576 32768 40960 49152 57344 65536 0 8192 16384 24576 32768 40960 49152 Digital Input Code Digital Input Code Figure 44. Figure 45. LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE (+105°C) ZERO-SCALE ERROR vs TEMPERATURE 57344 65536 10 VDD = 2.7V, Internal VREF = 2.5V VDD = 2.7V Internal VREF = 2.5V 5 Error (mV) LE (LSB) 0.5 -1.0 0 1.0 DLE (LSB) VDD = 2.7V, Internal VREF = 2.5V 0 0.5 0 -0.5 -5 -40 -1.0 0 8192 16384 24576 32768 40960 49152 57344 65536 0 40 80 120 Temperature (°C) Digital Input Code Figure 46. Figure 47. FULL-SCALE ERROR vs TEMPERATURE SOURCE AND SINK CURRENT CAPABILITY 10 3.0 VDD = 2.7V Internal VREF = 2.5V 2.5 5 VDD = 2.7V Internal Reference Enabled DAC Loaded with FFFFh VOUT (V) Error (mV) 2.0 0 1.5 1.0 0.5 DAC Loaded with 0000h -5 -40 0 0 40 80 120 0 Temperature (°C) 5 10 15 20 ISOURCE/SINK (mA) Figure 48. Figure 49. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 15 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 2.7V (continued) At TA = +25°C, internal reference used, and DAC output not loaded, unless otherwise noted SUPPLY CURRENT vs DIGITAL INPUT CODE POWER-SUPPLY CURRENT vs LOGIC INPUT VOLTAGE 650 1000 VDD = 2.7V Internal VREF = 2.5V VDD = 2.7V, Internal VREF Included, SCLK Input (all other digital inputs = GND) Sweep from 0V to 2.7V 900 600 IDD (mA) IDD (mA) 800 550 700 Sweep from 2.7V to 0V 600 500 500 450 400 0 8192 16384 24576 32768 40960 49152 57344 65536 0 0.3 Digital Input Code 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VLOGIC (V) Figure 50. Figure 51. FULL-SCALE SETTLING TIME: 2.7V RISING EDGE FULL-SCALE SETTLING TIME: 2.7V FALLING EDGE Trigger Pulse 2.7V/div Trigger Pulse 2.7V/div VDD = 2.7V Int VREF = 2.5V From Code: FFFFh To Code: 0000h Rising Edge 0.5V/div VDD = 2.7V Int VREF = 2.5V From Code: 0000h To Code: FFFFh Zoomed Rising Edge 1mV/div Falling Edge 0.5V/div Time (2ms/div) Zoomed Falling Edge 1mV/div Time (2ms/div) Figure 52. Figure 53. HALF-SCALE SETTLING TIME: 2.7V RISING EDGE HALF-SCALE SETTLING TIME: 2.7V FALLING EDGE Trigger Pulse 2.7V/div Trigger Pulse 2.7V/div VDD = 2.7V Int VREF = 2.5V From Code: CFFFh To Code: 4000h VDD = 2.7V Int VREF = 2.5V From Code: 4000h To Code: CFFFh Rising Edge 0.5V/div Zoomed Rising Edge 1mV/div Falling Edge 0.5V/div Time (2ms/div) Time (2ms/div) Figure 54. 16 Zoomed Falling Edge 1mV/div Figure 55. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS: DAC at VDD = 2.7V (continued) At TA = +25°C, internal reference used, and DAC output not loaded, unless otherwise noted VDD = 2.7V Int VREF = 2.5V From Code: 7FFFh To Code: 8000h Glitch: 0.08nV-s GLITCH ENERGY: 2.7V, 1LSB STEP, FALLING EDGE VOUT (200mV/div) VOUT (200mV/div) GLITCH ENERGY: 2.7V, 1LSB STEP, RISING EDGE Time (400ns/div) Time (400ns/div) Figure 57. GLITCH ENERGY: 2.7V, 16LSB STEP, RISING EDGE GLITCH ENERGY: 2.7V, 16LSB STEP, FALLING EDGE VDD = 2.7V Int VREF = 2.5V From Code: 8000h To Code: 8010h Glitch: 0.04nV-s VDD = 2.7V Int VREF = 2.5V From Code: 8010h To Code: 8000h Glitch: 0.12nV-s VOUT (200mV/div) VOUT (200mV/div) Figure 56. Time (400ns/div) Time (400ns/div) Figure 58. Figure 59. GLITCH ENERGY: 2.7V, 256LSB STEP, RISING EDGE GLITCH ENERGY: 2.7V, 256LSB STEP, FALLING EDGE VDD = 2.7V Int VREF = 2.5V From Code: 8000h To Code: 80FFh Glitch: Not Detected Theoretical Worst Case VOUT (5mV/div) VOUT (5mV/div) VDD = 2.7V Int VREF = 2.5V From Code: 8000h To Code: 7FFFh Glitch: 0.16nV-s Measured Worst Case Time (400ns/div) VDD = 2.7V Int VREF = 2.5V From Code: 80FFh To Code: 8000h Glitch: Not Detected Theoretical Worst Case Time (400ns/div) Figure 60. Figure 61. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 17 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com THEORY OF OPERATION DIGITAL-TO-ANALOG CONVERTER (DAC) VREF The DAC8560 architecture consists of a string DAC followed by an output buffer amplifier. Figure 62 shows a block diagram of the DAC architecture. VREF 50kW RDIVIDER VREF 2 50kW VFB R 62kW DAC Register REF (+) Register String REF (-) VOUT R To Output Amplifier (2x Gain) GND Figure 62. DAC8560 Architecture The input coding to the DAC8560 is straight binary, so the ideal output voltage is given by: DIN V OUT + V REF 65536 (1) R where DIN = decimal equivalent of the binary code that is loaded to the DAC