GS8662T08/09/18/36E-250/200/167 72Mb SigmaDDR-II™ Burst of 2 SRAM • Simultaneous Read and Write SigmaDDR-II™ Interface • Common I/O bus • JEDEC-standard pinout and package • Double Data Rate interface • Byte Write (x36 and x18) and Nybble Write (x8) function • Burst of 2 Read and Write • 1.8 V +100/–100 mV core power supply • 1.5 V or 1.8 V HSTL Interface • Pipelined read operation with self-timed Late Write • Fully coherent read and write pipelines • ZQ pin for programmable output drive strength • IEEE 1149.1 JTAG-compliant Boundary Scan • Pin-compatible with present 9Mb, 18Mb, 36Mb and 144Mb devices • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available Each internal read and write operation in a SigmaDDR-II B2 RAM is two times wider than the device I/O bus. An input data bus de-multiplexer is used to accumulate incoming data before it is simultaneously written to the memory array. An output data multiplexer is used to capture the data produced from a single memory array read and then route it to the appropriate output drivers as needed. When a new address is loaded into a x18 or x36 version of the part, A0 is used to initialize the pointers that control the data multiplexer / de-multiplexer so the RAM can perform "critical word first" operations. From an external address point of view, regardless of the starting point, the data transfers always follow the same sequence {0, 1} or {1, 0} (where the digits shown represent A0). De sig SigmaDDR-II™ Family Overview inputs, not differential inputs to a single differential clock input buffer. The device also allows the user to manipulate the output register clock inputs quasi independently with the C and C clock inputs. C and C are also independent single-ended clock inputs, not differential inputs. If the C clocks are tied high, the K clocks are routed internally to fire the output registers instead. ct Features 250 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O n— Di sco nt inu ed Pr od u 165-Bump BGA Commercial Temp Industrial Temp me nd ed for Ne w The GS8662T08/09/18/36E are built in compliance with the SigmaDDR-II SRAM pinout standard for Common I/O synchronous SRAMs. They are 75,497,472-bit (72Mb) SRAMs. The GS8662T08/09/18/36E SigmaDDR-II SRAMs are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. Clocking and Addressing Schemes No t Re co m The GS8662T08/09/18/36E SigmaDDR-II SRAMs are synchronous devices. They employ two input register clock inputs, K and K. K and K are independent single-ended clock Unlike the x18 and x36 versions, the input and output data multiplexers of the x8 and x9 versions are not preset by address inputs and therefore do not allow "critical word first" operations. The address fields of the x8 and x9 SigmaDDR-II B2 RAMs are one address pin less than the advertised index depth (e.g., the 8M x 8 has an 4M addressable index, and A0 is not an accessible address pin). Rev: 1.10 8/2012 1/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 -250 -200 -167 tKHKH 4.0 ns 5.0 ns 6.0 ns tKHQV 0.45 ns 0.45 ns 0.5 ns ct Parameter Synopsis 3 4 5 A CQ MCL/SA (144Mb) SA R/W BW2 B NC DQ27 DQ18 SA BW3 C NC NC DQ28 VSS SA D NC DQ29 DQ19 VSS VSS E NC NC DQ20 VDDQ VSS F NC DQ30 DQ21 VDDQ VDD G NC DQ31 DQ22 VDDQ VDD H Doff VREF VDDQ VDDQ J NC NC DQ32 K NC NC DQ23 L NC DQ33 M NC NC N NC DQ35 P NC NC R TDO 7 8 9 10 11 K BW1 LD SA SA CQ K BW0 SA NC NC DQ8 SA0 SA VSS NC DQ17 DQ7 VSS VSS VSS NC NC DQ16 VSS VSS VDDQ NC DQ15 DQ6 VSS VDD VDDQ NC NC DQ5 VSS VDD VDDQ NC NC DQ14 VDD VSS VDD VDDQ VDDQ VREF ZQ VDDQ VDD VSS VDD VDDQ NC DQ13 DQ4 VDDQ VDD VSS VDD VDDQ NC DQ12 DQ3 me nd ed for DQ24 VDDQ VSS VSS VSS VDDQ NC NC DQ2 DQ34 VSS VSS VSS VSS VSS NC DQ11 DQ1 DQ25 VSS SA SA SA VSS NC NC DQ10 DQ26 SA SA C SA SA NC DQ9 DQ0 SA SA C SA SA SA TMS TDI Re co m TCK 6 De sig 2 Ne w 1 n— Di sco nt inu ed Pr od u 2M x 36 SigmaDDR-II SRAM—Top View SA 11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch No t Notes: 1. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to DQ27:DQ35. 2. MCL = Must Connect Low Rev: 1.10 8/2012 2/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 4M x 18 SigmaDDR-II SRAM—Top View 2 3 4 5 6 7 8 9 10 11 A CQ SA SA R/W BW1 K NC LD SA SA CQ B NC DQ9 NC SA NC K BW0 SA NC NC DQ8 C NC NC NC VSS SA SA0 SA VSS NC DQ7 NC D NC NC DQ10 VSS VSS VSS VSS VSS NC NC NC E NC NC DQ11 VDDQ VSS VSS VSS VDDQ NC NC DQ6 F NC DQ12 NC VDDQ VDD VSS VDD VDDQ NC NC DQ5 G NC NC DQ13 VDDQ VDD VSS VDD VDDQ NC NC NC H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC NC VDDQ VDD VSS VDD VDDQ NC DQ4 NC K NC NC DQ14 VDDQ VDD VSS VDD VDDQ NC NC DQ3 L NC DQ15 NC VDDQ VSS VSS VSS VDDQ NC NC DQ2 M NC NC NC VSS VSS VSS VSS VSS NC DQ1 NC N NC NC DQ16 VSS SA SA SA VSS NC NC NC P NC NC R TDO TCK n— Di sco nt inu ed Pr od u De sig Ne w me nd ed for ct 1 DQ17 SA SA C SA SA NC NC DQ0 SA SA SA C SA SA SA TMS TDI 11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch No t Re co m Notes: 1. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17. 2. MCL = Must Connect Low Rev: 1.10 8/2012 3/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 8M x 9 SigmaDDR-II SRAM—Top View 2 3 4 5 6 7 8 9 10 11 A CQ SA SA R/W NC K NC LD SA SA CQ B NC NC NC SA NC K BW SA NC NC DQ4 C NC NC NC VSS SA SA SA VSS NC NC NC D NC NC NC VSS VSS VSS VSS VSS NC NC NC E NC NC DQ5 VDDQ VSS VSS VSS VDDQ NC NC DQ3 F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC G NC NC DQ6 VDDQ VDD VSS VDD VDDQ NC NC NC H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC NC VDDQ VDD VSS VDD VDDQ NC DQ2 NC K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC L NC DQ7 NC VDDQ VSS VSS VSS VDDQ NC NC DQ1 M NC NC NC VSS VSS VSS VSS VSS NC NC NC N NC NC NC VSS SA SA SA VSS NC NC NC P NC NC R TDO TCK n— Di sco nt inu ed Pr od u De sig Ne w me nd ed for ct 1 DQ8 SA SA C SA SA NC NC DQ0 SA SA SA C SA SA SA TMS TDI 11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch No t Re co m Notes: 1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0. SA0 is set to 0 at the beginning of each access. 2. MCL = Must Connect Low Rev: 1.10 8/2012 4/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 8M x 8 SigmaDDR-II SRAM—Top View 2 3 4 5 6 7 8 9 10 11 A CQ SA SA R/W NW1 K NC LD SA SA CQ B NC NC NC SA NC K NW0 SA NC NC DQ3 C NC NC NC VSS SA SA SA VSS NC NC NC D NC NC NC VSS VSS VSS VSS VSS NC NC NC E NC NC DQ4 VDDQ VSS VSS VSS VDDQ NC NC DQ2 F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC G NC NC DQ5 VDDQ VDD VSS VDD VDDQ NC NC NC H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC NC VDDQ VDD VSS VDD VDDQ NC DQ1 NC K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC L NC DQ6 NC VDDQ VSS VSS VSS VDDQ NC NC DQ0 M NC NC NC VSS VSS VSS VSS VSS NC NC NC N NC NC NC VSS SA SA SA VSS NC NC NC P NC NC R TDO TCK n— Di sco nt inu ed Pr od u De sig Ne w me nd ed for ct 1 DQ7 SA SA C SA SA NC NC NC SA SA SA C SA SA SA TMS TDI 11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch No t Re co m Notes: 1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0. SA0 is set to 0 at the beginning of each access. 2. NW0 controls writes to DQ0:DQ3; NW1 controls writes to DQ4:DQ7 3. MCL = Must Connect Low Rev: 1.10 8/2012 5/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Pin Description Table Description Type Comments SA Synchronous Address Inputs Input — NC No Connect — — R/W Synchronous Read/Write Input n— Di sco nt inu ed Pr od u ct Symbol — Input Active Low x18/x36 only Input Active Low x8 only Input Active Low Input Active High Input Active Low Input Active High Input Active Low Input — Input — Input — Output — HSTL Input Reference Voltage Input — ZQ Output Impedance Matching Input Input — MCL Must Connect Low — — DQ Data I/O Input/Output Three State Doff Disable DLL when low Input Active Low CQ Output Echo Clock Output — Output Echo Clock Output — Power Supply Supply 1.8 V Nominal Isolated Output Buffer Supply Supply 1.5 V Nominal Power Supply: Ground Supply — Synchronous Byte Writes NW0–NW1 Nybble Write Control Pin LD Synchronous Load Pin K Input Clock K Input Clock C Output Clock C Output Clock TMS Test Mode Select TDI Test Data Input TCK Test Clock Input TDO Test Data Output VREF me nd ed for Ne w De sig BW0–BW3 CQ VDD VDDQ VSS No t Re co m Notes: 1. NC = Not Connected to die or any other pin 2. C, C, K, or K cannot be set to VREF voltage. Rev: 1.10 8/2012 6/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Background ct Common I/O SRAMs, from a system architecture point of view, are attractive in read dominated or block transfer applications. Therefore, the SigmaDDR-II SRAM interface and truth table are optimized for burst reads and writes. Common I/O SRAMs are unpopular in applications where alternating reads and writes are needed because bus turnaround delays can cut high speed Common I/O SRAM data bandwidth in half. n— Di sco nt inu ed Pr od u Burst Operations Read and write operations are "burst" operations. In every case where a read or write command is accepted by the SRAM, it will respond by issuing or accepting two beats of data, executing a data transfer on subsequent rising edges of K and K, as illustrated in the timing diagrams. This means that it is possible to load new addresses every K clock cycle. Addresses can be loaded less often, if intervening deselect cycles are