NX3L1T53 Low-ohmic single-pole double-throw analog switch Rev. 04 — 24 March 2010 Product data sheet 1. General description The NX3L1T53 is a low-ohmic single-pole double-throw analog switch suitable for use as an analog or digital 2:1 multiplexer/demultiplexer. It has a digital select input (S), two independent inputs/outputs (Y0 and Y1), a common input/output (Z) and an active LOW enable input (E). When pin E is HIGH, the switch is turned off. Schmitt trigger action at the digital inputs makes the circuit tolerant to slower input rise and fall times. Low threshold digital inputs allows this device to be driven by 1.8 V logic levels in 3.3 V applications without significant increase in supply current ICC. The NX3L1T53 allows signals with amplitude up to VCC to be transmitted from Z to Y0 or Y1; or from Y0 or Y1 to Z. It’s low ON resistance (0.5 Ω) and flatness (0.13 Ω) ensures minimal attenuation and distortion of transmitted signals. 2. Features Wide supply voltage range from 1.4 V to 4.3 V Very low ON resistance (peak): 1.6 Ω (typical) at VCC = 1.4 V 1.0 Ω (typical) at VCC = 1.65 V 0.55 Ω (typical) at VCC = 2.3 V 0.50 Ω (typical) at VCC = 2.7 V 0.50 Ω (typical) at VCC = 4.3 V Break-before-make switching High noise immunity ESD protection: HBM JESD22-A114E Class 3A exceeds 7500 V MM JESD22-A115-A exceeds 200 V CDM AEC-Q100-011 revision B exceeds 1000 V IEC61000-4-2 contact discharge exceeds 8000 V for switch ports CMOS low-power consumption Latch-up performance exceeds 100 mA per JESD 78 Class II Level A 1.8 V control logic at VCC = 3.6 V Control input accepts voltages above supply voltage Very low supply current, even when input is below VCC High current handling capability (350 mA continuous current under 3.3 V supply) Specified from −40 °C to +85 °C and from −40 °C to +125 °C NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 3. Applications Cell phone PDA Portable media player 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX3L1T53GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm SOT833-1 NX3L1T53GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 × 2 × 0.5 mm SOT996-2 NX3L1T53GM −40 °C to +125 °C XQFN8U plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm SOT902-1 5. Marking Table 2. Marking codes[1] Type number Marking code NX3L1T53GT M53 NX3L1T53GD M53 NX3L1T53GM M53 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 2 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 6. Functional diagram 6 Y1 S 5 7 Y0 Z 1 E 2 Fig 1. 001aad386 Logic symbol Y0 S Z Y1 E Fig 2. 001aad387 Logic diagram 7. Pinning information 7.1 Pinning NX3L1T53 Z 1 8 VCC E 2 7 Y0 GND 3 6 Y1 GND 4 5 NX3L1T53 S Z 1 8 VCC E 2 7 Y0 GND 3 6 Y1 GND 4 5 S 001aaj537 001aaj955 Transparent top view Fig 3. Pin configuration SOT833-1 (XSON8) Transparent top view Fig 4. Pin configuration SOT996-2 (XSON8U) NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 3 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch NX3L1T53 Y0 1 Y1 S 8 VCC terminal 1 index area Z 2 6 E 3 5 GND GND 4 7 001aaj538 Transparent top view Fig 5. Pin configuration SOT902-1 (XQFN8U) 7.2 Pin description Table 3. Symbol Pin description Pin Description SOT833-1 and SOT996-2 SOT902-1 Z 1 7 common output or input E 2 6 enable input (active LOW) GND 3 5 ground (0 V) GND 4 4 ground (0 V) S 5 3 select input Y1 6 2 independent input or output Y0 7 1 independent input or output VCC 8 8 supply voltage 8. Functional description Table 4. Function table[1] Input Channel on S E L L Y0 to Z or Z to Y0 H L Y1 to Z or Z to Y1 X H switch off [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 