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Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP)
20X
GPC
TLN
Yes
Matte Tin (Sn)
RoHS Compliant
e3
Green Compliant
Yes
Amkor Philippines
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
23.927
0.590
0.025
0.025
24.566
3.174
3.174
0.172
0.014
0.014
0.012
0.011
0.005
0.005
0.001
0.235
0.277
0.277
0.133
0.133
43.610
3.987
2.726
0.151
50.474
1.842
1.842
80.703
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
86.4
864000
7.9
79000
5.4
54000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
29.65
296488
0.73
7306
0.03
304
0.03
304
30.44
304403
3.93
39333
3.93
39333
0.21
2131
0.02
175
0.02
175
0.02
152
0.01
134
0.01
67
0.01
67
0.00
15
0.29
2916
0.34
3433
0.34
3433
0.17
1653
0.17
1653
54.04
540375
4.94
49409
3.38
33773
0.19
1876
62.54
625434
2.28
22829
2.28
22829
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this
declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP)
20X
GPC
TLN
Yes
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Lingsen
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
7440‐22‐4
9003‐36‐5
3101‐60‐8
112‐07‐2
92‐88‐6
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous) A
Silica (Amorphous) B
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
7631‐86‐9
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
23.633
0.737
0.147
0.049
24.566
3.174
3.174
0.156
0.042
0.014
0.002
0.002
0.001
0.217
0.277
0.277
0.133
0.133
34.928
7.117
4.593
3.584
0.252
50.474
1.842
1.842
80.684
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
72.1
721000
19.5
195000
6.5
65000
0.8
8000
0.8
8000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
69.2
692000
14.1
141000
9.1
91000
7.1
71000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
29.29
292903
0.91
9134
0.18
1827
0.06
609
30.45
304473
3.93
39342
3.93
39342
0.19
1937
0.05
524
0.02
175
0.00
21
0.00
21
0.00
8
0.27
2686
0.34
3434
0.34
3434
0.17
1653
0.17
1653
43.29
432900
8.82
88207
5.69
56928
4.44
44416
0.31
3128
62.56
625578
2.28
22834
2.28
22834
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary
and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users
of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless
otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury
(Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP),
Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for
Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09%
(900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine
(Cl) in any homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP)
20X
GPC
TLN
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
UTAC Thailand
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Diester Resin
Functionalized Urethane
Epoxy Resin
7440‐22‐4
Proprietary
Proprietary
Proprietary
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
29690‐82‐2
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
23.633
0.737
0.147
0.049
24.566
3.174
3.174
0.157
0.021
0.017
0.009
0.204
0.277
0.277
0.133
0.133
43.105
3.887
1.615
1.615
0.252
50.474
1.842
1.842
80.672
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
77.0
770000
10.3
103000
8.5
85000
4.2
42000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
85.4
854000
7.7
77000
3.2
32000
3.2
32000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
29.29
292948
0.91
9136
0.18
1827
0.06
609
30.45
304520
3.93
39348
3.93
39348
0.20
1951
0.03
261
0.02
215
0.01
106
0.25
2533
0.34
3434
0.34
3434
0.17
1653
0.17
1653
53.43
534326
4.82
48177
2.00
20022
2.00
20022
0.31
3128
62.57
625674
2.28
22837
2.28
22837
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP)
20X / N‐TSSOP020
GPC
TLN
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
Lingsen
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
7440‐22‐4
9003‐36‐5
3101‐60‐8
112‐07‐2
92‐88‐6
461‐58‐5
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica (Amorphous) A
Silica (Amorphous) B
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
7631‐86‐9
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
24.199
0.596
0.025
0.025
24.845
3.174
3.174
0.156
0.042
0.014
0.002
0.002
0.001
0.217
0.277
0.277
0.061
0.001
0.062
34.928
7.117
4.593
3.584
0.252
50.474
1.842
1.842
80.892
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
72.1
721000
19.5
195000
6.5
65000
0.8
8000
0.8
8000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
69.2
692000
14.1
141000
9.1
91000
7.1
71000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
29.92
299150
0.74
7371
0.03
307
0.03
307
30.71
307136
3.92
39241
3.92
39241
0.19
1932
0.05
522
0.02
174
0.00
21
0.00
21
0.00
8
0.27
2679
0.34
3425
0.34
3425
0.08
750
0.00
18
0.08
769
43.18
431791
8.80
87980
5.68
56782
4.43
44302
0.31
3120
62.40
623975
2.28
22775
2.28
22775
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.