inserted. Deselect Cycles Chip Deselect commands are pipelined to the same degree as read commands. This means that if a deselect command is applied to the SRAM on the next cycle after a read command captured by the SRAM, the device will complete the two beat read data transfer and then execute the deselect command, returning the output drivers to high-Z. A high on the LD pin prevents the RAM from loading read or write command inputs and puts the RAM into deselect mode as soon as it completes all outstanding burst transfer operations. SigmaDDR-II B2 SRAM Read Cycles Ne w SigmaDDR-II B2 SRAM Write Cycles De sig The SRAM executes pipelined reads. The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The read command (LD low and R/W high) is clocked into the SRAM by a rising edge of K. After the next rising edge of K, the SRAM produces data out in response to the next rising edge of C (or the next rising edge of K, if C and C are tied high). The second beat of data is transferred on the next rising edge of C, for a total of two transfers per address load. No t Re co m me nd ed for The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The SRAM executes "late write" data transfers. Data in is due at the device inputs on the rising edge of K following the rising edge of K clock used to clock in the write command (LD and R/W low) and the write address. To complete the remaining beat of the burst of two write transfer, the SRAM captures data in on the next rising edge of K, for a total of two transfers per address load. Rev: 1.10 8/2012 7/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Special Functions n— Di sco nt inu ed Pr od u ct Byte Write and Nybble Write Control Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low during the data in sample times in a write sequence. Each write enable command and write address loaded into the RAM provides the base address for a 2 beat data transfer. The x18 version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any write sequence. Nybble Write (4-bit) write control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble Write Enable” and “NBx” may be substituted in all the discussion above. Data In Sample Time BW0 BW1 Beat 1 0 1 Beat 2 1 0 Resulting Write Operation Byte 2 D9–D17 Written Unchanged D0–D8 D9–D17 Data In Don’t Care Don’t Care Data In Byte 3 D0–D8 Byte 4 D9–D17 Unchanged Written Beat 2 me nd ed for Beat 1 Ne w Byte 1 D0–D8 De sig Example x18 RAM Write Sequence using Byte Write Enables No t Re co m Output Register Control SigmaDDR-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K and K clocks. If the C and C clock inputs isare tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to function as a conventional pipelined read SRAM. Rev: 1.10 8/2012 8/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Example Four Bank Depth Expansion Schematic LD3 LD2 LD0 R/W A0–An K Bank 1 A A LD LD R/W R/W K CQ K DQ C C Bank 2 Bank 3 A A LD LD R/W R/W K CQ DQ K C C CQ DQ me nd ed for C CQ Ne w DQ De sig Bank 0 n— Di sco nt inu ed Pr od u ct LD1 DQ1–DQn CQ No t Re co m Note: For simplicity BWn (or NWn), K, and C are not shown. Rev: 1.10 8/2012 9/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 No t Re co m me nd ed for Ne w De sig n— Di sco nt inu ed Pr od u ct FLXDrive-II Output Driver Impedance Control HSTL I/O SigmaQuad-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to VSS via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is between 175Ω and 350Ω. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is implemented with discrete binary weighted impedance steps. Rev: 1.10 8/2012 10/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 B2 Byte Write Clock Truth Table BW Current Operation K↑ (tn+1) K↑ (tn+2) K↑ (tn) T T T D ct BW D K↑ (tn+2) Write Dx stored if BWn = 0 in both data transfers D1 D2 F Write Dx stored if BWn = 0 in 1st data transfer only D1 X F T Write Dx stored if BWn = 0 in 2nd data transfer only X D2 F F Write Abort No Dx stored in either data transfer X X Current Operation D D K↑ (tn) K↑ (tn+1) K↑ (tn+2) Write Dx stored if NWn = 0 in both data transfers D1 D2 Write Dx stored if NWn = 0 in 1st data transfer only D1 X n— Di sco nt inu ed Pr od u K↑ (tn+1) Ne w B2 Nybble Write Clock Truth Table De sig Notes: 1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”. 2. If one or more BWn = 0, then BW = “T”, else BW = “F”. NW K↑ (tn+1) K↑ (tn+2) T T T F F T Write Dx stored if NWn = 0 in 2nd data transfer only X D2 F F Write Abort No Dx stored in either data transfer X X No t Re co m me nd ed for NW Notes: 1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”. 