View detail for

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
Matte Tin (Sn)
RoHS Compliant
e3
Green Compliant
Amkor Philippines
REACH Compliant
STN
Yes
Yes
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
29690‐82‐2
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
24.169
0.596
0.025
0.025
24.814
2.820
2.820
0.153
0.013
0.013
0.011
0.010
0.005
0.005
0.001
0.209
0.350
0.350
0.055
0.055
81.158
7.318
3.041
3.041
0.475
95.033
1.966
1.966
125.248
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
85.4
854000
7.7
77000
3.2
32000
3.2
32000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
19.30
192969
0.48
4755
0.02
198
0.02
198
19.81
198120
2.25
22514
2.25
22514
0.12
1220
0.01
100
0.01
100
0.01
87
0.01
77
0.00
38
0.00
38
0.00
8
0.17
1669
0.28
2795
0.28
2795
0.04
438
0.04
438
64.80
647984
5.84
58425
2.43
24280
2.43
24280
0.38
3794
75.88
758764
1.57
15700
1.57
15700
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made
to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a
written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm)
for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
STN
Yes
Matte Tin (Sn)
RoHS Compliant
e3
Green Compliant
Yes
Lingsen
REACH Compliant
Yes
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
Silicon (Si)
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
Silver (Ag)
Gold (Au)
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Tin (Sn)
Package Material Declaration
Homogeneous Material
CAS #
Weight (mg) Percentage
ppm
7440‐50‐8
24.169
97.4
974000
7439‐89‐6
0.596
2.4
24000
7723‐14‐0
0.025
0.1
1000
7440‐66‐6
0.025
0.1
1000
24.814
100.0
1000000
7440‐21‐3
2.820
100.0
1000000
2.820
100.0
1000000
7440‐22‐4
0.139
72.1
721000
9003‐36‐5
0.038
19.5
195000
3101‐60‐8
0.013
6.5
65000
0.002
0.8
8000
112‐07‐2
92‐88‐6
0.002
0.8
8000
461‐58‐5
0.001
0.3
3000
0.193
100.0
1000000
7440‐22‐4
0.350
100.0
1000000
0.350
100.0
1000000
7440‐57‐5
0.055
100.0
1000000
0.055
100.0
1000000
60676‐86‐0
81.158
85.4
854000
Proprietary
7.318
7.7
77000
29690‐82‐2
3.041
3.2
32000
Proprietary
3.041
3.2
32000
1333‐86‐4
0.475
0.5
5000
95.033
100.0
1000000
7440‐31‐5
1.966
100.0
1000000
1.966
100.0
1000000
125.231
Package
Percentage
ppm
19.30
192995
0.48
4756
0.02
198
0.02
198
19.81
198146
2.25
22517
2.25
22517
0.11
1108
0.03
300
0.01
100
0.00
12
0.00
12
0.00
5
0.15
1537
0.28
2795
0.28
2795
0.04
438
0.04
438
64.81
648070
5.84
58433
2.43
24284
2.43
24284
0.38
3794
75.89
758864
1.57
15702
1.57
15702
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this
declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the
European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by
Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be
proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify
or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations
provided herein unless otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb),
Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate
(DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm)
for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of
0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and
Chlorine (Cl) in any homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
STN
Yes
Matte Tin (Sn)
RoHS Compliant
e3
Green Compliant
Yes
UTAC Thailand
REACH Compliant
Yes
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
Silicon (Si)
Silver (Ag)
Diester Resin
Functionalized Urethane
Epoxy Resin
Silver (Ag)
Gold (Au)
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Tin (Sn)
Package Material Declaration
Homogeneous Material
CAS #
Weight (mg) Percentage
ppm
7440‐50‐8
24.169
97.4
974000
7439‐89‐6
0.596
2.4
24000
7723‐14‐0
0.025
0.1
1000
7440‐66‐6
0.025
0.1
1000
24.814
100.0
1000000
7440‐21‐3
2.820
100.0
1000000
2.820
100.0
1000000
7440‐22‐4
0.140
77.0
770000
Proprietary
0.019
10.3
103000
Proprietary
0.015
8.5
85000
Proprietary
0.008
4.2
42000
0.182
100.0
1000000
7440‐22‐4
0.350
100.0
1000000
0.350
100.0
1000000
7440‐57‐5
0.055
100.0
1000000
0.055
100.0
1000000
60676‐86‐0
81.158
85.4
854000
Proprietary
7.318
7.7
77000
29690‐82‐2
3.041
3.2
32000
Proprietary
3.041
3.2
32000
1333‐86‐4
0.475
0.5
5000
95.033
100.0
1000000
7440‐31‐5
1.966
100.0
1000000
1.966
100.0
1000000
125.220
Package
Percentage
ppm
19.30
193012
0.48
4756
0.02
198
0.02
198
19.82
198164
2.25
22519
2.25
22519
0.11
1116
0.01
149
0.01
123
0.01
61
0.14
1450
0.28
2795
0.28
2795
0.04
438
0.04
438
64.81
648127
5.84
58438
2.43
24286
2.43
24286
0.38
3795
75.89
758930
1.57
15703
1.57
15703
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this
declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the
European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by
Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be
proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify
or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations
provided herein unless otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb),
Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate
(DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm)
for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of
0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and
Chlorine (Cl) in any homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
Matte Tin (Sn)
RoHS Compliant
e3
Green Compliant
Amkor Philippines
REACH Compliant
STN
Yes
Yes
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
29690‐82‐2
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
24.169
0.596
0.025
0.025
24.814
2.820
2.820
0.153
0.013
0.013
0.011
0.010
0.005
0.005
0.001
0.209
0.350
0.350
0.025
0.001
0.026
81.158
7.318
3.041
3.041
0.475
95.033
1.966
1.966
125.218
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
85.4
854000
7.7
77000
3.2
32000
3.2
32000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
19.30
193014
0.48
4756
0.02
198
0.02
198
19.82
198167
2.25
22519
2.25
22519
0.12
1220
0.01
100
0.01
100
0.01
87
0.01
77
0.00
38
0.00
38
0.00
8
0.17
1669
0.28
2795
0.28
2795
0.02
199
0.00
5
0.02
204
64.81
648136
5.84
58438
2.43
24286
2.43
24286
0.38
3795
75.89
758941
1.57
15704
1.57
15704
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made
to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a
written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm)
for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
STN
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
Lingsen
REACH Compliant
Yes
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
Silicon (Si)
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
Silver (Ag)
Copper (Cu)
Palladium (Pd)
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Tin (Sn)
Package Material Declaration
Homogeneous Material
CAS #
Weight (mg)
Percentage
ppm
7440‐50‐8
24.169
97.4
974000
7439‐89‐6
0.596
2.4
24000
7723‐14‐0
0.025
0.1
1000
7440‐66‐6
0.025
0.1
1000
24.814
100.0
1000000
7440‐21‐3
2.820
100.0
1000000
2.820
100.0
1000000
7440‐22‐4
0.139
72.1
721000
9003‐36‐5
0.038
19.5
195000
3101‐60‐8
0.013
6.5
65000
112‐07‐2
0.002
0.8
8000
92‐88‐6
0.002
0.8
8000
461‐58‐5
0.001
0.3
3000
0.193
100.0
1000000
7440‐22‐4
0.350
100.0
1000000
0.350
100.0
1000000
7440‐50‐8
0.025
97.6
976000
7440‐05‐3
0.001
2.4
24000
0.026
100.0
1000000
60676‐86‐0
81.158
85.4
854000
Proprietary
7.318
7.7
77000
29690‐82‐2
3.041
3.2
32000
Proprietary
3.041
3.2
32000
1333‐86‐4
0.475
0.5
5000
95.033
100.0
1000000
7440‐31‐5
1.966
100.0
1000000
1.966
100.0
1000000
125.202
Package
Percentage
ppm
19.30
193040
0.48
4757
0.02
198
0.02
198
19.82
198193
2.25
22522
2.25
22522
0.11
1109
0.03
300
0.01
100
0.00
12
0.00
12
0.00
5
0.15
1538
0.28
2796
0.28
2796
0.02
199
0.00
5
0.02
204
64.82
648221
5.84
58446
2.43
24289
2.43
24289
0.38
3795
75.90
759041
1.57
15706
1.57
15706
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and
thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any
changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise
provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury
(Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl
Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium
(Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09%
(900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl)
in any homogeneous material.