Freescale Semiconductor User’s Guide Document Number: KT09XS3400UG Rev. 2.0, 8/2012 KIT09XS3400EVBE Evaluation Board User Guide Featuring the MC09XS3400 Figure 1. KIT09XS3400EVBE Evaluation Board Table of Contents 1 Kit Contents / Packing List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 Important Notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Installing SPIGen Freeware on your Computer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 EVB Setup Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Using the EVB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Using Hardware and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Jumper Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 12 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 © Freescale Semiconductor, Inc., 2012. All rights reserved. Kit Contents / Packing List 1 Kit Contents / Packing List • • • Evaluation Board CD 09XS3400 Warranty Card KT09XS3400UG, Rev. 2.0 2 Freescale Semiconductor Important Notice 2 Important Notice Freescale provides the enclosed product(s) under the following conditions: This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This EVB may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This EVB is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact Freescale sales and technical support services. Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and will be replaced by a new kit. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typical”, must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale product could create a situation where personal injury or death may occur. Should the buyer purchase or use Freescale products for any such unintended or unauthorized application, the buyer shall indemnify and hold Freescale and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2012. KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 3 Introduction 3 Introduction This Evaluation Board demonstrates the capability of the MC09XS3400 as a 12 V quad high side switch product family, with integrated control and a high number of protective and diagnostic functions. The MC09XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low RDS(ON) MOSFETs (quad 9.0 mΩ) can control four separate 55 W / 28 W bulbs, and/or Xenon modules, and/or LEDs. Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Output slew rates are selectable to control electromagnetic emissions. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control if desired. The MC09XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has fail-safe mode to provide fail-safe functionality of the outputs in case of MCU damage. The four channels can be controlled individually by external/internal clock-signals or by direct inputs. Using the internal clock allows fully autonomous device operation. Programmable output voltage slew rates (individually programmable) helps improve EMC performance. To avoid shutting off the device upon inrush current, while still being able to closely track the load current, a dynamic over-current threshold profile is featured. Switching current of each channel can be sensed with a programmable sensing ratio. Whenever communication with the external microcontroller is lost, the device enters a fail-safe operation mode, but remains operational, controllable, and protected. 3.1 Evaluation Board Features This family of devices is designed for low-voltage automotive lighting applications. Its four low RDS(ON) MOSFETs can control: • • • • Four separate 55 W / 28 W bulbs Four separate Xenon modules Four separate LEDs Four separate Other type of loads In addition, this family of devices has the following features: • Programming, control, and diagnostics are accomplished using a 16-bit SPI interface • Its output with selectable slew-rate allows to satisfy electromagnetic compatibility (EMC) requirements • Each output can be controlled with an internal PWM modulated clock signal, instead of an external clock 3.2 Device Description/Features • Four protected high side switches • Operating voltage range of 6.0 to 20 V with sleep current < 5.0 μA, extended mode from 4.0 to 28 V • 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy chain capability • PWM module using external clock or calibratable internal oscillator with programmable outputs delay management • Smart over-current shutdown, severe