2. If one or more NWn = 0, then NW = “T”, else NW = “F”. Rev: 1.10 8/2012 11/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 x36 Byte Write Enable (BWn) Truth Table BW1 BW2 BW3 D0–D8 D9–D17 D18–D26 D27–D35 1 1 1 1 Don’t Care Don’t Care Don’t Care Don’t Care 0 1 1 1 Data In Don’t Care Don’t Care Don’t Care 1 0 1 1 Don’t Care Data In Don’t Care Don’t Care 0 0 1 1 Data In Data In Don’t Care Don’t Care 1 1 0 1 Don’t Care Don’t Care Data In Don’t Care 0 1 0 1 Data In Don’t Care Data In Don’t Care 1 0 0 1 Don’t Care Data In Data In Don’t Care 0 0 0 1 Data In Data In Data In Don’t Care 1 1 1 0 Don’t Care Don’t Care Don’t Care Data In 0 1 1 0 Data In Don’t Care Don’t Care Data In 1 0 1 0 Don’t Care Data In Don’t Care Data In 0 0 1 0 Data In Data In Don’t Care Data In 1 1 0 0 Don’t Care Don’t Care Data In Data In 0 1 0 0 Data In Don’t Care Data In Data In 1 0 0 0 Don’t Care Data In Data In Data In 0 0 0 0 Data In Data In Data In Data In 1 1 0 1 1 0 0 0 n— Di sco nt inu ed Pr od u De sig D0–D8 D9–D17 Don’t Care Don’t Care Data In Don’t Care Don’t Care Data In Data In Data In NW1 D0–D3 D4–D7 1 Don’t Care Don’t Care 1 Data In Don’t Care 0 Don’t Care Data In 0 Data In Data In me nd ed for BW1 Re co m BW0 Ne w x18 Byte Write Enable (BWn) Truth Table ct BW0 x8 Nybble Write Enable (NWn) Truth Table NW0 0 1 No t 1 0 *Assuming stable conditions, the RAM can achieve optimum impedance within 1024 cycles. Rev: 1.10 8/2012 12/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Absolute Maximum Ratings (All voltages reference to VSS) Description Value Unit VDD Voltage on VDD Pins –0.5 to 2.9 V VDDQ Voltage in VDDQ Pins –0.5 to VDD VREF Voltage in VREF Pins VI/O Voltage on I/O Pins VIN Voltage on Other Input Pins IIN Input Current on Any Pin IOUT Output Current on Any I/O Pin TJ Maximum Junction Temperature TSTG Storage Temperature n— Di sco nt inu ed Pr od u ct Symbol V –0.5 to VDDQ V –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V +/–100 mA dc +/–100 mA dc o 125 C oC –55 to 125 Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect reliability of this component. De sig Recommended Operating Conditions Power Supplies Supply Voltage Min. Typ. Max. Unit VDD 1.7 1.8 1.9 V VDDQ 1.4 — 1.9 V 0.68 — 0.95 V me nd ed for I/O Supply Voltage Reference Voltage Symbol Ne w Parameter VREF Note: The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power down sequence must be the reverse. VDDQ must not exceed VDD. For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up. Operating Temperature Symbol Min. Typ. Max. Unit Ambient Temperature (Commercial Range Versions) TA 0 25 70 °C Ambient Temperature (Industrial Range Versions) TA –40 25 85 °C No t Re co m Parameter Rev: 1.10 8/2012 13/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Thermal Impedance Test PCB Substrate θ JA (C°/W) Airflow = 0 m/s θ JA (C°/W) Airflow = 1 m/s θ JA (C°/W) Airflow = 2 m/s θ JB (C°/W) θ JC (C°/W) 165 BGA 4-layer 16.3 13.4 12.4 6.2 1.5 ct Package HSTL I/O DC Input Characteristics Parameter Symbol DC Input Logic High VIH (dc) DC Input Logic Low VIL (dc) n— Di sco nt inu ed Pr od u Notes: 1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number. 2. Please refer to JEDEC standard JESD51-6. 3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to the PCB can result in cooling or heating of the RAM depending on PCB temperature. Min Max Units Notes VREF + 0.10 VDDQ + 0.3 V V 1 –0.3 V VREF – 0.10 V 1 AC Input Logic High AC Input Logic Low VREF Peak-to-Peak AC Voltage Symbol Min Max Units Notes VIH (ac) VREF + 0.20 — V 2,3 VIL (ac) — VREF – 0.20 V 2,3 VREF (ac) — 5% VREF (DC) V 1 me nd ed for Parameter Ne w HSTL I/O AC Input Characteristics De sig Notes: 1. Compatible with both 1.8 V and 1.5 V I/O drivers. 2. These are DC test criteria. DC design criteria is VREF ± 50 mV. The AC VIH/VIL levels are defined separately for measuring timing parameters. 3. VIL (Min) DC = –0.3 V, VIL(Min) AC = –1.5 V (pulse width ≤ 3 ns). 4. VIH (Max) DC = VDDQ + 0.3 V, VIH(Max) AC = VDDQ + 0.85 V (pulse width ≤ 3 ns). No t Re co m Notes: 1. The peak-to-peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF. 2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other. 