PHILIPS N74F174N

INTEGRATED CIRCUITS
74F174
Hex D flip-flops
Product specification
IC15 Data Handbook
1988 Oct 07
Philips Semiconductors
Product specification
Hex D flip-flop
74F174
FEATURES
PIN CONFIGURATION
• Six edge-triggered D-type flip-flops
• Buffered common Clock
• Buffered, asynchronous Master Reset
DESCRIPTION
The 74F174 has six edge-triggered D-type flip-flops with individual D
inputs and Q outputs. The common buffered Clock (CP) and Master
Reset (MR) inputs load and reset (clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transferred to
the corresponding flip-flop’s Q output.
TYPICAL fMAX
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F174
100MHz
35mA
1
16
VCC
Q0
2
15
Q5
D0
3
14
D5
D1
4
13
D4
Q1
5
12
Q4
D2
6
11
D3
Q2
7
10
Q3
GND
8
9
CP
SF00188
All Q outputs will be forced Low independent of Clock or Data inputs
by a Low voltage level on the MR input. The device is useful for
applications where true outputs only are required, and the Clock and
Master Reset are common to all storage elements.
TYPE
MR
ORDERING INFORMATION
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%,
Tamb = 0°C to +70°C
PKG DWG #
16-pin plastic DIP
N74F174N
SOT38-4
16-pin plastic SO
N74F174D
SOT109-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS
DESCRIPTION
D0–D5
74F (U.L.) HIGH/LOW
LOAD VALUE HIGH/LOW
Data inputs
1.0/1.0
20µA/0.6mA
CP
Clock Pulse input (active rising edge)
1.0/1.0
20µA/0.6mA
MR
Master Reset input (active-Low)
1.0/1.0
20µA/0.6mA
Outputs
50/33
1.0mA/20mA
Q0–Q5
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
LOGIC SYMBOL
IEC/IEEE SYMBOL
3
4
6
11
13
9
14
1
D0
9
CP
1
MR
D1
D2
D3
D4
3
D5
4
6
Q0
2
Q1
5
Q2
7
Q3
10
Q4
12
C1
R
1D
2
5
7
Q5
15
11
10
13
12
14
15
VCC = Pin 16
GND = Pin 8
SF00190
SF00189
October 7, 1988
2
853–0060 94766
Philips Semiconductors
Product specification
Hex D flip-flop
74F174
LOGIC DIAGRAM
D0
D1
3
D2
4
Q
D
Q
D
CP
MR
D4
11
Q
D
CP
RD
CP
D3
6
RD
Q
D
CP
14
Q
D
CP
RD
D5
13
Q
D
CP
RD
CP
RD
RD
9
1
2
VCC = Pin 16
GND = Pin 8
Q0
5
7
Q1
Q2
10
15
12
Q3
Q5
Q4
SF00192
FUNCTION TABLE
INPUTS
OUTPUTS
MR
CP
D
OPERATING MODE
Qn
L
X
X
L
Reset (clear)
H
↑
h
H
Load “1”
H
↑
l
L
Load “0”
H = High voltage level
L = Low voltage level
X = Don’t care
↑ = Low-to-High Clock transition
h = High voltage level one set-up time prior to the Low-to-High Clock transition.
l = Low voltage level one set-up time prior to the Low-to-High Clock transition.
