PHILIPS PCA9544ABS

PCA9544A
4-channel I2C-bus multiplexer with interrupt logic
Rev. 03 — 24 November 2008
Product data sheet
1. General description
The PCA9544A is a 1-of-4 bidirectional translating multiplexer, controlled via the I2C-bus.
The SCL/SDA upstream pair fans out to four SCx/SDx downstream pairs, or channels.
Only one SCx/SDx channel is selected at a time, determined by the contents of the
programmable control register. Four interrupt inputs, INT0 to INT3, one for each of the
SCx/SDx downstream pairs, are provided. One interrupt output, INT, which acts as an
AND of the four interrupt inputs, is provided.
A power-on reset function puts the registers in their default state and initializes the I2C-bus
state machine with no channels selected.
The pass gates of the multiplexer are constructed such that the VDD pin can be used to
limit the maximum high voltage which will be passed by the PCA9544A. This allows the
use of different bus voltages on each SCx/SDx pair, so that 1.8 V, 2.5 V or 3.3 V parts can
communicate with 5 V parts without any additional protection. External pull-up resistors
pull the bus up to the desired voltage level for each channel. All I/O pins are 5 V tolerant.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
1-of-4 bidirectional translating multiplexer
I2C-bus interface logic; compatible with SMBus
4 active LOW interrupt inputs
Active LOW interrupt output
3 address pins allowing up to 8 devices on the I2C-bus
Channel selection via I2C-bus
Power-up with all multiplexer channels deselected
Low Ron switches
Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses
No glitch on power-up
Supports hot insertion
Low standby current
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant Inputs
0 Hz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Three packages offered: SO20, TSSOP20 and HVQFN20
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9544AD
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
PCA9544APW
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
PCA9544ABS
HVQFN20
plastic thermal enhanced very thin quad flat package; SOT662-1
no leads; 20 terminals; body 5 × 5 × 0.85 mm
3.1 Ordering options
Table 2.
Ordering options
Type number
Topside mark
Temperature range
PCA9544AD
PCA9544AD
−40 °C to +85 °C
PCA9544APW
PA9544A
−40 °C to +85 °C
PCA9544ABS
9544A
−40 °C to +85 °C
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
2 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
4. Block diagram
PCA9544A
SC0
SC1
SC2
SC3
SD0
SD1
SD2
SD3
VSS
VDD
SCL
SDA
SWITCH CONTROL LOGIC
POWER-ON
RESET
INPUT
FILTER
A0
I2C-BUS
CONTROL
A1
A2
INT[3:0]
INT
INTERRUPT LOGIC
002aae296
Fig 1.
Block diagram
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
3 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
5. Pinning information
5.1 Pinning
A0
1
A1
2
20 VDD
19 SDA
A0
1
A1
2
20 VDD
19 SDA
A2
3
18 SCL
A2
3
18 SCL
INT0
4
17 INT
INT0
4
17 INT
SD0
5
16 SC3
SD0
5
SC0
6
15 SD3
SC0
6
INT1
7
14 INT3
INT1
7
14 INT3
SD1
8
13 SC2
SD1
8
13 SC2
SC1
9
12 SD2
SC1
9
12 SD2
VSS 10
11 INT2
VSS 10
11 INT2
PCA9544AD
PCA9544APW
002aae293
15 SD3
002aae294
Pin configuration for TSSOP20
16 SCL
17 SDA
18 VDD
20 A1
terminal 1
index area
Fig 3.
19 A0
Pin configuration for SO20
A2
1
15 INT
INT0
2
14 SC3
SD0
3
SC0
4
12 INT3
INT1
5
11 SC2
7
8
9
SC1
VSS
INT2
SD2 10
6
PCA9544ABS
SD1
Fig 2.
16 SC3
13 SD3
002aae295
Transparent top view
Fig 4.
