INTEGRATED CIRCUITS DATA SHEET TDA9820 Multistandard/dual channel TV FM intercarrier sound demodulator Product specification Supersedes data of March 1991 File under Integrated Circuits, IC02 1996 Nov 20 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 FEATURES GENERAL DESCRIPTION • Multistandard application for sound standards M, B/G, I and D/K The TDA9820 is a monolithic, integrated, multistandard TV FM intercarrier sound demodulator for all FM standards. The circuit contains two separate FM demodulators using Phase Locked Loop (PLL) reference frequency generation. The circuit requires a minimum number of external components. • Two alignment-free PLL FM demodulators • Four-input source selector for one of the two FM demodulators • Automatic second sound carrier mute • Mono and dual channel application • Low power consumption • Few external components required. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pin 14) 4.5 5.0 8.8 V IP supply current (pin 14) 23 30 37 mA IM AC peak current (pins 7 and 8) − − 1.5 mA Vi(rms) input signal (RMS value) − 150 250 µV Vo(rms) output signal (pins 7 and 8; RMS value) ∆fi = ±50 kHz 0.4 0.5 0.6 V S+N -------------N signal plus noise-to-noise ratio (pins 7 and 8) in accordance with “CCIR 468-3” 64 68 − dB α8/7 crosstalk attenuation f = 50 to 12500 Hz 60 70 − dB RR supply voltage ripple rejection (pins 7 and 8) VRR < 200 mV; f = 70 Hz 16 20 − dB Tamb operating ambient temperature 0 − 70 °C S+N -------------- = 40 dB N ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA9820 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA9820T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1996 Nov 20 2 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 BLOCK DIAGRAM Rs (1) 4.5 MHz (M) handbook, full pagewidth 9 5.5 MHz (B/G) + − 3 6.0 MHz (I) 8 V AF1 TDA9820 1 16 2 7-STAGE LIMITER AMPLIFIER 1 6.5 MHz (D/K) intercarrier VCO 1 7-STAGE LIMITER AMPLIFIER 2 15 4.72 MHz (M) or 5.74 MHz (B/G) or 6.74 MHz (D/K) 5 S1 CONTROL UNIT 6 S2 − + 7 VCO 2 SUPPLY mute 13 14 12 11 10 optional stereo channel separation adjustment VCO ref VP = 4.5 to 8.8 V MHA420 (1) Rpot (1) Resistor and potentiometer between capacitor and earth are inserted if adjustment of stereo channel separation is required. Fig.1 Block diagram. 1996 Nov 20 standard switch 3 V AF2 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 PINNING SYMBOL PIN DESCRIPTION IN1(B/G) 1 intercarrier input 1 at 5.5 MHz IN1(D/K) 2 intercarrier input 1 at 6.5 MHz IN1(M) 3 intercarrier input 1 at 4.5 MHz n.c. 4 not connected S1 5 S2 6 IN1(B/G) 1 16 IN1(I) IN1(D/K) 2 15 IN2 standard switch bit 1 input IN1(M) 3 14 VP standard switch bit 2 input n.c. 4 VAF2 7 audio output voltage 2 VAF1 8 audio output voltage 1 C1 9 decoupling capacitor 1 C2 10 decoupling capacitor 2 VCOref 11 VCO reference CSTAB 12 supply voltage stabilization GND 13 ground VP 14 supply voltage IN2 15 intercarrier input 2 IN1(I) 16 intercarrier input 1 at 6.0 MHz 1996 Nov 20 handbook, halfpage S1 5 13 GND TDA9820 12 CSTAB 11 VCOref S2 6 VAF2 7 10 C2 VAF1 8 9 C1 MHA529 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 FUNCTIONAL DESCRIPTION Stereo channel separation adjustment (optional) The complete circuit consists of two separate channels, each consisting of a limiter-amplifier, FM demodulator and AF amplifier. Circuit operation is also described in Fig.1. Optimal stereo channel separation is achieved by adjusting VAF1 (pin 8) and VAF2 (pin 7) as follows: 1. VAF1 by a resistor in series with the DC decoupling capacitor at pin 9 Source selector 2. VAF2 by a variable resistor in series with the DC decoupling capacitor on pin 10 to the same voltage as VAF1. The intercarrier signal is fed through external ceramic band-pass filters which are tuned to the sound carrier frequencies. Second sound carrier mute One of the four filtered sound carriers from pins 1, 2, 3 or 16 is fed to limiter-amplifier 1 via the appropriate electronic switch in the source selector. The electronic switch of the sound carrier is selected by the control unit (see Table 1). The output of the second FM demodulator is muted when the signal level (signal and/or noise) at pin 15 is less than typically 0.5 mV (RMS value). This avoids an incorrect stereo or dual sound identification when a mono signal is transmitted. Therefore, with a mono transmission, there is no audio output at pin 7. When the signal level at pin 15 is greater than typically 1.0 mV (RMS value) mute is switched off. The second sound carrier of the intercarrier signal is directly fed from pin 15 to limiter-amplifier 2. FM demodulators Each limiter-amplifier is AC-coupled into a FM demodulator. The integrated FM demodulator PLLs are alignment-free. The FM demodulator outputs are amplified to 500 mV (RMS value). High amplification and DC error signals of the PLLs, which are superimposed on the FM demodulator outputs, require DC decoupling at pins 9 and 10 of the AF amplifier inputs. Control unit The control unit selects the required sound standard according to the voltages on pin 5 and pin 6. The control unit performs the following: 1. selects the free-running frequencies of VCO1 and VCO2 2. switches the source selector (the four possible combinations are shown in Table 1). Table 1 Logic table; note 1 S1 (PIN 5) S2 (PIN 6) FREQUENCY VCO1 (MHz) FREQUENCY VCO2 (MHz) SOURCE SELECTOR CONNECTION B/G 1 1 5.5 5.74 pin 1 M 1 0 4.5 4.72 pin 3 I 0 1 6.0 off pin 16 D/K 0 0 6.5 6.74 pin 2 STANDARD Note 1. In columns S1 and S2: 0 = LOW and 1 = HIGH. 1996 Nov 20 5 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage (pin 14) −0.5 +9.0 V Vi input signal (pins 1, 2, 3, 15 and 16) −0.5 +5.0 V Vsw switching voltage (pins 5 and 6) −0.5 VP + 0.5 V ts short-circuit time (each pin except pins 13 and 14 to be tested; one at the time) − 10 s Tstg storage temperature −25 +125 °C device −25 +85 °C Tj junction temperature − 150 °C Tamb operating ambient temperature 0 70 °C Ves electrostatic handling for all pins note 1 −500 +500 V note 2 −4000 +4000 V device in packing Notes 1. Equivalent to discharging a 200 pF capacitor via a 0 Ω series resistor. 2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER VALUE UNIT TDA9820 (DIP16) 74 K/W TDA9820T (SO16) 104 K/W thermal resistance from junction to ambient in free air 1996 Nov 20 6 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 CHARACTERISTICS All voltages are measured to GND (pin 13); VP = 5 V; Tamb = 25 °C; ∆fi = ±50 kHz; fmod = 1 kHz; V1, 2, 3, 16/15 = 10 mV (RMS value); measurements taken in Fig.5; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin 14) VP supply voltage 4.5 5.0 8.8 V IP supply current 23 30 37 mA activated input 2.25 2.5 2.75 V not activated input − − 0.1 V Source selector and limiter-amplifier 1 (pins 1, 2, 3 and 16) VI RI Vi(rms) DC input voltage input resistance input signal (RMS value) activated input 480 600 720 Ω not activated input − − 600 Ω − 150 250 µV 200 − − mV 40 50 − dB 2.25 2.5 2.75 V 150 250 µV S+N -------------- = 40 dB N allowed input signal (RMS value) αct crosstalk attenuation not activated input to activated input Limiter-amplifier 2 V15 DC input voltage V15(rms) input signal (RMS value) − S+N -------------- = 40 dB ; note 1 N input signal for mute off (RMS value) 0.7 1.0 1.5 mV allowed input signal (RMS value) 200 − − mV R15 input resistance 480 600 720 Ω δ hysteresis of level detector 8 12 16 dB − 4.5 − MHz − 5.5 − MHz − 6.0 − MHz − 6.5 − MHz − 4.7 − MHz − 5.7 − MHz − 6.7 − MHz − − 10 % PLL FM demodulators VCO1 and VCO2 fVCO1 fVCO2 free-running frequencies free-running frequencies R11 = 27 kΩ; see Table 1 R11 = 27 kΩ; see Table 1 ∆ffr negative/positive free-running frequency spread D/∆ffr drift of free-running frequencies Tamb = 0 to 70 °C − 500 750 kHz ∆ffr(shift) shift of free-running frequencies 4.5 V < VP < 8.8 V − 200 300 kHz ∆ffr(ar) negative/positive adjustment range of free-running frequencies R11 = 22 kΩ 1 − − MHz R11 adjustment resistance for free-running frequencies (pin 11) 15 − 29 kΩ 1996 Nov 20 7 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator SYMBOL TDA9820 PARAMETER CONDITIONS S negative slope of free-running frequency R11 = 22 kΩ adjustment ∆f1 negative/positive catching range of PLLs ∆f2 negative/positive holding range of PLLs MIN. − TYP. MAX. UNIT 200 − kHz/kΩ 1.4 1.9 − MHz 2.0 3.0 − MHz Output amplifiers AF1 (pin 8) and AF2 (pin 7) VO DC output voltage 1.8 2.1 2.5 V Vo(rms) output signal (RMS value) 0.4 0.5 0.6 V 1.2 − − V clipping level IM AC peak current − − 1.5 mA IO DC source current − − 2.0 mA ∆Vo/Vo absolute drift of AF output signals Tamb = 0 to 70 °C − 0.7 − dB ∆Vo1/∆Vo2 relative drift of AF output signals Tamb = 0 to 70 °C − 0.2 − dB ∆VAF(1-2) negative/positive difference between output signals 50 µs de-emphasis − 0.3 1.0 dB Ro output resistance − 100 150 Ω αcs(ar) adjustment range of channel separation Rs = 1.1 kΩ; Rpot = 2.2 kΩ 1.5 − − dB THD total harmonic distortion 50 µs de-emphasis pin 8 − 0.1 0.3 % pin 7 − 0.25 0.5 % αAM AM suppression of AF(1-2) 50 µs de-emphasis; m = 0.3; fAM = 1 kHz 46 66 − dB S+N -------------N signal plus noise-to-noise ratio 50 µs de-emphasis; in accordance with “CCIR 468-3” 64 68 − dB LOW-level AF frequency response ∆VAF(1-2) = −3 dB − − 20 Hz HIGH-level AF frequency response 200 − − kHz AMres(rms) residual sound carrier signal and harmonics (RMS value) − 50 80 mV α8/7 crosstalk attenuation between AF outputs f = 50 to 12500 Hz 60 70 − dB RR supply voltage ripple rejection VRR < 200 mV; fr = 20 Hz to 200 kHz VP = 5 V 16 20 − dB VP = 8 V 24 28 − dB 18 24 − dB AFresp RR supply voltage ripple rejection with improved application for VP = 5 V fr = 20 Hz to 3 kHz; see Fig.3 and note 2 VP = 4.5 V 1996 Nov 20 VP = 4.75 V 21 27 − dB VP = 5.0 V 24 30 − dB VP = 5.5 V 21 27 − dB 8 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator SYMBOL TDA9820 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Control unit; see Table 1 V5,6 voltage for LOW level 0 − 0.8 V I5,6 source current for LOW level 0 < V5,6 < 0.8 − 180 250 µA R5,6 allowed resistance to ground 0 < V5,6 < 0.8 (LOW-level) − − 3.0 kΩ V5 voltage for HIGH level note 3 2.2 − VP V V6 voltage for HIGH level note 3 1.8 − VP V I5,6 sink current for HIGH level V5, 6 = VP − − 10 µA Notes 1. The output signal at pin 7 can only be measured when mute is disabled. This is achieved by inserting a resistor of 2.7 kΩ between pin 15 and ground. In this event the input impedance is 490 Ω. 2. Improvement of ripple rejection is possible by connecting series RC between pin 11 and pin 14 (15 kΩ + 2.2 µF; see Fig.5) for a supply voltage of 4.5 to 5.5 V. The rejection of ripple frequencies up to 3 kHz is improved, but up to 200 kHz is worse; see Fig.3. 3. An open pin (n.c.) is interpreted as HIGH. MHA530 40 handbook, full pagewidth RR (dB) (1) 30 (2) 20 10 0 4 5 6 7 The curves are typical and valid for ripple frequencies between 50 Hz and 3 kHz. Conditions: input signal: f = 5.5 MHz, 10 mV (RMS value); ripple on VP = 100 mV (RMS value), fr = 1 kHz; ripple rejection measurement: unweighted RMS. (1) Without RC. (2) With R = 15 kΩ and C = 2.2 µF. Fig.3 Typical improvement. 1996 Nov 20 9 8 VP (V) 9 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 INTERNAL CIRCUITRY handbook, full pagewidth 3.5 V 16 3.5 V 14 15 13 12 11 10 AF2 + 620 Ω 670 Ω 5.5 kΩ 5.5 kΩ 5 kΩ 10 k Ω 3 kΩ 3.5 V 3.5 V 620 Ω 620 Ω 620 Ω 5.5 kΩ 5.5 kΩ 5.5 kΩ 2 30 kΩ 3.6 V 4 50 kΩ 50 kΩ 2.54 V 2.54 V 2 mA 2 mA 3.6 V 13 kΩ 23 kΩ 1 kΩ 6 kΩ n.c. 3 3 kΩ 300 µA 3.6 V 6 kΩ 1 AF1 5 kΩ TDA9820 3.5 V 9 100 Ω 5 6 100 Ω 7 8 MHA421 Fig.4 Internal circuitry. 1996 Nov 20 10 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 TEST AND APPLICATION INFORMATION optional stereo channel separation adjustment intercarrier handbook, full pagewidth 6.0 MHz 4.72 MHz, or 5.74 MHz, or 6.74 MHz VP 10 µF 2.2 nF 2.2 nF 600 Ω 600 Ω 2.2 µF 27 kΩ 10 nF 2.2 µF 15 kΩ 15 14 13 Rs 1.1 kΩ 2.2 µF 2.2 µF (1) (1) 16 Rpot 2.2 kΩ 12 11 10 9 6 7 8 TDA9820 1 2 3 4 5 22 nF 2.2 kΩ 600 Ω 600 Ω 600 Ω 2.2 nF 2.2 nF 2.2 nF 5.5 MHz 6.5 MHz 4.5 MHz n.c. 22 nF 2.2 kΩ S1 intercarrier S2 VAF2 VAF1 without de-emphasis VAF2 VAF1 with 50 µs de-emphasis MHA422 (1) See note 2 of Chapter “Characteristics”. Fig.5 Test circuit. 1996 Nov 20 11 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 VP handbook, full pagewidth (1) (1) R16 R15 6.0 MHz 5.74 MHz 10 µF 2.2 µF 10 nF 16 15 14 13 2.2 µF 27 kΩ 12 2.2 µF 11 10 9 6 7 8 TDA9820 1 2 5.5 MHz 6.5 MHz (1) R1 3 5 MHA423 4.5 MHz (1) R2 4 n.c. S1 (1) R3 intercarrier (1) Resistor value depends on filter. Fig.6 Application circuit. 1996 Nov 20 12 S2 VAF2 VAF1 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1996 Nov 20 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 13 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1996 Nov 20 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-24 14 o 8 0o Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Nov 20 15 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Nov 20 16 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 NOTES 1996 Nov 20 17 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 NOTES 1996 Nov 20 18 Philips Semiconductors Product specification Multistandard/dual channel TV FM intercarrier sound demodulator TDA9820 NOTES 1996 Nov 20 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1200/02/pp20 Date of release: 1996 Nov 20 Document order number: 9397 750 01009