Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) 8S1 GPC Matte Tin (Sn) RoHS Compliant e3 Green Compliant Amkor Philippines REACH Compliant SWB Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 19.730 0.486 0.020 0.020 20.257 1.929 1.929 0.105 0.009 0.009 0.007 0.007 0.003 0.003 0.001 0.143 0.331 0.331 0.002 0.002 45.021 4.059 1.687 1.687 0.264 52.718 1.494 1.494 76.874 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 25.67 256659 0.63 6324 0.03 264 0.03 264 26.35 263511 2.51 25093 2.51 25093 0.14 1360 0.01 112 0.01 112 0.01 97 0.01 86 0.00 43 0.00 43 0.00 9 0.19 1860 0.43 4309 0.43 4309 0.00 26 0.00 26 58.56 585649 5.28 52804 2.19 21945 2.19 21945 0.34 3429 68.58 685771 1.94 19430 1.94 19430 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) 8S1 / N‐SO008 GPC SWB Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 19.730 0.486 0.020 0.020 20.257 1.929 1.929 0.095 0.026 0.009 0.001 0.001 0.000 0.132 0.331 0.331 0.002 0.002 45.021 4.059 1.687 1.687 0.264 52.718 1.494 1.494 76.862 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 25.67 256697 0.63 6325 0.03 264 0.03 264 26.35 263549 2.51 25097 2.51 25097 0.12 1235 0.03 334 0.01 111 0.00 14 0.00 14 0.00 5 0.17 1714 0.43 4310 0.43 4310 0.00 26 0.00 26 58.57 585735 5.28 52812 2.19 21948 2.19 21948 0.34 3429 68.59 685872 1.94 19433 1.94 19433 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) TA GPC SWB Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant No TSPIC REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin 1,4‐Bis(2,3‐epoxypropoxy)butane Dapsone 7440‐22‐4 9003‐36‐5 2425‐79‐8 80‐08‐0 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Fused Silica Epoxy Resin Phenol Resin Antimony Trioxide Brominated Epoxy Resin Carbon Black 60676‐86‐0 29690‐82‐2 9003‐35‐4 1309‐64‐4 40039‐93‐8 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 19.730 0.486 0.020 0.020 20.257 1.929 1.929 0.098 0.020 0.010 0.004 0.132 0.331 0.331 0.002 0.002 38.642 9.911 2.425 0.791 0.791 0.158 52.718 1.494 1.494 76.862 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 74.6 746000 14.9 149000 7.5 75000 3.0 30000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 73.3 733000 18.8 188000 4.6 46000 1.5 15000 1.5 15000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 25.67 256697 0.63 6325 0.03 264 0.03 264 26.35 263549 2.51 25097 2.51 25097 0.13 1278 0.03 255 0.01 129 0.01 51 0.17 1714 0.43 4310 0.43 4310 0.00 26 0.00 26 50.27 502744 12.89 128944 3.16 31550 1.03 10288 1.03 10288 0.21 2058 68.59 685872 1.94 19433 1.94 19433 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) 8S1 GPC SWB Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 19.730 0.486 0.020 0.020 20.257 1.929 1.929 0.095 0.026 0.009 0.001 0.001 0.000 0.132 0.331 0.331 0.001 0.000 0.001 45.021 4.059 1.687 1.687 0.264 52.718 1.494 1.494 76.861 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 25.67 256701 0.63 6325 0.03 264 0.03 264 26.36 263553 2.51 25097 2.51 25097 0.12 1236 0.03 334 0.01 111 0.00 14 0.00 14 0.00 5 0.17 1714 0.43 4310 0.43 4310 0.00 12 0.00 0 0.00 12 58.57 585743 5.28 52813 2.19 21948 2.19 21948 0.34 3429 68.59 685882 1.94 19433 1.94 19433 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.