register; it can range from 0 to 65535. R RESISTOR STRING The resistor string section is shown in Figure 63. It is simply a string of resistors, each of value R. The code loaded into the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier by closing one of the switches connecting the string to the amplifier. It is monotonic because it is a string of resistors. OUTPUT AMPLIFIER The output buffer amplifier is capable of generating rail-to-rail voltages on its output, giving an output range of 0V to VDD. It is capable of driving a load of 2kΩ in parallel with 1000pF to GND. The source and sink capabilities of the output amplifier can be seen in the Typical Characteristics. The slew rate is 1.8V/μs with a full-scale settling time of 8μs with the output unloaded. 18 Figure 63. Resistor String The inverting input of the output amplifier is available at the VFB pin. This feature allows better accuracy in critical applications by tying the VFB point and the amplifier output together directly at the load. Other signal conditioning circuitry may also be connected between these points for specific applications. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com INTERNAL REFERENCE VREF The DAC8560 includes a 2.5V internal reference that is enabled by default. The internal reference is externally available at the VREF pin. A minimum 100nF capacitor is recommended between the reference output and GND for noise filtering. Reference Disable The internal reference of the DAC8560 is a bipolar transistor-based, precision bandgap voltage reference. The basic bandgap topology is shown in Figure 64. Transistors Q1 and Q2 are biased such that the current density of Q1 is greater than that of Q2. The difference of the two base-emitter voltages (VBE1 - VBE2) has a positive temperature coefficient and is forced across resistor R1. This voltage is gained up and added to the base-emitter voltage of Q2, which has a negative temperature coefficient. The resulting output voltage is virtually independent of temperature. The short-circuit current is limited by design to approximately 100mA. Enable/Disable Internal Reference The DAC8560 internal reference is enabled by default; however, the reference can be disabled for debugging or evaluation purposes. A serial command requiring at least two additional SCLK cycles at the end of the 24-bit write sequence (see Serial Interface section) must be used to disable the internal reference. For proper operation, a total of at least 26 SCLK cycles are required for each enable/disable internal reference update sequence, during which SYNC must be held low. To disable the internal reference, execute the write sequence illustrated in Table 1 followed by at least two additional SCLK falling edges while SYNC is low. Q1 1 N Q2 R1 R2 Figure 64. Simplified Schematic of the Bandgap Reference To then enable the reference, either perform a power-cycle to reset the device, or sequentially execute the two write sequences in Table 2 and Table 3. Each of these write sequences must be followed by at least two additional SCLK falling edges while SYNC remains low. During the time that the internal reference is disabled, the DAC will function normally using an external reference. At this point, the internal reference is disconnected from the VREF pin (tri-state). Do not attempt to drive the VREF pin externally and internally at the same time indefinitely. Table 1. Write Sequence for Disabling the DAC8560 Internal Reference DB23 0 DB0 1 0 0 1 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 1 Table 2. Enabling the DAC8560 Internal Reference (Write Sequence 1 of 2) DB23 0 DB0 1 0 0 1 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 Table 3. Enabling the DAC8560 Internal Reference (Write Sequence 2 of 2) DB23 0 DB0 1 0 0 1 0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 1 19 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 SERIAL INTERFACE The DAC8560 has a 3-wire serial interface ( SYNC, SCLK, and DIN) that is compatible with SPI, QSPI, and Microwire interface standards, as well as most DSPs. See the Serial Write Operation timing diagram for an example of a typical write sequence. The write sequence begins by bringing the SYNC line LOW. Data from the DIN line is clocked into