INFINEON TDA5252G2

Data Sheet, Version 1.1, 2007-02-26
TDA5252 G2
ASK/FSK 915MHz Wireless
Transceiver
Wireless Control
Components
N e v e r
s t o p
t h i n k i n g .
Edition 2007-02-26
Published by Infineon Technologies AG,
Am Campeon 1-12,
D-85579 Neubiberg, Germany
© Infineon Technologies AG 2/26/07.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address
list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
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approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
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be endangered.
Da ta S heet, Versio n 1.1, 2 007-02-26
TDA5252 G2
ASK/FSK 915MHz Wireless
Transceiver
Wireless Control
Components
N e v e r
s t o p
t h i n k i n g .
Data Sheet
Revision History:
2007-02-26
TDA5252 G2
Previous Version: 1.0 as of 2006-12-12
Page
Subjects (major changes since last revision)
72
indication of the ESD-integrity values
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
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Controller Area Network (CAN): License of Robert Bosch GmbH
ASK/FSK 915MHz Wireless Transceiver
TDA5252 G2
Version 1.1
Product Info
General Description
The IC is a low power consumption single chip FSK/ASK
Transceiver for half duplex low datarate communication in the
915MHz band. The IC offers a very high level of integration and
needs only a few external components. It contains a highly
efficient power amplifier, a low noise amplifier (LNA) with AGC,
a double balanced mixer, a complex direct conversion stage, I/
Q limiters with RSSI generation, an FSK demodulator, a fully
integrated VCO and PLL synthesizer, a tuneable crystal
oscillator, an onboard data filter, a data comparator (slicer),
positive and negative peak detectors, a data rate detection
circuit and a 2/3-wire bus interface. Additionally there is a power
down feature to save battery power.
Features
– I2C/3-wire µController Interface
– On-chip low pass channel select filter and
data filter with tuneable bandwidth
– Data slicer with self-adjusting threshold and
2 peak detectors
– FSK sensitivity < -109dBm,
ASK sensitivity < -109dBm
– Transmit power up to +13dBm
– Self-polling logic with ultra fast data rate
detection
– Low supply current (Is = 9mA typ. receive, Is
= 13mA typ. transmit mode)
– Supply voltage range 2.1 - 5.5V
– Power down mode with very low supply
current consumption
– FSK and ASK modulation and demodulation
capability
– Fully integrated VCO and PLL
synthesizer and loop filter on-chip with on
chip crystal oscillator tuning
Application
– Electronic Metering
– Home Automation Systems
– Low Bitrate Communication
Systems
– Keyless Entry Systems
– Remote Control Systems
– Alarm Systems
– Telemetry Systems
Type
Ordering Code
Package
TDA5252 G2
SP000057332
PG-TSSOP-38
Data Sheet
5
2007-02-26
TDA5252 G2
Version 1.1
Table of Contents
page
1
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
1.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
1.3
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
1.4
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
2.1
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
2.2
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
2.3
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
2.4
2.4.1
2.4.2
2.4.3
2.4.4
2.4.5
2.4.6
2.4.7
2.4.8
2.4.9
2.4.10
2.4.11
2.4.12
2.4.13
2.4.14
2.4.15
2.4.16
2.4.17
2.4.18
2.4.19
2.4.20
Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Amplifier (PA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low Noise Amplifier (LNA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Downconverter 1st Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Downconverter 2nd I/Q Mixers . . . . . . . . . . . . . . . . . . . . . . . . . .
PLL Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/Q Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/Q Limiters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FSK Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Slicer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bandgap Reference Circuitry and Powerdown . . . . . . . . . . . . .
Timing and Data Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Interface and Register Definition . . . . . . . . . . . . . . . . . . . .
Wakeup Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Valid Detection, Data Pin . . . . . . . . . . . . . . . . . . . . . . . . .
Sequence Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RSSI and Supply Voltage Measurement . . . . . . . . . . . . . . . . . .
18
18
18
18
18
19
19
19
20
20
21
21
21
21
22
23
30
31
32
34
35
3
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
3.1
3.1.1
3.1.2
LNA and PA Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
RX/TX Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch in
RX-Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch in
3.1.3
Data Sheet
6
2007-02-26
TDA5252 G2
Version 1.1
Table of Contents
page
3.1.4
TX-Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer Frequency setting . . . . . . . . . . . . . . . . . . . . . . . . .
Transmit/Receive ASK/FSK Frequency Assignment . . . . . . . . .
Parasitics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Calculation of the external capacitors . . . . . . . . . . . . . . . . . . . .
FSK-switch modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Finetuning and FSK modulation relevant registers . . . . . . . . . .
Chip and System Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . .
46
49
50
52
53
54
55
56
3.3
IQ-Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
57
3.4
Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
58
3.5
Limiter and RSSI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
59
3.6
3.6.1
3.6.2
3.6.3
3.6.4
Data Slicer - Slicing Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RC Integrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak Detector - Analog output signal . . . . . . . . . . . . . . . . . . . .
Peak Detector – Power Down Mode . . . . . . . . . . . . . . . . . . . . .
61
61
62
63
64
3.7
3.7.1
3.7.2
Data Valid Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency Window for Data Rate Detection . . . . . . . . . . . . . . .
RSSI threshold voltage - RF input power . . . . . . . . . . . . . . . . .
65
66
67
3.8
Calculation of ON_TIME and OFF_TIME . . . . . . . . . . . . . . . . . . .
68
3.9
Example for Self Polling Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
68
3.10
Default Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
71
4
Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
72
4.1
4.1.1
4.1.2
4.1.3
4.1.4
Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
72
72
72
73
76
4.2
Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
79
4.3
Test Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
80
4.4
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
81
Data Sheet
7
40
42
2007-02-26
TDA5252 G2
Version 1.1
Product Description
1
Product Description
1.1
Overview
The IC is a low power consumption single chip FSK/ASK Transceiver for the ISM frequency band
915MHz. The IC combines a very high level of integration and minimum external part count. The
device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL
synthesizer, a crystal oscillator with FSK modulator, a limiter with RSSI generator, an FSK
demodulator, a data filter, a data comparator (slicer), a positive and a negative data peak detector,
a highly efficient power amplifier and a complex digital timing and control unit with I2C/3-wire
microcontroller interface. Additionally there is a power down feature to save battery power.
The transmit section uses direct ASK modulation by switching the power amplifier, and crystal
oscillator detuning for FSK modulation. The necessary detuning load capacitors are external. The
capacitors for fine tuning are integrated. The receive section is using a novel single-conversion/
direct-conversion scheme that is combining the advantages of both receive topologies. The IF is
contained on the chip, no RF channel filters are necessary as the channel filter is also on the chip.
The self-polling logic can be used to let the device operate autonomously as a master for a decoding
microcontroller.
1.2
Features
– Low supply current (Is = 9 mA typ. receive, Is = 13mA typ. transmit mode, both at 3 V supply
voltage, 25°C)
– Supply voltage range 2.1 V to 5.5 V
– Operating temperature range -40°C to +85°C
– Power down mode with very low supply current consumption
– FSK and ASK modulation and demodulation capability without external circuitry changes, FM
demodulation capability
– Fully integrated VCO and PLL synthesizer and loop filter on-chip with on-chip crystal oscillator
tuning, therefore no additional external components necessary
– Differential receive signal path completely on-chip, therefore no external filters are necessary
– On-chip low pass channel select and data filter with tuneable bandwith
– Data slicer with self-adjusting threshold and 2 peak detectors
– Self-polling logic with adjustable duty cycle and ultrafast data rate detection and timer mode
providing periodical interrupt
– FSK and ASK sensitivity < -109 dBm
– Adjustable LNA gain
– Digital RSSI and Battery Voltage Readout
– Provides Clock Out Pin for external microcontroller
– Transmit power up to +13 dBm in 50Ω load at 5V supply voltage
– I2C/3-wire microcontroller interface, working at max. 400kbit/s
Data Sheet
8
2007-02-26
TDA5252 G2
Version 1.1
Product Description
1.3
–
–
–
–
–
–
–
Application
Low Bitrate Communication Systems
Keyless Entry Systems
Remote Control Systems
Alarm Systems
Telemetry Systems
Electronic Metering
Home Automation Systems
1.4
Package Outlines
PG-TSSOP-38.EPS
Figure 1-1
PG-TSSOP-38 package outlines
Data Sheet
9
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
2
Functional Description
2.1
Pin Configuration
VCC
1
38
CI1
BUSMODE
2
37
CI1x
LF
____
ASKFSK
__
RxTx
3
36
CQ1
4
35
CQ1x
5
34
CI2
LNI
6
33
CI2x
LNIx
7
32
CQ2
GND1
8
31
CQ2x
GNDPA
9
30
GND
PA
10
29
RSSI
VCC1
11
28
PDN
12
27
DATA
___
PWDDD
PDP
13
26
SLC
14
25
VDD
15
24
CLKDIV
______
RESET
___
EN
BUSDATA
16
23
XGND
BUSCLK
17
22
XSWA
VSS
18
21
XIN
XOUT
19
20
XSWF
5252G1_pin_conf.wmf
Figure 2-1
Data Sheet
Pin Configuration
10
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
2.2
Pin Definitions and Functions
Table 2-1
Pin Definition and Function
Pin No. Symbol
Equivalent I/O-Schematic
1
VCC
1
Function
Analog supply (antiparallel diodes
between VCC, VCC1, VDD)
11
15
2
BUSMODE
Bus mode selection (I²C/3 wire bus
mode selection)
350
2
3
LF
Loop filter and VCO control voltage
200
3
4
ASKFSK
ASK/FSK- mode switch input
350
4
Data Sheet
11
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
5
RXTX
RX/TX-mode switch input/output
350
5
TX
6
LNI
RF input to differential Low Noise
Amplifier (LNA))
5k
6
1.1V 5k
7
180
180
PWDN
7
LNIX
8
GND1
PWDN
see Pin 6
Complementary RF input to
differential LNA
Ground return for LNA and Power
Amplifier (PA) dirver stage
30
8
18
9
9
10
GNDPA
PA
see Pin 8
Ground return for PA output stage
PA output stage
10 Ω
10
9
GndPA
11
VCC1
Data Sheet
see Pin 1
Supply for LNA and PA
12
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
12
PDN
Output of the negative peak
detector
50k
PWDN
350
50k
3k
12
13
PDP
Output of the positive peakdetector
50k
350
50k
3k
13
PWDN
14
SLC
Slicer level for the data slicer
1.2uA
350
50k
50k
50k
50k
50k
50k
14
1.2uA
15
16
VDD
BUSDATA
see Pin 1
Digital supply
Bus data in/output
15k
350
16
17
BUSCLK
Bus clock input
350
17
18
VSS
Data Sheet
see Pin 8
Ground for digital section
13
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
19
XOUT
Crystal oscillator output, can also
be used as external reference
frequency input.
4k
Vcc
Vcc-860mV
19
150µA
20
XSWF
FSK modulation switch
21
125fF .....
4pF
20
250fF .....
8pF
23
21
22
XIN
XSWA
see Pin 20
22
ASK modulation/FSK center
frequency switch
20
23
23
XGND
24
EN
see Pin 22
Crystal oscillator ground return
3-wire bus enable input
350
24
Data Sheet
14
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
25
RESET
Reset of the entire system (to
default values), active low
110k
350
25
10p
26
CLKDIV
Clock output
350
26
27
PWDDD
Power Down input (active high),
data detect output (active low)
30k
350
27
28
DATA
TX Data input, RX data output (RX
powerdown: pin 28 @ GND)
350
28
29
RSSI
RSSI output
S&H
350
29
37k
Data Sheet
16p
15
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
30
31
GND
CQ2x
see Pin 8
Analog ground
Pin for external Capacitor
Q-channel, stage 2
Stage1:Vcc-630mV
Stage2: Vcc-560mV
31
32
33
34
35
36
37
38
CQ2
CI2x
CI2
CQ1x
CQ1
CI1x
CI1
Data Sheet
II
II
II
II
II
II
II
Q-channel, stage 2
I-channel, stage 2
I-channel, stage 2
Q-channel, stage 1
Q-channel, stage 1
I-channel, stage 1
I-channel, stage 1
16
2007-02-26
Figure 2-2
Data Sheet
ANT
PA
10
7
(LNA/PA)
17
GndPA
9
PA
high/low
Gain
fRX= 1220MHz
fTX= 915MHz
MIXER
(digital)
(analog)
LNA
VCO
:4
90°
0°
f = 305MHz
LP
FILTER
LF
3
LOOP
FILTER
MIXER
TX/RX
:12/16
Channel
Filter
Q
PHASE
DET.
Charge P.
TX/RX
RSSI
ASK
FSK
6-bit
SAR-ADC
XIN
21
-Peak
Det
+Peak
Det
100k
Data
FILTER
22
XSWA
20
XSWF
CRYSTAL Osc, FSKMod, Finetuning
ASK/FSK
QUADRI
CORRELATOR
fQ= 19.0625MHz
XOUT
19
ASK DATA
LIMITER
LIMITER
CQ1
35
x
36 CQ1
37 CI1x
38 CI1
I
Channel
Filter
CQ2x
CQ2
CI2x
CI2
LNIx
6
fIF= 305MHz
MIXER
31
32
33
34
LNI
fRF= 915MHz
XGND
23
FSK DATA
CLK
Bandgap
Reference
100k
100k
ASK/FSK
-
SLICER
+
24
2
Gnd1
8
Gnd
30
(analog)
WAKEUP
LOGIC
CONTROLLER
INTERFACE
17
(LNA/PA)
16
BUSDATA
single ended to
differential conv.
ANT
SLC
14
BUSCLK
15
VDD
BUSMODE
__
EN
1
VCC
Vss
18
(digital)
4
5
27
26
28
29
25
12
13
VCC
Data (RX/TX)
RSSI
RESET
PDN
PDP
ASKFSK
RXTX
PWDDD
CLKDIV
2.3
11
VCC1
TDA5252 G2
Version 1.1
Functional Description
Functional Block Diagram
TDA5252G1_blockdiagram.wmf
Main Block Diagram
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
2.4
Functional Block Description
2.4.1
Power Amplifier (PA)
The power amplifier is operating in C-mode. It can be used in either high or low power mode. In
high-power mode the transmit power is approximately +13dBm into 50 Ohm at 5V and +6dBm at
2.1V supply voltage. In low power mode the transmit power is approximately -3dBm at 5V and
-30dBm at 2.1V supply voltage using the same matching network. The transmit power is controlled
by the D0-bit of the CONFIG register (subaddress 00H) as shown in the following Table 2-2. The
default output power mode is high power mode.
Table 2-2
Bit
D0
Sub Address 00H: CONFIG
Function
Description
PA_PWR
0= low TX Power, 1= high TX Power
Default
1
In case of ASK modulation the power amplifier is turned fully on and off by the transmit baseband
data, i.e. 100% On-Off-Keying.
