INFINEON TLE4267G

5-V Low Drop Voltage Regulator
TLE 4267
Features
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•
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•
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•
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Output voltage tolerance ≤ ±2%
400 mA output current capability
Low-drop voltage
Very low standby current consumption
Input voltage up to 40 V
Overvoltage protection up to 60 V (≤ 400 ms)
Reset function down to 1 V output voltage
ESD protection up to 2000 V
Adjustable reset time
On/off logic
Overtemperature protection
Reverse polarity protection
Short-circuit proof
Wide temperature range
Suitable for use in automotive electronics
Green Product (RoHS compliant)
AEC Qualified
P-TO220-7-3
P-TO 220-7-180
(TO-220 AB/7, Option E3180)
Functional Description
TLE 4267 is a 5-V low drop voltage regulator for
automotive applications in the PG-TO220-7 or
PG-DSO-14-30 package. It supplies an output current of
> 400 mA. The IC is shortcircuit-proof and has an
overtemperature protection circuit.
P-TO220-7-230
P-DSO-14-3, -8, -9, -11, 14
Type
Package
Type
Package
TLE 4267
PG-TO220-7-11
TLE 4267 S
PG-TO220-7-12
TLE 4267 G
PG-TO263-7-1
TLE 4267 GM
PG-DSO-14-30
Data Sheet
1
Rev. 2.5, 2007-03-20
TLE 4267
Application
The IC regulates an input voltage VI in the range of 5.5 V < VI < 40 V to a nominal output
voltage of VQ = 5.0 V. A reset signal is generated for an output voltage of VQ < VRT (typ.
4.5 V). The reset delay can be set with an external capacitor. The device has two logic
inputs. A voltage of VE2 > 4.0 V given to the E2-pin (e.g. by ignition) turns the device on.
Depending on the voltage on pin E6 the IC may be hold in active-state even if VE2 goes
to low level. This makes it simple to implement a self-holding circuit without external
components. When the device is turned off, the output voltage drops to 0 V and current
consumption tends towards 0 µA.
Design Notes for External Components
The input capacitor CI is necessary for compensation of line influences. The resonant
circuit consisting of lead inductance and input capacitance can be damped by a resistor
of approx. 1 Ω in series with CI. The output capacitor is necessary for the stability of the
regulating circuit. Stability is guaranteed at values of ≥ 22 µF and an ESR of ≤ 3 Ω within
the operating temperature range.
Circuit Description
The control amplifier compares a reference voltage, which is kept highly accurate by
resistance adjustment, to a voltage that is proportional to the output voltage and drives
the base of the series transistor via a buffer. Saturation control as a function of the load
current prevents any over-saturating of the power element.
The reset output RO is in high-state if the voltage on the delay capacitor CD is greater or
equal VUD. The delay capacitance CD is charged with the current ID for output voltages
greater than the reset threshold VRT. If the output voltage gets lower than VRT a fast
discharge of the delay capacitor CD sets in and as soon as VCD gets lower than VLD the
reset output RO is set to low-level (see Figure 6). The reset delay can be set within wide
range by dimensioning the capacitance of the external capacitor.
Data Sheet
2
Rev. 2.5, 2007-03-20
TLE 4267
Table 1
Truth Table for Turn-ON/Turn-OFF Logic
E2,
Inhibit
E6,
Hold
VQ
Remarks
L
X
OFF
Initial state, Inhibit internally pulled-up
H
X
ON
Regulator switched on via Inhibit, by ignition for example
H
L
ON
Hold clamped active to ground by controller while Inhibit is still
high
X
L
ON
Previous state remains, even ignition is shut off: self-holding
state
L
L
ON
Ignition shut off while regulator is in self-holding state
L
H
OFF
Regulator shut down by releasing of Hold while Inhibit remains
Low, final state. No active clamping required by external selfholding circuit (µC) to keep regulator in off-state.