3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers. Rev: 1.10 8/2012 14/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Undershoot Measurement and Timing Overshoot Measurement and Timing VIH 20% tKHKH VDD + 1.0 V VSS n— Di sco nt inu ed Pr od u 50% ct 50% VDD VSS – 1.0 V 20% tKHKH VIL Capacitance (TA = 25oC, f = 1 MHZ, VDD = 3.3 V) Parameter Symbol Input Capacitance CIN Output Capacitance COUT Clock Capacitance CCLK Input high level Unit VIN = 0 V 4 5 pF VOUT = 0 V 6 7 pF — 5 6 pF Conditions VDDQ 0V me nd ed for Input low level Max. Ne w AC Test Conditions Parameter Typ. De sig Note: This parameter is sample tested. Test conditions Max. input slew rate 2 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 Re co m Note: Test conditions as specified with output loading as shown unless otherwise noted. AC Test Load Diagram No t DQ Rev: 1.10 8/2012 50Ω RQ = 250 Ω (HSTL I/O) VREF = 0.75 V VT = VDDQ/2 15/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Symbol Test Conditions Min. Max Input Leakage Current (except mode pins) IIL VIN = 0 to VDD –2 uA 2 uA Doff IINDOFF VDD ≥ VIN ≥ VIL 0 V ≤ VIN ≤ VIL –100 uA –2 uA 2 uA 2 uA Output Leakage Current IOL Output Disable, VOUT = 0 to VDDQ –2 uA 2 uA n— Di sco nt inu ed Pr od u Parameter ct Input and Output Leakage Characteristics Programmable Impedance HSTL Output Driver DC Electrical Characteristics Parameter Output High Voltage Output Low Voltage Output High Voltage Output Low Voltage Symbol Min. Max. Units Notes VOH1 VDDQ/2 VDDQ V 1, 3 VOL1 Vss VDDQ/2 V 2, 3 VOH2 VDDQ – 0.2 VDDQ V 4, 5 VOL2 Vss 0.2 V 4, 6 No t Re co m me nd ed for Ne w De sig Notes: 1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω). 2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω). 3. Parameter tested with RQ = 250Ω and VDDQ = 1.5 V or 1.8 V 4. 0Ω ≤ RQ ≤ ∞Ω 5. IOH = –1.0 mA 6. IOL = 1.0 mA Rev: 1.10 8/2012 16/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Operating Currents Symbol Test Conditions Operating Current (x36): DDR IDD VDD = Max, IOUT = 0 mA Cycle Time ≥ tKHKH Min Operating Current (x18): DDR IDD VDD = Max, IOUT = 0 mA Cycle Time ≥ tKHKH Min Operating Current (x9): DDR IDD VDD = Max, IOUT = 0 mA Cycle Time ≥ tKHKH Min Operating Current (x8): DDR IDD VDD = Max, IOUT = 0 mA Cycle Time ≥ tKHKH Min Standby Current (NOP): DDR ISB1 Device deselected, IOUT = 0 mA, f = Max, All Inputs ≤ 0.2 V or ≥ VDD – 0.2 V Notes: Notes 0 to 70°C –40 to 85°C 0 to 70°C –40 to 85°C 775 mA 650 mA 675 mA 550 mA 575 mA 2, 3 700 mA 725 mA 600 mA 625 mA 525 mA 550 mA 2, 3 700 mA 725 mA 575 mA 600 mA 525 mA 550 mA 2, 3 700 mA 725 mA 575 mA 600 mA 525 mA 550 mA 2, 3 255 mA 265 mA 245 mA 255 mA 300 mA 310 mA 2, 4 0 to 70°C –40 to 85°C 750 mA De sig Power measured with output pins floating. Minimum cycle, IOUT = 0 mA Operating current is calculated with 50% read cycles and 50% write cycles. Standby Current is only after all pending read and write burst operations are completed. No t Re co m me nd ed for Ne w 1. 2. 3. 4. -167 n— Di sco nt inu ed Pr od u Parameter -200 ct -250 Rev: 1.10 8/2012 17/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Parameter -250 Symbol -200 -167 Units Min Max Min Max Min Max 8.4 ns Notes AC Electrical Characteristics Clock tKHKH tCHCH 4.0 8.4 5.0 8.4 6.0 tTKC Variable tKCVar — 0.2 — 0.2 — 0.2 ns K, K Clock High Pulse Width C, C Clock High Pulse Width tKHKL tCHCL 1.6 — 2.0 — 2.4 — ns K, K Clock Low Pulse Width C, C Clock Low Pulse Width tKLKH tCLCH 1.6 — 2.0 — 2.4 — ns K to K High C to C High tKHKH tCHCH 1.8 — 2.2 — 2.7 — ns K to K High C to C High tKHKH tCHCH 1.8 — 2.2 — 2.7 — ns K, K Clock High to C, C Clock High tKHCH 0 1.8 0 2.3 0 2.8 ns DLL Lock Time tKCLock 1024 — 1024 — 1024 — cycle K Static to DLL reset tKCReset 30 — 30 — 30 — ns K, K Clock High to Data Output Valid C, C Clock High to Data Output Valid tKHQV tCHQV — 0.45 — 0.45 — 0.5 ns 4 K, K Clock High to Data Output Hold C, C Clock High to Data Output Hold tKHQX tCHQX –0.45 — –0.45 — –0.5 — ns 4 K, K Clock High to Echo Clock Valid C, C Clock High to Echo Clock Valid tKHCQV tCHCQV — 0.45 — 0.45 — 0.5 ns K, K Clock High to Echo Clock Hold C, C Clock High to Echo Clock Hold tKHCQX tCHCQX –0.45 — –0.45 — –0.5 — ns tCQHQV — 0.30 — 0.35 — 0.40 ns 8 tCQHQX –0.30 — –0.35 — –0.40 — ns 8 tCQHCQH tCQHCQH 1.55 — 1.95 — 2.45 — ns tKHQZ tCHQZ — 0.45 — 0.45 — 0.5 ns 4 tKHQX1 tCHQX1 –0.45 — –0.45 — –0.5 — ns 4 tAVKH 0.5 — 0.6 — 0.7 — ns 1 tIVKH 0.5 — 0.6 — 0.7 — ns 2 Control Input Setup Time (BWX, NWX) tIVKH 0.35 — 0.4 — 0.5 — ns 3 Data Input Setup Time tDVKH 0.35 — 0.4 — 0.5 — ns CQ, CQ High Output Hold CQ Phase Distortion K Clock High to Data Output High-Z C Clock High to Data Output High-Z Setup Times Address Input Setup Time Re co m K Clock High to Data Output Low-Z C Clock High to Data Output Low-Z No t Control Input Setup Time (R/W, LD) Rev: 1.10 8/2012 Ne w me nd ed for CQ, CQ High Output Valid n— Di sco nt inu ed Pr od u De sig Output Times ct K, K Clock Cycle Time C, C Clock Cycle Time 18/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 6 6 © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Parameter -250 Symbol -200 -167 Min Max Min Max Min Max Units Notes AC Electrical Characteristics (Continued) Hold Times tKHAX 0.5 — 0.6 — 0.7 — ns 1 Control Input Hold Time (R/W, LD) tKHIX 0.5 — 0.6 — 0.7 — ns 2 Control Input Hold Time (BWX, NWX) tIVKH 0.35 — 0.4 — 0.5 — ns 3 Data Input Hold Time tKHDX 0.35 — 0.4 — 0.5 — ns 1. 