2.4.2
Low Noise Amplifier (LNA)
The LNA is an on-chip cascode amplifier with a voltage gain of 15 to 20dB and symmetrical inputs.
It is possible to reduce the gain to 0 dB via logic.
Table 2-3
Bit
D4
2.4.3
Sub Address 00H: CONFIG
Function
Description
LNA_GAIN
0= low Gain, 1= high Gain
Default
1
Downconverter 1st Mixer
The Double Balanced 1st Mixer converts the input frequency (RF) in the range of 915MHz down to
the intermediate frequency (IF) at approximately 305MHz. The local oscillator frequency is
generated by the PLL synthesizer that is fully implemented on-chip as described in Section 2.4.5.
This local oscillator operates at approximately 1220MHz in receive mode providing the above
mentioned IF frequency of 305MHz. The mixer is followed by a low pass filter with a corner
frequency of approximately 350MHz in order to prevent RF and LO signals from appearing in the
305MHz IF signal.
2.4.4
Downconverter 2nd I/Q Mixers
The Low pass filter is followed by 2 mixers (inphase I and quadrature Q) that convert the 305MHz
IF signal down to zero-IF. These two mixers are driven by a signal that is generated by dividing the
local oscillator signal by 4, thus equalling the IF frequency.
Data Sheet
18
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
2.4.5
PLL Synthesizer
The Phase Locked Loop synthesizer consists of two VCOs (i.e. transmit and receive VCO), a
divider by 4, an asynchronous divider chain with selectable overall division ratio, a phase detector
with charge pump and a loop filter and is fully implemented on-chip. The VCOs are including spiral
inductors and varactor diodes. The center frequency of the transmit VCO is 915MHz, the center
frequency of the receive VCO is 1220MHz.
Generally in receive mode the relationship between local oscillator frequency fosc, the receive RF
frequency fRF and the IF frequency fIF and thus the frequency that is applied to the I/Q Mixers is
given in the following formula:
f osc = 4/3 f RF = 4 f IF
[2 – 1]
The VCO signal is applied to a divider by 4 which is producing approximately 305MHz signals in
quadrature. The overall division ratio of the divider chain following the divider by 4 is 12 in transmit
mode and 16 in receive mode as the nominal crystal oscillator frequency is 19.0625MHz. The
division ratio is controlled by the RxTx pin (pin 5) and the D10 bit in the CONFIG register.
2.4.6
I/Q Filters
The I/Q IF to zero-IF mixers are followed by baseband 6th order low pass filters that are used for
RF-channel filtering.
OP
INTERNAL BUS
iq_filter.wmf
Figure 2-3
One I/Q Filter stage
The bandwidth of the filters is controlled by the values set in the filter-register. It can be adjusted
between 50 and 350kHz in 50kHz steps via the bits D1 to D3 of the LPF register (subaddress 03H).
2.4.7
I/Q Limiters
The I/Q Limiters are DC coupled multistage amplifiers with offset-compensating feedback circuit
and an overall gain of approximately 80dB each in the frequency range of 100Hz up to 350kHz.
Data Sheet
19
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Receive Signal Strength Indicator (RSSI) generators are included in both limiters which produce DC
voltages that are directly proportional to the input signal level in the respective channels. The
resulting I- and Q-channel RSSI-signals are summed to the nominal RSSI signal.
2.4.8
FSK Demodulator
The output differential signals of the I/Q limiters are fed to a quadrature correlator circuit that is used
to demodulate frequency shift keyed (FSK) signals. The demodulator gain is 2.4mV/kHz, the
maximum frequency deviation is ±300kHz as shown in Figure 2-4 below.
The demodulated signal is applied to the ASK/FSK mode switch which is connected to the input of
the data filter. The switch can be controlled by the ASKFSK pin (pin 4) and via the D11 bit in the
CONFIG register.
The modulation index m must be significantly larger than 2 and the deviation at least larger than
25kHz for correct demodulation of the signal.
1,6
1,5
1,4
1,3
U /V
1,2
1,1
1
0,9
0,8
0,7
0,6
0,5
-350 -300 -250 -200 -150 -100 -50
0
50
100 150 200 250 300 350
f /kHz
Qaudricorrelator.wmf
Figure 2-4
2.4.9
Typical Quadricorrelator Demodulation Characteristic
Data Filter
The 2-pole data filter has a Sallen-Key architecture and is implemented fully on-chip. The bandwidth
can be adjusted between approximately 5kHz and 102kHz via the bits D4 to D7 of the LPF register
(see also Table 2-18).
Data Sheet
20
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
ASK / FSK
OTA
INTERNAL BUS
data_filter.wmf
Figure 2-5
2.4.10
Data Filter architecture
Data Slicer
The data slicer is a fast comparator with a bandwidth of 100kHz. The self-adjusting threshold is
generated by a RC-network (LPF) or by use of one or both peak detectors depending on the
baseband coding scheme. This can be controlled by the D15 bit of the CONFIG register as shown
in the following table.
Table 2-4
Bit
D15
2.4.11
Sub Address 00H: CONFIG
Function
Description
SLICER
0= Lowpass Filter, 1= Peak Detector
Default
0
Peak Detectors
Two separate Peak Detectors are available. They are generating DC voltages in a fast-attack and
slow-release manner that are proportional to the positive and negative peak voltages appearing in
the data signal. These voltages may be used to generate a threshold voltage for non-Manchester
encoded signals, for example. The time-constant of the fast-attack/slow-release action is
determined by the RC network with external capacitor.
2.4.12
Crystal Oscillator
The reference oscillator is an NIC oscillator type (Negative Impedance Converter) with a crystal
operating in serial resonance. The nominal operating frequency of 19.0625MHz and the
frequencies for FSK modulation can be adjusted via 3 external capacitors. Via microcontroller and
bus interface the chip-internal capacitors can be used for finetuning of the nominal and the FSK
modulation frequencies. This finetuning of the crystal oscillator allows to eliminate frequency errors
due to crystal or component tolerances.
2.4.13
Bandgap Reference Circuitry and Powerdown
A Bandgap Reference Circuit provides a temperature stable 1.2V reference voltage for the device.
A power down mode is available to switch off all subcircuits that are controlled by the bidirectional
Powerdown&DataDetect PwdDD pin (pin 27) as shown in the following table. Power down mode
can either be activated by pin 27 or bit D14 in Register 00h. In power down mode also pin 28 (DATA)
is affected (see Section 2.4.17).
Data Sheet
21
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Table 2-5
2.4.14
PwdDD Pin Operating States
PwdDD
VDD
Ground/VSS
Operating State
Powerdown Mode
Device On
Timing and Data Control Unit
BusMode
EN
BusCLK
BusData
The timing and data control unit contains a wake-up logic unit, an I2C/3-wire microcontroller
interface, a “data valid” detection unit and a set of configuration registers as shown in the
subsequent figure.
REGISTERS
I2C / 3Wire
INTERFACE
INTERNAL BUS
DATA VALID
DETECTOR
6 Bit
ADC
FSK DATA
CONTROL
LOGIC
ASK DATA
BLOCK ENABLE
CLKDiv
PwdDD
Data
ASK / FSK
RX / TX
32kHz
RC-Osz.
DATA
VALID
FREQUENCY
window
TH1<TGATE<TH2
RX DATA
WAKEUP
LOGIC
AMPLITUDE
threshold TH3
ENABLE
RSSI
RF - BLOCK
19 MHz
XTAL-Osz.
AskFsk
POWER ON
SEQUENCER
RxTx
Reset
logic.wmf
Figure 2-6
Timing and Data Control Unit
The I2C / 3-wire Bus Interface gives an external microcontroller full control over important system
parameters at any time.
It is possible to set the device in three different modes: Slave Mode, Self Polling Mode and Timer
Mode. This is done by a state machine which is implemented in the WAKEUP LOGIC unit. A
detailed description is given in Section 2.4.16.
Data Sheet
22
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
The DATA VALID DETECTOR contains a frequency window counter and an RSSI threshold
comparator. The window counter uses the incoming data signal from the data slicer as the gating
signal and the crystal oscillator frequency as the timebase to determine the actual datarate. The
result is compared with the expected datarate.
The threshold comparator compares the actual RSSI level with the expected RSSI level.
If both conditions are true the PwdDD pin is set to LOW in self polling mode as you can see in
Section 2.4.16. This signal can be used as an interrupt for an external µP. Because the PwdDD
pin is bidirectional and open drain driven by an internal pull-up resistor it is possible to apply an
external LOW thus enabling the device.
2.4.15
Bus Interface and Register Definition
The TDA5252 supports the I2C bus protocol (2 wire) and a 3-wire bus protocol. Operation is
selectable by the BusMode pin (pin 2) as shown in the following table. All bus pins (BusData,
BusCLK, EN, BusMode) have a Schmitt-triggered input stage. The BusData pin is bidirectional
where the output is open drain driven by an internal 15kΩ pull up resistor.
Table 2-6
Bus Interface Format
Function
BusMode
2
Low
I C Mode
3-wire Mode
High
EN
High= inactive,
Low= active
BusCLK
Clock input
BusData
Data in/out
BusData
17
EN
24
FRONTEND
16
BusCLK
I2C / 3-wire
INTERFACE
INTERNAL BUS
BusMode
2
11100000
CHIP ADDRESS
i2c_3w_bus.wmf
Figure 2-7
Bus Interface
Note: The Interface is able to access the internal registers at any time, even in POWER DOWN
mode. There is no internal clock necessary for Interface operation.
Data Sheet
23
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
I2C Bus Mode
In this mode the BusMode pin (pin 2) = LOW and the EN pin (pin 24) = LOW.
Data Transition:
Data transition on the pin BusData can only occur when BusCLK is LOW. BusData transitions while
BusCLK is HIGH will be interpreted as start or stop condition.
Start Condition (STA):
A start condition is defined by a HIGH to LOW transition of the BusData line while BusCLK is HIGH.
This start condition must precede any command and initiate a data transfer onto the bus.
Stop Condition (STO):
A stop condition is defined by a LOW to HIGH transition of the BusData line while BusCLK is HIGH.
This condition terminates the communication between the devices and forces the bus interface into
the initial state.
Acknowledge (ACK):
Indicates a successful data transfer. The transmitter will release the bus after sending 8 bit of data.
During the 9th clock cycle the receiver will set the SDA line to LOW level to indicate it has received
the 8 bits of data correctly.
Data Transfer Write Mode:
To start the communication, the bus master must initiate a start condition (STA), followed by the 8bit
chip address. The chip address for the TDA5252 is fixed as „1110000“ (MSB at first). The last bit
(LSB=A0) of the chip address byte defines the type of operation to be performed:
A0=0, a write operation is selected and A0=1 a read operation is selected.
After this comparison the TDA5252 will generate an ACK and awaits the desired sub address byte
(00H...0FH) and data bytes. At the end of the data transition the master has to generate the stop
condition (STO).
Data Transfer Read Mode:
To start the communication in the read mode, the bus master must initiate a start condition (STA),
followed by the 8 bit chip address (write: A0=0), followed by the sub address to read (80H, 81H),
followed by the chip address (read: A0=1). After that procedure the data of the selected register
(80H, 81H) is read out. During this time the data line has to be kept in HIGH state and the chip sends
out the data. At the end of data transition the master has to generate the stop condition (STO).
Data Sheet
24
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Bus Data Format in I2C Mode
Table 2-7
MSB
1
1
Chip address Organization
1
1
1
1
MSB
CHIP ADDRESS
(WRITE)
1
1
1
0
STA
1
0
0
LSB
0
0
1
1
0
0
0
0
0
ACK
1
SUB ADDRESS (WRITE)
00H...08H, 0DH, 0EH, 0FH
S7
S6
S5
S4
S3
S2
S1
LSB
MSB
S0 ACK D7
DATA IN
LSB
D6 D5 D4 D3 D2 D1 D0 ACK STO
1
Table 2-10
0
ACK
S7
SUB ADDRESS (WRITE)
00H...08H, 0DH, 0EH, 0FH
S6
S5
S4
S3
S2
S1
LSB
S0
MSB
DATA IN
LSB
ACK D15 ... D8 ACK D7 D6 ...
D0
ACK STO
0
0
0
0
MSB
ACK S7
SUB ADDRESS (READ)
80H, 81H
S6
S5
S4
S3
S2
LSB
S1
MSB
S0 ACK STA
1
CHIP ADDRESS (READ)
1
1
0
0
0
0
LSB
1
ACK
I2C Bus Read Mode (continued)
MSB
R7
MSB
I2C Bus Read Mode
MSB CHIP ADDRESS (WRITE) LSB
1
0
0
MSB
CHIP ADDRESS (WRITE) LSB
Table 2-10
STA
0
0
I2C Bus Write Mode 16 Bit
Table 2-9
MSB
0
0
Function
Chip Address Write
Chip Address Read
I2C Bus Write Mode 8 Bit
Table 2-8
STA
0
0
LSB
0
1
DATA OUT FROM SUB ADDRESS
R6
R5
R4
R3
LSB
R2
R1
R0
ACK*
STO
* mandatory HIGH
3-wire Bus Mode
In this mode pin 2 (BusMode)= HIGH and Pin 16 (BusData) is in the data input/output pin. Pin 24
(EN) is used to activate the bus interface to allow the transfer of data to / from the device. When pin
24 (EN) is inactive (HIGH), data transfer is inhibited.
Data Transition:
Data transition on pin 16 (BusData) can only occur if the clock BusCLK is LOW. To perform a data
transfer the interface has to be enabled. This is done by setting the EN line to LOW. A serial transfer
is done via BusData, BusCLK and EN. The bit stream needs no chip address.
Data Transfer Write Mode:
To start the communication the EN line has to be set to LOW. The desired sub address byte and
data bytes have to follow. The subaddress (00H...0FH) determines which of the data bytes are
transmitted. At the end of data transition the EN must be HIGH.
Data transfer Read Mode:
To start the communication in the read mode, the EN line has to be set to LOW followed by the sub
address to read (80H, 81H). Afterwards the device is ready to read out data. At the end of data
transition EN must be HIGH.
Data Sheet
25
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Bus Data Format 3-wire Bus Mode
Table 2-11 3-wire Bus Write Mode
MSB
SUB ADDRESS (WRITE)
00H...08H, 0DH, 0EH,0FH
S7
S6 S5 S4 S3
S2 S1
LSB MSB
S0
Table 2-12 3-wire Bus Read Mode
MSB
SUB ADDRESS (READ)
80H, 81H
S7
S6 S5 S4 S3
S2 S1
DX
DATA IN X...0 (X=7 or 15)
...