Inhibit: E2 Enable function, active High
Hold: E6 Hold and release function, active Low
Data Sheet
3
Rev. 2.5, 2007-03-20
TLE 4267
PG-TO220-7-11
PG-TO263-7-1
PG-TO220-7-12
1 2 3 4 5 6 7
1 2 3 4 5 6 7
1 2 3 4 5 6 7
Ι
RO D Q
E2 GND E6
AEP01724
Ι
RO D Q
E2 GND E6
Ι
AEP01481
RO D Q
E2 GND E6
AEP02123
Figure 1
Pin Configuration (top view)
Table 2
Pin Definitions and Functions
Pin
Symbol
Function
1
I
Input; block to ground directly at the IC by a ceramic capacitor
2
E2
Inhibit; device is turned on by High signal on this pin; internal
pull-down resistor of 100 kΩ
3
RO
Reset Output; open-collector output internally connected to
the output via a resistor of 30 kΩ
4
GND
Ground; connected to rear of chip
5
D
Reset Delay; connect via capacitor to GND
6
E6
Hold; see Table 1 for function; this input is connected to output
voltage via a pull-up resistor of 50 kΩ
7
Q
5-V Output; block to GND with 22-µF capacitor, ESR < 3 Ω
Data Sheet
4
Rev. 2.5, 2007-03-20
TLE 4267
PG-DSO-14-30
Ι
E2
GND
GND
GND
N.C.
RO
1
2
3
4
5
6
7
14
13
12
11
10
9
8
N.C.
Q
GND
GND
GND
E6
D
AEP02710
Figure 2
Pin Configuration (top view)
Table 3
Pin Definitions and Functions
Pin
Symbol
Function
1
I
Input; block to ground directly at the IC by a ceramic capacitor
2
E2
Inhibit; device is turned on by High signal on this pin; internal
pull-down resistor of 100 kΩ
7
RO
Reset Output; open-collector output internally connected to
the output via a resistor of 30 kΩ
3, 4, 5, 10, GND
11, 12
Ground; connected to rear of chip
8
D
Reset Delay; connect with capacitor to GND for setting delay
9
E6
Hold; see Table 1 for function; this input is connected to output
voltage via a pull-up resistor of 50 kΩ
13
Q
5-V Output; block to GND with 22-µF capacitor, ESR ≤ 3 Ω
6, 14
N.C.
Not Connected
Data Sheet
5
Rev. 2.5, 2007-03-20
TLE 4267
Temperature
Sensor
Input
Saturation
Control and
Protection Circuit
Ι
Q 5V
Output
Control
Amplifier
Adjustment
Buffer
Reset
Generator
Bandgap
Reference
D Reset
Delay
R Reset
Output
Turn-ON/Turn-OFF
Logic
E2
Inhibit
Figure 3
Data Sheet
E6
Hold
GND
Ground
AEB01482
Block Diagram
6
Rev. 2.5, 2007-03-20
TLE 4267
Table 4
Absolute Maximum Ratings
TJ = -40 to 150 °C
Parameter
Symbol
Limit Values Unit
Notes
Min.
Max.
VI
VI
II
-42
42
V
–
–
60
V
t ≤ 400 ms
–
–
–
internally limited
VRO
IRO
-0.3
7
V
–
–
–
–
internally limited
VD
ID
-0.3
42
V
–
–
–
–
–
VQ
IQ
-0.3
7
V
–
–
–
–
internally limited
VE2
IE2
-42
42
V
–
-5
5
mA
t ≤ 400 ms
VE6
IE6
-0.3
7
V
–
–
–
mA
internally limited
IGND
-0.5
–
A
–
TJ
Tstg
–
150
°C
–
-50
150
°C
–
Input
Voltage
Voltage
Current
Reset Output
Voltage
Current
Reset Delay
Voltage
Current
Output
Voltage
Current
Inhibit
Voltage
Current
Hold
Voltage
Current
GND
Current
Temperatures
Junction temperature
Storage temperature
Data Sheet
7
Rev. 2.5, 2007-03-20
TLE 4267
Table 5
Operating Range
Parameter
Symbol
Limit Values Unit
Notes
Min.
Max.