2. 3. 4. 5. All Address inputs must meet the specified setup and hold times for all latching clock edges. Control signals are R/W, LD Control signals BW0, BW1, (NW0, NW1 for x8) and BW2, BW3 for x36. If C, C are tied high, K, K become the references for C, C timing parameters To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V). It is not possible for two SRAMs on the same board to be at such different voltages and temperatures. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard bands and test setup variations. No t Re co m me nd ed for Ne w De sig 6. 7. 8. n— Di sco nt inu ed Pr od u Notes: ct Address Input Hold Time Rev: 1.10 8/2012 19/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology Rev: 1.10 8/2012 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 20/34 CQ CQ DQ C C BWx R/W LD Address K No t K IVKH KHKH A IVKH KHAX AVKH KHKL Read A KHIX KHKH KHKL KHIX me nd ed for Re co m NOP B CHCQV CHCQX KLKH KHnKH De sig KHnKH Ne w KLKH Read B A A+1 CHQX1 C Write C B+1 C D DVKH KHIX IVKH Read D C+1 CQHQV CQHQX B C CHQX C+1 n— Di sco nt inu ed Pr od u CHQV NOP C and C Controlled Read First Timing Diagram ct KHDX GS8662T08/09/18/36E-250/200/167 © 2005, GSI Technology Rev: 1.10 8/2012 CQ CQ DQ1 BWx R/W LD Address K No t K BVKH KHKH A KHCQX KHCQV KHBX BVKH KLKH B KHBX KHCQV KHCQX Ne w KHAX AVKH KHKL Read A me nd ed for Re co m NOP A+1 NOP B KHQV C B+1 Write C KHQX C D DVKH C+1 KHBX BVKH Read D A CQHQV CQHQX C C+1 n— Di sco nt inu ed Pr od u KHQX1 De sig KHnKH Read B K and K Controlled Read First Timing Diagram ct KHDX GS8662T08/09/18/36E-250/200/167 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 21/34 © 2005, GSI Technology Rev: 1.10 8/2012 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 22/34 CQ CQ DQ C C BWx R/W LD CHCQX IVKH A KHKH CHCQV KHIX CHCQX B KHKH C DVKH A+1 KHKL A+1 KHIX KHnKH KHnKH Read C CHQX1 D NOP CHQV C E Write D CHQX D KHDX B CQHQV B+1 CQHQX C+1 D ct NOP n— Di sco nt inu ed Pr od u KLKH KLKH De sig CHCQV A A IVKH KHIX IVKH KHKL Read B Ne w KHAX AVKH Write A me nd ed for Re co m K Address No t K NOP C and C Controlled Write First Timing Diagram D+1 D+1 GS8662T08/09/18/36E-250/200/167 © 2005, GSI Technology Rev: 1.10 8/2012 KHAX CQ CQ KHCQX KHCQV A DVKH KLKH KHDX C A+1 A+1 KHQX1 D NOP KHQV C E KHQX Write D D NOP B CQHQV B+1 CQHQX C+1 D n— Di sco nt inu ed Pr od u KHnKH Read C De sig KHBX BVKH KHBX BVKH KHKL Read B Ne w DQ KHCQV KHBX B A KHCQX BVKH A AVKH KHKH me nd ed for Re co m Write A BWx R/W LD Address K No t K NOP K and K Controlled Write First Timing Diagram ct D+1 D+1 GS8662T08/09/18/36E-250/200/167 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 23/34 © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 JTAG Port Operation ct Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDD. n— Di sco nt inu ed Pr od u Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected. JTAG Pin Descriptions Pin Name I/O TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. In The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level. Test Data In TDO Test Data Out Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. Ne w TDI Description De sig Pin JTAG Port Registers me nd ed for Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up. Re co m Overview The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. No t Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM’s JTAG Port to another device in the scan chain with as little delay as possible. Rev: 1.10 8/2012 24/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 n— Di sco nt inu ed Pr od u ct Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register. JTAG TAP Block Diagram · · · · · · · · Boundary Scan Register · · 0 De sig Bypass Register 0 108 1 · 2 1 0 Instruction Register Ne w TDI TDO ID Code Register · · ·· 2 1 0 me nd ed for 31 30 29 Control Signals TMS TCK Test Access Port (TAP) Controller No t Re co m Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. Rev: 1.10 8/2012 25/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 GSI Technology JEDEC Vendor ID Code Bit # n— Di sco nt inu ed Pr od u ct Not Used Presence Register ID Register Contents 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 X 1 X X X X X X X X X X X X Tap Controller Instruction Set X X X X X X X 0 0 0 1 1 0 1 1 0 0 1 Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. No