INTEGRATED CIRCUITS DATA SHEET 74AHC273; 74AHCT273 Octal D-type flip-flop with reset; positive-edge trigger Product specification File under Integrated Circuits, IC06 1999 Sep 01 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 FEATURES DESCRIPTION • Ideal buffer for MOS microcontroller or memory The 74AHC/AHCT273 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. • Common clock and master reset • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V The 74AHC/AHCT273 have eight edge-triggered, D-type flip-flops with individual D inputs and Q outputs. • Balanced propagation delays The common clock (CP) and master reset (MR) inputs load and reset (clear) all flip-flops simultaneously. • All inputs have Schmitt trigger actions • Inputs accepts voltages higher than VCC The state of each D input, one set-up time before the LOW-to-HIGH clock transition, is transferred to the corresponding output (Qn) of the flip-flop. • See ‘377’ for clock enable version • See ‘373’ for transparent latch version All outputs will be forced LOW independently of clock or data inputs by a LOW on the MR input. • See ‘374’ for 3-state version • For AHC only: operates with CMOS input levels The device is useful for applications where the true output only is required and the clock and master reset are common to all storage elements. • For AHCT only: operates with TTL input levels • Specified from −40 to +85 °C and −40 to +125 °C. QUICK REFERENCE DATA Ground = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT AHC tPHL/tPLH propagation delay AHCT CL = 15 pF; VCC = 5 V CP to Qn 4.2 4.0 ns MR to Qn 3.7 3.9 ns fmax maximum clock frequency CL = 15 pF; VCC = 5 V 120 120 MHz VI = VCC or GND 3.0 3.0 pF 4.0 4.0 pF 14.0 18.0 pF CI input capacitance CO output capacitance CPD power dissipation capacitance CL = 50 pF; f = 1 MHz; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; ∑ (CL × VCC2 × fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. 1999 Sep 01 2 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 FUNCTION TABLE See note 1. INPUTS OUTPUTS OPERATING MODES MR CP Dn Qn reset (clear) L X X L load ‘1’ H ↑ h L load ‘0’ H ↑ l L Note 1. H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition; L = LOW voltage level; I = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition; X = don’t care; ↑ = LOW-to-HIGH transition. ORDERING INFORMATION PACKAGES OUTSIDE NORTH AMERICA NORTH AMERICA PINS PACKAGE MATERIAL CODE 74AHC273D 74AHC273D 20 SO plastic SOT163-1 74AHC273PW 74AHC273PW DH 20 TSSOP plastic SOT360-1 74AHCT273D 74AHCT273D 20 SO plastic SOT163-1 74AHCT273PW 7AHCT273PW DH 20 TSSOP plastic SOT360-1 PINNING PIN 1 SYMBOL DESCRIPTION MR master reset input (active LOW) 2, 5, 6, 9, 12, 15, 16 and 19 Q0 to Q7 flip-flop outputs 3, 4, 7, 8, 13, 14, 17 and 18 D0 to D7 data inputs 10 GND ground (0 V) 11 CP clock input (LOW-to-HIGH; edge-triggered) 20 VCC DC supply voltage 1999 Sep 01 3 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 handbook, halfpage MR 1 20 VCC Q0 2 19 Q7 11 handbook, halfpage 3 18 D7 D0 3 4 D1 4 17 D6 Q1 5 16 Q6 8 15 Q5 13 273 Q2 6 D2 7 14 D5 D3 8 13 D4 Q3 9 12 Q4 GND 10 11 CP 7 14 17 18 CP D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 MR 1 Q7 2 5 6 9 12 15 16 19 MNA460 MNA459 Fig.1 Pin configuration. handbook, halfpage 11 1 3 Fig.2 Logic symbol. handbook, halfpage C1 3 D0 Q0 2 4 D1 Q1 5 2 7 D2 Q2 6 5 8 D3 Q3 9 13 D4 14 D5 17 D6 Q6 16 18 D7 Q7 19 R 1D 4 7 6 8 9 13 12 14 15 17 16 18 Q4 12 Q5 15 1 MR 11 CP 19 MNA462 MNA461 Fig.3 IEC logic symbol. 1999 Sep 01 FF1 to FF8 Fig.4 Functional diagram. 4 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger D0 handbook, full pagewidth D D1 Q D2 D CP FF1 RD Q D3 D CP FF2 RD 74AHC273; 74AHCT273 Q D4 D CP FF3 RD Q D5 D CP FF4 RD Q D6 D CP FF5 RD Q D7 D CP FF6 RD Q D CP FF7 RD Q CP FF8 RD CP MR Q0 Q1 Q2 Q3 Fig.5 Logic diagram. 