D5
R6
DATA OUT FROM
SUB ADDRESS
R5 R4 R3 R2
LSB MSB
S0
R7
D4
D3
D2
LSB
D1
D0
LSB
R1
R0
Register Definition
Sub Addresses Overview
ADC
RSSI [8 Bit]
FILTER
I2C - SPI
INTERFACE
CONTROL
WAKEUP
CONFIG [16 Bit]
STATUS [8 Bit]
CLK_DIV [8 Bit]
BLOCK_PD [16Bit]
ON_TIME [16 Bit]
OFF_TIME [16 Bit]
COUNT_TH1 [16Bit]
COUNT_TH2 [16Bit]
RSSI_TH3 [8 Bit]
LPF [8 Bit]
XTAL
XTAL_TUNE [16Bit]
FSK [16Bit]
XTAL_CONFIG [8 Bit]
register_overview.wmf
Figure 2-8
Data Sheet
Sub Addresses Overview
26
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Subaddress Organization
Table 2-13
Sub Addresses of Data Registers Write
MSB
0
0
0
0
0
0
0
LSB
0
HEX
00h
Function
CONFIG
Description
General definition of status bits
Bit Length
16
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
01h
02h
FSK
XTAL_TUNING
Values for FSK-shift
Nominal frequency
16
16
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
03h
04h
LPF
ON_TIME
I/Q and data filter cutoff frequencies
ON time of wakeup counter
8
16
0
0
0
0
0
0
0
0
0
0
1
1
0
1
1
0
05h
06h
OFF_TIME
COUNT_TH1
OFF time of wakeup counter
Lower threshold of window counter
16
16
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
07h
08h
COUNT_TH2
RSSI_TH3
Higher threshold of window counter
Threshold for RSSI signal
16
8
0
0
0
0
0
0
0
0
1
1
1
1
0
1
1
0
0Dh
0Eh
CLK_DIV
XTAL_CONFIG
Configuration and Ratio of clock divider
XTAL configuration
8
8
0
0
0
0
1
1
1
1
0Fh
BLOCK_PD
Building Blocks Power Down
16
Table 2-14
Sub Addresses of Data Registers Read
MSB
Function
Description
Bit Length
1
0
0
0
0
0
0
LSB HEX
0
80h
STATUS
Results of comparison: ADC & WINDOW
8
1
0
0
0
0
0
0
1
81h
ADC
ADC data out
8
Data Byte Specification
Table 2-15
Sub Address 00H: CONFIG
Bit
Function
Description
Default
D15
D14
SLICER
ALL_PD
0= Lowpass, 1= Peak Detector
0= normal operation, 1= all Power down
0
0
D13
D12
TESTMODE
CONTROL
0= normal operation, 1=Testmode
0= RX/TX and ASK/FSK external controlled, 1= Register controlled
0
0
D11
D10
ASK_NFSK
RX_NTX
0= FSK, 1=ASK
0= TX, 1=RX
0
1
D9
D8
CLK_EN
RX_DATA_INV
0= CLK off during power down, 1= always CLK on, ever in PD
0= no Data inversion, 1= Data inversion
0
0
D7
D6
D_OUT
ADC_MODE
0= Data out if valid, 1= always Data out
0= one shot, 1= continuous
1
1
D5
D4
F_COUNT_MODE
LNA_GAIN
0= one shot, 1= continuous
0= low gain, 1= high gain
1
1
D3
D2
EN_RX
MODE_2
0= disable receiver, 1= enable receiver (in self polling and timer mode) *
0= slave mode, 1= timer mode
1
0
D1
D0
MODE_1
PA_PWR
0= slave or timer mode, 1= self polling mode
0= low TX Power, 1= high TX Power
0
1
Note D3: Function is only active in selfpolling and timer mode. When D3 is set to LOW the RX path
is not enabled if PwdDD pin is set to LOW. A delayed setting of D3 results in a delayed power ON
of the RX building blocks.
Data Sheet
27
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Table 2-16
Bit
Sub Address 01H: FSK
Function
Value
Table 2-17
Sub Address 02H: XTAL_TUNING
Description
Default
Bit
Description
Default
D15
not used
0
D15
not used
0
D14
not used
0
D14
not used
0
Setting for
positive
frequency
shift: +FSK or
ASK-RX
0
D13
not used
0
0
D12
not used
0
1
D11
not used
0
0
D10
not used
0
1
D9
not used
0
D13
FSK+5
8pF
D12
FSK+4
4pF
D11
FSK+3
2pF
D10
FSK+2
1pF
D9
FSK+1
500fF
D8
FSK+0
250fF
Function
Value
0
D8
not used
0
D7
not used
0
D7
not used
0
D6
not used
0
D6
not used
0
Setting for
negative
frequency
shift: -FSK
0
D5
Nominal_Frequ_5
8pF
0
D4
Nominal_Frequ_4
4pF
Setting for
nominal
frequency
1
D5
FSK-5
4pF
D4
FSK-4
2pF
D3
FSK-3
1pF
1
D3
Nominal_Frequ_3
2pF
D2
FSK-2
500fF
1
D2
Nominal_Frequ_2
1pF
D1
FSK-1
250fF
0
D1
Nominal_Frequ_1
500fF
D0
FSK-0
125fF
0
D0
Nominal_Frequ_0
250fF
Table 2-19
Table 2-18
Sub Address 03H: LPF
Bit
Function
D7
Datafilter_3
D6
Datafilter_2
D5
Datafilter_1
D4
Datafilter_0
D3
IQ_Filter_2
D2
IQ_Filter_1
D1
IQ_Filter_0
D0
not used
Table 2-20
Description
Default
0
3dB cutoff
frequency of
data filter
0
0
1
3dB cutoff
frequency of
IQ-filter
1
0
0
0
Sub Address 06H: COUNT_TH1
Bit
Function
Default
D15
not used
0
D14
not used
0
D13
not used
0
D12
not used
0
D11
TH1_11
0
D10
TH1_10
0
D9
TH1_9
0
D8
TH1_8
0
D7
TH1_7
0
D6
TH1_6
0
D5
TH1_5
0
D4
TH1_4
0
D3
TH1_3
0
D2
TH1_2
0
D1
TH1_1
0
D0
TH1_0
0
Data Sheet
0
0
ASK-TX
FSK-RX
1
0
Sub Addresses 04H / 05H: ON/OFF_TIME
Bit
Function
Default ON_TIME
Default
OFF_TIME
D15
ON_15 / OFF_15
1
1
D14
ON_14 / OFF_14
1
1
D13
ON_13 / OFF_13
1
1
D12
ON_12 / OFF_12
1
1
D11
ON_11 / OFF_11
1
0
D10
ON_10 / OFF_10
1
0
D9
ON_9 / OFF_9
1
1
D8
ON_8 / OFF_8
0
1
D7
ON_7 / OFF_7
1
1
D6
ON_6 / OFF_6
1
0
D5
ON_5 / OFF_5
0
0
D4
ON_4 / OFF_4
0
0
D3
ON_3 / OFF_3
0
0
D2
ON_2 / OFF_2
0
0
D1
ON_1 / OFF_1
0
0
D0
ON_0 / OFF_0
0
0
Table 2-21
28
0
Sub Address 07H: COUNT_TH2
Bit
Function
Default
D15
not used
0
D14
not used
0
D13
not used
0
D12
not used
0
D11
TH2_11
0
D10
TH2_10
0
D9
TH2_9
0
D8
TH2_8
0
D7
TH2_7
0
D6
TH2_6
0
D5
TH2_5
0
D4
TH2_4
0
D3
TH2_3
0
D2
TH2_2
0
D1
TH2_1
0
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Table 2-22
Sub Address 08H: RSSI_TH3
Bit
Function
D7
not used
D6
SELECT
D5
Description
Table 2-23
Sub Address 0DH: CLK_DIV
Default
Bit
Function
Default
1
D7
not used
0
1
D6
not used
0
TH3_5
1
D5
DIVMODE_1
0
D4
TH3_4
1
D4
DIVMODE_0
0
D3
TH3_3
1
D3
CLKDIV_3
1
D2
TH3_2
1
D2
CLKDIV_2
0
D1
TH3_1
1
D1
CLKDIV_1
0
D0
TH3_0
1
D0
CLKDIV_0
0
0= VCC, 1= RSSI
Table 2-24
Bit
Description
Default
D7
not used
0
D6
not used
0
D5
not used
0
D4
not used
0
D3
not used
0
only in bipolar mode
0
D2
FSK-Ramp 0
D1
FSK-Ramp 1
D0
Bipolar_FET
Table 2-25
Table 2-26
Bit
Sub Address 0EH: XTAL_CONFIG
Function
0
0= FET, 1=Bipolar
Sub Address 0FH: BLOCK_PD
Bit
Function
Description
Default
D15
REF_PD
1= power down Band Gap Reference
1
D14
RC_PD
1= power down RC Oscillator
1
D13
WINDOW_PD
1= power down Window Counter
1
D12
ADC_PD
1= power down ADC
1
D11
PEAK_DET_PD
1= power down Peak Detectors
1
D10
DATA_SLIC_PD
1= power down Data Slicer
1
D9
DATA_FIL_PD
1= power down Data Filter
1
D8
QUAD_PD
1= power down Quadri Correlator
1
D7
LIM_PD
1= power down Limiter
1
D6
I/Q_FIL_PD
1= power down I/Q Filters
1
D5
MIX2_PD
1= power down I/Q Mixer
1
D4
MIX1_PD
1= power down 1st Mixer
1
D3
LNA_PD
1= power down LNA
1
D2
PA_PD
1= power down Power Amplifier
1
D1
PLL_PD
1= power down PLL
1
D0
XTAL_PD
1= power down XTAL Oscillator
1
Table 2-27
Sub Address 80H: STATUS
Function
1
Sub Address 81H: ADC
Description
Bit
Function
Description
PD_ADC
ADC power down feedback Bit
D7
COMP_LOW
1 if data rate < TH1
D7
D6
COMP_IN
1 if TH1 < data rate < TH2
D6
SELECT
SELECT feedback Bit
D5
COMP_HIGH
1 if TH2 < data rate
D5
RSSI_5
RSSI value Bit5
RSSI_4
RSSI value Bit4
D4
COMP_0,5*LOW
1 if data rate < 0,5*TH1
D4
D3
COMP_0,5*IN
1 if 0,5*TH1 < data rate < 0,5*TH2
D3
RSSI_3
RSSI value Bit3
D2
COMP_0,5*HIGH
1 if 0,5*TH2 < data rate
D2
RSSI_2
RSSI value Bit2
RSSI_1
RSSI value Bit1
RSSI_0
RSSI value Bit0
D1
RSSI=TH3
1 if RSSI value is equal TH3
D1
D0
RSSI>TH3
1 if RSSI value is greater than TH3
D0
Data Sheet
29
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
2.4.16
Wakeup Logic
SLAVE MODE
(default)
MODE_1 = 0
MODE_2 = 0
SELF POLLING
MODE
TIMER MODE
MODE_1 = 1
MODE_2 = X
MODE_1 = 0
MODE_2 = 1
3_modes.wmf
Figure 2-9
Wakeup Logic States
Table 2-28
MODE settings: CONFIG register
MODE_1
MODE_2
0
0
0
1
1
X
Mode
SLAVE MODE
TIMER MODE
SELF POLLING MODE
SLAVE MODE: The receive and transmit operation is fully controlled by an external control device
via the respective RxTx, AskFsk, PwdDD, and Data pins. The wakeup logic is inactive in this case.
After RESET or 1st Power-up the chip is in SLAVE MODE. By setting MODE_1 and MODE_2 in the
CONFIG register the mode may be changed.
SELF POLLING MODE: The chip turns itself on periodically to receive using a built-in 32kHz RC
oscillator. The timing of this is determined by the ON_TIME and OFF_TIME registers, the duty cycle
can be set between 0 and 100% in 31.25µs increments. The data detect logic is enabled and a 15µs
LOW impulse is provided at PwdDD pin (Pin 27), if the received data is valid.
ON_TIME
Action
OFF_TIME
RX ON: valid Data
ON_TIME
RX ON: invalid Data
t
PwdDD pin in
SELF POLLING MODE
t
min. 2.6ms
15µs
timing_selfpllmode.wmf
Figure 2-10
Data Sheet
Timing for Self Polling Mode (ADC & Data Detect in one shot mode)
30
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Note: The time delay between start of ON time and the 15µs LOW impulse is 2.6ms + 3 period of
data rate.
If ADC & Data Detect Logic are in continuous mode the 15µs LOW impulse is applied at PwdDD
after each data valid decision.
In self polling mode if D9=0 (Register 00h) and when PwdDD pin level is HIGH the CLK output is
on during ON time and off during OFF time. If D9=1, the CLK output is always on.
TIMER MODE: Only the internal Timer (determined by the ON_TIME and OFF_TIME registers) is
active to support an external logic with periodical Interrupts. After ON_TIME + OFF_TIME a 15µs
LOW impulse is applied at the PwdDD pin (Pin 27).
Action
ON_TIME
OFF_TIME
ON_TIME
Register 04H
Register 05H
Register 04H
PwdDD pin in
TIMER MODE
t
t
15µs
15µs
timing_timermode.wmf
Figure 2-11
2.4.17
Timing for Timer Mode
Data Valid Detection, Data Pin
Data signals generate a typical spectrum and this can be used to determine if valid data is on air.
Amplitude
Frequency & RSSI Window
DATA on air
no DATA on air
RSSI
Frequency
f
data_rate_detect.wmf
Figure 2-12
Frequency and RSSI Window
The “data valid” criterion is generated from the result of RSSI-TH3 comparison and tGATE between
TH1 and TH2 result as shown below. In case of Manchester coding the 0,5*TH1 and 0,5*TH2 gives
improved performance.
The use of permanent data valid recognition makes it absolutely necessary to set the RSSI-ADC
and the Window counter into continuous mode (Register 00H, Bit D5 = D6 = 1).
Data Sheet
31
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
0,5*TH1
TGATE
TH1
0,5*TH2
TGATE
TH2
RSSI
TH3
DATA VALID
data_valid.wmf
Figure 2-13
Data Valid Circuit
D_OUT and RX_DATA_INV from the CONFIG register determine the output of data at Pin 28.
RxTxint and TX_ON are internally generated signals.
In RX and power down mode Data pin (Pin 28) is tied to GND.
RxTxint
RX_DATA_INV
RX DATA
Data
DATA VALID
28
D_OUT
TX DATA
TX ON
data_switch.wmf
Figure 2-14
2.4.18
Data Input/Output Circuit
Sequence Timer
The sequence timer has to control all the enable signals of the analog components inside the chip.
The time base is the 32 kHz RC oscillator.
After the first POWER ON or RESET a 1.06MHz clock is available at the clock output pin. This clock
output can be used by an external µP to set the system into the desired state and outputs valid data
after 500 µs (see Figure 2-15 and Figure 2-16, tCLKSU)
There are two possibilities to start the device after a reset or first power on:
−
PWDDD pin is LOW: Normal operation timing is performed after tSYSSU (see Figure 2-15).
