VISHAY 298D105X0016M2T

298D
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
FEATURES
•
0805, 0603 and 0402 footprint
•
Lead (Pb)-free L-shaped terminations
•
8 mm tape and reel packaging available per
EIA-481-1 and reeling per IEC 286-3
7" [178 mm] standard
PERFORMANCE CHARACTERISTICS
Capacitance Range: 0.68 µF to 220 µF
Operating Temperature: - 55 °C to + 85 °C
(to + 125 °C voltage derating)
Capacitance Tolerance: ± 20 % standard
Voltage Range: 2.5 WVDC to 50 WVDC
ORDERING INFORMATION
298D
MODEL
106
CAPACITANCE
X0
CAPACITANCE
TOLERANCE
010
DC VOLTAGE RATING
AT + 85 °C
This is expressed in
picofarads. The first
two digits are the
significant figures. The
third is the number of
zeros to follow.
X0 = ± 20 %
X9 = ± 10 %
This is expressed in volts.
To complete the three-digit
block, zeros precede the
voltage rating. A decimal
point is indicated by an “R”
(6R3 = 6.3 V).
M
CASE CODE
2
TERMINATION
T
REEL SIZE AND
PACKAGING
See Ratings 2 = 100 % Tin T = Tape and Reel
and Case
4 = Gold Plated
7" [178 mm] Reel
Codes Table
Note: Preferred tolerance and reel size are in bold.
We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating.
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Anode Termination
W
C
P1
P2
Cathode Termination
H
P1
L
CASE
L
W
H
P1
P2 (REF.)
C
K
0.039 + 0.008
[1.0 + 0.2]
0.02 + 0.008
[0.5 + 0.2]
0.024 max.
0.6 max.
0.01 ± 0.004
[0.25 ± 0.1]
0.02
[0.5]
0.015 ± 0.004
[0.38 ± 0.1]
M
0.063 ± 0.004
[1.60 ± 0.1]
0.033 ± 0.004
[0.85 ± 0.1]
0.031 ± 0.004
[0.80 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.024
[0.60]
0.024 ± 0.004
[0.60 ± 0.1]
P
0.094 ± 0.004
[2.4 ± 0.1]
0.057 ± 0.004
[1.45 ± 0.1]
0.043 ± 0.004
[1.10 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.057
[1.40]
0.035 ± 0.004
[0.90 ± 0.1]
* Please see document “Vishay Green and Halogen-Free Definitions (5-2008)” http://www.vishay.com/doc?99902
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38
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
RATINGS AND CASE CODES
µF
2.5 V
4V
6.3 V
0.68
1.0
K
2.2
K/M
3.3
4.7
K
K*/M
6.8
10
K/M
K*/M
15
K*
22
M
M
33
M
M
47
M
M
P*
100
P*
P
220
P
P
Note: * Preliminary values, contact factory for availability.
10 V
16 V
25 V
K
K/M
K/M
M
M
M
M
P
35 V
M*
50 V
P*
M
M
M*
P*
P
MARKING
V
4
6.3
10
16
20
25
35
50
M-case
Polarity Bar
Voltage Code
A
K-case
M-CASE
CODE
G
J
A
C
D
E
V
T
P-CASE
CAP, µF
CODE
0.68
w
1
A
2.2
J
3.3
N
4.7
S
6.8
W
10
a
15
e
22
l
33
n
47
s
68
w
100
A
150
E
220
J
P-case
Polarity Bar
Capacitance
Voltage Code
Code
GJ
STANDARD RATINGS
CAPACITANCE
(µF)
CASE
CODE
47
220
M
P
4.7
10
10
15
22
33
47
100
220
K
K
M
K
M
M
M
P
P
1.0
2.2
2.2
4.7
4.7
10
10
15
K
K
M
K
M
K
M
M
Document Number: 40065
Revision: 01-Sep-08
MAX. RIPPLE
MAX. ESR
MAX. DC
MAX. DF
AT + 25 °C
100 kHz
LEAKAGE
AT + 25 °C
100 kHz
Irms
AT + 25 °C
(%)
(Ω)
(µA)
(A)
2.5 WVDC AT + 85 °C, SURGE = 3.3 V. . . 1.6 WVDC AT + 125 °C, SURGE = 2.1 V
298D476X02R5M2T
2.4
20
4.0
0.08
298D227X02R5P2T
11.0
30
3.0
0.122