4 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Max Unit −0.5 +4.6 V [1] −0.5 +4.6 V [2] −0.5 VCC + 0.5 V VI input voltage VSW switch voltage IIK input clamping current VI < −0.5 V −50 - mA ISK switch clamping current VI < −0.5 V or VI > VCC + 0.5 V - ±50 mA ISW switch current VSW > −0.5 V or VSW < VCC + 0.5 V; source or sink current - ±350 mA VSW > −0.5 V or VSW < VCC + 0.5 V; pulsed at 1 ms duration, < 10 % duty cycle; peak current - ±500 mA −65 +150 °C - 250 mW Tstg select input S and enable input E Min storage temperature Ptot total power dissipation Tamb = −40 °C to +125 °C [3] [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V. [3] For XSON8, XSON8U and XQFN8U packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC supply voltage VI input voltage VSW switch voltage Tamb ambient temperature Δt/ΔV Conditions select input S and enable input E [1] input transition rise and fall rate VCC = 1.4 V to 4.3 V [2] Min Typ Max Unit 1.4 - 4.3 V 0 - 4.3 V 0 - VCC V −40 - +125 °C - - 200 ns/V [1] To avoid sinking GND current from terminal Z when switch current flows in terminal Yn, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Yn. In this case, there is no limit for the voltage drop across the switch. [2] Applies to control signal levels. NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 5 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 11. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter VIH VIL HIGH-level input voltage LOW-level input voltage Tamb = 25 °C Conditions Typ Max Min VCC = 1.4 V to 1.6 V 0.9 - - 0.9 - - V VCC = 1.65 V to 1.95 V 0.9 - - 0.9 - - V VCC = 2.3 V to 2.7 V 1.1 - - 1.1 - - V VCC = 2.7 V to 3.6 V 1.3 - - 1.3 - - V VCC = 3.6 V to 4.3 V 1.4 - - 1.4 - - V VCC = 1.4 V to 1.6 V - - 0.3 - 0.3 0.3 V VCC = 1.65 V to 1.95 V - - 0.4 - 0.4 0.3 V VCC = 2.3 V to 2.7 V - - 0.4 - 0.4 0.4 V VCC = 2.7 V to 3.6 V - - 0.5 - 0.5 0.5 V VCC = 3.6 V to 4.3 V - - 0.6 - 0.6 0.6 V - - - - ±0.5 ±1 μA VCC = 1.4 V to 3.6 V - - ±5 - ±50 ±500 nA VCC = 3.6 V to 4.3 V - - ±10 - ±50 ±500 nA VCC = 1.4 V to 3.6 V - - ±5 - ±50 ±500 nA VCC = 3.6 V to 4.3 V - - ±10 - ±50 ±500 nA VCC = 3.6 V - - 100 - 690 6000 nA VCC = 4.3 V input leakage current select input S and enable input E; VI = GND to 4.3 V; VCC = 1.4 V to 4.3 V IS(OFF) OFF-state leakage current Y0 and Y1 port; see Figure 6 ICC ΔICC ON-state leakage current Unit Min II IS(ON) Tamb = −40 °C to +125 °C Max Max (85 °C) (125 °C) Z port; see Figure 7 supply current VI = VCC or GND; VSW = GND or VCC - - 150 - 800 7000 nA additional VSW = GND or VCC supply current VI = 2.6 V; VCC = 4.3 V - 2.0 4.0 - 7 7 μA VI = 2.6 V; VCC = 3.6 V - 0.35 0.7 - 1 1 μA VI = 1.8 V; VCC = 4.3 V - 7.0 10.0 - 15 15 μA VI = 1.8 V; VCC = 3.6 V - 2.5 4.0 - 5 5 μA VI = 1.8 V; VCC = 2.5 V - 50 200 - 300 500 nA CI input capacitance - 1.0 - - - - pF CS(OFF) OFF-state capacitance - 35 - - - - pF CS(ON) ON-state capacitance - 130 - - - - pF NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 6 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 11.1 Test circuits VCC S VIL or VIH Y0 Z Y1 1 switch 2 switch S E 1 VIL VIH 2 VIH VIH IS E GND VIH VI VO 001aad390 VI = 0.3 V or VCC − 0.3 V; VO = VCC − 0.3 V or 0.3 V. Fig 6. Test circuit for measuring OFF-state leakage current VCC S VIL or VIH Z IS Y0 1 Y1 2 switch S E 1 VIL VIL 2 VIH VIL switch E GND VIL VO VI 001aad391 VI = 0.3 V or VCC − 0.3 V; VO = open circuit. Fig 7. Test circuit for measuring ON-state leakage current 11.2 ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 9 to Figure 15. Symbol RON(peak) Parameter ON