−
PWDDD pin is HIGH (device in power down mode): A clock is offered at the clock output pin
until the device is activated (PWDDD pin is pulled to LOW). After the first activation the time
tSYSSU is required until normal operation timing is performed (see Figure 2-16 ).
This could be used to extend the clock generation without device programming or activation.
Note: It is required to activate the device for the duration of tSYSSU after first power on or a reset.
Only if this is done the normal operation timing is performed.
Data Sheet
32
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
With default settings the clock generating units are disabled during PD, therefore no clock is
available at the clock output pin. It is possible to offer a clock signal at the clock output pin every
time (also during PD) if the CLK_EN Bit in the CONFIG register is set to HIGH.
RESET
or 1st POWER ON
PWDDD = low
TX activ or RX activ
STATUS
XTAL EN
PD
*
CLOCK FOR EXTERNAL µP
DC OFFSET COMPENSATION
PD
TX activ
RX activ
TX activ
RX activ
*
if RX
PEAK DETECTOR EN
if RX
DATADETECTION EN
if RX
POWER AMP EN
if TX
tCLKSU
tCLKSU
tTXSU
0.5ms
tCLKSU
0.5ms
tTXSU
1.1ms
0.5ms
tTXSU
1.1ms
1.1ms
tSYSSU
tRXSU
tRXSU
tDDSU
tDDSU
2.2ms
8ms
tRXSU
2.2ms
2.6ms
2.2ms
2.6ms
tDDSU
2.6ms
Sequenzer_Timing_pupstart.wmf
Figure 2-15
1st start or reset in active mode
Note: The time values are typical values
RESET
or 1st POWER ON
PWDDD = high
PWDDD = low
STATUS
PD
XTAL EN
CLOCK FOR EXTERNAL µP
TX activ or RX activ
PD
TX activ
RX activ
*
if RX
DC OFFSET COMPENSATION
PEAK DETECTOR EN
if RX
DATADETECTION EN
if RX
POWER AMP EN
if TX
tCLKSU
tCLKSU
0.5ms
tTXSU
0.5ms
1.1ms
tTXSU
1.1ms
tRXSU
tSYSSU
2.2ms
8ms
tRXSU
2.2ms
tDDSU
2.6ms
tDDSU
2.6ms
Sequenzer_Timing_pdstart.wmf
Figure 2-16
1st start or reset in PD mode
* State is either „I“ or „O“ depending on time of setting into powerdown.
Note: The time values are typical values
Data Sheet
33
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
This means that the device needs tDDSU setup time to start the data detection after RX is activated.
When activating TX it requires tTXSU setup time to enable the power amplifier.
For timing information refer to Table 4-3.
For test purposes a TESTMODE is provided by the Sequencer as well. In this mode the BLOCK_PD
register be set to various values. This will override the Sequencer timing. Depending on the settings
in Config Register 00H the corresponding building blocks are enabled, as shown in the subsequent
figure.
RC- OSC.
INTERNAL BUS
BLOCK_PD
REGISTER
ASK/FSK
16
16
ENABLE / DISABLE
BUILDING BLOCKS
TX ON
XTAL FREQU.
SELECT
16
SWITCH
RX ON
2
TESTMODE
ALL_PD
CLK_EN
32 kHz
TIMING
DECODE
RESET
sequencer_raw.wmf
Figure 2-17
2.4.19
Sequencer‘s capability
Clock Divider
It supports an external logic with a programmable Clock at pin 26 (CLKDIV).
32 kHz
WINDOW COUNT COMPLETE
DIVMODE_1
DIVMODE_0
4 BIT
COUNTER
SWITCH
19 MHz
DIVIDE
BY 2
INTERNAL BUS
CLKDiv
26
clk_div.wmf
Figure 2-18
Clock Divider
The Output Selection and Divider Ratio can be set in the CLK_DIV register.
Data Sheet
34
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
Table 2-29
D5
0
0
1
1
CLK_DIV Output Selection
D4
0
1
0
1
Output
Output from Divider (default)
19.0625MHz
32kHz
Window Count Complete
Note: Data are valid 500 µs after the crystal oscillator is enabled (see Figure 2-15 and Figure 216, tCLKSU).
Table 2-30
CLK_DIV Setting
D3
D2
D1
D0
Total Divider Ratio
0
0
0
0
2
0
0
1
4
0
0
0
1
0
6
0
0
1
1
8
0
1
0
0
10
0
1
0
1
12
0
1
1
0
14
1
1
1
16
0
1
0
0
0
18
1
0
0
1
20
1
0
1
0
22
1
0
1
1
24
1
1
0
0
26
1
0
1
28
1
1
1
1
0
30
1
1
1
1
32
Output Frequency [MHz]
9.53
4.77
3.18
2.38
1.91
1.59
1.36
1.19
1.06 (default)
0.95
0.87
0.79
0.73
0.68
0.64
0.6
Note: As long as default settings are used, there is no clock available at the clock output during
Power Down. It is possible to enable the clock during Power Down by setting CLK_EN (Bit D9) in
the Config Register (00H) to HIGH.
2.4.20
RSSI and Supply Voltage Measurement
The input of the 6Bit-ADC can be switched between two different sources: the RSSI voltage (default
setting) or a resistor network dividing the Vcc voltage by 5.
Table 2-31
Source for 6Bit-ADC Selection (Register 08H)
SELECT
Input for 6Bit-ADC
Vcc / 5
0
1
RSSI (default)
Data Sheet
35
2007-02-26
TDA5252 G2
Version 1.1
Functional Description
To prevent wrong interpretation of the ADC information (read from Register 81H: ADC) you can use
the ADC- Power Down feedback Bit (D7) and the SELECT feedback Bit (D6) which correspond to
the actual measurement.
Note: As shown in Section 2.4.18 there is a setup time of 2.6ms after RX activating. Thus the
measurement of RSSI voltage does only make sense after this setup time.
Data Sheet
36
2007-02-26
TDA5252 G2
Version 1.1
Application
3
Application
3.1
LNA and PA Matching
3.1.1
RX/TX Switch
VCC
C5
L1
D1
C1
50 Ohm
SMA-connector
C2
L2
C3
R1
PA
C4
C7
C9
LNI
D2
L3
C10
LNIX
TDA525x
RF I/O
RX/TX
RX/TX
C6
RX/TX_Switch.wmf
Figure 3-1
RX/TX Switch
The RX/TX-switch combines the PA-output and the LNA-input into a single 50 Ohm SMAconnector. Two pin-diodes are used as switching elements. If no current flows through a pin diode,
it works as a high impedance for RF with very low capacitance. If the pin-diode is forward biased, it
provides a low impedance path for RF. (some Ω)
3.1.2
Switch in RX-Mode
The RX/TX-switch is set to the receive mode by either applying a high level or an open to the RX/
TX-jumper on the evalboard or by leaving it open. Then both pin-diodes are not biased and
therefore have a high impedance.
Data Sheet
37
2007-02-26
TDA5252 G2
Version 1.1
Application
VCC
C5
L1
50 Ohm
SMA-connector
C1
C2
L2
C3
R1
PA
C4
C7
C9
LNI
L3
RX/TX
grounded
(with jumper or
RX/TX-pin of IC)
C10
LNIX
TDA525x
RF I/O
RX/TX
C6
RX_Mode.wmf
Figure 3-2
RX-Mode
The RF-signal is able to run from the RF-input-SMA-connector to the LNA-input-pin LNI via C1, C2,
C7, L3 and C9. R1 does not affect the matching circuit due to its high resistance. The other input of
the differential LNA LNIX can always be AC-grounded using a large capacitor without any loss of
performance. In this case the differential LNA can be used as a single ended LNA, which is easier
to match. The S11 of the LNA at pin LNI on the evalboard is 0.931 / -44° (equals a resistor of
1.2kOhm in parallel to a capacitor of 1.4pF) for both high and low-gain-mode of the LNA. (pin LNIX
AC-grounded) This impedance has to be matched to 50 Ohm with the parts C9, L3, C7 and C2. C1
is a DC-decoupling-capacitor. On the evalboard the most important matching components are
(shunt) L3 and (series)C7, C2. The capacitors is mainly a DC-decoupling-capacitor and may be
used for some fine tuning of the matching circuit. A good CAE tool (featuring smith-chart) may be
used for the calculation of the values of the components. However, the final values of the matching
components always have to be found on the board because of the parasitics of the board, which
highly influence the matching circuit at RF.
Data Sheet
38
2007-02-26
TDA5252 G2
Version 1.1
Application
Measured Magnitude of S11 of evalboard:
S11_measured_915.pcx.
Figure 3-3
S11 measured
Above you can see the measured S11 of the evalboard. The –3dB-points are at 851MHz and
989MHz. So the 3dB-bandwidth is:
B = f U − f L = 989MHz − 851MHz = 138MHz
The loaded Q of the resonant circuit is:
QL =
[3 – 1]
[3 – 2]
f center
915 MHz
=
= 6 .63
B
138 MHz
The unloaded Q of the resonant circuit is equal to the Q of the inductor due to its losses.
[3 – 3]
QU = QINDUCTOR ≈ 36 @ 915MHz
An approximation of the losses of the input matching network can be made with the formula:
 Q 
 6.63
LOSS = −20 * log1 − L  = −20 * log1 −
= 1,8dB
36 

 QU 
Data Sheet
39
[3 – 4]
2007-02-26
TDA5252 G2
Version 1.1
Application
The noise figure of the LNA-input-matching network is equal to its losses. The input matching
network is always a compromise of sensitivity and selectivity. The loaded Q should not get too high
because of 2 reasons:
more losses in the matching network and hence less sensitivity
tolerances of components affect matching too much. This will cause problems in a tuning-free mass
production of the application. A good CAE-tool will help to see the effects of component tolerances
on the input matching more accurate by tweaking each value.
A very high selectivity can be reached by using SAW-filters at the expense of higher cost and lower
sensitivity which will be reduced by the losses of the SAW-Filter of approx. 4dB.
Image-suppression:
Due to the quite high 1st-IF of the frontend, the image frequency is quite far away. The image
frequency of the receiver is at:
f IMAGE = f SIGNAL + 2 * f IF = 915MHz + 2 * 305 = 1525MHz
[3 – 5]
The image suppression on the evalboard is about 17dB.
LO-leakage:
The LO of the 1st Mixer is at:
4
4
f LO = f RECEIVE * = 915MHz* = 1220MHz
3
3
[3 – 6]
The LO-leakage of the evalboard on the RF-input is about –90dBm.
3.1.3
Switch in TX-Mode
The evalboard can be set into the TX-Mode by grounding the RX/TX-jumper on the evalboard or
programming the TDA5255 to operate in the TX-Mode. If the IC is programmed to operate in the
TX-Mode, the RX/TX-pin will act as an open drain output at a logical LOW. Then a DC-current can
flow from VCC to GND via L1, L2, D1, R1 and D2.
I PIN−DIODE =
[3 – 7]
Vcc − 2 ∗VFORWARD,PIN−DIODE
R1
Now both pin-diodes are biased with a current of approx. 0.3mA@3V and have a very low
impedance for RF.
Data Sheet
40
2007-02-26
TDA5252 G2
Version 1.1
Application
VCC
C5
L1
50 Ohm
SMA-connector
C1
C2
L2
C3
R1
PA
C4
C7
C9
LNI
C10
L3
RX/TX
grounded
(with jumper or
RX/TX-pin of IC)
LNIX
TDA525x
RF I/O
RX/TX
C6
TX_Mode.wmf
Figure 3-4
TX_Mode
R1 does not influence the matching because of its very high resistance. Due to the large
capacitance of C1, C6 and C5 the circuit can be further simplified for RF:
L1
50 Ohm
SMA-connector
L2
C2
C3
PA
C4
C7
C9
LNI
L3
C10
LNIX
TDA525x
RF I/O
TX_Mode_simplified.wmf
Figure 3-5
TX_Mode_simplified
The LNA-matching is RF-grounded now, so no power is lost in the LNA-input. The PA-matching
consists of C2, C3 L2, C4 and L1.
When designing the matching of the PA, C2 must not be changed anymore because its value is
already fixed by the LNA-input-matching.
Data Sheet
41
2007-02-26
TDA5252 G2
Version 1.1
Application
3.1.4
Power-Amplifier
The power amplifier operates in a high efficient class C mode. This mode is characterized by a
pulsed operation of the power amplifier transistor at a current flow angle of θ<<π. A frequency
selective network at the amplifier output passes the fundamental frequency component of the pulse
spectrum of the collector current to the load. The load and its resonance transformation to the
collector of the power amplifier can be generalized by the equivalent circuit of Figure 3-6. The tank
circuit L//C//RL in parallel to the output impedance of the transistor should be in resonance at the
operating frequency of the transmitter.
VS
L
C
RL
Equivalent_power_wmf.
Figure 3-6
Equivalent power amplifier tank circuit
The optimum load at the collector of the power amplifier for “critical” operation under idealized
conditions at resonance is:
RLC =
VS 2
2PO
[3 – 8]
A typical value of RLC for an RF output power of Po= 13mW is:
RLC =
32
= 350Ω
2 ∗ 0.013
[3 – 9]
Critical” operation is characterized by the RF peak voltage swing at the collector of the PA transistor
to just reach the supply voltage VS. The high efficiency under “critical” operating conditions can be
explained by the low power loss at the transistor.
During the conducting phase of the transistor there is no or only a very small collector voltage
present, thus minimizing the power loss of the transistor (iC*uCE). This is particularly true for low
current flow angles of θ<<π. In practice the RF-saturation voltage of the PA transistor and other
parasitics will reduce the “critical” RLC.
The output power Po will be reduced when operating in an “overcritical” mode at a RL > RLC. As
shown in Figure 3-7, however, power efficiency E (and bandwidth) will increase by some degree
when operating at higher RL. The collector efficiency E is defined as
Data Sheet
42
2007-02-26
TDA5252 G2
Version 1.1
Application
E=
PO
VS I C
[3 – 10]
The diagram of Figure 3-7 has been measured directly at the PA-output at VS=3V. A power loss in
the matching circuit of about 3dB will decrease the output power. As shown in the diagram, 250
Ohm is the optimum impedance for operation at 3V. For an approximation of ROPT and POUT at
other supply voltages those 2 formulas can be used:
[3 – 11]
ROPT ~ VS
and
POUT ~ ROPT
[3 – 12]
The behaviour of the power amplifier over the impedance and frequency is in principle the same as
of the TDA5250, but of course strongly depends on the matching network. (see also specification
of TDA5250)
Power_E_vs_RL.wmf
Figure 3-7
Output power Po (mW) and collector efficiency E vs. load resistor RL.
The DC collector current Ic of the power amplifier and the RF output power Po vary with the load
resistor RL. This is typical for overcritical operation of class C amplifiers. The collector current will
show a characteristic dip at the resonance frequency for this type of “overcritical” operation. The
depth of this dip will increase with higher values of RL.
