BT1308W series D Triacs logic level Rev. 01 — 27 February 2008 Product data sheet 1. Product profile 1.1 General description Passivated sensitive gate triacs in a SOT223 surface-mountable plastic package 1.2 Features n Sensitive gate n Direct interfacing to logic level ICs n Gate triggering in four quadrants n Direct interfacing to low-power gate drive circuits 1.3 Applications n General purpose switching and phase control n Low-power AC fan speed controllers 1.4 Quick reference data n VDRM ≤ 400 V (BT1308W-400D) n VDRM ≤ 600 V (BT1308W-600D) n ITSM ≤ 9 A (t = 20 ms) n IGT ≤ 5 mA n IGT ≤ 7 mA (T2− G+) n IT(RMS) ≤ 0.8 A 2. Pinning information Table 1. Pinning Pin Description 1 main terminal 1 (T1) 2 main terminal 2 (T2) 3 gate (G) 4 mounting base; main terminal 2 (T2) Simplified outline Graphic symbol 4 T2 T1 G sym051 1 2 SOT223 3 BT1308W series D NXP Semiconductors Triacs logic level 3. Ordering information Table 2. Ordering information Type number BT1308W-400D Package Name Description Version SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 BT1308W-600D 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage BT1308W-400D - 400 V BT1308W-600D - 600 V full sine wave; Tsp ≤ 107.4 °C; see Figure 4 and 5 - 0.8 A IT(RMS) RMS on-state current ITSM non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 t = 20 ms - 9 A t = 16.7 ms - 10 A - 0.32 A2s I2t I2t for fusing tp = 10 ms dIT/dt rate of rise of on-state current ITM = 1 A; IG = 20 mA; dIG/dt = 0.2 A/µs T2+ G+ - 50 A/µs T2+ G− - 50 A/µs T2− G− - 50 A/µs T2− G+ - 10 A/µs IGM peak gate current - 1 A PGM peak gate power - 5 W PG(AV) average gate power - 0.1 W Tstg storage temperature −40 +150 °C Tj junction temperature - 125 °C over any 20 ms period BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 2 of 13 BT1308W series D NXP Semiconductors Triacs logic level 003aac209 1.2 Ptot (W) 0.8 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° 90° α 60° 30° 0.4 0.0 0 0.2 0.4 0.6 0.8 1 IT(RMS) (A) α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 003aac207 12 ITSM (A) 8 ITSM IT 4 t 1/f Tj(init) = 25 °C max 0 1 102 10 103 number of cycles f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 3 of 13 BT1308W series D NXP Semiconductors Triacs logic level 003aac208 103 ITSM IT ITSM (A) t tp Tj(init) = 25 °C max 102 (1) (2) 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit (2) T2− G+ quadrant limit Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values 003aab489 6 003aab487 1 IT(RMS) (A) IT(RMS) (A) 0.8 4 0.6 0.4 2 0.2 0 10-2 10-1 0 -50 1 10 surge duration (s) 0 50 100 Tsp (°C) 150 f = 50 Hz Tsp = 107.4 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of solder point temperature; maximum values BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 4 of 13 BT1308W series D NXP Semiconductors Triacs logic level 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; see Figure 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient full cycle for minimum footprint; see Figure 13 - 156 - K/W for pad area; see Figure 14 - 70 - K/W 003aac210 102 Zth(j-sp) (K/W) 10 1 P 10-1 t tp 10-2 10-5 Fig 6. 10-4 10-3 10-2 10-1 1 tp (s) 10 Transient thermal impedance from junction to solder point as a function of pulse width BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 5 of 13 BT1308W series D NXP Semiconductors Triacs logic level 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit T2+ G+ - 1 5 mA T2+ G− - 2 5 mA T2− G− - 2 5 mA T2− G+ - 4 7 mA T2+ G+ - 1 10 mA T2+ G− - 5 10 mA Static characteristics IGT IL gate trigger current latching current VD = 12 V; IT = 0.1 A; see Figure 8 VD = 12 V; IG = 0.1 A; see Figure 10 T2− G− - 1 10 mA T2− G+ - 2 10 mA IH holding current VD = 12 V; IG = 0.1 A; see Figure 11 - 1 10 mA VT on-state voltage IT = 0.85 A; see Figure 9 - 1.35 1.6 V VGT gate trigger voltage ID off-state current VD = 12 V; IT = 0.1 A; see Figure 7 - 0.9 2 V VD = VDRM; IT = 0.1 A; Tj = 110 °C 0.1 0.7 - V VD = VDRM(max); Tj = 125 °C - 0.1 0.5 mA 30 45 - V/µs Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 0.67 × VDRM(max); Tj = 110 °C; exponential waveform; gate open circuit dVcom/dt rate of change of commutating voltage VDM = VDRM(max); Tj = 50 °C; ITM = 0.84 A; dIcom/dt = 0.3 A/ms - 5 - V/µs tgt gate-controlled turn-on time ITM = 1 A; VD = VDRM(max); IG = 25 mA; dIG/dt = 5 A/µs - 2 - µs BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 6 of 13 BT1308W series D NXP Semiconductors Triacs logic level 003aaa039 1.6 003aaa030 3 VGT IGT VGT(25°C) IGT(25°C) (1) (2) 1.2 2 (3) (4) 0.8 (1) (2) (3) 1 (4) 0.4 0 −60 −10 40 90 0 −60 140 −10 40 90 Tj (°C) 140 Tj (°C) (1) T2+ G+ (2) T2− G+ (3) T2− G− (4) T2+ G− Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. 003aab486 1.6 Normalized gate trigger current as a function of junction temperature 003aaa031 3 IL IT (A) IL(25°C) 1.2 2 0.8 1 (1) (2) (3) 0.4 0 0 0.4 0.8 1.2 1.6 VT (V) 2 0 −60 −10 40 90 140 Tj (°C) Vo = 1.171 V Rs = 0.5125 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage Fig 10. Normalized latching current as a function of junction temperature BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 7 of 13 BT1308W series D NXP Semiconductors Triacs logic level 003aaa032 2.0 IH IH(25°C) 1.5 1.0 0.5 0 −60 −10 40 90 140 Tj (°C) Fig 11. Normalized holding current as a function of junction temperature BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 8 of 13 BT1308W series D NXP Semiconductors Triacs logic level 7. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA SC-73 EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 Fig 12. Package outline SOT223 (SC-73) BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 9 of 13 BT1308W series D NXP Semiconductors Triacs logic level 8. Mounting 3.8 min 1.5 min 6.3 1.5 min (3×) 2.3 1.5 min 4.6 001aab508 All dimensions are in mm. Fig 13. Minimum footprint SOT223 36 18 60 9 4.5 4.6 10 7 15 50 001aab509 All dimensions are in mm. Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick). Fig 14. Printed circuit board pad area SOT223 BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 10 of 13 BT1308W series D NXP Semiconductors Triacs logic level 9. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes BT1308W_SER_D_1 20080227 Product data sheet - - BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 11 of 13 BT1308W series D NXP Semiconductors Triacs logic level 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BT1308W_SER_D_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 12 of 13 BT1308W series D NXP Semiconductors Triacs logic level 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 February 2008 Document identifier: BT1308W_SER_D_1