INFINEON BSS223PW_06

BSS 223PW
OptiMOS-P Small-Signal-Transistor
Feature
Product Summary
• P-Channel
VDS
-20
V
• Enhancement mode
RDS(on)
1.2
Ω
• Super Logic Level (2.5 V rated)
ID
-0.39
A
• 150°C operating temperature
PG-SOT-323
3
• Avalanche rated
• dv/dt rated
2
1
VSO05561
Drain
pin 3
Gate
pin1
Marking
Type
Package
Tape and Reel
BSS 223PW
PG-SOT-323
L6327:3000pcs/r. X4s
Source
pin 2
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
A
TA=25°C
-0.39
TA=70°C
-0.31
Pulsed drain current
ID puls
Unit
-1.56
TA=25°C
EAS
1.4
mJ
dv/dt
-6
kV/µs
Gate source voltage
VGS
±12
V
Power dissipation
Ptot
0.25
W
-55... +150
°C
Avalanche energy, single pulse
ID =-0.39 A , VDD =-10V, RGS =25Ω
Reverse diode dv/dt
IS =-0.39A, VDS =-16V, di/dt=200A/µs, Tjmax =150°C
TA=25°C
Operating and storage temperature
Tj , Tstg
IEC climatic category; DIN IEC 68-1
Rev 1.3
55/150/56
Page 1
2006-12-04
BSS 223PW
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - soldering point
RthJS
-
-
180
Thermal resistance, junction - ambient, leaded
RthJA
-
-
500
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
-20
-
-
VGS(th)
-0.6
-0.9
-1.2
Static Characteristics
Drain-source breakdown voltage
V
VGS =0, ID=-250µA
Gate threshold voltage, VGS = VDS
ID =-1.5µA
Zero gate voltage drain current
µA
IDSS
VDS =-20V, VGS =0, Tj =25°C
-
-0.1
-1
VDS =-20V, VGS =0, Tj =150°C
-
-10
-100
IGSS
-
-10
-100
nA
RDS(on)
-
1.27
2.1
Ω
RDS(on)
-
0.7
1.2
Gate-source leakage current
VGS =-12V, VDS =0
Drain-source on-state resistance
VGS =-2.5V, ID =-0.29A
Drain-source on-state resistance
VGS =-4.5, ID =-0.39A
Rev 1.3
Page 2
2006-12-04
BSS 223PW
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
0.35
0.7
-
S
pF
Dynamic Characteristics
Transconductance
gfs
çVDS ç≥2*çIDç*RDS(on)max
ID =-0.31A
Input capacitance
Ciss
VGS =0, VDS =-15V,
-
45
56
Output capacitance
Coss
f=1MHz
-
21
26
Reverse transfer capacitance
Crss
-
17
22
Turn-on delay time
td(on)
VDD =-10V, VGS =-4.5V,
-
3.8
5.7
Rise time
tr
ID =-0.39A, RG=6Ω
-
5
7.5
Turn-off delay time
td(off)
-
5.1
7.6
Fall time
tf
-
3.2
4.8
-
-0.04
-
-0.4
-0.5
-
-0.5
-0.62
V(plateau) VDD =-10V, ID =-0.39A
-
-2.2
-2.7
IS
-
-
-0.39 A
-
-
-1.56
-1.33 V
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =-10V, ID =-0.39A
VDD =-10V, ID =-0.39A,
-0.05 nC
VGS =0 to -4.5V
Gate plateau voltage
V
Reverse Diode
Inverse diode continuous
TA=25°C
forward current
Inv. diode direct current, pulsed ISM
Inverse diode forward voltage
VSD
VGS =0, IF=-0.39
-
-1
Reverse recovery time
trr
VR =-10V, |IF | = |lD |,
-
7.6
9.5
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
1.1
1.4
nC
Rev 1.3
Page 3
2006-12-04
BSS 223PW
1 Power dissipation