t Re co m me nd ed for Ne w De sig When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table. Rev: 1.10 8/2012 26/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 JTAG Tap Controller State Diagram Test Logic Reset 1 0 Run Test Idle 1 Select DR 1 0 1 Capture DR 0 Capture IR 0 Shift DR 1 1 ct 0 1 Shift IR 0 1 1 Exit1 DR 0 Exit1 IR 0 0 Pause DR 1 Exit2 DR De sig 1 Update DR 0 0 Pause IR 1 Exit2 IR 0 1 0 0 Update IR 1 0 Ne w 1 1 Select IR n— Di sco nt inu ed Pr od u 0 me nd ed for Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. No t Re co m SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is still determined by its input pins. Rev: 1.10 8/2012 27/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK when the controller is in the Update-IR state. n— Di sco nt inu ed Pr od u ct Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction. Notes EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1 IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2 SAMPLE-Z 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z except CQ. 1 RFU 011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1 GSI 101 GSI private instruction. 1 RFU 110 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 Places Bypass Register between TDI and TDO. 1 Ne w Description me nd ed for Code Re co m Instruction De sig JTAG TAP Instruction Set Summary BYPASS 111 No t Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state. Rev: 1.10 8/2012 28/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 JTAG Port Recommended Operating Conditions and DC Characteristics Symbol Min. Max. Unit Notes Test Port Input Low Voltage VILJ –0.3 0.3 * VDD V 1 Test Port Input High Voltage VIHJ 0.6 * VDD VDD +0.3 V 1 n— Di sco nt inu ed Pr od u ct Parameter TMS, TCK and TDI Input Leakage Current TMS, TCK and TDI Input Leakage Current TDO Output Leakage Current Test Port Output High Voltage Test Port Output Low Voltage Test Port Output CMOS High Test Port Output CMOS Low IINHJ –300 1 uA 2 IINLJ –1 100 uA 3 IOLJ –1 1 uA 4 VOHJ VDD – 200 mV — V 5, 6 VOLJ — 0.4 V 5, 7 VOHJC VDD – 100 mV — V 5, 8 VOLJC — 100 mV V 5, 9 me nd ed for Ne w De sig Notes: 1. Input Under/overshoot voltage must be –1 V < Vi < VDDn +1 V not to exceed V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ ≤ VIN ≤ VDDn 3. 0 V ≤ VIN ≤ VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDD supply. 6. IOHJ = –2 mA 7. IOLJ = + 2 mA 8. IOHJC = –100 uA 9. IOLJC = +100 uA JTAG Port AC Test Conditions Parameter Input high level Re co m Input low level Conditions VDD – 0.2 V JTAG Port AC Test Load TDO 0.2 V 1 V/ns Input reference level VDD/2 Output reference level VDD/2 50Ω 30pF* VDDQ/2 * Distributed Test Jig Capacitance No t Input slew rate Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted. Rev: 1.10 8/2012 29/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 JTAG Port Timing Diagram tTKC tTKH tTKL TCK tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input JTAG Port AC Electrical Characteristics n— Di sco nt inu ed Pr od u tTH tTS ct TDI Parameter Symbol Min Max Unit TCK Cycle Time tTKC 50 — TCK Low to TDO Valid tTKQ — TCK High Pulse Width tTKH 20 TCK Low Pulse Width tTKL 20 TDI & TMS Set Up Time tTS 10 — ns TDI & TMS Hold Time tTH 10 — ns De sig ns ns — ns — ns No t Re co m me nd ed for Ne w 20 Rev: 1.10 8/2012 30/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Package Dimensions—165-Bump FPBGA (Package E) A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.40~0.60 (165x) ct 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 1.0 14.0 Ne w 10.0 15±0.05 0.20(4x) No t Re co m C 1.0 0.36~0.46 1.50 MAX. SEATING PLANE B 1.0 A B C D E F G H J K L M N P R me nd ed for 0.20 C A De sig 17±0.05 1.0 A B C D E F G H J K L M N P R n— Di sco nt inu ed Pr od u 11 10 9 8 7 6 5 4 3 2 1 Rev: 1.10 8/2012 31/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Ordering Information—GSI SigmaDDR-II SRAM Speed (MHz) TA2 250 C 165-bump BGA 200 C SigmaDDR-II B2 SRAM 165-bump BGA 167 C GS8662T08E-250I SigmaDDR-II B2 SRAM 165-bump BGA 250 I 8M x 8 GS8662T08E-200I SigmaDDR-II B2 SRAM 165-bump BGA 200 I 8M x 8 GS8662T08E-167I SigmaDDR-II B2 SRAM 165-bump BGA 167 I 8M x 9 GS8662T09E-250 SigmaDDR-II B2 SRAM 165-bump BGA 250 C 8M x 9 GS8662T09E-200 SigmaDDR-II B2 SRAM 165-bump BGA 200 C 8M x 9 GS8662T09E-167 SigmaDDR-II B2 SRAM 165-bump BGA 167 C 8M x 9 GS8662T09E-250I SigmaDDR-II B2 SRAM 165-bump BGA 250 I 8M x 9 GS8662T09E-200I SigmaDDR-II B2 SRAM 165-bump BGA 200 I 8M x 9 GS8662T09E-167I SigmaDDR-II B2 SRAM 165-bump BGA 167 I 4M x 18 GS8662T18E-250 SigmaDDR-II B2 SRAM 165-bump BGA 250 C 4M x 18 GS8662T18E-200 