INTEGRATED CIRCUITS DATA SHEET TDA9817; TDA9818 Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators Product specification Supersedes data of 2001 Oct 19 2004 Jun 29 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 FEATURES • AC-coupled limiter amplifier for sound intercarrier signal • 5 V supply voltage • Alignment-free FM Phase-Locked Loop (PLL) demodulator with high linearity • Applicable for Intermediate Frequencies (IFs) of 38.9, 45.75 and 58.75 MHz • Sound IF (SIF) input for single reference Quasi Split Sound (QSS) mode (PLL controlled); SIF AGC detector for gain controlled SIF amplifier; single reference QSS mixer able to operate in high performance single reference QSS mode and in intercarrier mode • Gain controlled wide band Video IF (VIF) amplifier (AC-coupled) • True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics and excellent pulse response) • AM demodulator without extra reference circuit • Stabilizer circuit for ripple rejection and to achieve constant output signals • Robustness for over-modulation better than 105% due to gated phase detector at L/L accent standard and PLL-bandwidth control at negative modulated standards • ElectroStatic Discharge (ESD) protection for all pins. • Voltage Controlled Oscillator (VCO) frequency switchable between L and L accent (alignment external) picture carrier frequency GENERAL DESCRIPTION The TDA9817 is an integrated circuit for single standard vision IF signal processing and FM demodulation. • VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector for B/G, peak white detector for L; signal controlled reaction time for L The TDA9818 is an integrated circuit for multistandard vision IF signal processing, sound AM and FM demodulation. • Tuner AGC with adjustable TakeOver Point (TOP) • Automatic Frequency Control (AFC) detector without extra reference circuit ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9817T SO24 DESCRIPTION VERSION plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 TDA9817TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 TDA9818 SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 TDA9818T TDA9818TS 2004 Jun 29 SO24 SSOP24 2 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage 4.5 5 5.5 V IP supply current 76 90 104 mA Vi(VIF)(rms) vision IF input signal voltage sensitivity −1 dB video at output (RMS value) − 60 100 µV 0.97 1.1 1.23 V 7 8 − MHz 56 60 − dB Vo(CVBS)(p-p) video output signal voltage (peak-to-peak value) Bv(−3dB) −3 dB video bandwidth on pin CVBS S/NW weighted signal-to-noise ratio for video αIM(1.1) intermodulation attenuation at ‘blue’ f = 1.1 MHz 58 64 − dB αIM(3.3) intermodulation attenuation at ‘blue’ f = 3.3 MHz 58 64 − dB αH(sup) suppression of video signal harmonics 35 40 − dB Vi(SIF)(rms) sound IF input signal voltage sensitivity (RMS value) −3 dB at intercarrier output − 50 100 µV Vo(FM)(rms) audio output signal voltage for FM (RMS value) B/G standard; 27 kHz, 54% modulation 0.4 0.5 0.6 V M/N standard; 25 kHz modulation 0.36 0.45 0.54 V 0.4 0.5 0.6 V − 0.2 0.5 % − 0.5 1.0 % FM 55 60 − dB AM 47 53 − dB B/G and L standard; CL < 50 pF; RL > 1 kΩ; AC load Vo(AM)(rms) audio output signal voltage for AM (RMS value) L standard; 54% modulation THDaudio total harmonic distortion audio signal 54% modulation FM AM S/NW(audio) 2004 Jun 29 weighted signal-to-noise ratio audio signal 54% modulation 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... TAGC 14 TOP CBL CVAGC TPLL 22 15(1) 4 6 TUNER AGC VIF AGC LADJ VCO2 7(1) 19 VCO1 18 VP AFC 17 21 GND 20 VOLTAGE REFERENCE AFC DETECTOR VIF1 1 VIF SAW VIF2 2 VIF AMPLIFIER 4 SIF1 23 SIF SAW SIF2 24 VCO TWD FPLL VIDEO DEMODULATOR AND AMPLIFIER 16 CVBS 1.1 V (p-p) QSS MIXER INTERCARRIER MIXER AM DEMODULATOR SIF AMPLIFIER SOUND video TRAP 1 V (p-p) 8 AF Philips Semiconductors 2 × fpc Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators BLOCK DIAGRAM 2004 Jun 29 L/L accent switch and adjust audio intercarrier mode SIF AGC TDA9817 TDA9818 INTERCARRIER MODE SWITCH FM-PLL DEMODULATOR 3(1) 12 13 CSAGC STD QSS FMin 9 Vde-em (1) Not connected for TDA9817T and TDA9817TS. Fig.1 Block diagram. mute switch 11 Cde-em CDEC MHA663 Product specification standards selection switch handbook, full pagewidth 5.5 MHz 10 TDA9817; TDA9818 5 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 PINNING SYMBOL PIN DESCRIPTION VIF1 1 VIF differential input signal voltage 1 VIF2 2 VIF differential input signal voltage 2 STD 3 standards selection switch; note 1 CVAGC 4 VIF AGC capacitor CSAGC 5 SIF AGC capacitor TPLL 6 PLL filter VIF1 1 24 SIF2 VIF2 2 23 SIF1 STD 3 22 TOP CVAGC 4 21 VP CSAGC 5 20 GND TPLL 6 LADJ 7 AF 8 17 AFC Vde-em 9 16 CVBS LADJ 7 L/L accent switch and adjust; note 1 AF 8 audio output Vde-em 9 de-emphasis output Cde-em 10 de-emphasis input CDEC 11 QSS 12 decoupling capacitor single reference QSS/intercarrier output voltage FMin 13 sound intercarrier input voltage TAGC 14 tuner AGC output CBL 15 black level detector; note 1 CVBS 16 composite video output voltage AFC 17 AFC output VCO1 18 VCO1 resonance circuit VCO2 19 VCO2 resonance circuit GND 20 ground VP 21 supply voltage TOP 22 tuner AGC takeover point adjust SIF1 23 SIF differential input signal voltage 1 SIF2 24 SIF