4 WVDC AT + 85 °C, SURGE = 5.2 V. . . 2.7 WVDC AT + 125 °C, SURGE = 3.4 V
298D475X0004K2T
0.5
15
20
0.027
298D106X0004K2T
4.0
50
20
0.027
298D106X0004M2T
0.5
8.0
5.0
0.071
298D156X0004K2T (2)
10
50
20
0.027
298D226X0004M2T
0.9
15
4.0
0.08
298D336X0004M2T
2.6
15
4.0
0.08
298D476X0004M2T
3.8
20
4.0
0.08
298D107X0004P2T
4.0
20
2.0
0.1
298D227X0004P2T
17.6
30
3.0
0.122
6.3 WVDC AT + 85 °C, SURGE = 8 V. . . 4 WVDC AT + 125 °C, SURGE = 5 V
298D105X06R3K2T
0.5
6.0
20
0.027
298D225X06R3K2T
0.5
8.0
20
0.027
298D225X06R3M2T
0.5
10
5.0
0.07
298D475X06R3K2T (2)
4.0
50
20
0.027
298D475X06R3M2T
0.5
8.0
3.0
0.09
298D106X06R3K2T (2)
10
50
20
0.027
298D106X06R3M2T
0.6
8.0
5.0
0.071
298D156X06R3M2T
1.0
20
7.0
0.06
PART
NUMBER
For technical questions, contact: [email protected]
ΔC/C (1)
(%)
± 30
± 30
± 30
± 30
± 10
± 30
± 15
± 20
± 30
± 30
± 30
± 30
± 30
± 10
± 30
± 10
± 30
± 10
± 20
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39
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
STANDARD RATINGS
CAPACITANCE
(µF)
CASE
CODE
22
33
47
100
M
M
P
P
1.0
2.2
2.2
4.7
10
15
22
33
47
K
K
M
M
M
M
M
P
P
1.0
1.0
2.2
4.7
K
M
M
M
1.0
4.7
M
P
MAX. ESR
MAX. RIPPLE
MAX. DC
MAX. DF
AT + 25 °C
100 kHz
LEAKAGE
AT + 25 °C
100 kHz
Irms
AT + 25 °C
(%)
(Ω)
(µA)
(A)
6.3 WVDC AT + 85 °C, SURGE = 8 V. . . 4 WVDC AT + 125 °C, SURGE = 5 V
298D226X06R3M2T
2.8
20
5.5
0.067
298D336X06R3M2T
4.2
30
7.5
0.058
298D476X06R3P2T
3.0
22
3.0
0.122
298D107X06R3P2T
6.3
30
2.0
0.150
10 WVDC AT + 85 °C, SURGE = 13 V. . . 7 WVDC AT + 125 °C, SURGE = 8 V
298D105X0010K2T
0.5
6.0
20
0.027
298D225X0010K2T
0.5
8.0
15
0.027
298D225X0010M2T
0.5
10
10
0.05
298D475X0010M2T
0.5
6.0
5.0
0.071
298D106X0010M2T
1.0
20
7.5
0.058
298D156X0010M2T
1.5
20
7.5
0.058
298D226X0010M2T
22
30
8.0
0.06
298D336X0010P2T
3.3
10
2.0
0.150
298D476X0010P2T
4.7
22
3.0
0.122
16 WVDC AT + 85 °C, SURGE = 20 V. . . 10 WVDC AT + 125 °C, SURGE = 12 V
298D105X0016K2T
3.0
10
20
0.027
298D105X0016M2T
0.5
6.0
12.0
0.045
298D225X0016M2T
0.5
10
12.0
0.045
298D475X0016M2T
0.8
8.0
6.0
0.06
25 WVDC AT + 85 °C, SURGE = 32 V. . . 17 WVDC AT + 125 °C, SURGE = 20 V
298D105X0025M2T
0.5
6.0
10.0
0.05
298D475X0025P2T
1.2
6.0
4.0
0.106
PART
NUMBER
Notes:
(1) See Performance Characteristics tables, page 41
(2)
ΔC/C (1)
(%)
± 15
± 30
± 20
± 20
± 30
± 30
± 10
± 15
± 15
± 20
± 30
± 10
± 20
± 30
± 15
± 15
± 15
± 10
± 10
In development
CAPACITORS PERFORMANCE CHARACTERISTICS
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
Category Temperature Range
Capacitance Tolerance
Dissipation Factor (at 120 Hz)
ESR (100 kHz)
PERFORMANCE CHARACTERISTICS
- 55 °C to + 85 °C (to + 125 °C with voltage derating)
± 20 %, ± 10 % (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power
with 1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than
Leakage Current
described in. Standard Ratings Table. Note that the leakage current varies with temperature and
applied voltage. See graph below for the appropriate adjustment factor.