Data Sheet
43
2007-02-26
TDA5252 G2
Version 1.1
Application
As Figure 3-8 shows, detuning beyond the bandwidth of the matching circuit results in a significant
increase of collector current of the power amplifier and in some loss of power. This diagram shows
the data of the circuit of the test board around the center frequency of 915MHz.
PA-out_&_I-collector_vs_frequency.wmf
Figure 3-8
PA-out & I-collector vs. frequency
C4, L2 and C3||C2 are the main matching components which are used to transform the 50 Ohm
load at the SMA-RF-connector to a higher impedance at the PA-output (250Ohm@3V). L1 can be
used for finetuning of the resonance frequency but should not be too low in order to keep its loss
low.
The transformed impedance of 250Ohm+j0 at the PA-output-pin can be verified with a network
analyzer using this measurement procedure:
1. Calibrate your network analyzer.
2. Connect a short, low-loss 50 Ohm cable to your network analyzer with an open end on one side.
Semirigid cable works best.
3. Use the „Port Extension“ feature of your network analyzer to shift the reference plane of your
network analyzer to the open end of the cable.
4. Connect the center-conductor of the cable to the solder pad of the pin „PA“ of the IC. The shield
has to be grounded. Very short connections must be used. Do not remove the IC or any part of
the matching-components!
5. Screw a 50Ohm-dummy-load on the RF-I/O-SMA-connector
6. The TDA5255 has to be in ASK-TX-Mode, Data-Input=LOW.
7. Be sure that your network analyzer is AC-coupled and turn on the power supply of the IC.
8. Measure the S-parameter
Data Sheet
44
2007-02-26
TDA5252 G2
Version 1.1
Application
The evalboard has been optimized for 3V. The load is about 250+j0 at 915MHz.
A tuning-free realization requires a careful design of the components within the matching network.
A simple linear CAE-tool will help to see the influence of tolerances of matching components.
Suppression of spurious harmonics may require some additional filtering within the antenna
matching circuit. Both can be seen in Figure 3-9 and Figure 3-10 The total spectrum of the
evalboard can be summarized as:
Carrier fc
+9dBm
fc-18.1MHz
-69dBm
fc+18.1MHz
-72dBm
2nd harmonic
-45dBm
3rd harmonic
-49dBm
spectrum_13.2GHz.bmp
Figure 3-9
Data Sheet
Transmit Spectrum 13.2GHz
45
2007-02-26
TDA5252 G2
Version 1.1
Application
spektrum_300MHz.bmp
Figure 3-10
3.2
Transmit Spectrum 300MHz
Crystal Oscillator
The equivalent schematic of the crystal with its parameters specified by the crystal manufacturer
can be taken from the subsequent figure.
Here also the load capacitance of the crystal CL, which the crystal wants to see in order to oscillate
at the desired frequency, can be seen.
C1
L1
-R
R1
CL
C0
Crystal.wmf
Figure 3-11
Crystal
L1:
motional inductance of the crystal
C1:
motional capacitance of the crystal
C0:
shunt capacitance of the crystal
[3 – 14]
Data Sheet
46
2007-02-26
TDA5252 G2
Version 1.1
Application
Therefore the Resonant Frequency fs of the crystal is defined as:
fS =
1
2π
[3 – 13]
L1 * C1
The Series Load Resonant Frequency fS‘ of the crystal is defined as:
f S `=
1
2π L1 * C1
* 1+
C1
C0 + C L
regarding Figure 3-11
fs’ is the nominal frequency of the crystal with a specified load when tested by the crystal
manufacturer.
Pulling Sensitivity of the crystal is defined as the magnitude of the relative change in frequency
relating to the variation of the load capacitor.
δf S ´
fS
− C1
δD
=
=
2
δC L
δCL
2(C0 + C L )
[3 – 15]
Choosing CL as large as possible results in a small pulling sensitivity. On the other hand a small CL
keeps the influence of the serial inductance and the tolerances associated to it small (see formula
[3-17]).
Start-up Time
t Start ~
L1
− R − Rext
where:
-R:
Rext:
[3 – 16]
is the negative impedance of the oscillator
see Figure 3-11
is the sum of all external resistances (e.g. R1 or any
other resistance that may be present in the circuit,
see Figure 3-10
The proportionality of L1 and C1 of the crystal is defined by formula [3-13]. For a crystal with a small
C1 the start -up time will also be slower. Typically the lower the value of the crystal frequency, the
lower the C1.
A short conclusion regarding crystal and crystal oscillator dependencies is shown in the following
table:
Data Sheet
47
2007-02-26
TDA5252 G2
Version 1.1
Application
Table 3-1
Crystal and crystal oscilator dependency
Result
Relative Tolerance Maximum Deviation
>>
>>
<
<
>>>
>
>>
>
>
<
Independent variable
C1 >
C0 >
frequency of quartz >
LOSC >
CL >
tStart-up
<
<<
-
The crystal oscillator in the TDA5252 is a NIC (negative impedance converter) oscillator type. The
input impedance of this oscillator is a negative impedance in series to an inductance. Therefore the
load capacitance of the crystal CL (specified by the crystal supplier) is transformed to the
capacitance Cv as shown in formula [3-17].
LOSC
-R
f, CL
CV
TDA 5250
QOSZ_NIC.wmf
Figure 3-12
CL =
Crystal Oscillator
1
1
− ω 2 LOSC
CV
↔ CV =
CL:
ω:
LOSC:
1
[3 – 17]
1
+ ω 2 LOSC
CL
crystal load capacitance for nominal frequency
angular frequency
inductivity of the crystal oscillator - typ: 2.75µH with pad of board
2.5µH without pad
With the aid of this formula it becomes obvious that the higher the serial capacitance CV is, the
higher is the influence of LOSC.
The tolerance of the internal oscillator inductivity is much higher, so the inductivity is the dominating
value for the tolerance.
FSK modulation and tuning are achieved by a variation of Cv.
Data Sheet
48
2007-02-26
TDA5252 G2
Version 1.1
Application
In case of small frequency deviations (up to +/- 1000 ppm), the desired load capacitances for FSK
modulation are frequency depending and can be calculated with the formula below.
2 ⋅ ( C + C )
∆f 
0
L
C −
C ⋅ ---------- ⋅  1 + ---------------------------------
+
L
0 N⋅f 
C

1
C L ± = -----------------------------------------------------------------------------------------2 ⋅ ( C + C )
∆f 
0
L
1 ± ---------- ⋅  1 + ---------------------------------
N⋅f 
C1

CL:
C0:
C1:
f:
N:
∆f:
[3 – 18]
crystal load capacitance for nominal frequency
shunt capacitance of the crystal
motional capacitance of the crystal
crystal oscillator frequency
division ratio of the PLL
peak frequency deviation
With CL+ and CL- the necessary Cv+ for FSK HIGH and Cv- for FSK LOW can be calculated.
Alternatively, an external AC coupled (10nF in series to 1kΩ) signal can be applied at pin 19 (Xout).
The drive level should be approximately 100mVpp.
3.2.1
Synthesizer Frequency setting
Generating ASK and FSK modulation 3 setable frequencies are necessary.
3.2.1.1
Possible crystal oscillator frequencies
The resulting possible crystal oscillator frequencies are shown in the following Figure 3-13
RX:
TX:
FSK-
FSK
ASK
Deviation
f1
ASK
FSK+
Deviation
f0
f2
Nominal
Frequency
free_reg.wmf
Figure 3-13
possible crystal oscillator frequencies
In ASK receive mode the crystal oscillator is set to frequency f2 to realize the necessary frequency
offset to receive the ASK signal at f0*N (N: division ratio of the PLL).
Data Sheet
49
2007-02-26
TDA5252 G2
Version 1.1
Application
To set the 3 different frequencies 3 different Cv are necessary. Via internal switches 3 external
capacitors can be combined to generate the necessary Cv in case of ASK- or FSK-modulation.
Internal banks of switchable capacitors allow the finetuning of these frequencies.
3.2.2
Transmit/Receive ASK/FSK Frequency Assignment
Depending on whether the device operates in transmit or receive mode or whether it operates in
ASK or FSK the following cases can be distinguished:
3.2.2.1
FSK-mode
In transmit mode the two frequencies representing logical HIGH and LOW data states have to be
adjusted depending on the intended frequency deviation and separately according to the following
formulas:
fCOSC HI = (fRF + fDEV) / 48
[3 – 19]
fCOSC LOW = (fRF - fDEV) / 48
e.g.
fCOSC HI
= (915E6 + 50E3) / 48 = 19,0635167MHz
fCOSC LOW
= (915E6 - 50E3) / 48 = 19,0614583MHz
with a frequency deviation of 50kHz.
Figure 3-14 shows the configuration of the switches and the capacitors to achieve the 2 desired
frequencies. Gray parts of the schematics indicate inactive parts. For FSK modulation the ASKswitch is always open.
For FSK LOW the FSK-switch is closed and Cv2 and Ctune2 are bypassed. The effective Cv- is given
by:
CV − = C v1 + C tune1
[3 – 20]
For finetuning Ctune1 can be varied over a range of 8 pF in steps of 125fF. The switches of this Cbank are controlled by the bits D0 to D5 in the FSK register (subaddress 01H, see Table 3-6).
For FSK HIGH the FSK-switch is open. So the effective Cv+ is given by:
( C v1 + C tune1 ) ⋅ ( C v2 + C tune2 )
C v+ = --------------------------------------------------------------------------------------C v1 + C tune1 + C v2 + C tune2
[3 – 21]
The C-bank Ctune2 can be varied over a range of 16 pF in steps of 250fF for finetuning of the FSK
HIGH frequency. The switches of this C-bank are controlled by the bits D8 to D13 in the FSK
register (subaddress 01H, see Table 3-6).
Data Sheet
50
2007-02-26
TDA5252 G2
Version 1.1
Application
L
XOUT 19
-R
f, CL
-R
f, CL
XIN 21
XIN 21
CV1
CV1
Ctune1
XSWF 20
Ctune1
XSWF 20
XSWA 22
XSWA 22
CV3
CV2
CV3
Ctune2
Ctune2
FSK LOW
FSKswitch
XGND 23
FSKswitch
ASKswitch
XGND 23
ASKswitch
CV2
L
XOUT 19
FSK HIGH
QOSC_FSK.wmf
Figure 3-14
FSK modulation
In receive mode the crystal oscillator frequency is set to yield a direct-to-zero conversion of the
receive data. Thus the frequency may be calculated as
fCOSC = fRF / 48,
[3 – 22]
e.g.
fCOSC = 915E6 / 48 = 19.0625MHz
which is identical to the ASK transmit case.
XOUT 19
L
-R
f, CL
XIN 21
CV1
Ctune1
XSWF 20
XSWA 22
CV3
Ctune2
ASKswitch
XGND 23
FSKswitch
CV2
QOSC_ASK.wmf
Figure 3-15
FSK receive
In this case the ASK-switch is closed. The necessary Cvm is given by:
Data Sheet
51
2007-02-26
TDA5252 G2
Version 1.1
Application
(C + C
) ⋅ (C + C + C
)
v1
tune1
v2
tune2
v3
C vm = -------------------------------------------------------------------------------------------------------C +C
+C +C +C
v1
tune1
v2
tune2
v3
[3 – 23]
The C-bank Ctune2 can be varied over a range of 16 pF in steps of 250fF for finetuning of the FSK
receive frequency. In this case the switches of the C-bank are controlled by the bits D0 to D5 of the
XTAL_TUNING register (subaddress 02H, see Table 3-5).
3.2.2.2
ASK-mode:
In transmit mode the crystal oscillator frequency is the same as in the FSK receive case, see
Figure 3-15.
In receive mode a receive frequency offset is necessary as the limiters feedback is AC-coupled.
This offset is achieved by setting the oscillator frequency to the FSK HIGH transmit frequency, see
Figure 3-14.
3.2.3
Parasitics
For the correct calculation of the external capacitors the parasitic capacitances of the pins and the
switches (C20, C21, C22) have to be taken into account.
XOUT 19
L
-R
f, CL
XIN 21
CV1
C21
Ctune1
XSWF 20
XSWA 22
CV2
CV3
XGND 23
C22
C20
Ctune2
QOSC_parasitics.wmf
Figure 3-16
Data Sheet
parasitics of the switching network
52
2007-02-26
TDA5252 G2
Version 1.1
Application
Table 3-2
Typical values of parasitic capacitances
Name
Value
C20
4,6 pF
C21
FSK-: 2,8 pF / FSK+&ASK: 2.2pF
C22
1 pF
With the given parasitics the actual Cv can be calculated:
C
C v- = C v1 + C tune1 + C 21
[3 – 24]
(C + C
) ⋅ (C + C + C
)
v1
tune1
v2
20
tune2
C v+ = ------------------------------------------------------------------------------------------------------- + C 21
C v1 + C tune1 + C v2 + C 20 + C
tune2
[3 – 25]
( C v1 + C tune1 ) ⋅ ( C v2 + C 20 + C + C 22 + C
)
v3
tune2
= ----------------------------------------------------------------------------------------------------------------------------------------- + C
21
vm
C v1 + C tune1 + C v2 + C 20 + C + C 22 + C
v3
tune2
[3 – 26]
Note: Please keep in mind also to include the Pad parasitics of the circuit board.
3.2.4
Calculation of the external capacitors
1. Determination of necessary crystal frequency using formula [3-19].
e.g. fFSK- = fCOSC LOW
2. Determine corresponding CLoad applying formula [3-18].
e.g. CL FSK- = CL ±
3. Necessary CV using formula [3-17].
e.g.
CV − =
1
1
C L , FSK −
+ (2πf FSK − ) * LOSC
2
1. When the necessary Cv for the 3 frequencies (Cv- for FSK LOW, Cv+ for FSK HIGH and Cvm for
FSK-receive) are known the external capacitors and the internal tuning caps can be calculated
using the following formulas:
[3 – 29]
Data Sheet
53
2007-02-26
TDA5252 G2
Version 1.1
Application
-FSK:
C v1 + C tune1 = C v- – C 21
[3 – 27]
+FSK:
( C v1 + C tune1 ) ⋅ ( C v+ – C 21 )
C v2 + C tune2 = ---------------------------------------------------------------------- – C 20
( C v1 + C tune1 ) – ( C v+ – C 21 )
[3 – 28]
FSK_RX:
( C v1 + C tune1 ) ⋅ ( C vm – C 21 )
C v3 + C tune2 = ------------------------------------------------------------------------- – C 20 – C v2 – C 22
( C v1 + C tune1 ) – ( C vm – C 21 )
To compensate frequency errors due to crystal and component tolerance Cv1, Cv2 and Cv3 have to
be varied. To enable this correction, half of the necessary capacitance variation has to be realized
with the internal C-banks.
If no finetuning is intended it is recommended to leave XIN (Pin 21) open. So the parasitic
capacitance of Pin 21 has no effect.
Note: Please keep in mind also to include the Pad parasitics of the circuit board.
