PRTR5V0U6AS High speed interface ESD protection to IEC 61000-4-2 level 4 Rev. 01 — 18 February 2008 Product data sheet 1. Product profile 1.1 General description The PRTR5V0U6AS is designed to protect Input/Output (I/O) ports that are sensitive to capacitive load, such as USB 2.0, Ethernet, DVI and HDMI from destruction by ElectroStatic Discharge (ESD). It provides protection to downstream signal and supply components from ESD voltages as high as ±8 kV (contact discharge). The PRTR5V0U6AS incorporates six pairs of ultra-low capacitance rail-to-rail diodes plus a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD protection to be independent of supply voltage with any ESD voltage discharged locally within the device. The PRTR5V0U6AS is fabricated using monolithic silicon technology integrating six ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 8-lead SO8 (SOT96) package. 1.2 Features n n n n n Pb-free and RoHS compliant, dark green ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge Six ultra-low input capacitance (1 pF typical) ESD rail-to-rail ESD protection diodes Supply voltage independent clamping due to integrated Zener diode Small 8-lead SO8 (SOT96) package 1.3 Applications n General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: u Cellular and PCS mobile handsets u PC/Notebook USB2.0/IEEE1394 ports u DVI/HDMI interfaces u Cordless telephones u Wireless data (WAN/LAN) systems u PDAs PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 2. Pinning information Table 1. Pinning Pin Description Simplified outline 1 ESD protection I/O 1 2 ESD protection I/O 2 3 ground (GND) 4 ESD protection I/O 3 5 ESD protection I/O 4 6 ESD protection I/O 5 7 supply voltage (VCC) 8 ESD protection I/O 6 8 1 Symbol 5 1 8 2 7 3 6 4 5 4 001aah388 3. Ordering information Table 2. Ordering information Type number PRTR5V0U6AS Package Name Description SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 Version 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VI input voltage Vesd electrostatic discharge voltage Max Unit 0 5.5 V −8 +8 kV −55 +125 °C all pins; IEC 61000-4-2; level 4 contact discharge Tstg Min storage temperature 5. Recommended operating conditions Table 4. Operating conditions Symbol Parameter Tamb ambient temperature Conditions PRTR5V0U6AS_1 Product data sheet Min Typ Max Unit −40 - +85 °C © NXP B.V. 2008. All rights reserved. Rev. 01 — 18 February 2008 2 of 7 PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 6. Characteristics Table 5. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 1.0 - pF C(I/O-GND) input/output to ground capacitance VI = 0 V; f = 1 MHz; VCC = 3 V [1] ILR reverse leakage current VI = 3 V [1] - - 100 nA Zener diode; II = 1 mA [2] 6 - 9 V [2] - 30 - pF - 0.7 - V breakdown voltage VBR Csup supply pin to ground capacitance VI = 0 V; f = 1 MHz; VCC = 3 V VF forward voltage [1] Measured from pin 1, 2, 4, 5, 6 and 8 to ground. [2] Measured from pin 7 to ground. PRTR5V0U6AS_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 18 February 2008 3 of 7 PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 7. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 1. Package outline SOT96-1 (SO8) PRTR5V0U6AS_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 18 February 2008 4 of 7 PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 8. Abbreviations Table 6. Abbreviations Acronym Description DVI Digital Video Interface ESD ElectroStatic Discharge HDMI High Definition Multimedia interface LAN Local Area Network PCS Personal Computing System PDA Personal Digital Assistant RoHS Restriction of Hazardous Substances USB Universal Serial Bus WAN Wide Area Network 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PRTR5V0U6AS_1 20080218 Product data sheet - - PRTR5V0U6AS_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 18 February 2008 5 of 7 PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PRTR5V0U6AS_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 18 February 2008 6 of 7 PRTR5V0U6AS NXP Semiconductors High speed interface ESD protection to IEC 61000-4-2 level 4 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Recommended operating conditions. . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 2 2 2 2 3 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 18 February 2008 Document identifier: PRTR5V0U6AS_1