short-circuit, over-temperature protections with time limited auto-retry, and fail-safe mode in case of MCU damage • Output OFF or ON open-load detection compliant to bulbs or LEDs and short-to-battery detection. Analog current feedback with selectable ratio and board temperature feedback KT09XS3400UG, Rev. 2.0 4 Freescale Semiconductor Introduction 3.3 Required Equipment Minimum required equipment: • • • • • Power DC supply 40 A/20 V Optional DC supply 1.0 A/ 5.0 V Typical load (lamps,...) USB enabled computer with Windows XP, Windows 2000, or Windows NT KITUSBSPIEVME KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 5 Installing SPIGen Freeware on your Computer 4 Installing SPIGen Freeware on your Computer There current version of SPIGen is designed to run on a USB enabled computer with Windows XP, Windows 2000, or Windows NT. This version of SPIGen includes a README.txt file which will describe the operating systems where the software should be installed. Before you install the program, refer to the SPIGen README.txt file to check the compatibility of the installation program and your computer operating system. To install the software from the CD-ROM, insert the CD-ROM into your CD drive. Click the Start button, and then click “Run…”. While running Windows NT, Windows 2000, or Windows XP, type “D:\SPIGen_Win_NT_2000_XP\Setup.exe” in the box, and then click “OK”. Several temporary files will be copied to your computer, and then the Installation Wizard will guide you through the rest of the process. To use SPIGen, Go to the Windows Start menu, then Programs, then SPIGen, and click on the SPIGen icon. The SPIGen “Generic SPI Generator” graphic user interface (GUI) will appear. Go to the File menu in the upper left hand corner of the GUI, and select Open, then browse the CD to find and select the SPIGen Configuration “.spi” file for the EVB you are using. Click Open, and SPIGen will open a specifically configured SPI command generator for your EVB. SPI word sent SPI word received Extra Pin configuration Predefined SPI commands Figure 2. SPIGen GUI KT09XS3400UG, Rev. 2.0 6 Freescale Semiconductor EVB Setup Configuration 5 EVB Setup Configuration Power Supply SPI Communication KITUSBSPIEVBE 25 Pin Parallel Connector PC via USB KIT09XS3400EVBE Figure 3. KIT09XS3400EVBE Setup Configuration Diagram KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 7 Using the EVB 6 Using the EVB Warning: Always wear Safety Glasses when working around electronic modules and when soldering. Remove the capacitor C4 when testing reverse supply on VPWR. 1. The EVB allows the customer to quickly evaluate features of the device with a simple bench top setup. All switch inputs may be evaluated using the onboard switch banks or actual system switches connected to the switch input edge connector. 2. Using a standard 25 pin Sub-D parallel port cable and the enclosed SPIGen SPI Driver software, you can use a personal computer to provide the serial peripheral interface (SPI) communication with this EVB (see SETUP_EVB). 3. Connect the power supply to the VPWR and GND terminals on the EVB. Make sure the voltages provided are in accordance with the device data sheet and that the supply currents are sufficient to supply the switch contact wetting current. For the SPI communication is needed +5.0 V. This voltage can be provided from PC via parallel cable (JP9 must be inserted) or through external power supply via connector VDD. Without +5.0 V, the device will be in Fail-safe mode. 4. Connect desired external load between one of the output (OUT0 - OUT3) and power supply ground. 5. For direct control of the outputs, apply +5.0 V on connectors IN0 - IN3. The corresponding high side output turns-on. Each IN input wakes the device. 6. To prepare the evaluation board for SPIGen, place jumpers JP9 and JP10 in the 1-2 position. 7. To use SPIGen, Go to the Windows Start menu, then Programs, then SPIGen, and click on the SPIGen icon. The SPIGen “Generic SPI Generator” GUI will appear. Go to the File menu in the upper left hand corner of the GUI, and select Open, then browse the CD to find and select the Device_EVB_CONFIGURATION_FILE.spi. file for the Kit. Click Open, and SPIGen will open a specifically configured SPI command generator for the Kit. The configuration file will set all parameters for SPI signals from the PC and provide a list of commands that may be sent to the EVB. 8. To set up the device to read switch inputs the user may use the batch commands from the “Send a Batch of Commands” tab. In the “Send a Batch of Commands” window, the Full Initialize batch will appear. To send the batch of commands to the EVB, click the Send Once tab. To quickly evaluate the EVB and device, simply click on the “Send one Command at a Time” tab, select the switch status command from the Quick Commands list, and click the Send Continuous tab. The opening and closing of switches may now be seen on the Word Received bits window field. Refer to the device data sheet for detailed information on I/O communication and device operation. KT09XS3400UG, Rev. 2.0 8 Freescale Semiconductor Using Hardware and Software 7 Using Hardware and Software The KIT09XS3400EVBE operates with a single DC power supply from 4.0 to 28 V, and is fully controlled via SPI with the help of an USB-SPI KITUSBSPIEVME EVB kit requiring a 5.0 V DC power supply. Starting up the KIT09XS3400EVBE: To Start working with the KIT09XS3400EVBE, provide the 12 V input voltage between 4.0 to 28 V, connecting the (+) probe to the VPWR terminal and the (-) probe to the GND terminal on the Input power terminal block. Then apply a 5.0 V input voltage between VDD and the GND terminal. The load is connected between the HS0 (or HS1) terminal and the (-) terminal of 12 V power supply. Controlling the KIT09XS3400EVBE via the SPI: The KITUSBSPIEVME EVB kit allows interaction with the KIT09XS3400EVBE using the graphical user interface (GUI) developed by Freescale to fully operate the MC09XS3400 device. KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 9 Jumper Connections 8 Jumper Connections Name Description JP1 JP2 JP3 JP4 Allows independent control of each high side switch output 1-2 selection: outputs are controlled via SPIGen or connectors J7 - J10 2-3 selection: direct control of the output, appropriate output is ON JP5 FSI selection 1-2: FSI terminal connected through 6.8 kOhm resistor to ground 2-3: FSI terminal connected to ground JP6 Allows wake-up function of IC. 1-2 selection will give external control through connector J12. 2-3 selection is to wake-up from battery voltage, i.e. in the case of ignition. JP7 Selection of supplying of FSB LED 1-2: FSB LED D1 connected to VDD (5.0 V) 2-3: FSB LED D1 connected to VPWR (12 V) JP9 Source of VDD (+5.0 V) 1-2: +5.0 V is provided by PC via parallel cable Floating: +5.0 V must be connected to J11, otherwise the device is in fail-safe mode (the output states depend on R11 value) JP10 Connection of RSTB input 1-2 position: control through SPIGen Floating: RSTB is ground. This means that the IC is in Sleep mode JP11 Connection of VDD to the device 1-2 position: VDD connected to the device Floating: Device without VDD JP12 R8 bypassing 1-2 position: R8 is bypassed with 0 Ohm. For higher speed of SPI (MCU control of the device only) Floating: Low speed SPI operation with SPIGen software TEST POINTS Several test points are presented on the evaluation board to check some signals using an oscilloscope if necessary. KT09XS3400UG, Rev. 2.0 10 Freescale Semiconductor Schematic 9 Schematic JP1 HDR 3X1 Schematic net marking C4,C13,C14,C15 not populated by default VDD Test point mark 1 2 3 R1 VDD JP2 HDR 3X1 2 1 10K 1 2 3 R4 10K CSB R5 CSB GND 10K U1 2 IN0 3 IN1 5 IN2 SI R6 10K R7 10K R8 SO SI SO 10K FSI 2 1 RSTB RSTB JP12 HDR 2X1 JP5 HDR 3X1 1 2 3 J13 VPWR HS0 21 OUT0 10 CS HS1 19 OUT1 11 SCLK 12 HS2 22 OUT2 SI 16 SO HS3 18 OUT3 24 FSI 9 RST 7 FS 8 WAKE 1 CSNS GND C4 100nF 50V GND GND C9 xnF 50V IN3 SPQ15 R11 6.8k GND 6 SCLK SCLK C3 100nF 50V GND 15 GND C13 100nF 50V VPWR GND IN0 VPWR 2 3 1 4 5 SMA C14 xnF 50V NC NC OUT0 OUT1 OUT2 C5 22nF 50V GND GND GND OUT3 GND C6 22nF 50V C10 xnF 50V C11 xnF 50V GND GND GND 2 3 1 4 5 J3 J14 OUT0 SMA 2 3 1 4 5 J4 J15 OUT1 SMA 2 3 1 4 5 J5 J16 OUT2 SMA C7 22nF 50V GND 4 20 P_GND JP4 HDR 3X1 IN3 VPWR 14 10K C2 100nF 50V 13 1 2 3 R3 C15 100nF 50V VDD JP3 HDR 3X1 IN2 VPWR HDR 2X1 GND GND R2 1 2 3 IN1 J2 JP11 17 23 IN0 10K GND 2 3 1 4 5 J6 J17 OUT3 SMA C8 22nF 50V C12 xnF 50V GND GND C9-C12 not populated by default GND GND GND JP7 HDR 3X1 VPWR 1 2 3 VDD FSB R10 10K D1 RED JP6 HDR 3X1 VPWR 1 2 3 WAKE R9 WAKE 10K CSNS C Sense 10K R13 C1 22nF 50V R12 4.7K GND GND Figure 4. Schematic Part One KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 