differential input signal voltage 2 Cde-em 10 19 VCO2 18 VCO1 15 CBL 14 TAGC CDEC 11 QSS 12 13 FMin mha664 Fig.2 Pin configuration SDIP24. Note 1. Not connected for TDA9817T and TDA9817TS. 2004 Jun 29 TDA9818 5 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators handbook, halfpage handbook, halfpage VIF1 1 24 SIF2 VIF1 1 24 SIF2 VIF2 2 23 SIF1 VIF2 2 23 SIF1 STD(1) 3 22 TOP STD(1) 3 22 TOP CVAGC 4 21 VP CVAGC 4 21 VP CSAGC 5 20 GND CSAGC 5 20 GND TPLL 6 TPLL 6 19 VCO2 AF 8 17 AFC Vde-em 19 VCO2 TDA9818T TDA9817T 18 VCO1 LADJ(1) 7 AF 8 17 AFC Vde-em 9 16 CVBS Cde-em 10 LADJ(1) 9 16 CVBS Cde-em 10 15 CBL(1) 14 TAGC CDEC 11 14 TAGC 13 FMin QSS 12 TDA9818TS 7 TDA9817TS 18 VCO1 (1) 15 CBL CDEC 11 13 FMin QSS 12 MGU397 MGU398 (1) Not connected for TDA9817T. (1) Not connected for TDA9817TS. Fig.3 Pin configuration SO24. 2004 Jun 29 TDA9817; TDA9818 Fig.4 Pin configuration SSOP24. 6 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators FUNCTIONAL DESCRIPTION proportional to the phase difference between the VCO and the input signal. The DC current of either frequency detector or phase detector is converted into a DC voltage via the loop filter, which controls the VCO frequency. In the event of positive modulated signals the phase detector is gated by composite sync in order to avoid signal distortion for overmodulated VIF signals. The integrated circuit comprises the functional blocks as shown in Fig.1: • Vision IF amplifier and VIF AGC detector • Tuner AGC • Frequency Phase Locked Loop detector (FPLL) • VCO, Travelling Wave Divider (TWD) and AFC VCO, Travelling Wave Divider (TWD) and AFC • Video demodulator and amplifier The VCO operates with a resonance circuit (with L and C in parallel) at double the picture carrier frequency. The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to actually double the picture carrier frequency is generated by the frequency-phase detector (FPLL) and fed via the loop filter to the first variable capacitor. This control voltage is amplified and additionally converted into a current which represents the AFC output signal. At centre frequency the AFC output current is equal to zero. • Sound IF amplifier and SIF AGC • Single reference QSS mixer • AM demodulator • FM-PLL demodulator • Audio Frequency (AF) signal processing • Internal voltage stabilizer. Vision IF amplifier and VIF AGC detector The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. For TDA9818: the VCO centre frequency can be decreased (required for L accent standard) by activating an additional internal capacitor. This is achieved by using the L accent switch. In this event the second variable capacitor can be controlled by a variable resistor at the L accent switch for setting the VCO centre frequency to the required L accent value. The AGC detector generates the required VIF gain control voltage for constant video output by charging/discharging the AGC capacitor. Therefore for negative video modulation the sync level and for positive video modulation the peak white level of the video signal is detected. In order to reduce the reaction time for positive modulation, where a very large time constant is needed, an additional level detector increases the discharging current of the AGC capacitor (fast mode) in the event of a decreasing VIF amplitude step. The additional level information is given by the black-level detector voltage. The oscillator signal is divided by 2 with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency. Video demodulator and amplifier The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the ‘in phase’ signal of the travelling wave divider output. In the demodulator stage the video signal polarity can be switched in accordance with the TV standard. Tuner AGC The AGC capacitor voltage is converted to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted at pin TADJ. This allows to match the tuner to the SAW filter in order to achieve the optimum IF input level. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics for B/G and L standard. The standard dependent level shift in this stage delivers the same sync level for positive and negative modulation. The video output signal at pin CVBS is 1.1 V (p-p) for nominal vision IF modulation, in order to achieve 1 V (p-p) at sound trap output. Frequency Phase Locked Loop detector (FPLL) The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current 2004 Jun 29 TDA9817; TDA9818 7 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 Sound IF amplifier and SIF AGC FM-PLL demodulator The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration. The FM-PLL demodulator consists of a limiter and an FM-PLL. The limiter provides the amplification and limitation of the FM sound intercarrier signal. The result is high sensitivity and AM suppression. The amplifier consists of 7 stages which are internally AC-coupled in order to minimize the DC offset. The SIF AGC detector is related to the SIF input signal (average level of AM or FM carrier) and controls the SIF amplifier to provide a constant SIF signal to the AM demodulator and single reference QSS mixer. At L standard (AM sound) the SIF AGC reaction time is set to ‘slow’ for nominal video conditions. But with a