INTEGRATED CIRCUITS DATA SHEET 74AHC1G00; 74AHCT1G00 2-input NAND gate Product specification Supersedes data of 2002 Feb 27 2002 May 27 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 FEATURES DESCRIPTION • Symmetrical output impedance The 74AHC1G/AHCT1G00 is a high-speed Si-gate CMOS device. • High noise immunity • ESD protection: The 74AHC1G/AHCT1G00 provides the 2-input NAND function. – HBM EIA/JESD22-A114-A exceeds 2000 V – MM EIA/JESD22-A115-A exceeds 200 V – CDM EIA/JESD22-C101 exceeds 1000 V. • Low power dissipation • Balanced propagation delays • Very small 5-pin package • Output capability: standard • Specified from −40 to +125 °C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT AHC1G tPHL/tPLH propagation delay A and B to Y CI input capacitance CPD power dissipation capacitance CL = 15 pF; VCC = 5 V CL = 50 pF; f = 1 MHz; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. 2002 May 27 2 AHCT1G 3.5 3.6 ns 1.5 1.5 pF 17 18 pF Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 FUNCTION TABLE See note 1. INPUTS OUTPUT A B Y L L H L H H H L H H H L Note 1. H = HIGH voltage level; L = LOW voltage level. ORDERING INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE MARKING 74AHC1G00GW −40 to +125 °C 5 SC-88A plastic SOT353 AA 74AHCT1G00GW −40 to +125 °C 5 SC-88A plastic SOT353 CA 74AHC1G00GV −40 to +125 °C 5 SC-74A plastic SOT753 A00 74AHCT1G00GV −40 to +125 °C 5 SC-74A plastic SOT753 C00 PINNING PIN SYMBOL DESCRIPTION 1 B data input B 2 A data input A 3 GND ground (0 V) 4 Y data output Y 5 VCC supply voltage 2002 May 27 3 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 handbook, halfpage B 1 A 2 GND 5 VCC handbook, halfpage 00 3 4 Y 1 B 2 A Y 4 MNA097 MNA096 Fig.1 Pin configuration. handbook, halfpage 1 Fig.2 Logic symbol. handbook, halfpage & B 4 2 Y A MNA098 MNA099 Fig.3 IEC logic symbol. 2002 May 27 Fig.4 Logic diagram. 4 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 RECOMMENDED OPERATING CONDITIONS 74AHC1G SYMBOL PARAMETER 74AHCT1G CONDITIONS UNIT MIN. TYP. MAX. MIN. VCC supply voltage 2.0 5.0 5.5 4.5 VI input voltage 0 − 5.5 VO output voltage 0 − VCC Tamb operating ambient temperature see DC and AC −40 characteristics per device +25 tr, tf (∆t/∆f) input rise and fall times VCC = 3.3 ±0.3 V − VCC = 5 ±0.5 V − TYP. MAX. 5.0 5.5 V 0 − 5.5 V 0 − VCC V +125 −40 +25 +125 °C − 100 − − − ns/V − 20 − − 20 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK input diode current − −20 mA VI < −0.5 V IOK output diode current VO < −0.5 V or VO > VCC + 0.5 V; note 1 − ±20 mA IO output source or sink current −0.5 V < VO < VCC + 0.5 V − ±25 mA ICC VCC or GND current − ±75 mA Tstg storage temperature −65 +150 °C PD power dissipation per package − 250 mW for temperature range from −40 to +125 °C Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2002 May 27 5 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 DC CHARACTERISTICS Family 74AHC1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (°C) TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH VOL VCC (V) 25 MIN. TYP. -40 to +85 -40 to +125 MAX. MIN. MAX. MIN. MAX. UNIT 2.0 1.5 − − 1.5 − 1.5 − V 3.0 2.1 − − 2.1 − 2.1 − V 5.5 3.85 − − 3.85 − 3.85 − V 2.0 − − 0.5 − 0.5 − 0.5 V 3.0 − − 0.9 − 0.9 − 0.9 V 5.5 − − 1.65 − 1.65 − 1.65 V HIGH-level output VI = VIH or VIL; voltage IO = −50 µA 2.0 1.9 2.0 − 1.9 − 1.9 − V VI = VIH or VIL; IO = −50 µA 3.0 2.9 3.0 − 2.9 − 2.9 − V VI = VIH or VIL; IO = −50 µA 4.5 4.4 4.5 − 4.4 − 4.4 − V VI = VIH or VIL; IO = −4.0 mA 3.0 2.58 − − 2.48 − 2.40 − V VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V VI = VIH or VIL; IO = 50 µA 2.0 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 50 µA 3.0 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 50 µA 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 4.0 mA 