PHILIPS BT134W-600

Philips Semiconductors
Product specification
Triacs
BT134W series
GENERAL DESCRIPTION
Glass passivated triacs in a plastic
envelope suitable for surface
mounting, intended for use in
applications
requiring
high
bidirectional transient and blocking
voltage capability and high thermal
cycling
performance.
Typical
applications include motor control,
industrial and domestic lighting,
heating and static switching.
PINNING - SOT223
PIN
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MAX. MAX. MAX. UNIT
VDRM
BT134WBT134WBT134WRepetitive peak off-state
voltages
RMS on-state current
Non-repetitive peak on-state
current
500
500F
500G
500
600
600F
600G
600
800
800F
800G
800
V
1
10
1
10
1
10
A
A
IT(RMS)
ITSM
PIN CONFIGURATION
DESCRIPTION
1
main terminal 1
2
main terminal 2
3
gate
SYMBOL
4
T2
tab
main terminal 2
2
1
T1
G
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
VDRM
Repetitive peak off-state
voltages
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak
on-state current
I2t
dIT/dt
IGM
VGM
PGM
PG(AV)
Tstg
Tj
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
Storage temperature
Operating junction
temperature
CONDITIONS
MIN.
-
full sine wave; Tsp ≤ 108 ˚C
full sine wave; Tj = 25 ˚C prior to
surge
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 1.5 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
T2+ G+
T2+ GT2- GT2- G+
over any 20 ms period
MAX.
-500
5001
-600
6001
UNIT
-800
800
V
-
1
A
-
10
11
0.5
A
A
A2s
-40
-
50
50
50
10
2
5
5
0.5
150
125
A/µs
A/µs
A/µs
A/µs
A
V
W
W
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/µs.
September 1997
1
Rev 1.200
Philips Semiconductors
Product specification
Triacs
BT134W series
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-sp
Thermal resistance
junction to solder point
Thermal resistance
junction to ambient
Rth j-a
MIN.
TYP.
MAX.
UNIT
full or half cycle
-
-
15
K/W
pcb mounted; minimum footprint
pcb mounted; pad area as in fig:14
-
156
70
-
K/W
K/W
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
IGT
Gate trigger current
IL
Latching current
IH
Holding current
VT
VGT
On-state voltage
Gate trigger voltage
ID
Off-state leakage current
CONDITIONS
MIN.
BT134WVD = 12 V; IT = 0.1 A
T2+ G+
T2+ GT2- GT2- G+
VD = 12 V; IGT = 0.1 A
T2+ G+
T2+ GT2- GT2- G+
VD = 12 V; IGT = 0.1 A
IT = 2 A
VD = 12 V; IT = 0.1 A
VD = 400 V; IT = 0.1 A;
Tj = 125 ˚C
VD = VDRM(max);
Tj = 125 ˚C
TYP.
MAX.
UNIT
...
...F
...G
-
5
8
11
30
35
35
35
70
25
25
25
70
50
50
50
100
mA
mA
mA
mA
-
7
16
5
7
5
20
30
20
30
15
20
30
20
30
15
30
45
30
45
30
mA
mA
mA
mA
mA
0.25
1.2
0.7
0.4
1.50
1.5
-
V
V
V
-
0.1
0.5
mA
MIN.
TYP.
MAX.
UNIT
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
dVD/dt
Critical rate of rise of
off-state voltage
dVcom/dt
Critical rate of change of
commutating voltage
tgt
Gate controlled turn-on
time
September 1997
CONDITIONS
BT134WVDM =67% VDRM(max);
Tj = 125 ˚C; exponential
waveform; gate open
circuit
VDM = 400 V; Tj = 95 ˚C;
IT(RMS) = 1 A;
dIcom/dt = 1.8 A/ms; gate
open circuit
ITM = 1.5 A;
VD = VDRM(max); IG = 0.1 A;
dIG/dt = 5 A/µs;
2
...
100
...F
50
...G
200
250
-
V/µs
-
-
10
50
-
V/µs
-
-
-
2
-
µs
Rev 1.200
Philips Semiconductors
Product specification
Triacs
BT134W series
BT134W
Ptot / W
1.4
Tsp(max) / C
1.2
104
107
1.2
1
110
120
0.8
90
0.8
113
60
0.6
0.6
116
30
0.4
119
0.2
122
0
0
0.2
0.4
0.6
0.8
IT(RMS) / A
0.4
0.2
125
1.2
1
0
-50
Fig.1. Maximum on-state dissipation, Ptot, versus rms
on-state current, IT(RMS), where α = conduction angle.
1000
2
50
Tsp / C
100
150
IT(RMS) / A
BT134W
I TSM
IT
T
100
0
Fig.4. Maximum permissible rms current IT(RMS) ,
versus solder point temperature Tsp.
BT134W
ITSM / A
108 C
1
= 180
1
BT134W
IT(RMS) / A
time
1.5
Tj initial = 25 C max
dI T /dt limit
1
T2- G+ quadrant
10
0.5
1
10us
100us
1ms
T/s
10ms
0
0.01
100ms
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 20ms.
12
ITSM / A
10
8
1.6
ITSM
T
Tj initial = 25 C max
4
0.8
2
0.6
10
100
Number of cycles at 50Hz
VGT(Tj)
VGT(25 C)
0.4
-50
1000
Fig.3. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
September 1997
10
BT136
1.2
1
1
1
1.4
time
6
0
surge duration / s
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tsp ≤ 108˚C.
BT134W
IT
0.1
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
3
Rev 1.200
Philips Semiconductors
Product specification
Triacs
3
BT134W series
IGT(Tj)
IGT(25 C)
2
BT136
Tj = 125 C
Tj = 25 C
T2+ G+
T2+ GT2- GT2- G+
2.5
2
BT134W
IT / A
1.5
Vo = 1.0 V
Rs = 0.21 Ohms
typ
1
1.5
max
1
0.5
0.5
0
-50
0
50
Tj / C
100
0
150
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
IL(Tj)
IL(25 C)
0
0.5
1
VT / V
1.5
2
Fig.10. Typical and maximum on-state characteristic.
100
TRIAC
2.5
BT134W
Zth j-sp (K/W)
10
unidirectional
2
bidirectional
1
1.5
P
D
1
tp
0.1
0.5
t
0
-50
0
50
Tj / C
100
0.01
10us
150
IH(Tj)
IH(25C)
1ms
10ms
0.1s
1s
10s
tp / s
Fig.11. Transient thermal impedance Zth j-sp, versus
pulse width tp.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
3
0.1ms
1000
TRIAC
dVcom/dt (V/us)
off-state dV/dt limit
BT134...G SERIES
2.5
BT134 SERIES
100
2
BT134...F SERIES
1.5
10
1
0.5
0
-50
dIcom/dt = 5.1
A/ms
0
50
Tj / C
100
1
150
3
50
2.3
1.8
100
1.4
150
Tj / C
Fig.12. Typical commutation dV/dt versus junction
temperature, parameter commutation dIT/dt. The triac
should commutate when the dV/dt is below the value
on the appropriate curve for pre-commutation dIT/dt.
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
September 1997
0
3.9
4
Rev 1.200
Philips Semiconductors
Product specification
Triacs
BT134W series
MOUNTING INSTRUCTIONS
Dimensions in mm.
3.8
min
1.5
min
2.3
1.5
min
6.3
(3x)
1.5
min
4.6
Fig.13. soldering pattern for surface mounting SOT223.
PRINTED CIRCUIT BOARD
Dimensions in mm.
36
18
60
4.5
4.6
9
10
7
15
50
Fig.14. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick).
September 1997
5
Rev 1.200
Philips Semiconductors
Product specification
Triacs
BT134W series
MECHANICAL DATA
Dimensions in mm
6.7
6.3
Net Mass: 0.11 g
B
3.1
2.9
0.32
0.24
0.2
4
A
A
0.10
0.02
16
max
M
7.3
6.7
3.7
3.3
13
2
1
10
max
1.8
max
1.05
0.80
2.3
0.60
0.85
4.6
3
0.1 M
B
(4x)
Fig.15. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
September 1997
6
Rev 1.200
Philips Semiconductors
Product specification
Triacs
BT134W series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997
7
Rev 1.200