the 24-bit shift register on each falling edge of SCLK. The serial clock frequency can be as high as 30MHz, making the DAC8560 compatible with high-speed DSPs. On the 24th falling edge of the serial clock, the last data bit is clocked in and the programmed function is executed. At this point, the SYNC line may be kept LOW or brought HIGH. In either case, it must be brought HIGH for a minimum of 33ns before the next write sequence so that a falling edge of SYNC can initiate the next write sequence. As previously mentioned, it must be brought HIGH again before the next write sequence. INPUT SHIFT REGISTER The input shift register is 24 bits wide, as shown in Table 4. The first six bits must be '000000'. The next two bits (PD1 and PD0) are control bits that set the desired mode of operation (normal mode or any one of three power-down modes) as indicated in Table 5. www.ti.com A more complete description of the various modes is located in the Power-Down Modes section. The next 16 bits are the data bits, which are transferred to the DAC register on the 24th falling edge of SCLK under normal operation (see Table 5). SYNC INTERRUPT In a normal write sequence, the SYNC line is kept LOW for at least 24 falling edges of SCLK and the DAC is updated on the 24th falling edge. However, if SYNC is brought HIGH before the 24th falling edge, it acts as an interrupt to the write sequence. The shift register is reset, and the write sequence is seen as invalid. Neither an update of the DAC register contents, nor a change in the operating mode occurs, as shown in Figure 65. POWER-ON RESET The DAC8560 contains a power-on-reset circuit that controls the output voltage during power up. On power up, all registers are filled with zeros and the output voltage is zero-scale; it remains there until a valid write sequence is made to the DAC. This feature is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up. Table 4. DAC8560 Data Input Register Format DB23 0 DB0 0 0 0 0 0 PD 1 PD 0 D15 D14 D13 D12 D11 D10 D9 D8 24th Falling Edge D7 D6 D5 D4 D3 D2 D1 D0 24th Falling Edge CLK SYNC DIN DB23 DB0 DB23 Invalid/Interrupted Write Sequence: Output/Mode Does Not Update on the 24th Falling Edge DB0 Valid Write Sequence: Output/Mode Updates on the 24th Falling Edge Figure 65. SYNC Interrupt Facility 20 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com POWER-DOWN MODES The DAC8560 supports four separate modes of operation. These modes are programmable by setting two bits (PD1 and PD0) in the control register. Table 5 shows how to control the operating mode with data bits PD1 (DB17) and PD0 (DB16). The advantage of this switching is that the output impedance of the device is known while it is in power-down mode. As shown in Table 5, there are three different power-down options. VOUT can be connected internally to GND through a 1kΩ resistor, a 100kΩ resistor, or open circuited (High-Z). The output stage is illustrated in Figure 66. Table 5. Operating Modes PD1 (DB17) PD0 (DB16) 0 0 Normal operation 0 1 Power-down 1 kΩ to GND 1 0 Power-down 100 kΩ to GND 1 1 Power-down High-Z VFB OPERATING MODE Resistor String DAC When both bits are set to '0', the device works normally with its typical current consumption of 530μA at 5.5V. However, for the three power-down modes, the supply current falls to 1.2μA at 5.5V (0.7μA at 3.6V). Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. Amplifier Power-Down Circuitry VOUT Resistor Network Figure 66. Output Stage During Power Down All analog circuitry is shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power down. The time to exit power-down is typically 2.5μs for VDD = 5V, and 5μs for VDD = 3V. See the Typical Characteristics for more information. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 21 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com APPLICATION INFORMATION INTERNAL REFERENCE The DAC8560 internal reference does not require an external load capacitor for stability because it is stable with any capacitive load. However, for improved noise performance, an external load capacitor of 150nF or larger connected to the VREF output is recommended. Figure 67 shows the typical connections required for operation of the DAC8560 internal reference. A supply bypass capacitor at the VDD input is also recommended. DAC8560 VDD GND 8 DIN 7 VFB SCLK 6 VOUT SYNC 5 1 VDD 2 VREF 3 4 1mF VREF 150nF Figure 67. Typical Connections for Operating the DAC8560 Internal Reference The DAC8560 internal reference (grades C and D) features an exceptional typical drift coefficient of 2ppm/°C from –40°C to +120°C. Characterizing a large number of units, a maximum drift coefficient of 5ppm/°C (grades C and D) is observed. Temperature drift results are summarized in the Typical Characteristics. Noise Performance Typical 0.1Hz to 10Hz voltage noise can be seen in Figure 8, Internal Reference Noise. Additional filtering can be used to improve output noise levels, although care should be taken to ensure the output impedance does not degrade the AC performance. The output noise spectrum at VREF without any external components is depicted in Figure 7, Internal Reference Noise Density vs Frequency. Another noise density spectrum is also shown in Figure 7, which was obtained using a 4μF load capacitor at VREF for noise filtering. Internal reference noise impacts the DAC output noise; see the DAC Noise Performance section for more details. Load Regulation Supply Voltage The DAC8560 internal reference features an extremely low dropout voltage. It can be operated with a supply of only 5mV above the reference output voltage in an unloaded condition. For loaded conditions, refer to the Load Regulation section. The stability of the DAC8560 internal reference with variations in supply voltage (line regulation, DC PSRR) is also exceptional. Within the specified supply voltage range of 2.7V to 5.5V, the variation at VREF is smaller than 10μV/V; see the Typical Characteristics. Load regulation is defined as the change in reference output voltage as a result of changes in load current. The load regulation of the DAC8560 internal reference is measured using force and sense contacts as pictured in Figure 68. The force and sense lines reduce the impact of contact and trace resistance, resulting in accurate measurement of the load regulation contributed solely by the DAC8560 internal reference. Measurement results are summarized in the Typical Characteristics. Force and sense lines should be used for applications requiring improved load regulation. Temperature Drift The DAC8560 internal reference is designed to exhibit minimal drift error, defined as the change in reference output voltage over varying temperature. The drift is calculated using the box method, which is described by Equation 2: Drift Error + ǒ Ǔ V REF_MAX * V REF_MIN V REF T RANGE 10 6 (ppmń°C) Output Pin VOUT Force Line IL Sense Line (2) Where: VREF_MAX = maximum reference voltage observed within temperature range TRANGE. VREF_MIN = minimum reference voltage observed within temperature range TRANGE. VREF = 2.5V, target value for reference output voltage. 22 Contact and Trace Resistance Meter Load Figure 68. Accurate Load Regulation of the DAC8560 Internal Reference Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com Long-Term Stability Long-term stability/aging refers to the change of the output voltage of a reference over a period of months or years. This effect lessens as time progresses, as shown in Figure 6, the typical long-term stability curve. The typical drift value for the DAC8560 internal reference is 50ppm from 0 hours to 1900 hours. This parameter is characterized by powering-up and measuring 20 units at regular intervals for a period of 1900 hours. DD REF +6V R1 10kW OPA703 VDD VREF 10mF ±5V VFB VOUT DAC8560 0.1mF -6V GND Three-Wire Serial Interface Thermal Hysteresis Thermal hysteresis for a reference is defined as the change in output voltage after operating the device at +25°C, cycling the device through the specified temperature range, and returning to +25°C. It is expressed in Equation 3: Ť VREF_PRE * V REF_POST Ť 10 6 (ppm) V HYST + VREF_NOM ǒ R2 10kW V V Ǔ Figure 69. Bipolar Output Range Using External Reference at 5V R2 10kW V DD (3) Where: VHYST = thermal hysteresis. VREF_PRE = output voltage measured at +25°C pre-temperature cycling. VREF_POST = output voltage measured after the device has been cycled through the temperature range of –40°C to +120°C, and returned to +25°C. +6V R1 10kW ±2.5V OPA703 VDD