3.0 − − 0.36 − 0.44 − 0.55 V VI = VIH or VIL; IO = 8.0 mA 4.5 − − 0.36 − 0.44 − 0.55 V HIGH-level input voltage LOW-level input voltage LOW-level output voltage ILI input leakage current VI = VCC or GND 5.5 − − 0.1 − 1.0 − 2.0 µA ICC quiescent supply current VI = VCC or GND; 5.5 IO = 0 − − 1.0 − 10 − 40 µA CI input capacitance − 1.5 10 − 10 − 10 pF 2002 May 27 6 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 Family 74AHCT1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 OTHER VCC (V) MIN. −40 to +125 UNIT TYP. MAX. MIN. MAX. MIN. MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 − − 2.0 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 − 0.8 − 0.8 V VOH HIGH-level output VI = VIH or VIL; voltage IO = −50 µA 4.5 4.4 4.5 − 4.4 − 4.4 − V VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V VI = VIH or VIL; IO = 50 µA 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 8.0 mA 4.5 − − 0.36 − 0.44 − 0.55 V VOL LOW-level output voltage ILI input leakage current VI = VIH or VIL 5.5 − − 0.1 − 1.0 − 2.0 µA ICC quiescent supply current VI = VCC or GND; 5.5 IO = 0 − − 1.0 − 10 − 40 µA ∆ICC additional quiescent supply current per input pin VI = 3.4 V; other inputs at VCC or GND; IO = 0 − − 1.35 − 1.5 − 1.5 mA CI input capacitance − 1.5 10 − 10 − 10 pF 2002 May 27 5.5 7 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 AC CHARACTERISTICS Type 74AHC1G00 GND = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS CL (pF) Tamb (°C) 25 −40 to +85 −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. see Figs 5 and 6 15 − 4.5 7.9 1.0 9.5 1.0 10.5 ns 50 − 6.5 11.4 1.0 13.0 1.0 14.5 ns see Figs 5 and 6 15 − 3.5 5.5 1.0 6.5 1.0 7.0 ns 50 − 4.9 7.5 1.0 8.5 1.0 9.5 ns VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay A and B to Y VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay A and B to Y Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5 V. Type 74AHCT1G00 GND = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS CL (pF) Tamb (°C) 25 −40 to +85 −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. see Figs 5 and 6 15 − 3.6 6.2 1.0 7.1 1.0 8.0 ns 50 − 5.0 7.9 1.0 9.0 1.0 10.0 ns VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay A and B to Y Note 1. Typical values at VCC = 5 V. 2002 May 27 8 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 AC WAVEFORMS handbook, halfpage VM A, B input tPHL tPLH VM Y output MNA106 FAMILY VI INPUT REQUIREMENTS VM INPUT VM OUTPUT AHC1G GND to VCC 50% VCC 50% VCC AHCT1G GND to 3.0 V 1.5 V 50% VCC Fig.5 The inputs (A and B) to output (Y) propagation delays. VCC handbook, halfpage PULSE GENERATOR VI VO D.U.T. RT CL MNA101 Definitions for test circuit: CL = Load capacitance including jig and probe capacitance (see Chapter “AC characteristics”). RT = Termination resistance should be equal to the output impedance Z0 of the pulse generator. Fig.6 Load circuitry for switching times. 2002 May 27 9 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 PACKAGE OUTLINES Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 2002 May 27 REFERENCES IEC JEDEC EIAJ SC-88A 10 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 Plastic surface mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION SOT753 2002 May 27 REFERENCES IEC JEDEC JEITA SC-74A 11 EUROPEAN PROJECTION ISSUE DATE 02-04-16 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. 2002 May 27 12 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 May 27 13 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 May 27 14 Philips Semiconductors Product specification 2-input NAND gate 74AHC1G00; 74AHCT1G00 NOTES 2002 May 27 15 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA74 © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613508/05/pp16 Date of release: 2002 May 27 Document order number: 9397 750 09699