2 Drain current
Ptot = f (TA )
ID = f (TA )
parameter: |VGS |≥ 4.5 V
BSS 223PW
-0.42
0.28
W
A
0.24
-0.36
0.22
-0.32
BSS 223PW
-0.28
0.18
ID
Ptot
0.2
-0.24
0.16
0.14
-0.2
0.12
-0.16
0.1
-0.12
0.08
0.06
-0.08
0.04
-0.04
0.02
0
0
20
40
60
80
100
120
°C
0
0
160
20
40
60
80
100
120
TA
160
TA
3 Safe operating area
4 Transient thermal impedance
ID = f ( VDS )
ZthJA = f (tp )
parameter : D = 0 , TA = 25 °C
parameter : D = tp /T
-10
°C
1 BSS 223PW
10 3
BSS 223PW
K/W
A
10 2
10 1
R
DS
(
on
)
=
ID
V
DS
-10 0
Z thJA
/I
D
tp = 180.0µs
10 0
1 ms
D = 0.50
0.20
-10
-1
10
-1
0.10
0.05
10 ms
0.02
10 -2
-10 -2 -1
-10
-10
0
DC
1
-10
V
-10
2
VDS
Rev 1.3
10 -3 -7
10
0.01
single pulse
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
Page 4
2006-12-04
BSS 223PW
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS )
RDS(on) = f (ID )
parameter: Tj =25°C
parameter: VGS
0.7
4
3V
4V
A
4.5V
6V
7V
8V
0.5
10V
RDS(on)
Ω
-I D
2.5V
3
2.5
0.4
2
2.2V
2.5V
3V
4V
4.5V
6V
7V
8V
10V
2.2V
0.3
1.5
0.2
1
0.1
0
0
0.5
0.3
0.6
V
0.9
0
0
1.5
0.1
0.2
0.3
0.4
0.5
A
-VDS
0.7
-ID
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); |VDS |≥ 2 x |ID| x RDS(on)max
gfs = f(ID)
parameter: Tj = 25 °C
parameter: Tj = 25 °C
0.7
1.1
S
A
0.9
0.8
g fs
-I D
0.5
0.4
0.7
0.6
0.5
0.3
0.4
0.2
0.3
0.2
0.1
0.1
0
0
0.5
1
1.5
2
V
3
-VGS
Rev 1.3
0
0
0.1
0.2
0.3
0.4
0.5
A
0.7
-ID
Page 5
2006-12-04
BSS 223PW
9 Drain-source on-resistance
10 Typ. gate threshold voltage
RDS(on) = f(Tj )
VGS(th) = f (Tj)
parameter: ID = -0.39 A, VGS = -4.5 V
parameter: VGS = VDS
1.6
1.6
V
98%
- VGS(th)
RDS(on)
Ω
1.2
1
98%
1.2
1
typ.
typ.
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
-60
-20
20
60
°C
100
2%
0
-60
160
-20
20
60
100
°C
160
Tj
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD )
parameter: VGS =0, f=1 MHz; Tj = 25 °C
parameter: Tj
10
2
-10 1
BSS 223PW
A
Ciss
C
IF
-10 0
pF
Coss
-10 -1
Tj = 25 °C typ
Tj = 150 °C typ
Crss
Tj = 25 °C (98%)
Tj = 150 °C (98%)
10 1
0
2
4
6
8
10
12
V
-10 -2
0
15
-VDS
Rev 1.3
-0.4
-0.8
-1.2
-1.6
-2
-2.4 V
-3
VSD
Page 6
2006-12-04
BSS 223PW
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj ), par.: ID = -0.39 A
VGS = f (QGate )
VDD = -10 V, RGS = 25 Ω
parameter: ID = -0.39 A pulsed; Tj = 25 °C
1.4
-16
BSS 223PW
V
mJ
-12
EAS
VGS
1
-10
0.8
-8
20%
0.6
-6
50%
80%
0.4
-4
0.2
-2
0
20
40
60
80
100
120
°C
0
0
160
Tj
0.2
0.4
0.6
0.8
1
nC
1.3
|QGate |
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
-24.5
BSS 223PW
V
V (BR)DSS
-23.5
-23
-22.5
-22
-21.5
-21
-20.5
-20
-19.5
-19
-18.5
-18
-60
-20
20
60
100
°C
180
Tj
Rev 1.3
Page 7
2006-12-04
BSS 223PW
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Rev 1.3
Page 8
2006-12-04