In the suitable range for the serial capacitor, either capacitors with a tolerance of 0.1pF or 1% are
available.
A spreadsheet, which can be used to predict the total frequency error by simply entering the crystal
specification, may be obtained from Infineon.
3.2.5
FSK-switch modes
The FSK-switch can be used either in a bipolar or in a FET mode. The mode of this switch is
controlled by bit D0 of the XTAL_CONFIG register (subaddress 0EH).
In the bipolar mode the FSK-switch can be controlled by a ramp function. This ramp function is set
by the bits D1 and D2 of the XTAL_CONFIG register (subadress 0EH). With these modes of the
FSK-switch the bandwidth of the FSK spectrum can be influenced.
When working in the FET mode the power consumption can be reduced by about 200 µA.
The default mode is bipolar switch with no ramp function (D0 = 1, D1 = D2 = 0), which is suitable
for all bitrates.
Table 3-3
Sub Address 0EH: XTAL_CONFIG
D0
D1
D2
Switch mode
0
n.a.
n.a.
FET
1
0
0
bipolar (default)
1
0
bipolar
1
1
0
1
bipolar
1
1
1
bipolar
Data Sheet
54
Ramp time
< 0.2 µs
< 0.2 µs
4 µs
8 µs
12 µs
Max. Bitrate
> 32 kBit/s NRZ
> 32 kBit/s NRZ
32 kBit/s NRZ
16 kBit/s NRZ
12 kBit/s NRZ
2007-02-26
TDA5252 G2
Version 1.1
Application
3.2.6
Finetuning and FSK modulation relevant registers
Case FSK-RX or ASK-TX (Ctune2):
Table 3-4
Bit
D5
D4
D3
D2
D1
D0
Sub Address 02H: XTAL_TUNING
Function
Value
Nominal_Frequ_5
8pF
Nominal_Frequ_4
4pF
Nominal_Frequ_3
2pF
Nominal_Frequ_2
1pF
Nominal_Frequ_1
500fF
Nominal_Frequ_0
250fF
Description
Setting for
nominal
frequency
ASK-TX
FSK-RX
(Ctune2)
Default
0
1
0
0
1
0
Description
Setting for
positive
frequency
shift: +FSK
or ASK-RX
(Ctune2)
Default
0
0
1
0
1
0
0
0
1
1
0
0
Case FSK-TX or ASK-RX (Ctune1 and Ctune2):
Table 3-5
Bit
D13
D12
D11
D10
D9
D8
D5
D4
D3
D2
D1
D0
Sub Address 01H: FSK
Function
FSK+5
FSK+4
FSK+3
FSK+2
FSK+1
FSK+0
FSK-5
FSK-4
FSK-3
FSK-2
FSK-1
FSK-0
Value
8pF
4pF
2pF
1pF
500fF
250fF
4pF
2pF
1pF
500fF
250fF
125fF
Setting for
negative
frequency
shift: -FSK
(Ctune1)
Default values
In case of using the evaluation board, the crystal with its typical parameters (fp=19,0625MHz,
C1=8fF, C0=2,1pF, CL=20pF) and external capacitors with Cv1=8.2pF, Cv2=6.8pF, Cv3=22pF
each are used the following default states are set in the device.
Table 3-6
Default oscillator settings
Operating state
Frequency
ASK-TX / FSK-RX
915 MHz
+FSK-TX / ASK-RX
+50 kHz
-FSK-TX
-50 kHz
Data Sheet
55
2007-02-26
TDA5252 G2
Version 1.1
Application
3.2.7
Chip and System Tolerances
Quartz: fp=19.0625MHz; C1=8fF; C0=2.1pF; CL=20pF (typical values)
Cv1=8.2pF, Cv2=6.8pF, Cv3=22pF
Table 3-7
Internal Tuning
Part
Frequency set accuracy
Temperature (-40...+85C)
Supply Voltage(2.1...5.5V)
Total
Frequency tolerance
@ 915MHz
+/- 1.5kHz
+/- 5kHz
+/- 1.5kHz
+/- 8kHz
Rel. tolerance
+/- 1.6ppm
+/- 6ppm
+/- 1.5ppm
+/- 9ppm
Table 3-8
Default Setup (without internal tuning & without Pin21 usage)
Part
Frequency tolerance Rel. tolerance
@ 915MHz
Internal capacitors (+/- 10%)
+/- 4kHz
+/- 4.5ppm
Inductivity of the crystal oscillator
+/- 29kHz
+/- 33ppm
Temperature (-40...+85C)
+/- 5kHz
+/- 6ppm
Supply Voltage (2.1...5.5V)
+/- 1kHz
+/- 1.5ppm
Total
+/- 39kHz
+/- 45ppm
Tolerance values in Table 3-8 are valid, if pin 21 is not connected. Establishing the connection to
pin 21 the tolerances increase.
Concerning the frequency tolerances of the whole system also crystal tolerances (tuning
tolerances, temperature stability, tolerance of CL) have to be considered.
In addition to the chip tolerances also the crystal and external component tolerances have to be
considered in the tuning and non-tuning case.
In case of internal tuning: The crystal on the evaluation board has a temperature stability of +/20ppm (or +/- 18kHz of the RF), which must be added to the total tolerances.
In case of default setup (without internal tuning and without usage of pin 21) the temperature
stability and tuning tolerance of the crystal as well as the tolerance of the external capacitors (+/0.1pF) have to be added. The crystal on the evaluation board has a temperature stability of +/20ppm (means +/- 18kHz of the RF) and a tuning tolerance of +/- 10ppm (means +/- 9kHz of the
RF). The external capacitors add a tolerance of +/- 3.5ppm (or +/- 3.2kHz regarding to the RF).
The frequency stabilities of both the receiver and the transmitter and the modulation bandwidth set
the limit for the bandwidth of the IQ filter. To achieve a high receiver sensitivity and efficient
Data Sheet
56
2007-02-26
TDA5252 G2
Version 1.1
Application
suppression of adjacent interference signals, the narrowest possible IQ bandwidth should be
realized (see Section 3.3).
3.3
IQ-Filter
The IQ-Filter should be set to values corresponding to the RF-bandwidth of the received RF signal
via the D1 to D3 bits of the LPF register (subaddress 03H).
Table 3-9
D3
0
0
0
0
1
1
1
1
3dB cutoff frequencies I/Q Filter
D2
D1
nominal f-3dB in kHz
(programmable)
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
resulting effective
channel
bandwidth in kHz
not used
350
250
200
150 (default)
100
50
not used
700
500
400
300
200
100
10
50kHz
100kHz
0
150kHz
- 10
200kHz
250kHz
-20
350kHz
-30
-40
-50
-60
-70
-80
10
10 0
10 0 0
10 0 0 0
f [ kHz]
iq_filter_curve.wmf
Figure 3-17
Data Sheet
I/Q Filter Characteristics
57
2007-02-26
TDA5252 G2
Version 1.1
Application
effective channel bandwidth
-f
-f
f
3dB
IQ Filter
3dB
IQ Filter
f
iq_char.wmf
Figure 3-18
3.4
IQ Filter and frequency characteristics of the receive system
Data Filter
The Data-Filter should be set to values corresponding to the bandwidth of the transmitted Data
signal via the D4 to D7 bits of the LPF register (subaddress 03H).
Table 3-10
D7
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Data Sheet
3dB cutoff frequencies Data Filter
D6
D5
D4
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
58
nominal f-3dB in kHz
5
7 (default)
9
11
14
18
23
28
32
39
49
55
64
73
86
102
2007-02-26
TDA5252 G2
Version 1.1
Application
3.5
Limiter and RSSI
The I/Q Limiters are DC coupled multistage amplifiers with offset-compensating feedback circuit
and an overall gain of approximately 80dB each in the frequency range of 100Hz up to 350kHz.
Receive Signal Strength Indicator (RSSI) generators are included in both limiters which produce DC
voltages that are directly proportional to the input signal level in the respective channels. The
resulting I- and Q-channel RSSI-signals are summed to the nominal RSSI signal.
I- Filter
fg
33
C
RSSI
32
CQ2x
34
CQ2
35
Cc
CI2x
36
CQ1x
37
CQ1
CI1x
38
CI2
Cc
Cc
CI1
Cc
I
Limiter
29 RSSI
31
Quadr.
Corr.
37k
SUM
Q- Filter
fg
Quadr.
Corr.
Q
Limiter
limiter input.wmf
Figure 3-19
Limiter and Pinning
The DC offset compensation needs 2.2ms after Power On or Tx/Rx switch. This time is hard wired
and independent from external capacitors CC on pins 31 to 38. The maximum value for this
capacitors is 47nF.
RSSI accuracy settling time = 2.2ms + 5*RC=2.2ms+5*37k*2.2nF=2.6ms
R - internal resistor; C - external capacitor at Pin 29
Table 3-11
Cc
[nF]
220
100
47
22
10
Data Sheet
Limiter Bandwidth
f3dB
lower limit
[Hz]
100
220
470
1000
2200
f3dB
upper
limit
IQ Filter
- ll - ll - ll - ll -
59
Comment
setup time not guaranteed
setup time not guaranteed
Eval Board
2007-02-26
TDA5252 G2
Version 1.1
Application
v [dB]
80
0
f
f
f
3dB
IQ Filter
3dB
lower limit
f
3dB
Limiter
limiter_char.wmf
Figure 3-20
Limiter frequency characteristics
ADC
1300
1200
1100
1000
900
RSSI /mV
800
700
600
500
high gain
400
low gain
300
200
100
0
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
RF /dBm
RSSI.wmf
Figure 3-21
Data Sheet
Typ. RSSI Level (Eval Board) @3V
60
2007-02-26
TDA5252 G2
Version 1.1
Application
3.6
Data Slicer - Slicing Level
The data slicer is an analog-to-digital converter. It is necessary to generate a threshold value for the
negative comparator input (data slicer). The TDA5255 offers an RC integrator and a peak detector
which can be selected via logic. Independent of the choice, the peak detector outputs are always
active.
3.6.1
Table 3-12
Bit
D15
RC Integrator
Sub Address 00H: CONFIG
Function
Description
SLICER
0= LP, 1= Peak Detector
Default
0
SET
0
Necessary external component (Pin14): CSLC
This integrator generates the mean value of the data filter output. For a stable threshold value, the
cut-off frequency has to be lower than the lowest signal frequency. The cutoff frequency results from
the internal resistance R=100kΩ and the external capacitor CSLC on Pin14.
Cut-off frequency:
f
cut − off
=
1
< Min {f
2 π ⋅100 kΩ ⋅ C SLC
Signal
}
[3 – 30]
Component calculation: (rule of thumb)
TL – longest period of no signal change
C
SLC
≥
3 ⋅TL
100 k Ω
[3 – 31]
SLC_RC.wmf
Figure 3-22
Data Sheet
Slicer Level using RC Integrator
61
2007-02-26
TDA5252 G2
Version 1.1
Application
3.6.2
Table 3-13
Bit
D15
Peak Detectors
Sub Address 00H: CONFIG
Function
Description
SLICER
0= LP, 1= Peak Detector
Default
0
SET
1
The TDA5252 has two peak detectors built in, one for positive peaks in the data stream and the
other for the negative ones.
Necessary external components:
- Pin12: CN
- Pin13: CP
SLC_PkD.wmf
Figure 3-23
Slicer Level using Peak Detector
For applications requiring fast attack and slow release from the threshold value it is reasonable to
use the peak detectors. The threshold value is generated by an internal voltage divider. The release
time is defined by the internal resistance values and the external capacitors.
Data Sheet
τ
posPkD
= 100 k Ω ⋅ C p
τ
negPkD
= 100 k Ω ⋅ C
62
[3 – 32]
n
[3 – 33]
2007-02-26
TDA5252 G2
Version 1.1
Application
Signal
τ posPkD
Signal
Pos. Peak Detector (pin13)
Threshold SLC(pin14)
Neg. Peak Detector (pin12)
τ negPkD
t
PkD_timing.wmf
Figure 3-24
Peak Detector timing
Component calculation: (rule of thumb)
Cp ≥
2 ⋅ TL1
[3 – 34]
100kΩ
TL1 – longest period of no signal change (LOW signal)
Cn
≥
2 ⋅ TL2
100kΩ
3.6.3
TL2 – longest period of no signal change (HIGH signal)
[3 – 35]
Peak Detector - Analog output signal
The TDA5255 data output can be digital (pin 28) or in analog form by using the peak detector output
and changing some settings.
To get an analog data output the slicer must be set to lowpass mode (Reg. 0, D15 = LP = 0) and
the peak detector capacitor at pin 12 or 13 has to be changed to a resistor of about 47kOhm.
Data Sheet
63
2007-02-26
TDA5252 G2
Version 1.1
Application
PkD_analog.wmf
Figure 3-25
3.6.4
Peak Detector as analog Buffer (v=1)
Peak Detector – Power Down Mode
For a safe and fast threshold value generation the peak detector is turned on by the sequencer
circuit (see Section 2.4.18) only after the entire receiving path is active.
In the off state the output of the positive peak detector is tied down to GND and the output of the
negative peak detector is pulled up to VCC.
PKD_PWDN.wmff
Figure 3-26
Data Sheet
Peak detector - power down mode
64
2007-02-26
TDA5252 G2
Version 1.1
Application
Signal
Data Signal
Vcc
Neg. Peak Detector (pin12)
Threshold (pin14)
2,2ms
Pos. Peak Detector (pin13)
0
Power ON
Power Down
Power ON
Peak Detector Power ON
t
PkD_PWDN3.wmf
Figure 3-27
3.7
Power down mode
Data Valid Detection
In order to detect valid data two criteria must be fulfilled.
One criteria is the data rate, which can be set in register 06h and 07h. The other one is the received
RF power level, which can be set in register 08h in form of the RSSI threshold voltage. Thus for
using the data valid detection FSK modulation is recommended.
Timing for data detection looks like the following. Two settings are possible: „Continuous“ and
„Single Shot“, which can be set by D5 and D6 in register 00H.
Data
t
Sequenzer enables
data detection
t
Counter Reset
reset
reset
t
Gate time
count
t
Compare with single
TH and latch result
comp.
comp.
t
Compare with double
TH and latch result
comp.
t
(Frequency) Window
Count Complete
start of conversion
count
ready*
possible start of next conversion
t
Frequ_Detect_Timing_continuous.wmf
Figure 3-28
Data Sheet
Frequency Detection timing in continuous mode
65
2007-02-26
TDA5252 G2
Version 1.1
Application
Note 1: Chip internal signal „Sequencer enables data detection“ has a LOW to HIGH transition
about 2.6ms after RX is activated (see Figure 2-15).
Note 2: The positive edge of the „Window Count Complete“ signal latches the result of comparison
of the analog to digital converted RSSI voltage with TH3 (register 08H). A logic combination of this
output and the result of the comparison with single/double THx defines the internal signal
„data_valid“.