Pin configuration for HVQFN20
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
4 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
5.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SO20, TSSOP20
HVQFN20
A0
1
19
A1
2
20
address input 1
A2
3
1
address input 2
INT0
4
2
active LOW interrupt input 0
SD0
5
3
serial data 0
SC0
6
4
serial clock 0
INT1
7
5
active LOW interrupt input 1
SD1
8
6
serial data 1
SC1
9
7
serial clock 1
VSS
10
8[1]
supply ground
INT2
11
9
active LOW interrupt input 2
SD2
12
10
serial data 2
SC2
13
11
serial clock 2
INT3
14
12
active LOW interrupt input 3
SD3
15
13
serial data 3
SC3
16
14
serial clock 3
INT
17
15
active LOW interrupt output
SCL
18
16
serial clock line
SDA
19
17
serial data line
VDD
20
18
supply voltage
[1]
address input 0
HVQFN20 package supply ground is connected to both VSS pin and exposed center pad. VSS pin must be
connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level
performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the
board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in
the thermal pad region.
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
5 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
6. Functional description
Refer to Figure 1 “Block diagram”.
6.1 Device addressing
Following a START condition the bus master must output the address of the slave it is
accessing. The address of the PCA9544A is shown in Figure 5. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
1
1
1
0
A2
fixed
A1
A0 R/W
hardware
selectable
002aab189
Fig 5.
Slave address
The last bit of the slave address defines the operation to be performed. When set to
logic 1 a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9544A which will be stored in the Control register. If multiple bytes are
received by the PCA9544A, it will save the last byte received. This register can be written
and read via the I2C-bus.
interrupt bits
(read only)
bit
7
6
5
channel selection bits
(read/write)
4
INT3 INT2 INT1 INT0
3
2
1
0
X
B2
B1
B0
enable bit
Fig 6.
002aae297
Control register
6.2.1 Control register definition
A SCx/SDx downstream pair, or channel, is selected by the contents of the control
register. This register is written after the PCA9544A has been addressed. The 3 LSBs of
the control byte are used to determine which channel is to be selected. When a channel is
selected, it will become active after a STOP condition has been placed on the I2C-bus.
This ensures that all SCx/SDx lines will be in a HIGH state when the channel is made
active, so that no false conditions are generated at the time of connection.
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
6 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
Table 4.
Control register: Write—channel selection; Read—channel status
INT3
INT2
INT1
INT0
D3
B2
B1
B0
Command
X
X
X
X
X
0
X
x
no channel selected
X
X
X
X
X
1
0
0
channel 0 enabled
X
X
X
X
X
1
0
1
channel 1 enabled
X
X
X
X
X
1
1
0
channel 2 enabled
X
X
X
0
X
1
1
1
channel 3 enabled
0
0
0
0
0
0
0
0
no channel selected;
power-up default state
6.3 Interrupt handling
The PCA9544A provides 4 interrupt inputs, one for each channel and one open-drain
interrupt output. When an interrupt is generated by any device, it will be detected by the
PCA9544A and the interrupt output will be driven LOW. The channel need not be active
for detection of the interrupt. A bit is also set in the control byte. Bits 7:4 of the control byte
correspond to channel 3 to channel 0 of the PCA9544A, respectively. Therefore, if an
interrupt is generated by any device connected to channel 2, the state of the interrupt
inputs is loaded into the control register when a read is accomplished. Likewise, an
interrupt on any device connected to channel 0 would cause bit 4 of the control register to
be set on the read. The master can then address the PCA9544A and read the contents of
the control byte to determine which channel contains the device generating the interrupt.
The master can then reconfigure the PCA9544A to select this channel, and locate the
device generating the interrupt and clear it. The interrupt clears when the device
originating the interrupt clears.
It should be noted that more than one device can be providing an interrupt on a channel,
so it is up to the master to ensure that all devices on a channel are interrogated for an
interrupt.
The interrupt inputs may be used as general purpose inputs if the interrupt function is not
required.