decreasing VIF amplitude step the SIF AGC is set to ‘fast’ mode controlled by the VIF AGC detector. In FM mode this reaction time is always ‘fast’. Furthermore the AF output signal can be muted by connecting a resistor between the limiter input pin FMin and ground. The FM-PLL consists of an integrated relaxation oscillator, an integrated loop filter and a phase detector. The oscillator is locked to the FM intercarrier signal, output from the limiter. As a result of locking, the oscillator frequency tracks with the modulation of the input signal and the oscillator control voltage is superimposed by the AF voltage. The FM-PLL operates as an FM demodulator. Single reference QSS mixer The single reference QSS mixer is realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass for attenuation of the video signal components to the output pin QSS. With this system a high performance hi-fi stereo sound processing can be achieved. Audio Frequency signal processing The AF amplifier consists of two parts: 1. The AF pre-amplifier for FM sound is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by approximately 33 dB. The low-pass characteristic of the amplifier reduces the harmonics of the intercarrier signal at the sound output terminal pin Vde-em at which the de-emphasis network for FM sound is applied. An additional DC control circuit is implemented to keep the DC level constant, independent of process spread. For a simplified application without a sound IF SAW filter the single reference QSS mixer can be switched to the intercarrier mode by connecting pin SIF2 to ground. In this mode the sound IF passes the vision IF SAW filter and the composite IF signal is fed to the single reference QSS mixer. This IF signal is multiplied with the 90 degree TWD output signal for converting the sound IF to intercarrier frequency. This composite intercarrier signal is fed to the output pin QSS, too. By using this quadrature detection, the low frequency video signals are removed. 2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail output stage. This amplifier makes use of an input selector for switching to AM, FM de-emphasis or mute state, controlled by the standard switching voltage and the mute switching voltage. AM demodulator The AM demodulator is realized by a multiplier. The modulated SIF amplifier output signal is multiplied in phase with the limited (AM is removed) SIF amplifier output signal. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the AF amplifier. 2004 Jun 29 Internal voltage stabilizer The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage. 8 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT TDA9817T, TDA9818 and TDA9818T: maximum chip temperature of 120 °C; note 1 − 5.5 V TDA9817TS and TDA9818TS: maximum chip temperature of 130 °C; note 1 − 5.5 V Vn voltage at pins VIF1, VIF2, STD, CVAGC, CSAGC, TPLL, Vde-em, Cde-em, CDEC, FMin, TAGC, CBL, AFC, VP, TOP, SIF1 and SIF2 0 VP V tsc(max) maximum short-circuit time to ground or VP − 10 s VTAGC tuner automatic gain control output voltage 0 13.2 V Tstg storage temperature −25 +150 °C Tamb ambient temperature −20 +70 °C Vesd electrostatic handling voltage −300 +300 V note 2 Notes 1. IP = 104 mA; Tamb = 70 °C; Rth(j-a) = 65 K/W for TDA9818, Rth(j-a) = 85 K/W for TDA9817T and TDA9818T, Rth(j-a) = 110 K/W for TDA9817TS and TDA9818TS. 2. Machine model class B (L = 2.5 µH). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA9818 65 K/W TDA9817T; TDA9818T 85 K/W TDA9817TS; TDA9818TS 110 K/W thermal resistance from junction to ambient in free air 2004 Jun 29 9 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 CHARACTERISTICS VP = 5 V; Tamb = 25 °C; see Table 1 for input frequencies and levels; input level Vi(VIF)(rms) = 10 mV (sync level for B/G, peak white level for L); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier B/G: 10%; L = 3%; video signal in accordance with “CCIR, line 17” or “NTC-7 Composite”; measurements taken in Fig.15; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin VP) VP supply voltage IP supply current note 1 4.5 5 5.5 V 76 90 104 mA Vision IF amplifier (pins VIF1 and VIF2) Vi(VIF)(rms) input signal voltage sensitivity (RMS value) B/G standard; −1 dB video at output − 60 100 µV Vi(VIF)(max)(rms) maximum input signal voltage (RMS value) B/G standard; 1 dB video at output 120 200 − mV ∆V(IF)(int) internal IF amplitude within AGC range; difference between picture B/G standard; and sound carrier ∆f = 5.5 MHz − 0.7 1 dB GIF(ctrl) IF gain control range 65 70 − dB see Fig.5 Ri(dif) differential input resistance note 2 1.7 2.2 2.7 kΩ Ci(dif) differential input capacitance note 2 1.2 1.7 2.5 pF VI(VIF) DC input voltage note 2 − 3.4 − V 125 130 − MHz K−1 True synchronous video demodulator; note 3 fVCO(max) maximum oscillator frequency for carrier regeneration ∆fosc/∆T oscillator drift as a function oscillator is free-running; of temperature IAFC = 0; note 4 − − ±20 × 10−6 ∆fosc/∆VP oscillator shift as a function of supply voltage − − ±1.5 × 10−3 V−1 VVCO(rms) oscillator voltage swing at pins VCO1 and VCO2 (RMS value) 50 80 110 fcr(pc) picture carrier capture range B/G, M/N and L standard ±1.4 ±1.8 − MHz L accent standard; fpc = 33.9 MHz; RLADJ = 5.6 kΩ ±0.9 ±1.2 − MHz ∆fpc(fr) picture carrier frequency (free-running) accuracy L accent standard; fpc = 33.9 MHz; RLADJ = 5.6 kΩ − ±200 ±400 kHz falgn(Laccent) L accent alignment frequency range L accent standard; IAFC = 0 ±400 ±600 − kHz tacq acquisition time BL = 70 kHz; note 5 − 30 ms 2004 Jun 29 f = 2fpc oscillator is free-running; note 4 10 − mV Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL Vi(VIF)(sens)(rms) PARAMETER VIF input signal voltage sensitivity for PLL to be locked (RMS value); pins VIF1 and VIF2 TDA9817; TDA9818 CONDITIONS maximum IF gain; note 6 MIN. TYP. MAX. UNIT − 30 70 µV 0.97 1.1 1.23 V 1.9 2.33 3.0 Composite video amplifier (pin CVBS); sound carrier off Vo(CVBS)(p-p) output signal voltage (peak-to-peak value) V/S ratio between video (black-to-white) and sync level ∆Vo(CVBS) output signal voltage difference difference between B/G and L standard − − ±12 % Vsync sync voltage level B/G and L standard 1.4 1.5 1.6 V Vclip(u) upper video clipping voltage level VP − 1.1 VP − 1 − V Vclip(l) lower video clipping voltage level − 0.7 0.9 V Ro output resistance − − 10 Ω Ibias(int) internal DC bias current for emitter-follower 2.2 3.0 − mA Io(sink)(max) maximum AC and DC output sink current 1.6 − − mA Io(source)(max) maximum AC and DC output source current 2.9 − − mA ∆Vo(CVBS)(B/G) deviation of CVBS output signal voltage at B/G standard 50 dB gain control − − 0.5 dB 30 dB gain control − − 0.1 dB ∆Vo(BL)(B/G) black level tilt in B/G standard gain variation; note 7 − − 1 % ∆Vo(BL)(L) vertical black level tilt for worst case in L standard vision carrier modulated by − test line (VITS) only; gain variation; note 7 − 1.9 % Gdif differential gain “CCIR, line 330” − 2 5 % ϕdif differential phase “CCIR, line 330” − 1 2 deg Bv(−1dB) −1 dB video bandwidth B/G and L standard; CL < 50 pF; RL > 1 kΩ; AC load 5 6 − MHz Bv(−3dB) −3 dB video bandwidth B/G and L standard; CL < 50 pF; RL > 1 kΩ; AC load 7 8 − MHz S/NW weighted signal-to-noise ratio see Fig.7; note 8 56 60 − dB S/N unweighted signal-to-noise see Fig.7; note 8 ratio 49 53 − dB 2004 Jun 29 see Fig.10 note 2 11 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL αIM(1.1) PARAMETER TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT intermodulation attenuation at ‘blue’ f = 1.1 MHz; see Fig.8; note 9 58 64 − dB intermodulation attenuation at ‘yellow’ f = 1.1 MHz; see Fig.8; note 9 60 66 − dB intermodulation attenuation at ‘blue’ f = 3.3 MHz; see Fig.8; note 9 58 64 − dB intermodulation attenuation at ‘yellow’ f = 3.3 MHz; see Fig.8; note 9 59 65 − dB ∆funwanted(p-p) robustness for unwanted frequency deviation of picture carrier (peak-to-peak value) L standard; residual carrier: 3%; serration pulses: 50%; note 2 − − 12 kHz ∆ϕ robustness for modulator imbalance L standard; residual carrier: 0%; serration pulses: 50%; note 2 − − 3 % αvc(rms) residual vision carrier (RMS value) fundamental wave and harmonics; B/G and L standard − 2 5 mV αH(sup) suppression of video signal harmonics note 10a 35 40 − dB αH(spur) spurious elements note 10b 40 − − dB PSRR power supply ripple rejection at pin CVBS video signal; grey level; see Fig.13 B/G standard 30 35 − dB L standard 26 30 − dB 1 1.25 mA 2.5 3.1 µA αIM(3.3) VIF AGC detector (pins CVAGC and CBL) Ich charging current B/G and L standard; note 7 0.75 additional charging current L standard in event of missing VITS pulses and no white video content Idch discharging current 1.9 B/G standard 15 20 25 µA normal mode L 225 300 375 nA fast mode L 30 40 50 µA tresp(inc) AGC response to an increasing VIF step B/G and L standard; note 11 − 0.05 0.1 ms/dB tresp(dec) AGC response to a decreasing VIF step B/G standard − 2.2 3.5 ms/dB fast mode L − 1.1 1.8 ms/dB normal mode L; note 11 − 150 240 ms/dB L standard −2 −6 −10 dB 1.95 2.0 2.05 V 1.6 1.66 1.72 V ∆IF VIF amplitude step for activating fast AGC mode Vth(CBL) threshold voltage level see Fig.10 additional charging current L standard L standard; fast mode L 2004 Jun 29 12 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL PARAMETER TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT Tuner AGC (pin TAGC) IF input signal voltage for minimum starting point of tuner takeover (RMS value) input at pins VIF1 and VIF2; RTOP = 22 kΩ; ITAGC = 0.4 mA − 2 5 mV IF input signal voltage for maximum starting point of tuner takeover (RMS value) input at pins VIF1 and VIF2; RTOP = 0 Ω; ITAGC = 0.4 mA 50 100 − mV Vo(TAGC) permissible output voltage from external source; note 2 − − 13.2 V Vsat(TAGC) saturation voltage ITAGC = 1.5 mA − − 0.2 V ∆VTOP(TAGC)/∆T variation of takeover point by temperature ITAGC = 0.4 mA − 0.03 0.07 dB/K ITAGC(sink) see Fig.5 no tuner gain reduction; VTAGC = 13.2 V − − 5 µA maximum tuner gain reduction 1.5 2 2.6 mA − 6 8 dB 33.9 MHz 0.5 0.75 1.0 µA/kHz 38.9 MHz 0.5 0.75 1.0 µA/kHz 45.75 MHz 0.45 0.65 0.85 µA/kHz 58.75 MHz 0.38 0.55 0.72 Vi(rms) ∆GIF sink current IF slip by automatic gain control tuner gain current from 20% to 80% AFC circuit (pin AFC); see Fig.9; note 12 CRstps ∆fIF/∆T Vo(AFC) control steepness ∆IAFC/∆f note 13 frequency variation by temperature output voltage µA/kHz 10−6 K−1 K−1 B/G and L standard; IAFC = 0; note 4 − − ±20 × L accent standard; IAFC = 0; note 4 − − ±60 × 10−6 upper limit VP − 0.6 VP − 0.3 − V lower limit − 0.3 0.6 V Io(source)(AFC) output source current 150 200 250 µA Io(sink)(AFC) output sink current 150 200 250 µA ∆IAFC(p-p) residual video modulation current (peak-to-peak value) − 20 30 µA 2004 Jun 29 B/G and L standard 13 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL PARAMETER TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT Sound IF amplifier (pins SIF1 and SIF2) Vi(SIF)(rms) Vi(max)(rms) input signal voltage sensitivity (RMS value) maximum input signal voltage (RMS value) FM mode; −3 dB at − intercarrier output pin QSS 50 100 µV AM mode; −3 dB at AF output pin AF 50 100 µV FM mode; 1 dB at 65 intercarrier output pin QSS 100 − mV AM mode; 1 dB at AF output pin AF 65 100 − mV FM and AM mode; see Fig.6 60 66 − dB − GSIF(ctrl) SIF gain control range Ri(dif) differential input resistance note 2 1.7 2.2 2.7 kΩ Ci(dif) differential input capacitance 1.2 1.7 2.5 pF VI(SIF) DC input voltage − 3.4 − V αSIF,VIF crosstalk attenuation between SIF and VIF inputs between pins VIF1 and VIF2, and pins SIF1 and SIF2; note 14 50 − − dB FM mode 8 12 16 µA note 2 SIF AGC detector (pin CSAGC) Ich(CSAGC) charging current Idch(CSAGC) discharging current AM mode 0.8 1.2 1.6 µA FM mode 8 12 16 µA normal mode AM 1 1.4 1.8 µA fast mode AM 60 85 110 µA QSS mode; sound carrier 1; sound carrier 2 off 100 140 180 mV L standard; without modulation 100 140 180 mV intercarrier mode; sound carrier 1; sound carrier 2 off − note 15 − mV Single reference QSS intercarrier mixer (B/G standard; pin QSS) Vo(rms) Vo(peak) IF intercarrier output level (RMS value) IF intercarrier output level (peak value) QSS mode 141 198 225 mV L standard; 80% AM modulation 255 356 458 mV Bs(−3dB) −3 dB intercarrier bandwidth upper limit 7.5 9 − MHz αsc(rms) residual sound carrier (RMS value) QSS mode; fundamental wave and harmonics − 2 5 mV intercarrier mode; fundamental wave and harmonics − 2 5 mV 2004 Jun 29 14 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL αvc(rms) PARAMETER residual vision carrier (RMS value) TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT QSS mode; fundamental wave and harmonics − 2 5 mV intercarrier mode; fundamental wave and harmonics − 5 20 mV αH(sup) suppression of video signal harmonics intercarrier mode; fvideo ≤ 5 MHz 39 − − dB Ro(QSS) output resistance note 2 − − 25 Ω VO(QSS) DC output voltage − 2.0 − V Iint(QSS) DC internal bias current for emitter follower 1.9 2.5 − mA Isink(max)(QSS) maximum AC and DC output sink current 1.4 1.9 − mA Isource(max)(QSS) maximum AC and DC output source current 3.0 3.5 − mA − − 100 µV − 250 400 µV 200 − − mV 46 50 − dB Limiter amplifier (pin FMin); note 16 Vi(FMin)(rms) input signal voltage for lock-in (RMS value) Vi(FMin)(rms) input signal voltage (RMS value) + N S - weighted ------------N = 40 dB allowed input signal voltage (RMS value) αAM AM suppression 50 µs de-emphasis; AM: f = 1 kHz; m = 0.3 refer to 27 kHz (54% FM deviation) Ri(FMin) input resistance note 2 VI(FMin) DC input voltage 480 600 720 Ω − 2.8 − V upper limit 7.0 − − MHz lower limit − − 4.0 MHz upper limit 9.0 − − MHz lower limit − − 3.5 MHz − − 4 µs FM-PLL demodulator fcr catching range of PLL fhr holding range of PLL tacq acquisition time 2004 Jun 29 15 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL PARAMETER TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT FM operation (B/G standard; pin AF); notes 16 and 16a Vo(AF)(rms) AF output signal voltage (RMS value) 27 kHz (54% FM deviation); see Fig.15; note 17 Rx = 470 Ω 200 250 300 mV Rx = 0 Ω 400 500 600 mV 25 kHz (50% FM deviation); Rx = 0 Ω; see Fig.15; note 17 360 450 540 mV Vo(AF)(clip) AF output clipping signal voltage level THD < 1.5% 1.0 − 1.2 V THD < 1.5%; note 17 − − ±53 kHz − 3 × 10−3 7 × 10−3 dB/K − 3.0 V ∆fAF frequency deviation ∆Vo/∆T temperature drift of AF output signal voltage Vde-em(DC) DC voltage at decoupling capacitor voltage dependent on VCO 1.2 frequency; note 18 RAF output resistance note 2 − − 100 Ω VAF DC output voltage − 2.3 − V Isink(max)(AF) maximum AC and DC output sink current − − 0.5 mA Isource(max)(AF) maximum AC and DC output source current − − 0.5 mA BAF(−3dB) −3 dB audio frequency bandwidth without de-emphasis capacitor 100 125 − kHz THD total harmonic distortion 27 kHz (54% FM deviation) − 0.2 0.5 % S/NW weighted signal-to-noise ratio FM-PLL only; with 50 µs de-emphasis; 27 kHz (54% FM deviation); “CCIR 468-4” 55 60 − dB αsc(rms) residual sound carrier (RMS value) fundamental wave and harmonics − − 75 mV αAF mute attenuation of AF signal B/G and L standard 70 75 − dB ∆VAF DC jump voltage of AF output terminal for switching AF output to mute state and vice versa FM-PLL in lock mode − ±50 ±150 mV PSRR power supply ripple rejection at pin AF Rx = 0 Ω; f = 70 Hz; see Figs 13 and 15 20 26 − dB 2004 Jun 29 16 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators SYMBOL PARAMETER TDA9817; TDA9818 CONDITIONS MIN. TYP. MAX. UNIT Single reference QSS AF performance for FM operation (B/G standard); see Table 1; notes 19, 20 and 21 S/NW weighted signal-to-noise ratio pc/sc1 ratio at pins VIF1 and VIF2; 27 kHz (54% FM deviation); “CCIR 468-4” black picture 40 − − dB 53 58 − dB white