VI
TJ
5.5
40
V
see diagram
-40
150
°C
–
Junction ambient
Rthja
–
65
K/W
PG-TO220-7-11
package
Junction-case
Rthjc
–
6
K/W
PG-TO220-7-11
package
Junction-case
Zthjc
–
2
K/W
T < 1 ms
Input voltage
Junction temperature
Thermal Resistance
PG-TO220-7-11
package
Junction ambient
Rthja
–
70
K/W
PG-TO263-7-1
(SMD) package
Junction-case
Rthjc
–
6
K/W
PG-TO263-7-1
(SMD) package
Junction-case
Zthjc
–
2
K/W
T < 1 ms
PG-TO263-7-1
(SMD) package
Junction ambient
Rthja
–
65
K/W
PG-TO220-7-12
package
Junction-case
Rthjc
–
6
K/W
PG-TO220-7-12
package
Junction-case
Zthjc
–
2
K/W
T < 1 ms
PG-TO220-7-12
package
Junction ambient
Rthja
–
70
K/W
PG-DSO-14-30
package
Junction-pin
Rthjp
–
30
K/W
PG-DSO-14-30
package
Data Sheet
8
Rev. 2.5, 2007-03-20
TLE 4267
Table 6
Characteristics
VI = 13.5 V; -40 °C < TJ < 125 °C; VE2 > 4 V (unless specified otherwise)
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit Test Condition
Output voltage
VQ
4.9
5
5.1
V
5 mA ≤ IQ ≤ 400 mA
6 V ≤ VI ≤ 26 V
Output voltage
VQ
4.9
5
5.1
V
5 mA ≤ IQ ≤ 150 mA
6 V ≤ VI ≤ 40 V
Output current limiting
IQ
Iq
500
–
–
mA
TJ = 25 °C
–
–
50
µA
IC turned off
Current consumption
Iq = II - IQ
Iq
–
1.0
10
µA
TJ = 25 °C
Current consumption
Iq = II - IQ
Iq
Current consumption
Iq = II - IQ
Iq
–
–
60
mA
IQ = 400 mA
Current consumption
Iq = II - IQ
Iq
–
–
80
mA
Drop voltage
VDr
∆VQ
∆VQ
–
0.3
0.6
V
–
–
50
mV
–
15
25
mV
Supply-voltage rejection
SVR
–
54
–
dB
IQ = 400 mA
VI = 5 V
IQ = 400 mA1)
5 mA ≤ IQ ≤ 400 mA
VI = 6 to 36 V;
IQ = 5 mA
fr = 100 Hz;
Vr = 0.5 Vpp
Longterm stability
∆VQ
–
0
–
mV
1000 h
Switching threshold
VRT
4.2
4.5
4.8
V
–
Reset High level
–
4.5
–
–
V
Saturation voltage
VRO,SAT
RRO
VD,SAT
ID
VUD
–
0.1
0.4
V
Rext = ∞
RR = 4.7 kΩ 2)
–
30
–
kΩ
–
–
50
100
mV
8
15
25
µA
VQ < VRT
VD = 1.5 V
2.6
3
3.3
V
–
Current consumption
Iq = II - IQ
Load regulation
Supply-voltage
regulation
IC turned off
–
1.3
4
mA
IQ = 5 mA
IC turned on
Reset Generator
Internal Pull-up resistor
Saturation voltage
Charge current
Upper delay switching
threshold
Data Sheet
9
Rev. 2.5, 2007-03-20
TLE 4267
Table 6
Characteristics (cont’d)
VI = 13.5 V; -40 °C < TJ < 125 °C; VE2 > 4 V (unless specified otherwise)
Parameter
Delay time
Lower delay switching
threshold
Reset reaction time
Symbol
Limit Values
Unit Test Condition
Min.
Typ.