11 Schematic J18 JP10 HDR 2X1 J1 5 4 1 3 2 SMA M2 RSTB 1 14 2 15 3 16 4 17 5 18 6 19 7 20 8 21 9 22 10 23 11 24 12 25 13 1 2 CSB GND SI J19 SCLK 5 4 1 3 2 SMA IN0 IN1 IN2 GND IN3 VDD J20 2 1 5 4 1 3 2 SMA JP9 HDR 2X1 SO GND J21 5 4 1 3 2 SMA M1 DB25 GND Schematic net marking GND J22 5 4 1 3 2 SMA GND VDD VDD 1nF C21 16V R18 C26 VPWR 10nF 50V 10 1nF C22 16V R19 C27 OUT0 10nF 50V 10 1nF C23 16V R20 C28 OUT1 10nF 50V 10 1nF C24 16V R21 C29 OUT2 10nF 50V 10 1nF C25 16V R22 C30 OUT3 10nF 50V 10 GND GND U2 PROTOTYPE AREA 8 7 6 5 4 3 2 1 VPWR 16 15 14 13 12 11 10 9 VDD 24 23 22 21 20 19 18 17 J7 IN0 J8 J10 IN0 IN3 J11 J23 IN3 VDD IN1 J9 GND IN2 IN1 IN2 GND GND J12 WAKE VDD RSTB J24 RSTB WAKE VPWR C16 XnF 50V C17 XnF 50V C18 XnF 50V C19 XnF 50V Horizontal banana test jack connectors GND Figure 5. Schematic Part Two KT09XS3400UG, Rev. 2.0 12 Freescale Semiconductor Board Layout 10 Board Layout 10.1 Top Assembly Layer Figure 6. Top Assembly Layer KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 13 Board Layout 10.2 Bottom Assembly Layer Figure 7. Bottom Assembly Layer KT09XS3400UG, Rev. 2.0 14 Freescale Semiconductor Board Layout 10.3 PCB Top Layer Figure 8. PCB Top Layer KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 15 Board Layout 10.4 PCB Bottom Layer Figure 9. PCB Bottom Layer KT09XS3400UG, Rev. 2.0 16 Freescale Semiconductor Bill of Material 11 Bill of Material Table 1. KIT09XS3400EVBE Bill of Material (1) PART NUMBER VALUE/RATING QTY PART DESIGNATION Resistor 5% SMD 0805 10 k 11 R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R13 Resistor 1% SMD 0805 6.8 k 1 R11 Resistor 1% Thru-hole 10mm 2.7 k 1 R12 Resistor 5% 1.0 W Thru-hole 10 mm 10 R 5 R18, R19, R20, R21, R22 Ceramic Capacitor 50 V SMD 0805 AVX 10 nF 1 C1 Ceramic Capacitor 50 V SMD 1206 AVX 10 nF 5 C26, C27, C28, C29, C30 Ceramic Capacitor 50 V SMD 0805 AVX 100 nF 4 C2, C3, C13, C15 Electrolytic Capacitor 63 V Thru - hole 5.0 mm 10 μF 2 C4, C20 Ceramic Capacitor 50 V SMD 0805 AVX 22 nF 4 C5, C6, C7, C8 Ceramic Capacitor SMD 0805 For EMC tuning 9 C9, C10, C11, C12, C14, C16, C17, C18, C19 Ceramic Capacitor 50 V SMD 1206 AVX 1.0 nF 5 C21, C22, C23, C24, C25 SMD 0805 Lumex Red LED 1 D1 Freescale Quad High Side Switch MC09XS3400AFK 1 U1 Samtec Header 3x1 7 JP1, JP2, JP3, JP4, JP5, JP6, JP7 Samtec Header 2x1 4 JP9, JP10, JP11, JP12 PCB connector 90° ZEDB25PBA ITT CANNON 25-pin 1 J1 SMA 19-46-1-TGG MULTICOMP Jack 10 J2, J3, J4, J5, J6, J18, J19, J20, J21, J22 Horizontal Test jack 105-0752-001 Johnson Components YES 8 J7, J8, J9, J10, J11, J12, J23, J24 Screw diameter + 2 nuts + 2 washers each for power connector 4.0 mm 5 J13, J14, J15, J16, J17 PCB Test Terminal 200-203 William Hughes YES 18 OUT1,OUT2, OUT3, WAKE, VPWR, VDD, SO, SI, SCLK, RSTB, OUT0, IN0, GND, FSI, FSB, CSNS, CSB, C Sense Notes 1. Freescale does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or tables. While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 17 References 12 References The following table contains URLs where you can obtain information on other Freescale products and MC09XS3400 product solutions: DESCRIPTION URL MC09XS3400 Product Summary Page http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=MC09XS3400 MC09XS3400 Data Sheet www.freescale.com/files/analog/doc/data_sheet/MC09XS3400.pdf MC09XS3400 Fact Sheet www.freescale.com/files/analog/doc/fact_sheet/MC09XS3400FS.pdf SPIGEN Reference http://www.freescale.com/files/soft_dev_tools/software/device_drivers/SPIGen.html Freescale’s Analog Web Site www.freescale.com/analog Freescale’s Automotive Applications Web Site www.freescale.com/automotive 12.1 Support Visit Freescale.com/support for a list of phone numbers within your region. 12.2 Warranty Visit Freescale.com/warranty for a list of phone numbers within your region. KT09XS3400UG, Rev. 2.0 18 Freescale Semiconductor Revision History 13 Revision History REVISION DATE DESCRIPTION OF CHANGES 1.0 8/2012 • Initial Release 2.0 8/2012 • Minor text edits, no technical changes KT09XS3400UG, Rev. 2.0 Freescale Semiconductor 19 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: store.esellerate.net/store/Policy.aspx?Selector=RT&s=STR0326182960&pc. Freescale, the Freescale logo, AltiVec, C-5, CodeTest, CodeWarrior, ColdFire, C-Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. Document Number: KT09XS3400UG Rev. 2.0 8/2012