resistance (peak) −40 °C to +85 °C Conditions Unit Min Max Min Max VCC = 1.4 V - 1.6 3.7 - 4.1 Ω VCC = 1.65 V - 1.0 1.6 - 1.7 Ω VCC = 2.3 V - 0.55 0.8 - 0.9 Ω VCC = 2.7 V - 0.5 0.75 - 0.9 Ω VCC = 4.3 V - 0.5 0.75 - 0.9 Ω VI = GND to VCC; ISW = 100 mA; see Figure 8 NX3L1T53_4 Product data sheet −40 °C to +125 °C Typ[1] © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 7 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch Table 8. ON resistance …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 9 to Figure 15. Symbol ΔRON RON(flat) Parameter −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Typ[1] Max Min Max VCC = 1.4 V - 0.04 0.3 - 0.3 Ω VCC = 1.65 V - 0.04 0.2 - 0.3 Ω VCC = 2.3 V - 0.02 0.08 - 0.1 Ω VCC = 2.7 V - 0.02 0.075 - 0.1 Ω VCC = 4.3 V - 0.02 0.075 - 0.1 Ω VCC = 1.4 V - 1.0 3.3 - 3.6 Ω VCC = 1.65 V - 0.5 1.2 - 1.3 Ω VCC = 2.3 V - 0.15 0.3 - 0.35 Ω VCC = 2.7 V - 0.13 0.3 - 0.35 Ω VCC = 4.3 V - 0.2 0.4 - 0.45 Ω [2] ON resistance mismatch VI = GND to VCC; between channels ISW = 100 mA [3] ON resistance (flatness) VI = GND to VCC; ISW = 100 mA [1] Typical values are measured at Tamb = 25 °C. [2] Measured at identical VCC, temperature and input voltage. [3] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature. 11.3 ON resistance test circuit and waveforms V VCC VIL or VIH VSW S Y0 1 Z Y1 2 switch S E 1 VIL VIL 2 VIH VIL switch E GND VIL VI ISW 001aah456 RON = VSW / ISW. Fig 8. Test circuit for measuring ON resistance NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 8 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 001aag564 1.6 RON (Ω) 1.2 (1) 0.8 (2) (3) (4) 0.4 (5) (6) 0 0 1 2 3 4 5 VI (V) (1) VCC = 1.5 V. (2) VCC = 1.8 V. (3) VCC = 2.5 V. (4) VCC = 2.7 V. (5) VCC = 3.3 V. (6) VCC = 4.3 V. Measured at Tamb = 25 °C. Fig 9. ON resistance as a function of input voltage 001aag565 1.6 001aag566 1.0 RON (Ω) RON (Ω) 0.8 1.2 (1) (2) (3) (4) 0.6 (1) (2) (3) (4) 0.8 0.4 0.4 0.2 0 0 0 1 2 3 0 VI (V) 2 3 VI (V) (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. (4) Tamb = −40 °C. Fig 10. ON resistance as a function of input voltage; VCC = 1.5 V Fig 11. ON resistance as a function of input voltage; VCC = 1.8 V NX3L1T53_4 Product data sheet 1 © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 9 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 001aag567 1.0 RON (Ω) 001aag568 1.0 RON (Ω) 0.8 0.8 0.6 0.6 (1) (2) (3) (4) 0.4 0.4 0.2 0.2 0 (1) (2) (3) (4) 0 0 1 2 3 0 1 2 VI (V) (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. (4) Tamb = −40 °C. Fig 12. ON resistance as a function of input voltage; VCC = 2.5 V 001aag569 1.0 3 VI (V) RON (Ω) Fig 13. ON resistance as a function of input voltage; VCC = 2.7 V 001aaj896 1.0 RON (Ω) 0.8 0.8 0.6 0.6 (1) (2) (3) (4) 0.4 (1) (2) (3) (4) 0.4 0.2 0.2 0 0 0 1 2 3 4 0 1 VI (V) 3 4 5 VI (V) (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. (4) Tamb = −40 °C. (4) Tamb = −40 °C. Fig 14. ON resistance as a function of input voltage; VCC = 3.3 V Fig 15. ON resistance as a function of input voltage; VCC = 4.3 V NX3L1T53_4 Product data sheet 2 © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 10 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 12. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 18. Symbol Parameter ten enable time tdis disable time 25 °C Conditions Max Min Max (85 °C) Max (125 °C) VCC = 1.4 V to 1.6 V - 50 90 - 120 120 ns VCC = 1.65 V to 1.95 V - 36 70 - 80 90 ns VCC = 2.3 V to 2.7 V - 24 45 - 50 55 ns VCC = 2.7 V to 3.6 V - 22 40 - 45 50 ns VCC = 3.6 V to 4.3 V - 22 40 - 45 50 ns VCC = 1.4 V to 1.6 V - 32 70 - 80 90 ns VCC = 1.65 V to 1.95 V - 20 55 - 60 65 ns VCC = 2.3 V to 2.7 V - 12 25 - 30 35 ns VCC = 2.7 V to 3.6 V - 10 20 - 25 30 ns - 10 20 - 25 30 ns S or E to Z or Yn; see Figure 16 S or E to Z or Yn; see Figure 16 break-before-make see Figure 17 time VCC = 1.4 V to 1.6 V [2] - 19 - 9 - - ns VCC = 1.65 V to 1.95 V - 17 - 7 - - ns VCC = 2.3 V to 2.7 V - 13 - 4 - - ns VCC = 2.7 V to 3.6 V - 10 - 3 - - ns VCC = 3.6 V to 4.3 V - 10 - 2 - - ns [1] Typical values are measured at Tamb = 25 °C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively. [2] Break-before-make guaranteed by design. NX3L1T53_4 Product data sheet Unit Min VCC = 3.6 V to 4.3 V tb-m −40 °C to +125 °C Typ[1] © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 11 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 12.1 Waveform and test circuits VI VM S, E input VM GND ten tdis VOH output OFF to HIGH HIGH to OFF VX VX GND ten tdis VOH VX output HIGH to OFF OFF to HIGH VX 001aah457 GND Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 16. Enable and disable times Table 10. Measurement points Supply voltage Input Output VCC VM VX 1.4 V to 4.3 V 0.5VCC 0.9VOH NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 12 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch VCC S Y0 Z Y1 E VIL G VI V VO RL CL VEXT = 1.5 V GND 001aah458 a. Test circuit VI 0.5VI 0.9VO 0.9VO VO tb-m 001aag572 b. Input and output measurement points Fig 17. Test circuit for measuring break-before-make timing VCC S Y0 1 Z Y1 2 switch E VIL VI G V VO RL CL VEXT = 1.5 V GND 001aah459 Test data is given in Table 11. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. VEXT = External voltage for measuring switching times. VI may be connected to S or E. Fig 18. Test circuit for measuring switching times NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 13 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch Table 11. Test data Supply voltage Input Load VCC VI tr, tf CL RL 1.4 V to 4.3 V VCC ≤ 2.5 ns 35 pF 50 Ω 12.2 Additional dynamic characteristics Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise specified); tr = tf ≤ 2.5 ns; Tamb = 25 °C. Symbol Parameter Conditions THD fi = 20 Hz to 20 kHz; RL = 32 Ω; see Figure 19 total harmonic distortion Min Typ Max Unit VCC = 1.4 V; VI = 1 V (p-p) - 0.15 - % VCC = 1.65 V; VI = 1.2 V (p-p) - 0.10 - % VCC = 2.3 V; VI = 1.5 V (p-p) - 0.02 - % VCC = 2.7 V; VI = 2 V (p-p) - 0.02 - % - 0.02 - % - 60 - MHz - −90 - dB - 0.2 - V - 0.3 - V - −90 - dB VCC = 1.5 V - 3 - pC VCC = 1.8 V - 4 - pC VCC = 2.5 V - 6 - pC VCC = 3.3 V - 9 - pC VCC = 4.3 V - 15 - pC [1] VCC = 4.3 V; VI = 2 V (p-p) −3 dB frequency response RL = 50 Ω; see Figure 20 αiso isolation (OFF-state) fi = 100 kHz; RL = 50 Ω; see Figure 21 Vct crosstalk voltage between digital inputs and switch; fi = 1 MHz; CL = 50 pF; RL = 50 Ω; see Figure 22 f(−3dB) [1] VCC = 1.4 V to 4.3 V [1] VCC = 1.4 V to 4.3 V VCC = 1.4 V to 3.6 V VCC = 3.6 V to 4.3 V Xtalk crosstalk between switches; fi = 100 kHz; RL = 50 Ω; see Figure 23 VCC = 1.4 V to 4.3 V Qinj [1] charge injection [1] fi = 1 MHz; CL = 0.1 nF; RL = 1 MΩ; Vgen = 0 V; Rgen = 0 Ω; see Figure 24 fi is biased at 0.5VCC. NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 14 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 12.3 Test circuits VCC 0.5VCC RL S VIL or VIH Z Y0 1 Y1 2 switch switch S E 1 VIL VIL 2 VIH VIL E VIL D fi GND 001aah460 Fig 19. Test circuit for measuring total harmonic distortion VCC 0.5VCC RL S VIL or VIH Z Y0 1 Y1 2 switch switch S E 1 VIL VIL 2 VIH VIL E VIL dB fi GND 001aah461 Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads −3 dB. Fig 20. Test circuit for measuring the frequency response when switch is in ON-state 0.5VCC VCC 0.5VCC RL VIL or VIH RL S Y0 1 Z Y1 2 switch switch S E 1 VIH VIH 2 VIL VIH E VIH dB fi GND 001aah462 Adjust fi voltage to obtain 0 dBm level at input. Fig 21. Test circuit for measuring isolation (OFF-state) NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 15 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch VCC S VIL or VIH E Y0 Z VI logic input G Y1 RL RL 0.5VCC 0.5VCC CL V VO 001aah452 a. Test circuit logic input (S, E) off on off Vct VO 001aah453 b. Input and output pulse definitions VI may be connected to S or E. Fig 22. Test circuit for measuring crosstalk voltage between digital inputs and switch VCC VIL or VIH S Z 0.5VCC 0.5VCC RL RL Y0 1 Y1 2 E VIH fi dB GND 001aah463 Fig 23. Test circuit for measuring crosstalk NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 16 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch VCC S Y0 1 Z Y1 2 switch E Rgen VIL VI G VO RL CL Vgen GND 001aad398 a. Test circuit logic input (S, E) off on off ΔVO VO 001aah451 b. Input and output pulse definitions Qinj = ΔVO × CL. ΔVO = output voltage variation. Rgen = generator resistance. Vgen = generator voltage. VI may be connected to S or E. Fig 24. Test circuit for measuring charge injection NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 17 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 13. Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 25. Package outline SOT833-1 (XSON8) NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 18 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 26. Package outline SOT996-2 (XSON8U) NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 19 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area A E A1 detail X L1 e e C ∅v M C A B ∅w M C L 4 y1 C y 5 3 metal area not for soldering e1 b 2 6 e1 7 1 terminal 1 index area 8 X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.65 1.55 1.65 1.55 0.55 0.5 0.35 0.25 0.15 0.05 0.1 0.05 0.05 0.05 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT902-1 --- MO-255 --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 27. Package outline SOT902-1 (XQFN8U) NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 20 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 14. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes NX3L1T53_4 20100324 Product data sheet - NX3L1T53_3 NX3L1T53_3 20100201 Product data sheet - NX3L1T53_2 Modifications: • • Section 2: IEC61000-4-2 added. Table 8: ON resistance (flatness) changed at VCC = 4.3 V. NX3L1T53_2 20090414 Product data sheet - NX3L1T53_1 NX3L1T53_1 20090217 Product data sheet - - NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 21 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 22 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] NX3L1T53_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 24 March 2010 23 of 24 NX3L1T53 NXP Semiconductors Low-ohmic single-pole double-throw analog switch 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 11.2 11.3 12 12.1 12.2 12.3 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ON resistance test circuit and waveforms . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Waveform and test circuits . . . . . . . . . . . . . . . 12 Additional dynamic characteristics . . . . . . . . . 14 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information. . . . . . . . . . . . . . . . . . . . . 23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 24 March 2010 Document identifier: NX3L1T53_4