If unused, interrupt input(s) must be connected to VDD through a pull-up resistor.
Table 5.
Control register read — interrupt
INT3
INT2
INT1
X
X
X
X
X
X
0
1
0
1
X
D3
B2
B1
B0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
INT0
0
1
Command
no interrupt on channel 0
interrupt on channel 0
no interrupt on channel 1
interrupt on channel 1
no interrupt on channel 2
interrupt on channel 2
no interrupt on channel 3
interrupt on channel 3
Remark: Several interrupts can be active at the same time. For example: INT3 = 0,
INT2 = 1, INT1 = 1, INT0 = 0, means that there is no interrupt on channel 0 and
channel 3, and there is an interrupt on channel 1 and on channel 2.
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
7 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
6.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9544A in
a reset condition until VDD has reached VPOR. At this point, the reset condition is released
and the PCA9544A registers and I2C-bus state machine are initialized to their default
states (all zeroes), causing all the channels to be deselected. Thereafter, VDD must be
lowered below 0.2 V to reset the device.
6.5 Voltage translation
The pass gate transistors of the PCA9544A are constructed such that the VDD voltage can
be used to limit the maximum voltage that will be passed from one I2C-bus to another.
002aaa964
5.0
Vo(sw)
(V)
4.0
(1)
(2)
3.0
(3)
2.0
1.0
2.0
2.5
3.0
3.5
4.0
4.5
5.5
5.0
VDD (V)
(1) maximum
(2) typical
(3) minimum
Fig 7.
Pass gate voltage versus supply voltage
Figure 7 shows the voltage characteristics of the pass gate transistors (note that the graph
was generated using the data specified in Section 11 “Dynamic characteristics” of this
data sheet). In order for the PCA9544A to act as a voltage translator, the Vo(sw) voltage
should be equal to, or lower than the lowest bus voltage. For example, if the main bus was
running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be
equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at
Figure 7, we see that Vo(sw)(max) will be at 2.7 V when the PCA9544A supply voltage is
3.5 V or lower so the PCA9544A supply voltage could be set to 3.3 V. Pull-up resistors can
then be used to bring the bus voltages to their appropriate levels (see Figure 14).
More Information can be found in Application Note AN262, PCA954X family of I2C/SMBus
multiplexers and switches.
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
8 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
SDA
SCL
data line
stable;
data valid
Fig 8.
change
of data
allowed
mba607
Bit transfer
7.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 9).
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 9.
Definition of START and STOP conditions
7.3 System configuration
A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
9 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
7.4 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also, a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; setup and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 11. Acknowledgement on the I2C-bus
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
10 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
7.5 Bus transactions
slave address
SDA
S
1
1
1
0
A2
control register
A1
A0
START condition
0
R/W
A
X
X
X
X
X
B2
acknowledge
from slave
B1
B0
A
P
acknowledge
from slave
STOP condition
002aae299
Fig 12. Write control register
slave address
SDA
S
1
1
1
0
A2
START condition
last byte
control register
A1
A0
1
R/W
A
INT INT INT INT
3
2
1
0
acknowledge
from slave
X
B2
B1
B0
NA
P
no acknowledge
from master
STOP condition
002aae300
Fig 13. Read control register
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
11 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
8. Application design-in information
VDD = 2.7 V to 5.5 V
VDD = 3.3 V
V = 2.7 V to 5.5 V
(1)
SDA
SDA
SD0
SCL
SCL
SC0
INT
INT0
PCA9544A
channel 0
V = 2.7 V to 5.5 V
(1)
I2C-bus/SMBus master
SD1
channel 1
SC1
INT1
V = 2.7 V to 5.5 V
(1)
SD2
channel 2
SC2
INT2
V = 2.7 V to 5.5 V
(1)
A2
A1
SD3
A0
SC3
VSS
INT3
channel 3
002aae298
(1) If the device generating the interrupt has an open-drain output structure or can be 3-stated,
a pull-up resistor is required.