Max.
tD
VLD
–
20
–
ms
Cd = 100 nF
–
0.43
–
V
–
tRR
–
2
–
µs
Cd = 100 nF
VU,INH
VL,INH
RINH
∆VINH
IINH
VU,HOLD
VL,HOLD
RHOLD
–
3
4
V
IC turned on
2
–
–
V
IC turned off
50
100
200
kΩ
–
0.2
0.5
0.8
V
–
–
35
100
µA
VINH = 4 V
30
35
40
%
Referred to VQ
60
70
80
%
Referred to VQ
20
50
100
kΩ
–
VI,OV
VI,turn on
42
44
46
V
36
–
–
V
VI increasing
VI decreasing
Inhibit
Turn on voltage
Turn off voltage
Pull-down resistor
Hysteresis
Input current
Hold voltage
Turn off voltage
Pull-up resistor
Overvoltage Protection
Turn off voltage
Turn on voltage
after turn off
1) Drop voltage = VI - VQ (measured when the output voltage VQ has dropped 100 mV from the nominal value
obtained at VI = 13.5 V)
2) The reset output is Low for 1 V < VQ < VRT
Data Sheet
10
Rev. 2.5, 2007-03-20
TLE 4267
ΙΙ
Ι
1000 µF
470 nF
Ι E2
VΙ
22 µF
TLE 4267
Inhibit
RO
D
Ιd
VE2
ΙQ
Q
VC
GND
Ι GND
4.7 k Ω
Ι RO
VQ
Hold
VR
VE6
CD
AES01483
Figure 4
Test Circuit
Ι
Input
E2; eg
from Terminal 15
Reset
to µC
470 nF
Inhibit
Q
5 V Output
R
TLE 4267
100 nF
R
GND
22 µF
Hold
From µC
AES01484
Figure 5
Data Sheet
Application Circuit
11
Rev. 2.5, 2007-03-20
TLE 4267
VΙ
t
VINH
VU, INH
VL, INH
t
< t RR
VQ
VRT
VD
VUD
t
t RR
dV Ι D
=
dt C D
VLD
VD, SAT
VRO
t
tD
VRO, SAT
t
Power on Thermal
Reset
Shutdown
Figure 6
Data Sheet
Voltage Drop
at Input
Undervoltage
at Output
Secondary Load
Spike
Bounce
Shutdown
AET01985
Time Response
12
Rev. 2.5, 2007-03-20
TLE 4267
VΙ
t
VE2
VU, INH
1)
5)
VL, INH
<1 µs
VE6
VU, HOLD
2)
VL, HOLD
4)
< 10 µs
6)
t
10)
7)
t
VQ
VQ, NOM
VRT
8)
t
VD
VUD
V LD
VD, SAT
VRO
t RR
tD
9)
3)
VRO, SAT
t
t
Enable active
Hold inactive, pulled up by VQ
Power-ON reset
Hold active, clamped to
GND by external µC
5) Enable inactive, clamped by int.
pull-down resistor
1)
2)
3)
4)
Figure 7
Data Sheet
6)
7)
8)
9)
10)
Pulse width smaller than 1 µ s
Hold inactive, released by µC
Voltage controller shutdown
Output-low reset
No switch on via VE6 possible after E6
was released to VE6 >VE6, rel for more
than 4 µs
AET01986
Enable and Hold Behavior
13
Rev. 2.5, 2007-03-20
TLE 4267
Output Voltage VQ versus
Temperature Tj
AED01486
5.10
VQ
Drop Voltage VDr versus
Output Current IQ
V
AED01488
700
VDr
V Ι = 13.5 V
mV
5.00
500
400
T j = 125 C
4.90
300
T j = 25 C
200
4.80
100
4.70
-40
0
40
80
0
160
C
0
100
200
300
400
mA
Charge Current ID versus
Temperature Tj
Delay Switching Threshold VUD versus
Temperature Tj
AED01485
22
AED01487
4.0
ΙD
VUD
µA
V Ι = 13.5 V
V
3.0
V Ι = 13.5 V
18
600
ΙQ
Tj
VUD
VC = 0 V
2.5
16
ΙD
2.0
14
1.5
12
1.0
10
-40
0.5
0
40
80
0
-40
160
C
40
80
160
C
Tj
Tj
Data Sheet
0
14
Rev. 2.5, 2007-03-20
TLE 4267
Current Consumption Iq versus
Output Current IQ
Current Consumption Iq versus
Input Voltage VI
AED01490
70
AED01491
15
Ιq
Ιq
mA