picture 50 55 − dB 6 kHz sine wave (black-to-white modulation) 42 48 − dB sound carrier subharmonics; f = 2.75 MHz ±3 kHz 45 51 − dB Intercarrier AF performance for FM operation (standard B/G); see Table 1; notes 19, 20 and 22 S/NW weighted signal-to-noise ratio pc/sc1 ratio at pins VIF1 27 and VIF2; 27 kHz (54% FM deviation); “CCIR 468-4” − − dB black picture 47 51 − dB white picture 47 51 − dB 6 kHz sine wave (black-to-white modulation) 40 46 − dB sound carrier subharmonics; f = 2.75 MHz ±3 kHz 35 39 − dB AM operation (L standard; pin AF); note 23 Vo(AF)(rms) AF output signal voltage (RMS value) 54% modulation 400 500 600 mV THD total harmonic distortion 54% modulation − 0.5 1.0 % BAF(−3dB) −3 dB AF bandwidth 100 125 − kHz S/NW weighted signal-to-noise ratio 47 53 − dB VAF DC potential voltage − 2.3 − V PSRR power supply ripple rejection at pin AF 20 26 − dB DC potential for logic B/G standard HIGH or pin not connected 2.8 − VP V DC potential for logic LOW L/L accent standard 0 − 0.8 V LOW level input current 190 250 310 µA “CCIR 468-4” see Fig.13 Switching level for standard switch (pin STD) Vlogic IIL 2004 Jun 29 Vi = 0 V 17 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 Notes 1. Values of video and sound parameters are decreased at VP = 4.5 V. 2. This parameter is not tested during production and is only given as an application information for designing the television receiver. 3. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d ≈ 3; calculated with sync level within gain control range). Resonance circuit of VCO: Q0 > 50; Cext = 8.2 pF ±0.25 pF; Cint ≈ 8.5 pF (loop voltage approximately 2.7 V). 4. Temperature coefficient of external LC circuit is equal to zero. 5. Vi(VIF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 6. VIF signal for nominal video signal. 7. The leakage current of the AGC capacitor should not exceed 1 µA at B/G standard, respectively 10 nA current at L standard. Larger currents will increase the tilt. 8. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin CVBS). B = 5 MHz weighted in accordance with “CCIR 567”. 9. The intermodulation figures are defined: V o at 4.4 MHz α 1.1 = 20 log -------------------------------------- + 3.6 dB ; α1.1 value at 1.1 MHz referenced to black/white signal; V o at 1.1 MHz V o at 4.4 MHz α 3.3 = 20 log -------------------------------------- ; α3.3 value at 3.3 MHz referenced to colour carrier. V o at 3.3 MHz 10. Measurements taken with SAW filter K3953 (sound carrier suppression: 40 dB); loop bandwidth BL = 70 kHz: a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; SIF SAW filter K9453; fvideo = 10 kHz to 10 MHz. 11. Response speed valid for a VIF input level range of 200 µV up to 70 mV. 12. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.9. The AFC-steepness can be changed by the resistors at pin AFC. 13. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0 > 50; note 3; C0 = Cint + Cext). 14. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF = 38.9 MHz. 15. Without using an SIF SAW filter the mixer can be switched to intercarrier mode by connecting pin SIF1 and/or pin SIF2 to ground. In this mode the SIF passes the VIF SAW filter and IF intercarrier levels are depending on the sound shelf of the VIF SAW filter. The intercarrier output signal at pin QSS can be calculated by the following formula taking into account the video output signal at pin CVBS (Vo(CVBS)(p-p) = 1.1 V typical) as a reference: 1 V o(rms) = 1.1 V ( p – p ) × ----------- × 10 2 2 V i(sc) ------------ ( dB ) + 6 dB ± 3 dB V i(pc) -------------------------------------------------------------20 where: 1 a) ----------- = correction term for RMS value 2 2 V i(sc) b) -------------- (dB) = sound-to-picture carrier ratio at VIF inputs in dB V i(pc) c) 6 dB = correction term of internal circuitry d) ±3 dB = tolerance of video output and intercarrier output amplitude Vo(rms) 2004 Jun 29 18 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 e) Example for SAW filter G1962: sound shelf value = 20 dB, V i(sc) ------------- = – 27 dB ⇒ V o(rms) = 32 mV (typical value) V i(pc) 16. Input level for second IF from an external generator with 50 Ω source impedance. AC-coupled with 10 nF capacitor, fmod = 1 kHz, 27 kHz (54% FM deviation) of audio references. A VIF/SIF input signal is not permitted. Pins CVAGC and CSAGC have to be connected to positive supply voltage for minimum IF gain. S/N and THD measurements are taken at 50 µs de-emphasis at pin Vde-em (modulator pre-emphasis has to be activated). The FM demodulator steepness ∆Vo(AF)/∆fAF is positive. a) Second IF input level 10 mV (RMS value). 17. Measured with an FM deviation of 27 kHz the typical AF output signal is 500 mV (RMS) (Rx = 0 Ω). By using Rx = 470 Ω the AF output signal is attenuated by 6 dB [250 mV (RMS)]. For handling a frequency deviation of more than 53 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended with Rx = 470 Ω. 18. The leakage current of the decoupling capacitor (2.2 µF) should not exceed 1 µA. 19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees b) QSS AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio) better than 60 dB (deviation 27 kHz) for 6 kHz sine wave black-to-white video modulation c) Picture-to-sound carrier ratio; pc/sc1 = 13 dB (transmitter). 