TP5335 DATA SHEET (06/27/2014) DOWNLOAD

Supertex inc.
TP5335
P-Channel Enhancement-Mode
Vertical DMOS FET
Features
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General Description
High input impedance and high gain
Low power drive requirement
Ease of paralleling
Low CISS and fast switching speeds
Excellent thermal stability
Integral source-drain diode
Free from secondary breakdown
The Supertex TP5335 is a low threshold enhancementmode (normally-off) transistor utilizing an advanced vertical
DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces a device
with the power handling capabilities of bipolar transistors
and with the high input impedance and positive temperature
coefficient inherent in MOS devices. Characteristic of all
MOS structures, this device is free from thermal runaway and
thermally-induced secondary breakdown.
Applications
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Logic level interfaces - ideal for TTL and CMOS
Solid state relays
Analog switches
Power management
Telecom switches
Ordering Information
Product Summary
Part Number
Package Option
Packing
TP5335K1-G
TO-236AB (SOT-23)
3000/Reel
-G denotes a lead (Pb)-free / RoHS compliant package.
Contact factory for Wafer / Die availablity.
Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.
Parameter
Value
Drain-to-source voltage
BVDSS
Drain-to-gate voltage
BVDGS
Gate-to-source voltage
RDS(ON)
BVDSS/BVDGS
-55 C to +150OC
O
Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied. Continuous
operation of the device at the absolute rating level may affect device reliability. All
voltages are referenced to device ground.
Typical Thermal Resistance
Package
θja
TO-236AB (SOT-23)
203OC/W
(max)
(max)
-350V
30Ω
-2.4V
DRAIN
SOURCE
±20V
Operating and storage temperature
VGS(th)
Pin Configuration
Absolute Maximum Ratings
Doc.# DSFP-TP5335
B081913
Supertex’s vertical DMOS FETs are ideally suited to a
wide range of switching and amplifying applications where
high breakdown voltage, high input impedance, low input
capacitance, and fast switching speeds are desired.
GATE
TO-236AB (SOT-23)
Product Marking
P3SW
W = Code for week sealed
= “Green” Packaging
Package may or may not include the following marks: Si or
TO-236AB (SOT-23)
Supertex inc.
www.supertex.com
TP5335
Thermal Characteristics
ID
Package
TO-236AB (SOT-23)
(continuous)†
ID
Power Dissipation
(pulsed)
@TA = 25OC
-85mA
-400mA
0.36W
IDR†
IDRM
-85mA
-400mA
Notes:
† ID (continuous) is limited by max rated Tj.
Electrical Characteristics (T
A
= 25OC unless otherwise specified)
Sym
Parameter
Min
Typ
Max
Units
BVDSS
Drain-to-source breakdown voltage
-350
-
-
V
VGS = 0V, ID = -100µA
VGS(TH)
Gate threshold voltage
-1.0
-
-2.4
V
VDS = VGS, ID = -1.0mA
Change in VGS(TH) with temperature
-
-
4.5
mV/ C
VDS = VGS, ID = -1.0mA
Gate body leakage current
-
-
-100
nA
VGS = ±20V, VDS = 0V
-
-
-10
µA
VDS = Max rating, VGS = 0V
-
-
-1.0
mA
VDS = 0.8 Max Rating,
VGS = 0V, TA = 125OC
-
-
-5.0
nA
VGS = 0V, VDS = -330V
-200
-
-
-400
-
-
ΔVGS(TH)
IGSS
IDSS
ID(ON)
RDS(ON)
ΔRDS(ON)
Zero gate voltage drain current
On-state drain current
-
-
30
Change in RDS(ON) with temperature
-
-
1.7
%/ C
VGS = -10V, ID = -200mA
125
-
-
mmho
VDS = -25V, ID = -200mA
-
-
110
COSS
Common source output capacitance
-
-
60
CRSS
Reverse transfer capacitance
-
-
22
td(ON)
Turn-on delay time
-
-
20
Rise time
-
-
15
Turn-off delay time
-
-
25
Fall time
-
-
25
Diode forward voltage drop
-
-
Reverse recovery time
-
800
trr
VGS = -4.5V, ID = -150mA
75
Input capacitance
VSD
VGS = -10V, VDS = -25V
-
CISS
tf
VGS = -4.5V, VDS = -25V
-
Forward transconductance
td(OFF)
mA
Static drain-to-source on-state
resistance
GFS
tr
O
Conditions
Ω
O
VGS = -10V, ID = -200mA
pF
VGS = 0V,
VDS = -25V,
f = 1MHz
ns
VDD = -25V,
ID = -150mA,
RGEN = 25Ω,
-1.8
V
VGS = 0V, ISD = -200mA
-
ns
VGS = 0V, ISD = -200mA
Notes:
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Switching Waveforms and Test Circuit
0V
INPUT
-10V
Pulse
Generator
10%
td(ON)
0V
OUTPUT
VDD
Doc.# DSFP-TP5335
B081913
tr
td(OFF)
90%
10%
RGEN
90%
t(OFF)
t(ON)
D.U.T.
tf
INPUT
OUTPUT
RL
90%
10%
2
VDD
Supertex inc.
www.supertex.com
TP5335
3-Lead TO-236AB (SOT-23) Package Outline (K1)
2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
D
3
E1 E
Gauge
Plane
0.25
1
e
b
e1
Seating
Plane
L
L1
2
View B
Top View
View B
A
A
A2
Seating
Plane
A1
Side View
Symbol
Dimension
(mm)
View A - A
A
A
A1
A2
b
D
E
E1
MIN
0.89
0.01
0.88
0.30
2.80
2.10
1.20
NOM
-
-
0.95
-
2.90
-
1.30
MAX
1.12
0.10
1.02
0.50
3.04
2.64
1.40
e
e1
0.95
BSC
1.90
BSC
L
0.20†
0.50
0.60
L1
0.54
REF
θ
0O
8O
JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
Supertex Doc.#: DSPD-3TO236ABK1, Version C041309.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
Supertex inc.
©2013 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited.
Doc.# DSFP-TP5335
B081913
3
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com