VFB VREF DAC8560 150nF VOUT -6V GND Three-Wire Serial Interface DAC NOISE PERFORMANCE Typical noise performance for the DAC8560 with the internal reference enabled is shown in Figure 39 to Figure 41. Output noise spectral density at pin VOUT versus frequency is depicted in Figure 39 for full-scale, midscale, and zero scale input codes. The typical noise density for midscale code is 170nV/√Hz at 1kHz and 100nV/√Hz at 1MHz. High-frequency noise can be improved by filtering the reference noise as shown in Figure 40, where a 4μF load capacitor is connected to the VREF pin and compared to the no-load condition. Integrated output noise between 0.1Hz and 10Hz is close to 50μVPP (midscale), as shown in Figure 41. BIPOLAR OPERATION USING THE DAC8560 The DAC8560 has been designed for single-supply operation, but a bipolar output range is also possible using the circuit in either Figure 69 or Figure 70. The circuit shown gives an output voltage range of ±VREF. Rail-to-rail operation at the amplifier output is achievable using an OPA703 as the output amplifier. Figure 70. Bipolar Output Range Using Internal Reference The output voltage for any input code can be calculated as using Equation 4: ƪ V O + VREF D Ǔ ǒ65536 ǒR R) R Ǔ * V 1 ǒRR Ǔƫ 2 2 REF 1 1 (4) where D represents the input code in decimal (0–65535). With VREF = 5V, R1 = R2 = 10kΩ. ǒ Ǔ V O + 10 D * 5V 65536 (5) This result has an output voltage range of ±5V with 0000h corresponding to a –5V output and FFFFh corresponding to a 5V output, as shown in Figure 69. Similarly, using the internal reference, a ±2.5V output voltage range can be achieved, as shown in Figure 70. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 23 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 MICROPROCESSOR INTERFACING www.ti.com MicrowireTM DAC8560 (1) DAC8560 TO 8051 Interface CS SYNC See Figure 71 for a serial interface between the DAC8560 and a typical 8051-type microcontroller. The setup for the interface is as follows: TXD of the 8051 drives SCLK of the DAC8560, while RXD drives the serial data line of the device. The SYNC signal is derived from a bit-programmable pin on the port of the 8051. In this case, port line P3.3 is used. When data is to be transmitted to the DAC8560, P3.3 is taken LOW. The 8051 transmits data in 8-bit bytes; thus, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left LOW after the first eight bits are transmitted, then a second write cycle is initiated to transmit the second byte of data. P3.3 is taken HIGH following the completion of the third write cycle. The 8051 outputs the serial data in a format which has the LSB first. The DAC8560 requires its data with the MSB as the first bit received. The 8051 transmit routine must therefore take this into account, and mirror the data as needed. SK SCLK SO DIN NOTE: (1) Additional pins omitted for clarity. Figure 72. DAC8560 to Microwire Interface DAC8560 to 68HC11 Interface Figure 73 shows a serial interface between the DAC8560 and the 68HC11 microcontroller. SCK of the 68HC11 drives the SCLK of the DAC8560, while the MOSI output drives the serial data line of the DAC. The SYNC signal is derived from a port line (PC7), similar to the 8051 diagram. DAC8560 (1) 68HC11(1) PC7 SYNC SCK SCLK MOSI 80C51/80L51(1) DAC8560 (1) P3.3 SYNC TXD SCLK RXD DIN NOTE: (1) Additional pins omitted for clarity. Figure 71. DAC8560 to 80C51/80L51 Interface DAC8560 to Microwire Interface Figure 72 shows an interface between the DAC8560 and any Microwire compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the DAC8560 on the rising edge of the SK signal. 24 DIN NOTE: (1) Additional pins omitted for clarity. Figure 73. DAC8560 to 68HC11 Interface The 68HC11 should be configured so that its CPOL bit is '0' and its CPHA bit is '1'. This configuration causes data appearing on the MOSI output to be valid on the falling edge of SCK. When data is being transmitted to the DAC, the SYNC line is held LOW (PC7). Serial data from the 68HC11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. (Data is transmitted MSB first.) In order to load data to the DAC8560, PC7 is left LOW after the first eight bits are transferred, then a second and third serial write operation is performed to the DAC. PC7 is taken HIGH at the end of this procedure. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com LAYOUT A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. The DAC8560 offers single-supply operation, and it often is used in close proximity with digital logic, microcontrollers, microprocessors, and digital signal processors. The more digital logic present in the design and the higher the switching speed, the more difficult it is to keep digital noise from appearing at the output. As a result of the single ground pin of the DAC8560, all return currents, including digital and analog return currents for the DAC, must flow through a single point. Ideally, GND would be connected directly to an analog ground plane. This plane would be separate from the ground connection for the digital components until they were connected at the power-entry point of the system. The power applied to VDD should be well regulated and low noise. Switching power supplies and DC/DC converters often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between the power connections and analog output. As with the GND connection, VDD should be connected to a power-supply plane or trace that is separate from the connection for digital logic until they are connected at the power-entry point. In addition, a 1μF to 10μF capacitor and 0.1μF bypass capacitor are strongly recommended. In some situations, additional bypassing may be required, such as a 100μF electrolytic capacitor or even a Pi filter made up of inductors and capacitors – all designed to essentially low-pass filter the supply, removing the high-frequency noise. Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 25 DAC8560 SLAS464B – DECEMBER 2006 – REVISED NOVEMBER 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (December 2006) to Revision A Page • Changed Output Voltage parameter min/max values from 2.4995 and 2.5005 to 2.4975 and 2.5025, respectively ........... 4 • Changed Initial Accuracy parameter min/max values from –0.02 and 0.02 to –0.1 and 0.1, respectively ........................... 4 Changes from Revision A (May 2011) to Revision B Page • Changed Revision date from A, May 2011 to B, November 2011 ....................................................................................... 1 • Changed "Zero-code error drift" in the ELEC CHARA table, TYP from ±20 to ±4 ............................................................... 3 26 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Link(s): DAC8560 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC8560IADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IADGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IADGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IBDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IBDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IBDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 D860 DAC8560ICDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560ICDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560ICDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IDDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IDDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 105 D860 DAC8560IDDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 105 D860 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing DAC8560IADGKR VSSOP DGK 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560IADGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560IBDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560IBDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560ICDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560ICDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560IDDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DAC8560IDDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC8560IADGKR VSSOP DGK 8 2500 367.0 367.0 38.0 DAC8560IADGKT VSSOP DGK 8 250 210.0 185.0 35.0 DAC8560IBDGKR VSSOP DGK 8 2500 367.0 367.0 38.0 DAC8560IBDGKT VSSOP DGK 8 250 210.0 185.0 35.0 DAC8560ICDGKR VSSOP DGK 8 2500 367.0 367.0 38.0 DAC8560ICDGKT VSSOP DGK 8 250 210.0 185.0 35.0 DAC8560IDDGKR VSSOP DGK 8 2500 367.0 367.0 38.0 DAC8560IDDGKT VSSOP DGK 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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