If the device generating the interrupt has a totem pole output structure and cannot be 3-stated,
a pull-up resistor is not required.
The interrupt inputs should not be left floating.
Fig 14. Typical application
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
12 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to ground (VSS = 0 V).[1]
Symbol
Parameter
Conditions
Max
Unit
VDD
supply voltage
−0.5
+7.0
V
VI
input voltage
−0.5
+7.0
V
II
input current
-
±20
mA
IO
output current
-
±25
mA
IDD
supply current
-
±100
mA
ISS
ground supply current
-
±100
mA
Ptot
total power dissipation
-
400
mW
Tstg
storage temperature
−60
+150
°C
Tamb
ambient temperature
−40
+85
°C
[1]
operating
The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 125 °C.
PCA9544A_3
Product data sheet
Min
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
13 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
10. Static characteristics
Table 7.
Static characteristics
VDD = 2.3 V to 3.6 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
See Table 8 for VDD = 4.5 V to 5.5 V.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.3
-
3.6
V
Supply
VDD
supply voltage
IDD
supply current
operating mode; VDD = 3.6 V;
no load; VI = VDD or VSS;
fSCL = 100 kHz
-
10
30
µA
Istb
standby current
standby mode; VDD = 3.6 V; no load;
VI = VDD or VSS; fSCL = 0 kHz
-
0.1
1
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.5
2.1
V
[2]
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
6
V
IOL
LOW-level output current
3
7
-
mA
VOL = 0.6 V
6
10
-
mA
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
10
13
pF
VOL = 0.4 V
Select inputs A0 to A2, INT0 to INT3
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
VDD + 0.5
V
ILI
input leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
1.6
3
pF
ON-state resistance
VDD = 3.0 V to 3.6 V; VO = 0.4 V;
IO = 15 mA
5
11
30
Ω
VDD = 2.3 V to 2.7 V; VO = 0.4 V;
IO = 10 mA
7
16
55
Ω
Vi(sw) = VDD = 3.3 V; Io(sw) = −100 µA
-
1.9
-
V
Vi(sw) = VDD = 3.0 V to 3.6 V;
Io(sw) = −100 µA
1.6
-
2.8
V
Pass gate
Ron
Vo(sw)
switch output voltage
Vi(sw) = VDD = 2.5 V; Io(sw) = −100 µA
-
1.5
-
V
Vi(sw) = VDD = 2.3 V to 2.7 V;
Io(sw) = −100 µA
1.1
-
2.0
V
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Cio
input/output capacitance
VI = VSS
-
3
5
pF
IOL
LOW-level output current
VOL = 0.4 V
3
7
-
mA
IOH
HIGH-level output current
-
-
+10
µA
INT output
[1]
For operation between published voltage ranges, refer to worst case parameter in both ranges.
[2]
VDD must be lowered to 0.2 V in order to reset part.
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
14 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
Table 8.
Static characteristics
VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
See Table 7 for VDD = 2.3 V to 3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
4.5
-
5.5
V
Supply
VDD
supply voltage
IDD
supply current
operating mode; VDD = 5.5 V;
no load; VI = VDD or VSS;
fSCL = 100 kHz
-
25
100
µA
Istb
standby current
standby mode; VDD = 5.5 V; no load;
VI = VDD or VSS; fSCL = 0 kHz
-
0.3
1
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.7
2.1
V
[2]
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
6
V
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
VOL = 0.6 V
6
-
-
mA
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
12
13
pF
Select inputs A0 to A2, INT0 to INT3
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
VDD + 0.5
V
ILI
input leakage current
pin at VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
2
5
pF
Ron
ON-state resistance
VDD = 4.5 V to 5.5 V; VO = 0.4 V;
IO = 15 mA
4
9
24
Ω
Vo(sw)
switch output voltage
Pass gate
Vi(sw) = VDD = 5.0 V; Io(sw) = −100 µA
-
3.6
-
V
Vi(sw) = VDD = 4.5 V to 5.5 V;
Io(sw) = −100 µA
2.6
-
4.5
V
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Cio
input/output capacitance
VI = VSS
-
3
5
pF
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
IOH
HIGH-level output current
-
-
+10
µA
INT output
[1]
For operation between published voltage ranges, refer to worst case parameter in both ranges.