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC
rating at + 25 °C
Reverse Voltage
5 % of the DC rating at + 85 °C
Vishay does not recommended intentional or repetitive application of reverse voltage
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or
voltage shall be calculated using the derating factors:
Temperature Derating
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
K-case: 0.015
Maximum Permissible Power
M-case: 0.025
Dissipation at 25 °C (W) in free air
P-case: 0.045
+ 85 °C RATING
+ 125 °C RATING
WORKING VOLTAGE (V) SURGE VOLTAGE (V) WORKING VOLTAGE (V) SURGE VOLTAGE (V)
4
5.2
2.7
3.4
6.3
8
4
5
10
13
7
8
Operating Temperature
16
20
10
12
20
26
13
16
25
32
17
20
35
46
23
28
50
65
33
40
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40
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
TYPICAL LEAKAGE CURRENT FACTOR RANGE
LEAKAGE CURRENT FACTOR
100
+ 125 °C
+ 85 °C
10
+ 55 °C
+ 25 °C
1.0
0 °C
0.1
- 55 °C
0.01
0.001
0
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED VOLTAGE
Notes
• At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table
• At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table
• At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD 202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD 202G Method 103B
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Thermal Shock
At - 55 °C/+ 125 °C, 30 min each,
for 5 cycles. MIL-STD 202G Method 107G
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
Terminal Strength
Apply a pressure load of 5 N for 10 ± 1 s
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
Substrate Bending
(Board flex)
Vibration
POST TEST PERFORMANCE
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20G peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
Mil-Std-202G, Method 213B, Condition I,
100G peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
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41
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
MECHANICAL PERFORMANCE CHARACTERISTICS
Resistance to Solder
Heat
At 260 °C, for 10 s, reflow
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solvents
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL94 VO with an
oxygen index of 32 %.
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
100
100
IMPEDANCE
ESR
IMPEDANCE
ESR
ESR/Z,Ω
ESR/Z, Ω
10
10
47 µF - 4 V
1
22 µF - 4 V
1
0.1
1
10
FREQUENCY, kHz
100
0.1
0.1
1000
10
100
1000
FREQUENCY, kHz
“M” Case
“M” Case
1000
1
1000
IMPEDANCE
ESR
IMPEDANCE
ESR
100
ESR/Z, Ω
ESR/Z, Ω
100
10
10
4.7 µF - 10 V
1
10 µF - 6 V
1
0.1
www.vishay.com
42
1
10
FREQUENCY, kHz
100
1000
0.1
0.1
1
For technical questions, contact: [email protected]
10
100
1000
FREQUENCY, kHz
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
10 000
1000
IMPEDANCE
ESR
IMPEDANCE
ESR
1000
ESR/Z, Ω
ESR/Z, Ω
100
10
100
1
0.1
1
10
FREQUENCY, kHz
100
1 µF - 16 V
10
10 µF - 10 V
1
0.1
1000
1
10
100
1000
FREQUENCY, kHz
“P” CASE
“P” CASE
100.0
1000.0
IMPEDANCE
IMPEDANCE
ESR
ESR
100.0
ESR, Z Ω
ESR/Z, Ω
10.0
10.0
1.0
1.0
33 µF - 10 V
4.7 µF - 25 V
0.1
0.1
0.1
1
10
100
0.1
1000
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
“P” CASE
“P” CASE
10.0
100.0
IMPEDANCE
ESR
IMPEDANCE
ESR
ESR, Z Ω
ESR, Z Ω
10.0
1.0
1.0
47 µF - 10 V
220 µF - 4 V
0.1
0.1
0.1
1
10
100
1000
0.1
1
FREQUENCY, kHz
Document Number: 40065
Revision: 01-Sep-08
For technical questions, contact: [email protected]
10
FREQUENCY, kHz
100
1000
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43
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 ± 0.004
[4.0 ± 0.10]
Tape Thickness
Deformation
Between
Embossments
0.014
[0.35]
MAX.
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Top
Cover
Tape
B1 MAX.
(Note 6)
10 Pitches Cumulative
Toler ance on T ape
± 0.008 [0.200]
Embossment
0.069 ± 0.004
0.079 ± 0.002
[1.75 ± 0.10]
[2.0 ± 0.05]
A0
K0
0.030 [0.75]
MIN.(Note 3)
B0
Top
Cover
Tape
0.004 [0.1]
MAX.
For Tape Feeder
Reference only
including draft.
Concentric around B0
(Note 5)
Center Lines
of Ca vity
20°
F
W
Maximum
Component
Rotation
0.030 [0.75]
MIN.(Note 4)
(Side or Front Sectional Vie w )
P1
USER DIRECTION OF FEED
Maximum
Cavity Siz e
(Note 1)
D1 MIN. For Components
0.079 x 0.047 [2.0 x 1.2] and Larger
.
(Note 5)
Cathode (-)
Anode (+)
Direction of Feet
Typical
Component
Cavity
Center Line
B0
Typical
Component
Center Line
A0
(Top View)
Tape and Reel Specifications: All case sizes are available on
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3
is also available. Standard reel diameter is 7" [178 mm],
13" [330 mm] reels are available and recommended as the most
cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
20° Maximum
Component Rotation
Tape
0.039 [1.0]
MAX.
0.9843 [250.0]
The most efficient packaging quantities are full reel increments on
a given reel diameter. The quantities shown allow for the sealed
empty pockets required to be in conformance with EIA-481-1. Reel
size and packaging orientation must be specified in the Vishay
Sprague part number.
Camber
(Top View)
Allo wable Camber to be 0.039/3.937 [1/100]
Non-Cumulative Ov er 9.843 [250.0]
Note:
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.)
F
K0
(MAX.)
P1
W
8 mm
0.108
[2.75]
0.039
[1.0]
0.138 ± 0.002
[3.5 ± 0.05]
0.054
[1.37]
0.157 ± 0.004
[4.0 ± 1.0]
0.315 ± 0.0118/- 0.0039
[8.0 ± 0.30/- 0.10]
298D
P
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44
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
PAPER TAPE AND REEL PACKAGING IN INCHES [millimeters]
T
Ø Do
P2
Po
[10 pitches cumulative tolerance
on tape ± 0.2 mm]
E1
Ao
Bottom Cover
Tape
F
W
Bo
E2
Top
Cover Tape
P1
Cavity Center Lines
Anode
Bottom Cover Tape
G
Cavity Size
Note 1
User Feed Direction
Figure 2
298D
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
P2
E
F
W
T
K
8 mm
0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002
[0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.1]
[2.0 ± 0.05] [1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2] [0.75 ± 0.05]
M
8 mm
0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002
[1.05 ± 0.05] [1.8 ± 0.05]
[1.5 ± 0.1]
[4.0 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.05] [1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2] [0.95 ± 0.05]
STANDARD PACKAGING QUANTITY
SERIES
298D
CASE CODE
QTY (PCS/REEL)
7" REEL
13" REEL
K
10 000
N/a
M
4000
N/a
P
3000
N/a
RECOMMENDED VOLTAGE DERATING GUIDELINES
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS
Capacitor Voltage Rating
4.0
6.3
10
16
20
25
35
50
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS
Capacitor Voltage Rating
4.0
6.3
10
16
20
25
35
50
Document Number: 40065
Revision: 01-Sep-08
Operating Voltage
2.5
3.6
6.0
10
12
15
24
28
Operating Voltage
2.5
3.3
5.0
8.0
10
12
15
24
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45
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
Vishay Sprague
POWER DISSIPATION
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + 25 °C (W) IN FREE AIR
CASE CODE
298D
K
0.015
M
0.025
P
0.045
RECOMMENDED REFLOW PROFILES
Tp °C
(tp)
Temperature (°C)
TL °C
Ts MAX. °C
(tL)
Ts MAX. °C
Preheat (ts)
25 °C
All Case Codes
TYPE
298D
TP
TP
lead (Pb)-free Sn/Pb
260 °C
TL
TL
TS MIN.
TS MIN.
TS MAX.
TS MAX.
tS
tS
lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb
tP
225 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 - 150
tL
60 - 90 60
PAD DIMENSIONS in inches [millimeters]
B
D
C
A
CASE CODE
A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
K
0.028 [0.70]
0.018 [0.45]
0.024 [0.60]
0.059 [1.50]
M
0.039 [1.00]
0.028 [0.70]
0.24 [0.60]
0.080 [2.00]
P
0.063 [1.60]
0.031 [0.80]
0.047 [1.20]
0.110 [2.80]
298D
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46
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
GUIDE TO APPLICATION
1.
where,
P=
RESR =
2.
6.
Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7.
Attachment:
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
I rms =
P
---------------R ESR
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series
resistance at the specified frequency.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
P
V rms = Z ---------------R ESR
or, from the formula:
V rms = I rms × Z
where,
P=
RESR =
Z=
2.1
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series
resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
3.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the DC
rating at + 85 °C and 1 % of the DC rating at + 125 °C.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
+ 85 °C
+ 125 °C
5.
DERATING FACTOR
1.0
0.9
0.4
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
Document Number: 40065
Revision: 01-Sep-08
Vishay Sprague
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
8.1
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
9.
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
For technical questions, contact: [email protected]
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47
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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