Omnidirectional Microphone with Bottom Port and Analog Output ADMP404 Data Sheet FUNCTIONAL BLOCK DIAGRAM Smartphones and feature phones Teleconferencing systems Digital video cameras Bluetooth headsets Video phones Tablets GENERAL DESCRIPTION ADMP404 OUTPUT POWER VDD GND Figure 1. LE APPLICATIONS OUTPUT AMPLIFIER TE Tiny 3.35 mm × 2.50 mm × 0.88 mm surface-mount package High SNR of 62 dBA High sensitivity of −38 dBV Flat frequency response from 100 Hz to 15 kHz Low current consumption: <250 µA Single-ended analog output High PSR of 70 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant 08616-001 FEATURES The ADMP404 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The ADMP404 is available in an ultraminiature 3.35 mm × 2.50 mm × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP404 is halide free. O B SO The ADMP4041 is a high quality, high performance, low power, analog output bottom-ported omnidirectional MEMS microphone. The ADMP404 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP404 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP404 has a high signal-to-noise ratio (SNR) and flat, wideband frequency response, resulting in natural sound with high intelligibility. Its low current consumption enables long battery life for portable applications. 1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved. ADMP404 Data Sheet TABLE OF CONTENTS Connecting to Analog Devices Audio Codecs ..........................7 Applications ....................................................................................... 1 Supporting Documents ................................................................7 Functional Block Diagram .............................................................. 1 PCB Land Pattern Layout .................................................................8 General Description ......................................................................... 1 Handling Instructions .......................................................................9 Revision History ............................................................................... 2 Pick and Place Equipment............................................................9 Specifications..................................................................................... 3 Reflow Solder .................................................................................9 Absolute Maximum Ratings ............................................................ 4 Board Wash ....................................................................................9 ESD Caution .................................................................................. 4 Reliability Specifications ................................................................ 10 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 11 Typical Performance Characteristics ............................................. 6 Ordering Guide .......................................................................... 11 TE Features .............................................................................................. 1 Applications Information ................................................................ 7 REVISION HISTORY 8/11—Rev. A to Rev. B Changes to Figure 1 ...........................................................................1 Changes to Supply Voltage Parameter, Table 1 ..............................3 Changes to Table 3.............................................................................4 Added Connecting to Analog Devices, Inc., Audio Codecs Section and Supporting Documents Section .................................7 Changes to Pick and Place Equipment Section (20 kg to 10 kg) ................................................................... 9 Added LGA_CAV Tape and Reel Outline Dimensions, Figure 12..........................................................................................11 B SO LE 7/12—Rev. B to Rev. C Changes to Features Section, General Description Section, Figure 1, and Page 1 Layout............................................................. 1 Add Note 1......................................................................................... 1 Changes to Powers Supply Rejection Parameter, Table 1 ............ 3 Changes to Temperature Range Parameter, Table 2..................... 4 Changes to Figure 5 .......................................................................... 6 Changes to Connecting to Analog Devices Audio Codecs Section, Figure 8, and Application Notes Section ........................ 7 Added Circuit Notes Section........................................................... 7 Changes to Temperature Humidity Bias (THB) Description Column, Table 5 and Temperature Cycle Column, Table 5 ...... 10 Changes to Ordering Guide .......................................................... 11 Deleted Figure 12 ............................................................................ 11 12/10—Rev. 0 to Rev. A Changes to Applications Section and General Description Section ...........................................................................1 Changes to Table 1.............................................................................3 Changes to Table 2.............................................................................4 O 7/10—Revision 0: Initial Version Rev. C | Page 2 of 12 Data Sheet ADMP404 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Symbol Total Harmonic Distortion Power Supply Rejection Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit THD PSR Min 1 kHz, 94 dB SPL −41 SNR EIN ZOUT Typ Omni −38 62 32 88 100 15 −3/+2 TE B SO See Figure 4 and Figure 6. LE VDD IS Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point Deviation limits from flat response within pass band 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak O 1 Test Conditions/Comments Rev. C | Page 3 of 12 Max Unit −35 dBV dBA dBA SPL dB Hz kHz dB % dB dB SPL 3 70 120 1.5 200 0.8 90 3.3 250 V µA Ω V µA ADMP404 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C CRITICAL ZONE TL TO TP LE tP TP TE ESD CAUTION TSMAX TSMIN tL tS RAMP-DOWN B SO PREHEAT t25°C TO PEAK TIME 08616-002 TEMPERATURE RAMP-UP TL Figure 2. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits O Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C (t25°C) to Peak Temperature Sn63/Pb37 125°C/sec maximum Pb-Free 125°C/sec maximum 100°C 150°C 60 sec to 75 sec 125°C/sec 45 sec to 75 sec 183°C 215°C +3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 minute maximum 100°C 200°C 60 sec to 75 sec 125°C/sec ~50 sec 217°C 245°C 0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 minute maximum Rev. C | Page 4 of 12 Data Sheet ADMP404 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 1 2 OUTPUT 3 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale 08616-003 ADMP404 VDD TE Figure 3. Pin Configuration Table 4. Pin Function Descriptions Mnemonic OUTPUT GND VDD Description Analog Output Signal Ground Power Supply O B SO LE Pin No. 1 2 3 Rev. C | Page 5 of 12 ADMP404 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 10 10 8 4 0 2 (dB) 0 –2 –10 –4 TE –6 –8 100 1k –20 100 08616-009 –10 10k FREQUENCY (Hz) Figure 4. Frequency Response Mask –10 –20 –60 –70 –80 100 1k 10k FREQUENCY (Hz) 08616-005 –50 B SO –40 Figure 5. Typical Power Supply Rejection Ratio vs. Frequency O PSR (dB) –30 10k Figure 6. Typical Frequency Response (Measured) LE 0 1k FREQUENCY (Hz) Rev. C | Page 6 of 12 08616-010 SENSITIVITY (dB) 6 Data Sheet ADMP404 APPLICATIONS INFORMATION CONNECTING TO ANALOG DEVICES AUDIO CODECS SUPPORTING DOCUMENTS The ADMP404 output can be connected to a dedicated codec microphone input (see Figure 7) or to a high input impedance gain stage (see Figure 8). A 0.1 µF ceramic capacitor placed close to the ADMP404 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at UG-142, EVAL-ADMP404Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board Evaluation Board User Guide where R is the input impedance of the codec. AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming Circuit Notes CN-0207, High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec LE A minimum value of 2.2 µF is recommended in Figure 7 because the input impedance of the ADAU1361/ADAU1761 can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 8 shows the ADMP404 connected to the ADA4897-1 op amp configured as a noninverting preamplifier. AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones TE fC = 1/(2π × C × R) Application Notes CN-0262, Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating MICBIAS 0.1µF VDD B SO 2.2µF MINIMUM ADAU1761 OR ADAU1361 LINN OUTPUT LINP GND CM 08616-020 ADMP404 Figure 7. ADMP404 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec GAIN = (R1 + R2)/R1 0.1µF R1 VREF R2 VDD ADMP404 1µF MINIMUM VOUT 10kΩ O GND ADA4897-1 VREF 08616-021 OUTPUT Figure 8. ADMP404 Connected to the ADA4897-1 Op Amp Rev. C | Page 7 of 12 ADMP404 Data Sheet PCB LAND PATTERN LAYOUT paste stencil pattern layout is shown in Figure 10. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP404 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 9. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder 1.52 0.68 1.22 TE 0.61 Ø1.55 1.90 Ø0.95 0.90 Figure 9. PCB Land Pattern Layout 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) 2× B SO 0.8 × 0.6 0.2 × 45 TYP 1.52mm 08616-008 1.22 O Figure 10. Suggested Solder Paste Stencil Pattern Layout Rev. C | Page 8 of 12 08616-007 LE 0.61 Data Sheet ADMP404 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 3. • • BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. O B SO LE • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. TE • Rev. C | Page 9 of 12 ADMP404 Data Sheet RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value. Table 5. TE Description −40°C, 500 hours, powered +125°C, 500 hours, powered +85°C/85% relative humidity (RH), 500 hours, powered −40°C/+125°C, one cycle per hour, 1000 cycles +150°C, 500 hours −40°C, 500 hours All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV O B SO LE Stress Test Low Temperature Operating Life High Temperature Operating Life Temperature Humidity Bias (THB) Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Rev. C | Page 10 of 12 Data Sheet ADMP404 OUTLINE DIMENSIONS 3.425 3.350 3.275 0.75 REF REFERENCE CORNER 3.06 REF PIN 1 1.08 1.52 0.30 BSC 0.30 BSC 0.90 × 0.68 (PINS 1, 3) 1.56 DIA. 1 2.575 2.500 2.425 2.21 REF 0.25 NOM DIA. 0.20 MIN THRU HOLE (SOUND PORT) 0.95 DIA. 0.54 REF 2 1.22 BSC 1.25 3 0.65 REF SIDE VIEW 0.21 REF BOTTOM VIEW 06-16-2010-A 0.98 0.88 0.78 0.64 REF 0.20 TYP × 45° TE TOP VIEW ORDERING GUIDE 1 Package Description 3-Terminal LGA_CAV, 13” Tape and Reel 3-Terminal LGA_CAV, 7” Tape and Reel Evaluation Board Z = RoHS Compliant Part. This package option is halide free. O 2 Temperature Range −40°C to +85°C −40°C to +85°C B SO Model 1 ADMP404ACEZ-RL ADMP404ACEZ-RL7 EVAL-ADMP404Z-FLEX LE Figure 11. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm × 2.50 mm Body (CE-3-2) Dimensions shown in millimeters Rev. C | Page 11 of 12 Package Option 2 CE-3-2 CE-3-2 Ordering Quantity 10,000 1,000 ADMP404 Data Sheet O B SO LE TE NOTES ©2010–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08616-0-7/12(C) Rev. C | Page 12 of 12