[2]
VDD must be lowered to 0.2 V in order to reset part.
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
15 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
11. Dynamic characteristics
Table 9.
Symbol
Dynamic characteristics
Parameter
Conditions
Standard-mode
I2C-bus
from SDA to SDn,
or SCL to SCn
Fast-mode I2C-bus
Unit
Min
Max
Min
Max
-
0.3[1]
-
0.3[1]
ns
0
100
0
400
kHz
4.7
-
1.3
-
µs
4.0
-
0.6
-
µs
4.7
-
1.3
-
µs
tPD
propagation delay
fSCL
SCL clock frequency
tBUF
bus free time between a STOP and
START condition
tHD;STA
hold time (repeated) START
condition
tLOW
LOW period of the SCL clock
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
µs
tSU;STO
set-up time for STOP condition
4.0
-
0.6
-
µs
tHD;DAT
data hold time
0[3]
3.45
0[3]
0.9
µs
tSU;DAT
data set-up time
250
-
100
-
ns
0.1Cb[4]
300
ns
[2]
tr
rise time of both SDA and SCL
signals
-
1000
20 +
tf
fall time of both SDA and SCL
signals
-
300
20 + 0.1Cb[4]
300
µs
Cb
capacitive load for each bus line
-
400
-
400
µs
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
tVD;DAT
data valid time
tVD;ACK
HIGH-to-LOW
[5]
-
1
-
1
µs
LOW-to-HIGH
[5]
-
0.6
-
0.6
µs
-
1
-
1
µs
data valid acknowledge time
INT
tv(INTnN-INTN) valid time from INTn to INT signal
[5]
-
4
-
4
µs
td(INTnN-INTN) delay time from INTn to INT inactive
[5]
-
2
-
2
µs
INTn inputs
[5]
1
-
1
-
µs
INTn inputs
[5]
0.5
-
0.5
-
µs
tw(rej)L
tw(rej)H
LOW-level rejection time
HIGH-level rejection time
[1]
Pass gate propagation delay is calculated from the 20 Ω typical Ron and the 15 pF load capacitance.
[2]
After this period, the first clock pulse is generated.
[3]
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to
bridge the undefined region of the falling edge of SCL.
[4]
Cb = total capacitance of one bus line in pF.
[5]
Measurements taken with 1 kΩ pull-up resistor and 50 pF load.
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
16 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
S
tSU;STA
tHD;DAT
tHIGH
tSU;DAT
Sr
tSU;STO
P
002aaa986
Fig 15. Definition of timing on the I2C-bus
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
17 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 16. Package outline SOT163-1 (SO20)
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
18 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 17. Package outline SOT360-1 (TSSOP20)
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
19 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
A
B
D
SOT662-1
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
b
6
y
y1 C
v M C A B
w M C
10
L
11
5
e
e2
Eh
1
15
terminal 1
index area
20
16
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.38
0.23
c
D(1)
Dh
E(1)
Eh
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
e
e1
2.6
0.65
e2
L
v
w
y
y1
2.6
0.75
0.50
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT662-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 18. Package outline SOT662-1 (HVQFN20)
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
20 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
21 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
22 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 19. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CDM
Charged-Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MM
Machine Model
PCB
Printed-Circuit Board
POR
Power-On Reset
SMBus
System Management Bus
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
23 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
15. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9544A_3
20081124
Product data sheet
-
PCA9544A_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Section 2 “Features”:
– 8th bullet item: changed from “RdsON” to “Ron”
– 16th bullet item: changed from “and 1000 V per JESD22-C101” to “and 1000 V CDM per
JESD22-C101”
•
•
•
•
Section 5.1 “Pinning”: added separate pinning diagrams for SO20 and TSSOP20