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
PARAMETER
SYMBOL
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5
mA
VOUT
Voltage applied to output in High output state
–0.5 to VCC
V
IOUT
Current applied to output in Low output state
40
mA
Tamb
Operating free-air temperature range
0 to +70
°C
Tstg
Storage temperature range
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
MIN
NOM
MAX
5.0
5.5
UNIT
VCC
Supply voltage
4.5
VIH
High-level input voltage
2.0
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–1
mA
IOL
Low-level output current
20
mA
Tamb
Operating free-air temperature range
+70
°C
October 7, 1988
0
3
V
V
Philips Semiconductors
Product specification
Hex D flip-flop
74F174
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
VIH = MIN, IOH = MAX
±5%VCC
2.7
VCC = MIN, VIL = MAX
±10%VCC
0.30
0.50
VIH = MIN, IOL = MAX
±5%VCC
0.30
0.50
–0.73
–1.2
V
100
µA
VCC = MAX, VI = 2.7V
20
µA
VCC = MAX, VI = 0.5V
–0.6
mA
–150
mA
45
mA
Low level output voltage
Low-level
VIK
Input clamp voltage
VCC = MIN, II = IIK
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
IIH
High-level input current
IIL
Low-level input current
ICC
Supply current (total)
UNIT
2.5
VOL
O
Short-circuit output
MAX
±10%VCC
High level output voltage
High-level
IOS
TYP2
MIN
VCC = MIN, VIL = MAX
VOH
O
current3
LIMITS
TEST CONDITIONS1
V
3.4
V
VCC = MAX
–60
VCC = MAX, Dn = MR = 4.5V, CP = ↑
35
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
VCC = +5.0V
Tamb = +25°C
CL = 50pF, RL = 500Ω
TEST
CONDITION
MIN
TYP
VCC = +5.0V ± 10%
Tamb = 0°C to +70°C
CL = 50pF, RL = 500Ω
MAX
MIN
UNIT
MAX
fMAX
Maximum clock frequency
Waveform 1
80
100
tPLH
tPHL
Propagation delay
CP to Qn
Waveform 1
3.5
4.5
5.5
6.0
8.0
10.0
3.5
4.5
80
9.0
11.0
MHz
ns
tPHL
Propagation delay MR to Qn
Waveform 2
5.0
8.5
14.0
5.0
15.0
ns
AC SETUP REQUIREMENTS
LIMITS
SYMBOL
PARAMETER
VCC = +5.0V
Tamb = +25°C
CL = 50pF, RL = 500Ω
TEST
CONDITION
MIN
TYP
MAX
VCC = +5.0V ± 10%
Tamb = 0°C to +70°C
CL = 50pF, RL = 500Ω
MIN
UNIT
MAX
tS(H)
tS(L)
Setup time, High or Low
Dn to CP
Waveform 3
4.0
4.0
4.0
4.0
ns
th(H)
th(L)
Hold time, High or Low
Dn to CP
Waveform 3
0.0
0.0
0.0
0.0
ns
tw(H)
tw(L)
CP Pulse width,
High or Low
Waveform 1
4.0
6.0
4.0
6.0
ns
tw(L)
MR Pulse width, Low
Waveform 2
5.0
5.0
ns
tREC
Recovery time, MR to CP
Waveform 2
5.0
5.0
ns
October 7, 1988
4
Philips Semiconductors
Product specification
Hex D flip-flop
74F174
AC WAVEFORMS
For all waveforms, VM = 1.5V.
The shaded areas indicate when the input is permitted to change for predictable output performance.
1/fMAX
Dn
tw(L)
CP
VM
VM
tw(H)
VM
VM
VM
ts(H)
th(H)
ts(L)
th(L)
tPLH
tPHL
Qn
VM
CP
VM
VM
VM
VM
SF00191
SF00166
Waveform 3. Data Setup and Hold Times
Waveform 1. Propagation Delay, Clock Input to Output,
Clock Pulse Width, and Maximum Clock Frequency
MR
VM
VM
tw(L)
tREC
VM
CP
tPHL
Qn
VM
SF00158
Waveform 2. Master Reset Pulse Width, Master Reset to
Output Delay and Master Reset to Clock recovery Time
TEST CIRCUIT AND WAVEFORMS
VCC
VIN
tw
90%
NEGATIVE
PULSE
10%
D.U.T.
RT
CL
RL
AMP (V)
VM
VM
VOUT
PULSE
GENERATOR
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
AMP (V)
90%
POSITIVE
PULSE
VM
VM
10%
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
RL = Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
90%
10%
tw
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0V
1.5V
rep. rate
tw
tTLH
tTHL
1MHz
500ns
2.5ns
2.5ns
SF00006
October 7, 1988
5
Philips Semiconductors
Product specification
Hex D flip-flops
74F174
DIP16: plastic dual in-line package; 16 leads (300 mil)
1988 Oct 07
6
SOT38-4
Philips Semiconductors
Product specification
Hex D flip-flops
74F174
SO16: plastic small outline package; 16 leads; body width 3.9 mm
1988 Oct 07
7
SOT109-1
Philips Semiconductors
Product specification
Hex D flip-flops
74F174
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
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Date of release: 10-98
9397-750-05089