R L = 25 Ω
mA
V Ι = 13.5 V
50
10
40
30
5
20
10
0
0
100
200
300
400
mA
0
600
0
20
10
30
ΙQ
VΙ
Output Current Limiting IQ versus
Temperature Tj
Output Current Limiting IQ versus
Input Voltage VI
AED01489
700
AED01987
700
mA
Ι Q mA
600
500
500
ΙQ
Tj = 25 C
Tj = 125 C
V Ι = 13.5 V
400
400
300
300
200
200
100
100
0
-40
0
40
80
0
160
C
Tj
Data Sheet
50
V
15
0
10
20
30
40 V 50
Vi
Rev. 2.5, 2007-03-20
TLE 4267
Output Voltage VQ versus
Inhibit Voltage VINH
AED01988
6
VQ
Inhibit Current IINH versus
Inhibit Voltage VINH
AED01989
50
Ι INH µA
V
5
40
4
30
3
20
2
10
1
0
0
1
2
3
4
0
5 V 6
VINH
Data Sheet
16
0
1
2
3
4
5 V 6
V INH
Rev. 2.5, 2007-03-20
TLE 4267
Package Outlines
10 ±0.2
A
9.9 ±0.2
9.8 ±0.15
1.27 ±0.1
0.25
3.7 ±0.3
10.2 ±0.3
C
0.5 ±0.1
2.4
7x
0.6 ±0.1
6x 1.27
1)
0.05
1.6 ±0.3
2.8 ±0.2
3.7 -0.15
8.6 ±0.3
0...0.15
9.25 ±0.2
1)
13.4
15.65 ±0.3
17 ±0.3
8.5
4.4
1)
3.9 ±0.4
M
A C
8.4 ±0.4
Typical
All metal surfaces tin plated, except area of cut.
GPT09083
Figure 8
PG-TO220-7-11 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet
17
Rev. 2.5, 2007-03-20
TLE 4267
4.4
10 ±0.2
1.27 ±0.1
0...0.3
B
0.05
2.4
0.1
4.7 ±0.5
2.7 ±0.3
7.551)
1±0.3
9.25 ±0.2
(15)
A
8.5 1)
0...0.15
7 x 0.6 ±0.1
6 x 1.27
0.5 ±0.1
0.25
M
A B
8˚ MAX.
1) Typical
Metal surface min. X = 7.25, Y = 6.9
All metal surfaces tin plated, except area of cut.
Figure 9
0.1 B
GPT09114
PG-TO263-7-1 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet
18
Rev. 2.5, 2007-03-20
TLE 4267
10 ±0.2
A
9.8 ±0.15
B
0...0.15
13 ±0.5
0.05
0.5 ±0.1
7x
0.6 ±0.1
1.27
9.25 ±0.2
1.27 ±0.1
11±0.5
C
1)
4.4
2.8 ±0.2
1)
13.4
17 ±0.3
15.65 ±0.3
8.5 1)
3.7 -0.15
2.4
0.25
M
A B C
Typical
All metal surfaces tin plated, except area of cut.
GPT09084
Figure 10
PG-TO220-7-12 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet
19
Rev. 2.5, 2007-03-20
TLE 4267
1.75 MAX.
C
1)
4 -0.2
B
1.27
0.64 ±0.25
0.1
2)
0.41+0.10
-0.06
6±0.2
0.2 M A B 14x
14
0.2 M C
8
1
7
1)
8.75 -0.2
8˚MAX.
0.19 +0.06
0.175 ±0.07
(1.47)
0.35 x 45˚
A
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
GPS01230
Figure 11
PG-DSO-14-30 (Plastic Dual Small Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet
20
Rev. 2.5, 2007-03-20
TLE 4267
Revision History
Version
Date
Rev. 2.5
2007-03-20 Initial version of RoHS-compliant derivate of TLE 4267
Page 1: AEC certified statement added
Page 1 and Page 17 ff: RoHS compliance statement and
Green product feature added
Page 1 and Page 17 ff: Package changed to RoHS
compliant version
Legal Disclaimer updated
Data Sheet
Changes
21
Rev. 2.5, 2007-03-20
Edition 2007-03-20
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
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characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.