PHILIPS BTA312B-600B

BTA312B series B and C
12 A Three-quadrant triacs high commutation
Rev. 01 — 12 April 2007
Product data sheet
1. Product profile
1.1 General description
Passivated, new generation, high commutation triacs in a SOT404 plastic single-ended
surface-mountable package
1.2 Features
n Very high commutation performance
maximized at each gate sensitivity
n High immunity to dV/dt
1.3 Applications
n High power motor control - e.g. washing n Non-linear rectifier-fed motor loads
machines, vacuum cleaners
n Refrigeration and air conditioning
n Electronic thermostats
compressors
1.4 Quick reference data
n VDRM ≤ 600 V (BTA312B-600B/C)
n VDRM ≤ 800 V (BTA312B-800B/C)
n ITSM ≤ 95 A (t = 20 ms)
n IGT ≤ 50 mA (BTA312B series B)
n IGT ≤ 35 mA (BTA312B series C)
n IT(RMS) ≤ 12 A
2. Pinning information
Table 1.
Pinning
Pin
Description
1
main terminal 1 (T1)
2
main terminal 2 (T2)
3
gate (G)
mb
mounting base; main terminal 2 (T2)
Simplified outline
mb
Symbol
T2
T1
G
sym051
2
1
3
SOT404 (D2PAK)
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
3. Ordering information
Table 2.
Ordering information
Type number
Package
BTA312B-600B
Name
Description
D2PAK
plastic single-ended surface-mounted package (D2PAK); 3-leads (one lead SOT404
cropped)
BTA312B-600C
Version
BTA312B-800B
BTA312B-800C
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
repetitive peak off-state voltage
Conditions
BTA312B-600B; BTA312B-600C
[1]
Min
Max
Unit
-
600
V
BTA312B-800B; BTA312B-800C
-
800
V
-
12
A
t = 20 ms
-
95
A
t = 16.7 ms
-
105
A
t = 10 ms
-
45
A2s
ITM = 20 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
-
100
A/µs
-
2
A
-
5
W
-
0.5
W
IT(RMS)
RMS on-state current
full sine wave; Tmb ≤ 101 °C; see
Figure 4 and 5
ITSM
non-repetitive peak on-state current
full sine wave; Tj = 25 °C prior to
surge; see Figure 2 and 3
I2t
I2t
dIT/dt
rate of rise of on-state current
IGM
peak gate current
PGM
peak gate power
PG(AV)
average gate power
Tstg
storage temperature
−40
+150
°C
Tj
junction temperature
-
125
°C
[1]
for fusing
over any 20 ms period
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 15 A/µs.
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
2 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
003aab690
16
Ptot
(W)
conduction
angle
(degrees)
form
factor
a
α = 180°
30
60
90
120
180
4
2.8
2.2
1.9
1.57
120°
12
90°
α
60°
30°
8
4
0
0
3
6
9
12
IT(RMS) (A)
α = conduction angle
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
003aab680
100
ITSM
(A)
80
60
40
ITSM
IT
t
20
1/f
Tj(init) = 25 °C max
0
1
102
10
103
number of cycles (n)
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
3 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
003aab691
103
ITSM
(A)
(1)
102
ITSM
IT
t
tp
Tj(init) = 25 °C max
10
10-5
10-4
10-3
10-2
tp (s)
10-1
tp ≤ 20 ms
(1) dIT/dt limit
Fig 3. Non-repetitive peak on-state current as a function of pulse duration; maximum values
003aab687
50
IT(RMS)
(A)
003aab686
15
IT(RMS)
(A)
40
10
30
20
5
10
0
10-2
10-1
1
10
surge duration (s)
0
-50
0
50
100
150
Tmb (°C)
f = 50 Hz
Tmb = 101 °C
Fig 4. RMS on-state current as a function of surge
duration; maximum values
Fig 5. RMS on-state current as a function of mounting
base temperature; maximum values
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
4 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-mb)
thermal resistance from junction to half cycle; see Figure 6
mounting base
full cycle; see Figure 6
thermal resistance from junction to mounted on a printed
ambient
circuit board; minimum
footprint
Rth(j-a)
Min
Typ
Max
Unit
-
-
2.0
K/W
-
-
1.5
K/W
-
55
-
K/W
003aab775
10
Zth(j-mb)
(K/W)
1
(1)
10−1
(2)
P
10−2
tp
10−3
10−5
10−4
10−3
10−2
10−1
1
t
10
tp (s)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
5 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
6. Static characteristics
Table 5.