SigmaDDR-II B2 SRAM 165-bump BGA 200 C 4M x 18 GS8662T18E-167 SigmaDDR-II B2 SRAM 165-bump BGA 167 C 4M x 18 GS8662T18E-250I SigmaDDR-II B2 SRAM 165-bump BGA 250 I 4M x 18 GS8662T18E-200I SigmaDDR-II B2 SRAM 165-bump BGA 200 I 4M x 18 GS8662T18E-167I SigmaDDR-II B2 SRAM 165-bump BGA 167 I 2M x 36 GS8662T36E-250 SigmaDDR-II B2 SRAM 165-bump BGA 250 C 2M x 36 GS8662T36E-200 SigmaDDR-II B2 SRAM 165-bump BGA 200 C 2M x 36 GS8662T36E-167 SigmaDDR-II B2 SRAM 165-bump BGA 167 C 2M x 36 GS8662T36E-250I SigmaDDR-II B2 SRAM 165-bump BGA 250 I 2M x 36 GS8662T36E-200I SigmaDDR-II B2 SRAM 165-bump BGA 200 I 2M x 36 GS8662T36E-167I SigmaDDR-II B2 SRAM 165-bump BGA 167 I 8M x 8 GS8662T08GE-250 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 C 8M x 8 GS8662T08GE-200 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 C 8M x 8 GS8662T08GE-167 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 C 8M x 8 GS8662T08GE-250I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 I GS8662T08GE-200I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 I GS8662T08GE-167I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 I GS8662T09GE-250 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 C Part Number1 Type Package 8M x 8 GS8662T08E-250 SigmaDDR-II B2 SRAM 165-bump BGA 8M x 8 GS8662T08E-200 SigmaDDR-II B2 SRAM 8M x 8 GS8662T08E-167 8M x 8 8M x 8 n— Di sco nt inu ed Pr od u De sig Ne w me nd ed for Re co m No t 8M x 8 8M x 9 ct Org Notes: 1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662T36E-200T. 2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. Rev: 1.10 8/2012 32/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Ordering Information—GSI SigmaDDR-II SRAM Part Number1 Type Package Speed (MHz) TA2 8M x 9 GS8662T09GE-200 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 C 8M x 9 GS8662T09GE-167 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 C 8M x 9 GS8662T09GE-250I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 I 8M x 9 GS8662T09GE-200I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 I 8M x 9 GS8662T09GE-167I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 I 4M x 18 GS8662T18GE-250 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 C 4M x 18 GS8662T18GE-200 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 C 4M x 18 GS8662T18GE-167 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 C 4M x 18 GS8662T18GE-250I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 I 4M x 18 GS8662T18GE-200I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 I 4M x 18 GS8662T18GE-167I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 I 2M x 36 GS8662T36GE-250 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 C 2M x 36 GS8662T36GE-200 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 C 2M x 36 GS8662T36GE-167 SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 C 2M x 36 GS8662T36GE-250I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 250 I 2M x 36 GS8662T36GE-200I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 200 I 2M x 36 GS8662T36GE-167I SigmaDDR-II B2 SRAM RoHS-compliant 165-bump BGA 167 I De sig n— Di sco nt inu ed Pr od u ct Org No t Re co m me nd ed for Ne w Notes: 1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662T36E-200T. 2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. Rev: 1.10 8/2012 33/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GS8662T08/09/18/36E-250/200/167 Revision History Format GS8662Txx_r1; GS8662Txx_r1_01 Content GS8662Txx_r1_01; GS8662Txx_r1_02 Content GS8662Txx_r1_02; GS8662Txx_r1_03 Content GS8662Txx_r1_03; GS8662Txx_r1_04 Content GS8662Txx_r1_04, GS8662Txx_r1_05 Content GS8662Txx_r1_05; GS8662Txx_r1_06 Content Content GS8662Txx_r1_07; GS8662Txx_r1_08 Content GS8662Txx_r1_08; GS8662Txx_r1_09a • Added RoHS-compliant information • Updated MAX tKHKH • Updated tKHKH, tKHCH in AC Char table • Added tKHKH and CQ Phase Distortion to AC Char table • Added CZ data • Updated I/O supply voltage data • Updated power-up sequence information • Changed separate Read and Write pins to one R/W-bar pin. • Updated Status to PQ • Added VREF note to Pin Description table • Updated FLXDrive-II Output Driver Impedance Control section • Removed Preliminary banner due to production status • Removed 267 MHz speed bin (T) De sig GS8662Txx_r1_06; GS8662Txx_r1_07 • Creation of new datasheet ct GS8662Txx_r1 Revisions n— Di sco nt inu ed Pr od u Types of Changes Format or Content Ne w File Name • (Rev1.09a: Editorial updates) No t Re co m me nd ed for Content • Revised AC Electrical Characteristics table Rev: 1.10 8/2012 34/34 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology