ETC BTA208_SERIES_D/E_AND_F

Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
GENERAL DESCRIPTION
BTA208 series D, E and F
QUICK REFERENCE DATA
Passivated guaranteed commutation
triacs in a plastic envelope intended for
use in motor control circuits or with other
highly inductive loads. These devices
balance the requirements of commutation
performance and gate sensitivity. The
"sensitive gate" E series and "logic level"
D series are intended for interfacing with
low power drivers, including micro
controllers.
PINNING - TO220AB
PIN
DESCRIPTION
1
main terminal 1
2
main terminal 2
3
gate
SYMBOL
PARAMETER
MAX.
MAX.
UNIT
600D
600E
600F
600
800E
800F
800
V
8
65
8
65
A
A
BTA208BTA208BTA208VDRM
Repetitive peak
off-state voltages
RMS on-state current
Non-repetitive peak on-state
current
IT(RMS)
ITSM
PIN CONFIGURATION
SYMBOL
tab
T2
tab
T1
G
1 23
main terminal 2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
VDRM
Repetitive peak off-state
voltages
IT(RMS)
RMS on-state current
ITSM
Non-repetitive peak
on-state current
I2t
dIT/dt
IGM
PGM
PG(AV)
Tstg
Tj
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate power
Average gate power
CONDITIONS
MIN.
-
full sine wave;
Tmb ≤ 102 ˚C
full sine wave;
Tj = 25 ˚C prior to
surge
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 12 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
over any 20 ms
period
Storage temperature
Operating junction
temperature
MAX.
-600
6001
UNIT
-800
800
V
-
8
A
-
65
72
21
100
A
A
A2s
A/µs
-
2
5
0.5
A
W
W
-40
-
150
125
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 6 A/µs.
March 2002
1
Rev 2.000
Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
BTA208 series D, E and F
THERMAL RESISTANCES
SYMBOL
PARAMETER
Rth j-mb
Thermal resistance
full cycle
junction to mounting base half cycle
Thermal resistance
in free air
junction to ambient
Rth j-a
CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
60
2.0
2.4
-
K/W
K/W
K/W
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
BTA208-
2
IGT
Gate trigger current
IL
Latching current
IH
MAX.
UNIT
...D
...E
...F
VD = 12 V; IT = 0.1 A
T2+ G+
T2+ GT2- G-
-
5
5
5
10
10
10
25
25
25
mA
mA
mA
VD = 12 V; IGT = 0.1 A
T2+ G+
T2+ GT2- G-
-
15
25
25
25
30
30
30
40
40
mA
mA
mA
Holding current
VD = 12 V; IGT = 0.1 A
-
15
25
30
mA
VT
VGT
On-state voltage
Gate trigger voltage
0.25
1.65
1.5
-
V
V
V
ID
Off-state leakage current
IT = 10 A
VD = 12 V; IT = 0.1 A
VD = 400 V; IT = 0.1 A;
Tj = 125 ˚C
VD = VDRM(max);
Tj = 125 ˚C
-
0.5
mA
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
BTA208-
dVD/dt
Critical rate of rise of
off-state voltage
dIcom/dt
Critical rate of change of
commutating current
dIcom/dt
Critical rate of change of
commutating current
...D
...E
...F
MAX.
UNIT
VDM = 67% VDRM(max);
Tj = 110 ˚C; exponential
waveform; gate open
circuit
VDM = 400 V; Tj = 125 ˚C;
IT(RMS) = 8 A;
dVcom/dt = 10V/µs; gate
open circuit
20
60
70
-
V/µs
2
5
14
-
A/ms
VDM = 400 V; Tj = 125 ˚C;
IT(RMS) = 8 A;
dVcom/dt = 0.1V/µs; gate
open circuit
6
10
20
-
A/ms
2 Device does not trigger in the T2-, G+ quadrant.
March 2002
2
Rev 2.000
Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
12
BTA208 series D, E and F
Tmb(max) / C
101
= 180
Ptot / W
120
10
10
105
8
102 C
109
60
6
30
6
BT137
8
90
1
IT(RMS) / A
113
4
4
117
2
121
0
0
2
4
6
IT(RMS) / A
2
125
10
8
0
-50
Fig.1. Maximum on-state dissipation, Ptot, versus rms
on-state current, IT(RMS), where α = conduction angle.
1000
0
50
Tmb / C
100
150
Fig.4. Maximum permissible rms current IT(RMS) ,
versus mounting base temperature Tmb.
ITSM / A
25
IT(RMS) / A
20
dI T /dt limit
15
100
10
I TSM
IT
5
time
T
Tj initial = 25 C max
10
10us
100us
1ms
T/s
10ms
0
0.01
100ms
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 20ms.
IT
60
T
50
10
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tmb ≤ 102˚C.
ITSM / A
70
0.1
1
surge duration / s
ITSM
1.6
time
1.4
VGT(Tj)
VGT(25 C)
Tj initial = 25 C max
1.2
40
1
30
20
0.8
10
0.6
0
1
10
100
0.4
-50
1000
Number of half cycles at 50Hz
Fig.3. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
March 2002
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
3
Rev 2.000
Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
BTA208 series D, E and F
IGT(Tj)
IGT(25°C)
25
3
Tj = 125 C
Tj = 25 C
T2+ G+
T2+ GT2- G-
2.5
IT / A
2
max
typ
20
Vo = 1.264 V
Rs = 0.0378 Ohms
15
1.5
10
1
5
0.5
0
-50
0
50
Tj/°C
100
0
150
0.5
1
1.5
VT / V
2
2.5
3
Fig.10. Typical and maximum on-state characteristic.
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
0
10
IL(Tj)
IL(25 C)
Zth j-mb (K/W)
unidirectional
2.5
1
bidirectional
2
1.5
0.1
P
D
tp
1
t
0.5
0.01
10us
0
-50
0
50
Tj / C
100
1ms
10ms
0.1s
1s
10s
tp / s
Fig.11. Transient thermal impedance Zth j-mb, versus
pulse width tp.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
dIcom/dt (A/ms)
100
3
0.1ms
150
F TYPE
E TYPE
D TYPE
IH(Tj)
IH(25C)
2.5
2
10
1.5
1
0.5
1
20
0
-50
0
50
Tj / C
100
60
80
100
120
140
Fig.12. Minimum, critical rate of change of
commutating current, dIcom/dt versus junction
temperature,dVcom/dt = 10 V/us
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
March 2002
40
Tj/˚C
150
4
Rev 2.000
Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
BTA208 series D, E and F
MECHANICAL DATA
Dimensions in mm
4,5
max
Net Mass: 2 g
10,3
max
1,3
3,7
2,8
5,9
min
15,8
max
3,0 max
not tinned
3,0
13,5
min
1,3
max 1 2 3
(2x)
0,9 max (3x)
2,54 2,54
0,6
2,4
Fig.13. SOT78 (TO220AB). pin 2 connected to mounting base.
Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
March 2002
5
Rev 2.000
Philips Semiconductors
Product specification
Three quadrant triacs
guaranteed commutation
BTA208 series D, E and F
DEFINITIONS
DATA SHEET STATUS
DATA SHEET
STATUS3
PRODUCT
STATUS4
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for
product development. Philips Semiconductors reserves the right to
change the specification in any manner without notice
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in
order to improve the design, manufacturing and supply. Changes will
be communicated according to the Customer Product/Process
Change Notification (CPCN) procedure SNW-SQ-650A
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 2002
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The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
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LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
3 Please consult the most recently issued datasheet before initiating or completing a design.
4 The product status of the device(s) described in this datasheet may have changed since this datasheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
March 2002
6
Rev 2.000