1999 Sep 01 5 Q4 Q5 Q6 MNA463 Q7 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL PARAMETER 74AHCT CONDITIONS UNIT MIN. TYP. MAX. MIN. TYP. MAX. 4.5 5.0 5.5 V VCC DC supply voltage 2.0 5.0 5.5 VI input voltage 0 − 5.5 0 − 5.5 V VO output voltage 0 − VCC 0 − VCC V Tamb operating ambient temperature −40 +25 +85 −40 +25 +85 °C −40 +25 +125 −40 +25 +125 °C tr,tf (∆t/∆f) see DC and AC characteristics per device input rise and fall ratio VCC = 3.3 ±0.3 V VCC = 5 ±0.5 V − − 100 − − − − − 20 − − 20 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK DC input diode current VI < −0.5 V; note 1 − −20 mA IOK DC output diode current VO < −0.5 V or VO > VCC + 0.5 V; note 1 − ±20 mA IO DC output source or sink current −0.5 V < VO < VCC + 0.5 V − ±25 mA ICC DC VCC or GND current − ±75 mA Tstg storage temperature PD power dissipation per package for temperature range: −40 to +125 °C; note 2 −65 +150 °C − 500 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO package: above 70 °C the value of PD derates linearly with 8 mW/K. For TSSOP package: above 60 °C the value of PD derates linearly with 5.5 mW/K. 1999 Sep 01 6 mW Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 DC CHARACTERISTICS Family 74AHC Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). Tamb (°C) TEST CONDITIONS SYMBOL OTHER VIH VIL VOH VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 1.5 − − 1.5 − 1.5 − 3.0 2.1 − − 2.1 − 2.1 − 5.5 3.85 − − 3.85 − 3.85 − 2.0 − − 0.5 − 0.5 − 0.5 3.0 − − 0.9 − 0.9 − 0.9 5.5 − − 1.65 − 1.65 − 1.65 2.0 1.9 2.0 − 1.9 − 1.9 − 3.0 2.9 3.0 − 2.9 − 2.9 − 4.5 4.4 4.5 − 4.4 − 4.4 − VI = VIH or VIL; IO = −4.0 mA 3.0 2.58 − − 2.48 − 2.40 − VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − LOW-level output VI = VIH or VIL; voltage; all outputs IO = 50 µA 2.0 − 0 0.1 − 0.1 − 0.1 3.0 − 0 0.1 − 0.1 − 0.1 4.5 − 0 0.1 − 0.1 − 0.1 LOW-level output voltage VI = VIH or VIL; IO = 4.0 mA 3.0 − − 0.36 − 0.44 − 0.55 VI = VIH or VIL; IO = 8.0 mA 4.5 − − 0.36 − 0.44 − 0.55 − 1.0 − 2.0 ±2.5 − ±10.0 µA HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL; voltage; all outputs IO = −50 µA HIGH-level output voltage VOL −40 to +85 25 PARAMETER V V V V V V II input leakage current VI = VCC or GND 5.5 − − 0.1 IOZ 3-state output OFF current VI = VIH or VIL; 5.5 VO = VCC or GND − − ±0.25 − ICC quiescent supply current VI = VCC or GND; 5.5 IO = 0 − − 4.0 − 40 − 80 µA CI input capacitance − 3 10 − 10 − 10 pF 1999 Sep 01 − 7 µA Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 Family 74AHCT Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 OTHER VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 − − 2.0 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 − 0.8 − 0.8 V VOH HIGH-level output voltage; all outputs VI = VIH or VIL; IO = −50 µA 4.5 4.4 4.5 − 4.4 − 4.4 − V HIGH-level output voltage VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V LOW-level output VI = VIH or VIL; voltage; all IO = 50 µA outputs 4.5 − 0 0.1 − 0.1 − 0.1 V LOW-level output VI = VIH or VIL; IO = 8.0 mA voltage 4.5 − − 0.36 − 0.44 − 0.55 V II input leakage current VI = VIH or VIL 5.5 − − 0.1 − 1.0 − 2.0 µA IOZ 3-state output OFF current VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 − − ±0.25 − ±2.5 − ±10.0 µA ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 4.0 − 40 − 80 µA ∆ICC additional quiescent supply current per input pin VI = VCC − 2.1 V; other inputs at VCC or GND; IO = 0 4.5 to 5.5 − − 1.35 − 1.5 − 1.5 mA CI input capacitance − 3 10 − 10 − 10 pF VOL 1999 Sep 01 − 8 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 AC CHARACTERISTICS Type 74AHC273 Ground = 0 V; tr = tf ≤ 3.0 ns. Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 25 PARAMETER WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. − 6.0 13.6 1.0 16.0 1.0 17.0 ns VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn 15 pF tPHL propagation delay see Figs 7 and 9 MR to Qn − 5.1 13.6 1.0 16.0 1.0 17.0 ns fmax maximum clock pulse frequency 75 120 − 65 − 65 − ns tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn − 8.6 17.1 1.0 19.5 1.0 21.5 ns tPHL propagation delay see Figs 7 and 9 MR to Qn − 7.3 17.1 1.0 19.5 1.0 21.5 ns tW clock pulse width HIGH or LOW see Figs 6 and 9 5.0 − − 6.5 − 6.5 − ns master reset pulse width LOW see Figs 7 and 9 5.0 − − 6.0 − 6.0 − ns 2.5 − − 2.5 − 2.5 − ns 3.0 − − 3.0 − 3.0 − ns 50 pF trem removal time MR to CP tsu set-up time Dn to CP th hold time Dn to CP 1.0 − − 1.0 − 1.0 − ns fmax maximum clock pulse frequency 50 75 − 45 − 45 − ns 1999 Sep 01 see Figs 8 and 9 9 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. − 4.2 9.0 1.0 10.5 1.0 11.5 ns VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn 15 pF tPHL propagation delay see Figs 7 and 9 MR to Qn − 3.7 8.5 1.0 10.0 1.0 11.0 ns fmax maximum clock pulse frequency 120 165 − 100 − 100 − ns tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn − 6.0 11.0 1.0 12.5 1.0 14.0 ns tPHL propagation delay see Figs 7 and 9 MR to Qn − 5.3 10.5 1.0 12.0 1.0 13.5 ns tW clock pulse width HIGH or LOW see Figs 6 and 9 5.0 − − 5.0 − 5.0 − ns master reset pulse width LOW see Figs 7 and 9 5.0 − − 5.0 − 5.0 − ns 2.0 − − 2.0 − 2.0 − ns 3.0 − − 3.0 − 3.0 − ns 50 pF trem removal time MR to CP tsu set-up time Dn to CP th hold time Dn to CP 1.0 − − 1.0 − 1.0 − ns fmax maximum clock pulse frequency 80 110 − 70 − 70 − ns see Figs 8 and 9 Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. 1999 Sep 01 10 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 Type 74AHCT273 Ground = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL MIN. TYP. −40 to +125 MAX. MIN. MAX. MIN. MAX. UNIT VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn 15 pF − 4.0 7.5 1.0 8.8 1.0 9.5 ns tPHL propagation delay see Figs 7 and 9 MR to Qn − 3.9 10.0 1.0 11.6 1.0 12.5 ns fmax maximum clock pulse frequency 75 − 65 − 65 − ns tPHL/tPLH propagation delay see Figs 6 and 9 CP to Qn 50 pF − 5.8 9.2 1.0 10.5 1.0 11.5 ns tPHL propagation delay see Figs 7 and 9 MR to Qn − 5.6 11.0 1.0 12.6 1.0 14.0 ns tW clock pulse width HIGH or LOW see Figs 6 and 9 5.0 − − 6.5 − 6.5 − ns master reset pulse width LOW see Figs 7 and 9 5.0 − − 6.0 − 6.0 − ns 2.5 − − 2.5 − 2.5 − ns 3.0 − − 3.0 − 3.0 − ns 120 trem removal time MR to CP tsu setup time Dn to CP th hold time Dn to CP 1.0 − − 1.0 − 1.0 − ns fmax maximum clock pulse frequency 50 75 − 45 − 45 − ns see Figs 8 and 9 Note 1. Typical values at VCC = 5.0 V. 1999 Sep 01 11 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 AC WAVEFORMS 1/f max handbook, full pagewidth VI VM(1) CP INPUT GND tW tPHL tPLH VM(1) Qn OUTPUT MNA200 FAMILY VI INPUT REQUIREMENTS VM INPUT VM OUTPUT AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V 50% VCC Fig.6 The clock (CP) to output (Qn) propagation delays, the clock pulse width output transition times and the maximum clock pulse frequency. VI handbook, full pagewidth VM(1) MR INPUT GND tW t rem VI VM(1) CP INPUT GND t PLH VI VM(1) Qn OUTPUT GND FAMILY VI INPUT REQUIREMENTS MNA464 VM INPUT VM OUTPUT AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V 50% VCC Fig.7 The master reset (MR) pulse width, the master reset to output (Qn) propagation delays and master reset to clock (CP) removal time. 1999 Sep 01 12 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 VI handbook, full pagewidth VM(1) CP INPUT GND tsu tsu th th VI VM(1) Dn INPUT GND VM(1) Qn OUTPUT MNA202 VI INPUT REQUIREMENTS FAMILY VM INPUT VM OUTPUT AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V 50% VCC The shaded areas indicate when the input is permitted to change for predicable output performance. Fig.8 The data set-up and hold times for the data input (Dn). S1 handbook, full pagewidth VCC PULSE GENERATOR VI 1000 Ω VO VCC open GND D.U.T. RT CL MNA183 TEST S1 tPLH/tPHL open tPLZ/tPZL VCC tPHZ/tPZH GND Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter “AC characteristics”). RL = load resistance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.9 Load circuitry for switching times. 1999 Sep 01 13 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1999 Sep 01 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 14 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 1999 Sep 01 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-06-16 95-02-04 MO-153AC 15 o Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 1999 Sep 01 16 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable suitable(2) HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Sep 01 17 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 NOTES 1999 Sep 01 18 Philips Semiconductors Product specification Octal D-type flip-flop with reset; positive-edge trigger 74AHC273; 74AHCT273 NOTES 1999 Sep 01 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 67 © Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 245002/01/pp20 Date of release: 1999 Sep 01 Document order number: 9397 750 06158