20. The pc/sc1 ratio is calculated as the addition of TV transmitter pc/sc1 ratio and SAW filter pc/sc1 ratio. This pc/sc1 ratio is necessary to achieve the S/NW values as noted. A different pc/sc1 ratio will change these values. 21. Measurements taken with SAW filter K3953 for vision IF (suppressed sound carrier) and K9453 for sound IF (suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 27 kHz (54% FM deviation). 22. Measurements taken with SAW filter G1962 (sound shelf: 20 dB) for vision and sound IF. Pin SIF1 and/or pin SIF2 has to be connected to ground for switching the single reference QSS mixer to intercarrier mode. 23. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier). Table 1 Input frequencies and carrier ratios DESCRIPTION picture or IF carrier sound carrier picture-to-sound carrier 2004 Jun 29 SYMBOL B/G STANDARD M/N STANDARD L STANDARD L ACCENT STANDARD UNIT fpc or fIF 38.9 45.75/58.75 38.9 33.9 MHz fsc1 33.4 41.25/54.25 32.4 40.4 MHz fsc2 33.158 − − − MHz sc1 13 7 10 10 dB sc2 20 − − − dB 19 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 MHA665 70 handbook, full pagewidth gain 0.06 (dB) 60 Vi(VIF)(rms) (mV) 50 0.6 40 Ituner (mA) 0 30 (1) 6 (2) (3) (4) 20 1 10 60 0 2 −10 1 (1) Ituner; RTOP = 22 kΩ. (2) Gain. 1.5 2 2.5 3 3.5 4 VCVAGC (V) 4.5 (3) Ituner; RTOP = 11 kΩ. (4) Ituner; RTOP = 0 Ω. Fig.5 Typical VIF and tuner AGC characteristics. MHA666 110 handbook, full pagewidth 100 (dBµV) 100 Vi(SIF)(rms) (mV) 10 90 80 70 1 60 50 0.1 40 30 0.01 20 1 1.5 2 2.5 3 3.5 Fig.6 Typical SIF AGC characteristic (FM and AM mode). 2004 Jun 29 20 4 VCSAGC (V) 4.5 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 MED684 75 handbook, halfpage S/N (dB) 50 25 0 −60 −40 −20 0 20 Vi(VIF)(rms)(dB) 0.06 0.6 6 10 60 600 Vi(VIF)(rms)(mV) Fig.7 Typical signal-to-noise ratio as a function of IF input voltage. 3.2 dB handbook, halfpage 10 dB 13.2 dB 13.2 dB 27 dB 27 dB sc cc pc sc cc BLUE pc YELLOW MED685 sc = sound carrier, with respect to sync level. cc = chrominance carrier, with respect to sync level. pc = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter G1962). Fig.8 Input signal conditions. 2004 Jun 29 21 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators VP = 5 V −200 IAFC TDA9817 17 TDA9818 0 2.5 100 nF (source current) −100 22 kΩ 22 kΩ MHA667 VAFC IAFC (V) (µA) handbook, full pagewidth VP TDA9817; TDA9818 VAFC 100 (sink current) 200 38.5 38.9 39.3 f (MHz) Fig.9 Measurement conditions and typical AFC characteristic. handbook, full pagewidth 2.6 V white level 1.83 V black level 1.5 V sync level B/G and M/N standard 2.6 V white level 2.0 V threshold level 1.83 V black level 1.66 V threshold level sync level 1.5 V L standard MHA668 Fig.10 Typical video signal levels on output pin CVBS (sound carrier off). 2004 Jun 29 22 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators MHA669 10 TDA9817; TDA9818 MHA670 10 handbook, halfpage handbook, halfpage (1) (1) (dB) THD (%) (dB) −10 (2) −30 (3) 1.6 −10 1.2 −30 0.8 (2) −50 −50 0.4 (3) −70 −70 30 50 70 90 110 Vi (dBµV) 30 50 0 90 110 Vi (dBµV) 70 (1) Signal. (2) AM rejection. (3) Noise. (1) Signal. (2) THD. (3) Noise. Fig.11 Typical audio level, noise and AM rejection (54% FM deviation) for FM. Fig.12 Typical audio level, noise and THD (54% AM modulation) for AM. handbook, full pagewidth VP = 5 V 100 mV (fripple = 70 Hz) VP = 5 V TDA9817 TDA9818 MHA671 t Fig.13 Ripple rejection condition. 2004 Jun 29 23 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 140 handbook, full pagewidth 10 antenna input (dBµV) IF signals RMS value (V) video 1.1 V (p-p) 1 120 (1) 100 10−1 SAW insertion loss 14 dB IF slip 6 dB 80 10−2 (TOP) tuning gain control range 70 dB VIF AGC 10−3 0.66 × 10−3 60 SAW insertion loss 14 dB 10−4 40 40 dB RF gain 10−5 0.66 × 10−5 20 10 VHF/UHF tuner VIF VIF amplifier, demodulator and video tuner SAW filter TDA9817; TDA9818 MHA672 (1) Depends on TOP. Fig.14 Front end level diagram. 2004 Jun 29 24 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 INTERNAL CIRCUITRY Table 2 PIN NO. Equivalent pin circuits and pin voltages PIN SYMBOL DC VOLTAGE (V) 1 VIF1 3.4 2 VIF2 3.4 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) + 1 1.1 kΩ 800 Ω 650 µA + 1.1 kΩ 2 650 µA 3.4 V MHA673 3 STD(1) 0 to VP 3.6 V 26 kΩ 3 3.6 V 16 kΩ 24 kΩ MHA674 4 CVAGC 1.5 to 4.0 40 µA 4 Ib 1 mA 2.5 µA 0.3/20/40 µA MHA675 2004 Jun 29 25 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators PIN NO. 5 PIN SYMBOL CSAGC DC VOLTAGE (V) TDA9817; TDA9818 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 1.5 to 4.0 + 15 µA 5 Ib + + + ±1 µA MHA676 6 PLL 1.5 to 4.0 + + + + + Ib 6 VCO 200 µA MHA677 7 LADJ(1) 0 to VP + 100 µA 7.6 kΩ + 7 9 kΩ 17 kΩ 100 µA 9 kΩ 7.2 kΩ 3.6 V 1V 2.5 V MHA678 2004 Jun 29 26 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators PIN NO. 8 PIN SYMBOL AF DC VOLTAGE (V) TDA9817; TDA9818 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 2.3 + + 21.7 kΩ 8 25 pF 23.7 kΩ 120 Ω MHA679 9 Vde-em 2.3 10 Cde-em 2.3 5.6 kΩ + 8.4 kΩ 10 pF 9 39 kΩ 8.4 kΩ 290 Ω 27.4 kΩ 5.6 kΩ + 10 3.5 kΩ MHA680 11 CDEC 1.2 to 3.0 + + + 90 µA 11 1 kΩ MHA681 2004 Jun 29 27 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators PIN NO. 12 PIN SYMBOL QSS DC VOLTAGE (V) TDA9817; TDA9818 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 2.0 + 150 Ω 1.9 mA 12 14.7 kΩ MHA682 13 FMin 2.65 400 Ω 13 640 Ω 40 kΩ 35 µA 2.65 V 600 µA MHA683 14 TAGC 0 to 13.2 14 MHA684 15 CBL(1) 0 to 3.2 + 5 µA + 2.5 µA + 0.15 µA + 2.5 µA 15 30 µA + 10 µA + 16 µA 10 µA 2.5 µA MHA685 2004 Jun 29 28 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators PIN NO. 16 PIN SYMBOL CVBS DC VOLTAGE (V) TDA9817; TDA9818 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) sync level: 1.5 + 100 Ω 2.1 pF 3.0 mA 16 MHA686 17 AFC 0.3 to VP − 0.3 + + IAFC ±200 µA 17 MHA687 18 VCO1 2.7 19 VCO2 2.7 + 420 Ω 420 Ω + 50 Ω 18 B/G 2.8 V 20 kΩ 20 kΩ L accent 19 500 µA MHA688 20 GND 0 21 VP VP 2004 Jun 29 29 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators PIN NO. 22 PIN SYMBOL TOP DC VOLTAGE (V) TDA9817; TDA9818 EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT) 0 to 1.9 30 kΩ 20 kΩ 3.6 V 9 kΩ 22 1.9 V MHA689 23 SIF1 3.4 24 SIF2 3.4 + 23 + 100 µA 1.1 kΩ 400 µA 5 kΩ 10 kΩ 1.8 V 1.1 kΩ + 24 800 Ω 3.4 V 400 µA MHA690 Note 1. Not connected for TDA9817T and TD9817TS. 2004 Jun 29 30 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 22 kΩ 100 nF 1:1 SIF input 50 Ω 1 5 2 4 22 kΩ 1.1 V (p-p) video GND tuner AGC TOP (1) 10 nF 22 kΩ 100 nF CBL 5.6 kΩ 3 24 23 22 21 19 20 18 17 15(2) 16 10 nF 14 13 TDA9817 TDA9818 31 intercarrier mode 1 2 3(2) 4 5 mute switch 7(2) 6 8 9 10 12 11 1:1 1 VIF input 50 Ω 5 2 330 Ω 4 2.2 µF 3 2.2 µF AF 22 output kΩ 220 nF 2.4 kΩ 22 nF Rx CDEC Philips Semiconductors AFC Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TEST AND APPLICATION INFORMATION 2004 Jun 29 VP 22 µF QSS intercarrier output 560 Ω 5.5 MHz(3) MHA691 L/L accent switch and adjust handbook, full pagewidth loop filter Fig.15 Test circuit. de-emphasis ≈50 µs Product specification (1) See Table 3. (2) Not connected for TDA9817T and TDA9817TS. (3) Depends on TV standard. SIF AGC TDA9817; TDA9818 standards VIF selection AGC switch This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 22 kΩ 100 nF 15 µH 22 kΩ tuner AGC GND IF input TOP SAW FILTER K9453 (1) 10 nF 22 kΩ 330 Ω CBL 100 nF 5.6 kΩ SIF (3) 23 24 22 21 19 20 18 17 15(2) 16 10 nF 14 13 TDA9817 TDA9818 32 intercarrier mode 1 2 3(2) 4 5 mute switch 7(2) 6 8 9 10 12 11 VIF 50 Ω SAW FILTER K3953 330 Ω 2.2 µF (3) 2.2 µF AF 22 output kΩ 220 nF 2.4 kΩ 22 nF CDEC Philips Semiconductors 1 V (p-p) video AFC Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators 2004 Jun 29 VP Rx 22 µF QSS intercarrier output 560 Ω 5.5 MHz(3) MHA692 L/L accent switch and adjust handbook, full pagewidth loop filter Fig.16 Application circuit. de-emphasis ≈50 µs Product specification (1) See Table 3. (2) Not connected for TDA9817T and TDA9817TS. (3) Depends on TV standard. SIF AGC TDA9817; TDA9818 standards VIF selection AGC switch Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators Table 3 TDA9817; TDA9818 Oscillator circuit for the different TV standards PARAMETER EUROPE USA JAPAN IF frequency 38.9 MHz 45.75 MHz 58.75 MHz VCO frequency 77.8 MHz 91.5 MHz 117.5 MHz Oscillator circuit 18 CVCO C(C9) 8.5 pF 8.2 pF 19 e.g. Toko coil Philips ceramic capacitor 2004 Jun 29 18 L(F4) 251 nH CVCO C(C9) 8.5 pF 10 pF 19 MHA693 18 L(F4) 163 nH MHA694 CVCO C(C9) 8.5 pF 15 pF 19 L(F4) 78 nH MHA695 5KM 369SNS-2010Z 5KMC V369SCS-2370Z MC 139 NE545SNAS100108 2222 632 51828 inside of coil 15 pF SMD; size = 0805 33 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 ME seating plane D A2 A A1 L c e Z b1 (e 1) w M MH b 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 22.3 21.4 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-02-04 03-02-13 SOT234-1 2004 Jun 29 EUROPEAN PROJECTION 34 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013 2004 Jun 29 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 35 o 8 o 0 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 2004 Jun 29 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 36 o Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all the BGA, HTSSON..T and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Surface mount packages REFLOW SOLDERING The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor 2004 Jun 29 37 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 2004 Jun 29 TDA9817; TDA9818 38 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD PACKAGE(1) MOUNTING WAVE Through-hole mount CPGA, HCPGA REFLOW(2) DIPPING suitable − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) − − Through-holesurface mount PMFP(4) not suitable not suitable − Surface mount BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(6) suitable − PLCC(7), SO, SOJ suitable suitable − not recommended(7)(8) suitable − SSOP, TSSOP, VSO, VSSOP not recommended(9) suitable − CWQCCN..L(11), PMFP(10), WQCCN32L(11) not suitable not suitable − LQFP, QFP, TQFP Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2004 Jun 29 39 Philips Semiconductors Product specification Single/multistandard VIF/SIF-PLL and FM-PLL/AM demodulators TDA9817; TDA9818 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Jun 29 40 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R25/03/pp41 Date of release: 2004 Jun 29 Document order number: 9397 750 13463