OL-PCF8576DU_DA Wire bond die; 59 bonding pads 10 February 2016 Package information 1. Package summary Terminal position code U (upper) Package type descriptive code UC Package style descriptive code UC (uncased chip) Package style suffix code NA (not applicable) Package body material type X (other) IEC package outline code --- JEDEC package outline code --- JEITA package outline code --- Mounting method type S (surface mount) Issue date 26-10-2011 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length - - 2.2 - mm E package width - - 2 - mm A seated height - - 0.38 - mm e nominal pitch - - 0.072 - mm n2 actual quantity of termination - - 59 - OL-PCF8576DU_DA NXP Semiconductors Wire bond die; 59 bonding pads 2. Package outline Wire bond die; 59 bonding pads PCF8576DU/DA D A 35 (1) 22 21 36 x 0 e E 0 y X 51 9 C2 52 59 1 8 C1 P4 P3 P2 P1 detail X 0 0.5 1 mm scale Notes 1. Marking code: PC8576D-2 Outline version pcf8576du_da_do References IEC JEDEC JEITA European projection Issue date 08-12-10 10-12-20 PCF8576DU/DA Fig. 1. Package outline OL-PCF8576DU_DA OL-PCF8576DU_DA Package information All information provided in this document is subject to legal disclaimers. 10 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/4 OL-PCF8576DU_DA NXP Semiconductors Wire bond die; 59 bonding pads 3. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. OL-PCF8576DU_DA Package information All information provided in this document is subject to legal disclaimers. 10 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/4 OL-PCF8576DU_DA NXP Semiconductors Wire bond die; 59 bonding pads 4. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Legal information......................................................... 3 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 February 2016 OL-PCF8576DU_DA Package information All information provided in this document is subject to legal disclaimers. 10 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/4