Static characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
IGT
IL
gate trigger
current
Conditions
BTA312B-600B
BTA312B-800B
BTA312B-600C
BTA312B-800C
Unit
Min
Typ
Max
Min
Typ
Max
T2+ G+
2
-
50
2
-
35
mA
T2+ G−
2
-
50
2
-
35
mA
T2− G−
2
-
50
2
-
35
mA
T2+ G+
-
-
60
-
-
50
mA
T2+ G−
-
-
90
-
-
60
mA
VD = 12 V; IT = 0.1 A; see Figure 8
latching current VD = 12 V; IGT = 0.1 A; see Figure 10
-
-
60
-
-
50
mA
IH
holding current
VD = 12 V; IGT = 0.1 A; see Figure 11
T2− G−
-
-
60
-
-
35
mA
VT
on-state
voltage
IT = 15 A; see Figure 9
-
1.3
1.6
-
1.3
1.6
V
VGT
gate trigger
voltage
VD = 12 V; IT = 0.1 A; see Figure 7
-
0.8
1.5
-
0.8
1.5
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C
0.25
0.4
-
0.25
0.4
-
V
-
0.1
0.5
-
0.1
0.5
mA
ID
off-state current VD = VDRM(max); Tj = 125 °C
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
6 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
7. Dynamic characteristics
Table 6.
Dynamic characteristics
Symbol Parameter
Conditions
BTA312B-600B
BTA312B-800B
BTA312B-600C
BTA312B-800C
Unit
Min
Typ
Max Min
Typ
Max
1000
2000
-
500
-
-
V/µs
dIcom/dt rate of change VDM = 400 V; Tj = 125 °C; IT(RMS) = 12 A;
of
without snubber; gate open circuit
commutating
current
30
-
-
20
-
-
A/ms
tgt
-
2
-
-
2
-
µs
dVD/dt
rate of rise of
off-state
voltage
VDM = 0.67 × VDRM(max); Tj = 125 °C;
exponential waveform; gate open circuit
gate-controlled ITM = 20 A; VD = VDRM(max); IG = 0.1 A;
turn-on time
dIG/dt = 5 A/µs
001aab101
1.6
001aac669
3
(1)
VGT
IGT
VGT(25°C)
IGT(25°C)
1.2
2
(2)
(3)
0.8
0.4
−50
1
0
50
100
150
0
−50
Tj (°C)
0
50
100
150
Tj (°C)
(1) T2− G−
(2) T2+ G−
(3) T2+ G+
Fig 7. Normalized gate trigger voltage as a function of
junction temperature
Fig 8. Normalized gate trigger current as a function of
junction temperature
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
7 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
003aab678
40
001aab100
3
IT
(A)
IL
IL(25°C)
30
2
20
1
(1)
10
(2)
(3)
0
0
0.5
1
1.5
2
VT (V)
0
−50
2.5
0
50
100
150
Tj (°C)
Vo = 1.127 V
Rs = 0.027 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. On-state current as a function of on-state
voltage
Fig 10. Normalized latching current as a function of
junction temperature
001aab099
3
IH
IH(25°C)
2
1
0
−50
0
50
100
150
Tj (°C)
Fig 11. Normalized holding current as a function of junction temperature
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
8 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
8. Package outline
SOT404
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
A
A1
E
mounting
base
D1
D
HD
2
Lp
1
3
c
b
e
e
Q
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
c
D
max.
D1
E
e
Lp
HD
Q
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
2.54
2.90
2.10
15.80
14.80
2.60
2.20
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-02-11
06-03-16
SOT404
Fig 12. Package outline SOT404 (D2PAK)
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
9 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BTA312B_SER_B_C_1
20070412
Product data sheet
-
-
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
10 of 12
BTA312B series B and C
NXP Semiconductors
12 A Three-quadrant triacs high commutation
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
BTA312B_SER_B_C_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 12 April 2007
11 of 12
NXP Semiconductors
BTA312B series B and C
12 A Three-quadrant triacs high commutation
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 April 2007
Document identifier: BTA312B_SER_B_C_1