Figure 3-27 shows that the logic is ready for the next conversion after 3 periods of the data signal.
Timing in Single Shot mode can be seen in the subsequent figure:
Data
t
Sequenzer enables
data detection
t
Counter Reset
reset
t
Gate time
count
t
Compare with single
TH and latch result
comp.
t
Compare with double
TH and latch result
comp.
t
(Frequency) Window
Count Complete
ready*
t
no possible start of next conversion
because of Single Shot Mode
start of conversion
Frequ_Detect_Timing_singleShot_wmf
Figure 3-29
3.7.1
Frequency Detection timing in Single Shot mode
Frequency Window for Data Rate Detection
The high time of data is used to measure the frequency of the data signal. For Manchester coding
either the data frequency or half of the data frequency have to be detected corresponding to one
high time or twice the high time of data signal.
A time period of 3*2*T is necessary to decide about valid or invalid data.
T
2*T
DATA
t
0
0
1
0
T2
T1
possible
GATE 1
t
0
2*T2
2*T1
possible
GATE 2
t
0
Data Sheet
1
66
2007-02-26
TDA5252 G2
Version 1.1
Application
window_count_timing.wmf
Figure 3-30
Window Counter timing
Example to calculate the thresholds for a given data rate:
- Data signal manchester coded
- Data Rate: 2kbit//s
- fclk= 19.0625 MHz
Then the period equals to
2⋅T =
1
= 0,5ms
2kbit/s
[3 – 36]
respectively the high time is 0,25ms.
We set the thresholds to +-10% and get: T1= 0,225ms and T2= 0,275ms
The thresholds TH1 and TH2 are calculated with following formulas
TH1 = T1⋅
f clk
4
TH2 = T2 ⋅
f clk
4
[3 – 37]
[3 – 38]
This yields the following results:
TH1~ 1072 = 010000110000b
TH2~ 1310 = 010100011110b
which have to be programmed into the D0 to D11 bits of the COUNT_TH1 and COUNT_TH2
registers (subaddresses 06H and 07H), respectively.
Default values (window counter inactive):
TH1= 000000000000b
TH2= 000000000001b
Note: The timing window of +-10% of a given high time T in general does not correspond to a
frequency window +-10% of the calculated data frequency.
3.7.2
RSSI threshold voltage - RF input power
The RF input power level is corresponding to a certain RSSI voltage, which can be seen in Section
3.5. The threshold TH3 of this RSSI voltage can be calculated with the following formula:
Data Sheet
67
2007-02-26
TDA5252 G2
Version 1.1
Application
TH3
=
desired
RSSI
threshold
1.2V
voltage
⋅ (2
6
[3 – 39]
− 1)
As an example a desired RSSI threshold voltage of 500mV results in TH3~26=011010b, which has
to be written into D0 to D5 of the RSSI_TH3 register (sub address 08H).
Default value (RSSI detection inactive):
TH3=111111b
3.8
Calculation of ON_TIME and OFF_TIME
ON= (216-1)-(fRC*tON)
[3 – 40]
OFF=( 216-1)-(fRC*tOFF)
[3 – 41]
fRC= Frequency of internal RC Oszillator
Example: tON= 0,005s, tOFF= 0,055s, fRC= 32300Hz
ON= 65535-(32300*0,005) ~ 65373= 1111111101011101b
OFF= 65535-(32300*0,055) ~ 63758= 1111100100001110b
The values have to be written into the D0 to D15 bits of the ON_TIME and OFF_TIME registers
(subaddresses 04H and 05H).
Default values:
ON= 65215 = 1111111011000000b
OFF= 62335 = 1111001110000000b
tON ~10ms @ fRC= 32kHz
tOFF ~100ms @ fRC= 32kHz
3.9
Example for Self Polling Mode
The settings for Self Polling Mode depend very much on the timing of the transmitted Signal. To
create an example we consider following data structure transmitted in FSK.
Data Sheet
68
2007-02-26
TDA5252 G2
Version 1.1
Application
4 Frames
Data
50ms
Data
Data
Data
t [ms]
50ms
400ms
Framedetails
t [ms]
Preamble
Data
Sync
t [ms]
Syncronisation Preamble
data_timing011.wmf
Figure 3-31
Example for transmitted Data-structure
According to existing synchronization techniques there are some synchronization bursts in front of
the data added (code violation!). A minimum of 4 Frames is transmitted. Data are preferably
Manchester encoded to get fastest respond out of the Data Rate Detection.
Target Application:
- received Signal has code violation as described before
- total mean current consumption below 1mA
- data reception within max. 400ms after first transmitted frame
One possible Solution:
tON = 15ms, tOFF= 135ms
This gives 15ms ON time of a total period of 150ms which results in max. 0.9mA mean current
consumption in Self Polling Mode. The resulting worst case timing is shown in the following figure:
Data Sheet
69
2007-02-26
TDA5252 G2
Version 1.1
Application
Case A:
Data
Data
50ms 15ms
Data
135ms
Data
t [ms]
µP enables Receiver
until Data completed
Interrupt
due PwdDD
Case B:
Data
50ms
Data
15ms
Data
135ms
Data
t [ms]
µP enables Receiver
until Data completed
Interrupt
due PwdDD
Case C:
Data
50ms
Data
15ms
Data
135ms
Data
t [ms]
µP enables Receiver
until Data completed
Interrupt
due PwdDD
... Receiver enabled
data_timing021.wmf
Figure 3-32
3 possible timings
Description:
Assumption: the ON time comes right after the first frame (Case A). If OFF time is 135ms the
receiver turns on during Sync-pulses and the PwdDD- pulse wakes up the µP.
If the ON time is in the center of the 50ms gap of transmission (Case B), the Data Detect Logic will
wake up the µP 135ms later.
If ON time is over just before Sync-pulses (Case C), next ON time is during Data transmission and
Data Detect Logic will trigger a PwdDD- pulse to wake up the µP.
Note: In this example it is recommended to use the Peak Detector for slicer threshold generation,
because of its fast attack and slow release characteristic. To overcome the data zero gap of 50ms
larger external capacitors than noted in Section 4.4 at pin12 and 13 are recommended. Further
information on calculating these components can be taken from Section 3.6.2.
Data Sheet
70
2007-02-26
TDA5252 G2
Version 1.1
Application
3.10
Default Setup
Default setup is hard wired on chip and effective after a reset or return of power supply.
Table 3-14
Default Setup
Parameter
Value
IFX-Board
IQ-Filter Bandwidth
Data Filter Bandwidth
Limiter lower fg
Slicing Level Generation
Nom. Frequency Capacity intern (ASK TX, FSK RX)
FSK+ Frequency Capacity intern (FSK+, ASK RX)
FSK- Frequency Capacity intern (FSK-)
150kHz
7kHz
470Hz
RC
4.5pF
2.5pF
1.5pF
47nF
10nF
915MHz
+50kHz
-50kHz
LNA Gain
Power Amplifier
HIGH
HIGH
+10dBm
RSSI accuracy settling time
ADC measurement
ON-Time
OFF-Time
Clock out RX PowerON
Clock out TX PowerON
Clock out RX PowerDOWN
Clock out TX PowerDOWN
2.6ms
RSSI
10ms
100ms
1.06MHz
1.06MHz
-
XTAL modulation switch
XTAL modulation shaping
bipolar
off
RX / TX
ASK/FSK
PwdDD
PWDN
Operating Mode
Slave
Data Sheet
71
Comment
2.2nF
Jumper
Jumper
Jumper
removed
2007-02-26
TDA5252 G2
Version 1.1
Reference
4
Reference
4.1
Electrical Data
4.1.1
Absolute Maximum Ratings
WARNING
The maximum ratings may not be exceeded under any circumstances, not even
momentarily and individually, as permanent damage to the IC may result.
The AC/DC characteristic limits are not guaranteed.
Table 4-1
#
Absolute Maximum Ratings
Parameter
Symbol
VESD-CDM
Limit Values
min
max
-0.3
5.8
-40
+125
-40
+150
114
-1.5
+1.5
ESD integrity, except pin
8, 9, 11, 15, 18, 23, 30
VESD-HBM
-2.0
+2.0
kV
ESD integrity, of pin
8, 9, 11, 15, 18, 23, 30
VESD-HBM
-500
+500
V
1
2
3
4
5
Supply Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
ESD integrity, all pins
6
7
4.1.2
Vs
Tj
Ts
RthJA
Unit
V
°C
°C
K/W
kV
Remarks
CDM according
EIA/JESD22-C101
HBM according
EIA/JESD22-A114-B
(1.5kΩ, 100pF)
HBM according
EIA/JESD22-A114-B
(1.5kΩ, 100pF)
Operating Range
Within the operational range the IC operates as explained in the circuit description.
Table 4-2
Operating Range
Parameter
Symbol
#
1
2
3
4
Supply voltage
Ambient temperature
Receive frequency
Transmit frequency
Data Sheet
VS
TA
fRX
fTX
Limit Values
min
max
2.1
5.5
-40
85
910
920
910
920
72
Unit Test Conditions L
Item
V
°C
MHz
MHz
2007-02-26
TDA5252 G2
Version 1.1
Reference
4.1.3
AC/DC Characteristics
AC/DC characteristics involve the spread of values guaranteed within the specified voltage and
ambient temperature range. Typical characteristics are the median of the production. The device
performance paramter marked with x are not part of the production test, but were either verified by
design or measured in an Infineon Evalboard as described in Section 4-2.
Table 4-3
AC/DC Characteristics with TA = 25 °C, VVCC = 2.1 ... 5.5 V
#
Parameter
Symbol
Limit Values
Unit
Test Conditions
min typ max
L Item
RECEIVER Characteristics
1 Supply current RX FSK
2 Supply current RX FSK
IRX_FSK
IRX_FSK
9.0
9.5
3 Supply current RX ASK IRX_ASK
4 Supply current RX ASK IRX_ASK
RFsens
5
Sensitivity FSK
10-3 BER
8.6
9.1
-109
RFsens
-109
6
Sensitivity ASK
10-3 BER
7 Power down current IPWDN_RX
8 System setup time (1st tSYSSU
power on or reset)
9 Clock Out setup time tCLKSU
4
5
8
3V, FSK, Default
5V, FSK, Default
mA
3V, ASK, Default
mA
5V, ASK, Default
dBm FSK@30kHz, 4kBit/s X
Manch. Data, Default
7kHz datafilter, 50kHz
IQ filter
dBm ASK, 4kBit/s Manch. X
data, Default setup 7kHz
datafilter,
50kHz IQ filter
12
nA
ms
5.5V, all power down
10
Receiver setup time
tRXSU
1.54
2.2
11
tDDSU
1.82
2.6
12
Data detection setup
time
RSSI stable time
stable CLKDIV output
signal
2.86 ms
DATA out (valid or
invalid)
3.38 ms Begin of Data detection
tRSSI
1.82
2.6
3.38 ms
13
Data Valid time
tData_Valid
3.35
ms
14
15
16
Input P1dB, high gain
Input P1dB, low gain
P1dB
P1dB_low
VBL_1MHz
-48dBm
-32dBm
50
17
LO Leakage
PLO
-90
Selectivity
Data Sheet
0.5
mA
mA
73
ms
RFin -100dBm
see chapter 4.5
4kBit/s Manch.
detected (valid)
dBm 3V, Default, high gain
dBm 3V, Default, low gain
dB fRF+/-1MHz, Default,
RFsens+3dB
dB
1220MHz
X
X
X
2007-02-26
TDA5252 G2
Version 1.1
Reference
Table 4-3
AC/DC Characteristics with TA = 25 °C, VVCC = 2.1 ... 5.5 V
#
Parameter
Symbol
Limit Values
Unit
Test Conditions
min typ max
L Item
TRANSMITTER Characteristics
1 Supply current TX, FSK
2 Supply current TX, FSK
3 Supply current TX, FSK
ITX
ITX
ITX
9.5
12.5
15
mA
mA
mA
2.1V, high power
3V, high power
5V, high power
4
5
6
Pout
Pout
Pout
+6
+9
+13
dBm
dBm
dBm
2.1V, high power
3V, high power
5V, high power
ITX
ITX
ITX
4,1
4.9
6.8
mA
mA
mA
2.1V, low power
3V, low power
5V, low power
Output power
Output power
Output power
7 Supply current TX, FSK
8 Supply current TX, FSK
9 Supply current TX, FSK
1
1
1
X
X
X
1
1
1
10
11
12
Output power
Output power
Output power
Pout_low
Pout_low
Pout_low
-30
-22
-3
dBm
dBm
dBm
2.1V, low power
3V, low power
5V, low power
X
X
X
13
Power down current
IPWDN_TX
5
nA
5.5V, all power down
14 Clock Out setup time
tCLKSU
0.5
ms
15 Transmitter setup time
tTXSU
16 Spurious fRF+/-fXTAL
17 Spurious 2nd harmonic
18 Spurious 3rd harmonic
P1st
P2nd
P3rd
stable CLKDIV output
signal
0.77 1.1 1.43 ms
PWDN-->PON or
RX-->TX
-72/-69
dBm
3V, 50Ohm Board
-45
dBm
3V, 50Ohm Board
-49
dBm
3V, 50Ohm Board
X
X
X
X
1: without pin diode current (RX/TX-switch)
[email protected]; 310uA@3V; 720uA@5V
Data Sheet
74
2007-02-26
TDA5252 G2
Version 1.1
Reference
Table 4-4
AC/DC Characteristics with TA = 25 °C, VVCC = 2.1 ... 5.5 V
Parameter
Symbol
Limit Values Unit
Test Conditions
#
min typ max
L Item
GENERAL Characteristics
1
Power down current
IPWDN_32k
timer mode (standby)
2
Power down current
IPWDN_32k
timer mode (standby)
3 Power down current with IPWDN_Xtl
XTAL ON
4 Power down current with IPWDN_Xtl
XTAL ON
uA
3V, 32kHz clock on
11
uA
5V, 32kHz clock on
750
uA
3V, CONFIG9=1
860
uA
5V, CONFIG9=1
5
32kHz oscillator freq.
f32kHz
6
XTAL startup time
tXTAL
0.5
Load capacitance
Serial resistance of the
crystal
9 Input inductance XOUT
10 Input inductance XOUT
CC0max
RRmax
5
LOSC
LOSC
2.75
2.5
uH with pad on evaluation board X
uH without pad on evaluation X
11 FSK demodulator gain
GFSK
2.4
mV/
kHz
0.35
0.55
1
1.2
14
V
V
V
V
mV/
dB
default setup
default setup
default setup
default setup
default setup
X
X
X
X
X
115 150 185 kHz
5.3 7
8.7 kHz
Default setup
Default setup
X
X
7
8
12
13
14
15
16
RSSI@-120dBm
RSSI@-100dBm
RSSI@-70dBm
RSSI@-50dBm
RSSI Gradient
U-120dBm
U-100dBm
U-70dBm
U-50dBm
GRSSI
17
18
IQ-Filter bandwidth
Data Filter bandwidth
f3dB_IQ
f3dB_LP
19
20
Vcc-Vtune RX, Pin3
Vcc-Vtune TX, Pin3
24
9
32
40
ms IFX Board with Crystal Q1 as X
specified in Section 4.4
100
Vcc-tune,RX 0.5
Vcc-tune,TX 0.5
1
1.1
kHz
pF
Ω
X
X
board
1.6
1.6
V
V
fRef=19.0625MHz
fRef=19.0625MHz
„X“ Not part of the production test - either verified by design or measured in an Infineon Evalboard as described
in Section 4-2.
Data Sheet
75
2007-02-26
TDA5252 G2
Version 1.1
Reference
4.1.4
Digital Characteristics
I2C Bus Timing
BusMode = LOW
t BUF
BusData
tH D.ST A
tR
tF
tL OW
tH D.ST A
BusCLK
t HD. DAT
t H IG H
tSU .DAT
t SU. STA
t SP
t SU.S TO
t HIG H
EN
pulsed or
mandatory low
t SU. ENAS DA
tSU. ENA SDA
t SU. ENAS DA
Figure 4-1
I2C Bus Timing
3-wire Bus Timing
BUS_MODE = HIGH
SDA
tSP
tLOW t
R
SCL
tSU.STA
tF
tHD.DA
T
tHIGH
tSU.DAT
tSU.STO
BUS_ENA
tWHEN
Figure 4-2
Data Sheet
3-wire Bus Timing
76
2007-02-26
TDA5252 G2
Version 1.1
Reference
Table 4-5
#
1
2
3
4
5
Digital Characteristics with TA = 25 °C, VVdd = 2.1 ... 5.5 V
Parameter
Symbol Limit Values
Unit
Test Conditions
min typ max
Data rate TX ASK
fTX.ASK
10
25 kBaud
PRBS9,
Manch.@+9dBm
Data rate TX ASK
fTX.ASK
10
64 kBaud
PRBS9,
Manch.@-5dBm
Data rate TX FSK
fTX.FSK
10
40 kBaud
PRBS9,
Manch.@+9dBm
@30kHz dev.
Data rate RX ASK
fRX.ASK
10
64 kBaud
PRBS9, Manch.
Data rate RX FSK
fRX.FSK
10
64 kBaud
PRBS9, Manch.
@30kHz dev.
6
Digital Inputs
High-level Input Voltage
Low-level Input Voltage
7
RXTX Pin 5
TX operation, int. controlled
8
CLKDIV Pin 26
trise (0.1*Vdd to 0.9*Vdd)
tfall (0.9*Vdd to 0.1*Vdd)
Output High Voltage
Output Low Voltage
VIH
VIL
Vdd0.2
0
Vdd
0.2
0.4
1.15
V
V
tr
tf
35
30
Vdd0.4
0.4
ns
ns
V
V
VOH
VOL
X
1
X
1
X
1
X
X
X
V
V
VOL
L Item
@Vdd=3V
Isink=800uA
Isink=3mA
@Vdd=3V
load 10pF
load 10pF
Isource=350uA
Isink=400uA
X
X
Bus Interface Characteristics
9 Pulse width of spikes which
tSP
must be suppressed by the
input filter
10 LOW level output voltage at
VOL
BusData
11
SLC clock frequency
fSLC
12 Bus free time between STOP tBUF
and START condition
13 Hold time (repeated) START tHO.STA
condition.
Data Sheet
0
0
1.3
0.6
50
ns
Vdd=5V
X
0.4
V
X
400
kHz
µs
3mA sink current
Vdd=5V
Vdd=5V
only I2C mode
Vdd=5V
After this period, the
first clock pulse is
generated, only I2C
µs
77
X
X
X
2007-02-26
TDA5252 G2
Version 1.1
Reference
Table 4-5
#
Digital Characteristics with TA = 25 °C, VVdd = 2.1 ... 5.5 V
Parameter
Symbol Limit Values
Unit
Test Conditions
min typ max
14 LOW period of BusCLK clock tLOW
1.3
µs
Vdd=5V
15 HIGH period of BusCLK
tHIGH
0.6
µs
Vdd=5V
clock
16 Setup time for a repeated tSU.STA 0.6
µs
only I2C mode
START condition
17
Data hold time
tHD.DAT
0
ns
Vdd=5V
18
Data setup time
tSU.DAT 100
ns
Vdd=5V
tR, tF
19
Rise, fall time of both
20+
300 ns
Vdd=5V
BusData and BusCLK
0.1Cb
signals
20
Setup time for STOP
tSU.STO 0.6
µs
only I2C mode
condition
Vdd=5V
21 Capacitive load for each bus
Cb
400 pF
Vdd=5V
line
22 Setup time for BusCLK to EN tSU.SCLE 0.6
µs
only 3-wire mode
Vdd=5V
N
23
H-pulsewidth (EN)
tWHEN
0.6
µs
Vdd=5V
L Item
X
X
X
X
X
X
2
X
X
X
X
X: Not part of the production test - either verified by design or measured in an Infineon Evalboard as described in
Section 4-2.
1: limited by transmission channel bandwidth and depending on transmit power level; ETSI regulation EN 300 220
fullfilled.
2: Cb= capacitance of one bus line
Data Sheet
78
2007-02-26
TDA5252 G2
Version 1.1
Reference
4.2
Test Circuit
The device performance parameters marked with X in Section 4.1.3 were either verified by design
or measured on an Infineon evaluation board (IFX board).
TDA5250_v42.schematic.pdf
Figure 4-3
Data Sheet
Schematic of the Evaluation Board
79
2007-02-26
TDA5252 G2
Version 1.1
Reference
4.3
Test Board Layout
Gerberfiles for this Testboard are available on request.
TDA5250_v42_layout.pdf
Figure 4-4
Layout of the Evaluation Board
Note 1: The LNA and PA matching network was designed for minimum required space and
maximum performance and thus via holes were deliberately placed into solder pads.
In case of reproduction please bear in mind that this may not be suitable for all automatic soldering
processes.
Note 2: Please keep in mind not to layout the CLKDIV line directly in the neighborhood of the crystal
and the associated components.
Note 3: The opto part (X4) should be supplied by connecting to X3.
Data Sheet
80
2007-02-26
TDA5252 G2
Version 1.1
Reference
4.4
Bill of Materials
Table 4-6
Bill of Materials
Reference
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
R20
R21
R22
R23
R24
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
Data Sheet
Value
4k7
10R
--1M
4k7
4k7
4k7
6k8
180
180
270
15k
10k
180
180
1M
1M
1M
560
1k
10
0
10
180
22p
1p
4p7
1p8
1nF
1nF
6p8
--18p
22pF
--10nF
10nF
Specification
0603
0603
--0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
--0603
0603
--0603
0603
81
Tolerance
+/-5%
+/-5%
--+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-0,1pF
+/-0.1pF
+/-0,1pF
+/-5%
+/-5%
+/-0,1pF
--+/-1%
+/-5%
--+/-10%
+/-10%
2007-02-26
TDA5252 G2
Version 1.1
Reference
Table 4-6
Bill of Materials
Reference
Value
C14
10nF
C15
8.2pF
C16
6.8pF
22pF
C17
C18
10nF
C19
2,2nF
C20
47nF
C21
47nF
C22
47nF
47nF
C23
C24
100nF
C25
100nF
C26
--C27
100nF
C28
100nF
100nF
C29
C30
--L1
68n
L2
12n
L3
8.2n
IC1
IC2
IC3
Q1
TDA5252
ILQ74
SFH6186
19.0625MHz
S1
T1
D1, D2
X1, X2
X5
1-pol.
BC847B
BAR63-02W
SMA-socket
SubD 25p.
Data Sheet
Specification
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
--0603
0603
0603
0603
SIMID 0603-C
(EPCOS)
SIMID 0603-C
(EPCOS)
SIMID 0603-C
(EPCOS)
PTSSOP38
Tolerance
+/-10%
+/-1%
+/-0,1pF
+/-1%
+/-10%
+/-10%
+/-10%
+/-10%
+/-10%
+/-10%
+/-10%
+/-10%
--+/-10%
+/-10%
+/-10%
+/-10%
+/-2%
Hz HDG0647
CL= 20pF
Spec.No. 1054-003
Freq. Tolerance +/- 10ppm
Temp. Tolerance +/- 20ppm
+/-2%
+/-2%
SOT-23 (Infineon)
SCD-80 (Infineon)
82
2007-02-26
TDA5252 G2
Version 1.1
List of Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Table 2-6
Table 2-7
Table 2-8
Table 2-9
Table 2-10
Table 2-11
Table 2-12
Table 2-13
Table 2-14
Table 2-15
Table 2-16
Table 2-17
Table 2-18
Table 2-19
Table 2-20
Table 2-21
Table 2-22
Table 2-23
Table 2-24
Table 2-25
Table 2-26
Table 2-27
Table 2-28
Table 2-29
Table 2-30
Table 2-31
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Table 3-8
Table 3-9
Table 3-10
Table 3-11
Table 3-12
Data Sheet
Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PwdDD Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Interface Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip address Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Bus Write Mode 8 Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Bus Write Mode 16 Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Bus Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-wire Bus Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-wire Bus Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Addresses of Data Registers Write. . . . . . . . . . . . . . . . . . . . . .
Sub Addresses of Data Registers Read. . . . . . . . . . . . . . . . . . . . . .
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 01H: FSK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 02H: XTAL_TUNING . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 03H: LPF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Addresses 04H / 05H: ON/OFF_TIME . . . . . . . . . . . . . . . . . . .
Sub Address 06H: COUNT_TH1 . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 07H: COUNT_TH2 . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 08H: RSSI_TH3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 0DH: CLK_DIV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 0EH: XTAL_CONFIG . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 0FH: BLOCK_PD . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 80H: STATUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 81H: ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MODE settings: CONFIG register . . . . . . . . . . . . . . . . . . . . . . . . . .
CLK_DIV Output Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CLK_DIV Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Source for 6Bit-ADC Selection (Register 08H). . . . . . . . . . . . . . . . .
Crystal and crystal oscilator dependency . . . . . . . . . . . . . . . . . . . . .
Typical values of parasitic capacitances . . . . . . . . . . . . . . . . . . . . . .
Sub Address 0EH: XTAL_CONFIG. . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 02H: XTAL_TUNING . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 01H: FSK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Default oscillator settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Default Setup (without internal tuning & without Pin21 usage) . . . . .
3dB cutoff frequencies I/Q Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3dB cutoff frequencies Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiter Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
83
page 11
page 18
page 18
page 21
page 22
page 23
page 25
page 25
page 25
page 25
page 26
page 26
page 27
page 27
page 27
page 28
page 28
page 28
page 28
page 28
page 28
page 29
page 29
page 29
page 29
page 29
page 29
page 30
page 35
page 35
page 35
page 48
page 53
page 54
page 55
page 55
page 55
page 56
page 56
page 57
page 58
page 59
page 61
2007-02-26
TDA5252 G2
Version 1.1
List of Tables
Table 3-13
Table 3-14
Table 4-1
Table 4-2
Table 4-3
Table 4-4
Table 4-5
Table 4-6
Data Sheet
Sub Address 00H: CONFIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Default Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC/DC Characteristics with TA = 25 °C, VVCC = 2.1 ... 5.5 V . . . . .
AC/DC Characteristics with TA = 25 °C, VVCC = 2.1 ... 5.5 V . . . . .
Digital Characteristics with TA = 25 °C, VVdd = 2.1 ... 5.5 V . . . . . .
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
84
page 62
page 71
page 72
page 72
page 73
page 75
page 77
page 81
2007-02-26
TDA5252 G2
Version 1.1
List of Figures
Figure 1-1
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
Figure 2-8
Figure 2-9
Figure 2-10
Figure 2-11
Figure 2-12
Figure 2-13
Figure 2-14
Figure 2-15
Figure 2-16
Figure 2-17
Figure 2-18
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 3-8
Figure 3-9
Figure 3-10
Figure 3-11
Figure 3-12
Figure 3-13
Figure 3-14
Figure 3-15
Figure 3-16
Figure 3-17
Figure 3-18
Figure 3-19
Figure 3-20
Figure 3-21
Figure 3-22
Figure 3-23
Figure 3-24
Data Sheet
PG-TSSOP-38 package outlines. . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Main Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
One I/Q Filter stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Typical Quadricorrelator Demodulation Characteristic . . . . . . . . . . . page
Data Filter architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Timing and Data Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Sub Addresses Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Wakeup Logic States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Timing for Self Polling Mode (ADC & Data Detect in one shot mode) page
Timing for Timer Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Frequency and RSSI Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Data Valid Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Data Input/Output Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
1st start or reset in active mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
1st start or reset in PD mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Sequencer‘s capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Clock Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
RX/TX Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
RX-Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
S11 measured . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
TX_Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
TX_Mode_simplified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Equivalent power amplifier tank circuit . . . . . . . . . . . . . . . . . . . . . . . page
Output power Po (mW) and collector efficiency E vs. load resistor RL. page
PA-out & I-collector vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Transmit Spectrum 13.2GHz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Transmit Spectrum 300MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
possible crystal oscillator frequencies . . . . . . . . . . . . . . . . . . . . . . . . page
FSK modulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
FSK receive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
parasitics of the switching network . . . . . . . . . . . . . . . . . . . . . . . . . . page
I/Q Filter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
IQ Filter and frequency characteristics of the receive system. . . . . . page
Limiter and Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Limiter frequency characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Typ. RSSI Level (Eval Board) @3V . . . . . . . . . . . . . . . . . . . . . . . . . page
Slicer Level using RC Integrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Slicer Level using Peak Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . page
Peak Detector timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . page
85
9
10
17
19
20
21
22
23
26
30
30
31
31
32
32
33
33
34
34
37
38
39
41
41
42
43
44
45
46
46
48
49
51
51
52
57
58
59
60
60
61
62
63
2007-02-26
TDA5252 G2
Version 1.1
List of Figures
Figure 3-25
Figure 3-26
Figure 3-27
Figure 3-28
Figure 3-29
Figure 3-30
Figure 3-31
Figure 3-32
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Data Sheet
Peak Detector as analog Buffer (v=1) . . . . . . . . . . . . . . . . . . . . . . . .
Peak detector - power down mode . . . . . . . . . . . . . . . . . . . . . . . . . .
Power down mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency Detection timing in continuous mode . . . . . . . . . . . . . . .
Frequency Detection timing in Single Shot mode . . . . . . . . . . . . . . .
Window Counter timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Example for transmitted Data-structure. . . . . . . . . . . . . . . . . . . . . . .
3 possible timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-wire Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Schematic of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . .
Layout of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
86
page
page
page
page
page
page
page
page
page
page
page
page
64
64
65
65
66
67
69
70
76
76
79
80
2007-02-26