Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP) 20X GPC TLN Yes Matte Tin (Sn) RoHS Compliant e3 Green Compliant Yes Amkor Philippines REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 24.199 0.596 0.025 0.025 24.845 3.207 3.207 0.174 0.014 0.014 0.012 0.011 0.005 0.005 0.001 0.238 0.277 0.277 0.133 0.133 43.584 3.985 2.724 0.151 50.445 1.842 1.842 80.987 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 86.4 864000 7.9 79000 5.4 54000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.88 298797 0.74 7363 0.03 307 0.03 307 30.68 306773 3.96 39604 3.96 39604 0.21 2146 0.02 176 0.02 176 0.02 153 0.01 135 0.01 68 0.01 68 0.00 15 0.29 2936 0.34 3421 0.34 3421 0.16 1647 0.16 1647 53.82 538160 4.92 49207 3.36 33635 0.19 1869 62.29 622871 2.27 22748 2.27 22748 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 24, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP) 20X GPC TLN Yes Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 23.633 0.737 0.147 0.049 24.566 3.207 3.207 0.158 0.043 0.014 0.002 0.002 0.001 0.219 0.277 0.277 0.133 0.133 34.908 7.113 4.590 3.582 0.252 50.445 1.842 1.842 80.690 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.29 292882 0.91 9134 0.18 1827 0.06 609 30.45 304452 3.98 39750 3.98 39750 0.20 1957 0.05 529 0.02 176 0.00 22 0.00 22 0.00 8 0.27 2714 0.34 3433 0.34 3433 0.17 1653 0.17 1653 43.26 432615 8.81 88148 5.69 56890 4.44 44387 0.31 3126 62.52 625166 2.28 22832 2.28 22832 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 24, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP) 20X GPC TLN Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes UTAC Thailand REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin Toluene 7440‐22‐4 Proprietary 108‐88‐3 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 23.633 0.737 0.147 0.049 24.566 3.207 3.207 0.188 0.017 0.002 0.206 0.277 0.277 0.133 0.133 43.080 3.884 1.614 1.614 0.252 50.445 1.842 1.842 80.677 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 91.2 912000 8.0 80000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.29 292928 0.91 9135 0.18 1827 0.06 609 30.45 304499 3.98 39756 3.98 39756 0.23 2334 0.02 205 0.00 20 0.26 2559 0.34 3434 0.34 3434 0.17 1653 0.17 1653 53.40 533974 4.81 48145 2.00 20008 2.00 20008 0.31 3126 62.53 625262 2.28 22836 2.28 22836 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 24, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 20‐Lead, 4.4 x 6.5 mm Body, 0.65 mm Lead Pitch, Thin Shrink Small Outline Package (TSSOP) 20X / N‐TSSOP020 GPC TLN Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 24.199 0.596 0.025 0.025 24.845 3.207 3.207 0.158 0.043 0.014 0.002 0.002 0.001 0.219 0.277 0.277 0.061 0.001 0.062 34.908 7.113 4.590 3.582 0.252 50.445 1.842 1.842 80.897 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.91 299129 0.74 7371 0.03 307 0.03 307 30.71 307114 3.96 39648 3.96 39648 0.20 1952 0.05 528 0.02 176 0.00 22 0.00 22 0.00 8 0.27 2707 0.34 3425 0.34 3425 0.08 750 0.00 18 0.08 768 43.15 431506 8.79 87922 5.67 56744 4.43 44273 0.31 3118 62.36 623563 2.28 22774 2.28 22774 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 24, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.