Table 3 “Pin description”: added Table note [1] and its reference at HVQFN20 pin 8 (VSS)
Section 6.5 “Voltage translation”: changed symbol from “Vpass” to “Vo(sw)”
Figure 14 “Typical application”: corrected signal names:
– for channel 2, changed “SD1” and “SC1” to “SD2” and “SC2”
– for channel 3, changed “SD1” and “SC1” to “SD3” and “SC3”
•
Table 6 “Limiting values”:
– changed parameter for ISS from “supply current” to “ground supply current”
– changed parameter for Tamb from “operating ambient temperature” to “ambient temperature”
(moved “operating” to Conditions column)
– deleted (old) table note 1 (this statement is now located in Section 16.3 “Disclaimers”,
paragraph “Limiting values”)
– Table note [1], 2nd sentence: changed from “should not exceed 150 °C” to “should not exceed
125 °C”
•
Table 7 “Static characteristics” (VDD = 2.3 V to 3.6 V):
– table title changed from “DC characteristics” to “Static characteristics”
– descriptive line below table title: changed from “See Table 8 for VDD = 3.6 V to 5.5 V.”
to “See Table 8 for VDD = 4.5 V to 5.5 V.”
– sub-section “Pass gate”: changed symbol/parameter from “RON, Switch resistance” to
“Ron, ON-state resistance”
– sub-section “Pass gate”: changed symbol from “VPass” to “Vo(sw)”
– sub-section “Pass gate”, Conditions column: changed symbol from “Vswin” to “Vi(sw)”;
changed symbol from “Iswout” to “Io(sw)”
•
Table 8 “Static characteristics” (VDD = 4.5 V to 5.5 V):
– table title changed from “DC characteristics” to “Static characteristics”
– sub-section “Pass gate”: changed symbol/parameter from “RON, Switch resistance” to
“Ron, ON-state resistance”
– sub-section “Pass gate”: changed symbol from “VPass” to “Vo(sw)”
– sub-section “Pass gate”, Conditions column: changed symbol from “Vswin” to “Vi(sw)”;
changed symbol from “Iswout” to “Io(sw)”
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
24 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
Table 13.
Revision history …continued
Document ID
Modifications:
(continued)
Release date
•
Data sheet status
Change notice
Supersedes
Table 9 “Dynamic characteristics”:
– symbol tHD;STA: phrase “After this period, the first clock pulse is generated.” has been moved to
Table note [2]
– symbols tVD:DATL and tVD:DATH merged to form tVD;DAT (and added Conditions “HIGH-to-LOW”
and “LOW-to-HIGH”)
– sub-section “INT” re-written in its entirety
•
•
Added soldering information
Added Section 14 “Abbreviations”
PCA9544A_2
20040929
(9397 750 13931)
Product data sheet
-
PCA9544A_1
PCA9544A_1
20040728
(9397 750 13301)
Objective data sheet
-
-
PCA9544A_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 November 2008
25 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9544A_3
Product data sheet
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Rev. 03 — 24 November 2008
26 of 27
PCA9544A
NXP Semiconductors
4-channel I2C-bus multiplexer with interrupt logic
18. Contents
1
2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.2.1
6.3
6.4
6.5
7
7.1
7.2
7.3
7.4
7.5
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Device addressing . . . . . . . . . . . . . . . . . . . . . . 6
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 6
Control register definition . . . . . . . . . . . . . . . . . 6
Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . 7
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
Voltage translation . . . . . . . . . . . . . . . . . . . . . . 8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 9
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
START and STOP conditions . . . . . . . . . . . . . . 9
System configuration . . . . . . . . . . . . . . . . . . . . 9
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 11
Application design-in information . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 November 2008
Document identifier: PCA9544A_3