PHILIPS KMI16

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D391
KMI16/1
Integrated rotational speed sensor
Product specification
Supersedes data of 1998 May 15
2000 Sep 05
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
DESCRIPTION
PINNING
The KMI16/1 sensor detects rotational speed of ferrous
gear wheels and reference marks.
PIN
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a ferrite magnet.
SYMBOL
DESCRIPTION
1
VCC
DC supply voltage
2
Vout
open collector output
3
GND
ground
The frequency of the digital current output signal is
proportional to the rotational speed of the target wheel.
handbook, halfpage
The open collector (OC) output allows for a high degree of
flexibility in the design of subsequent conditioning
electronics.
CAUTION
Do not press two or more products together against their
magnetic forces. Do not expose products to strong
magnetic fields of more than 30 kA/m.
1
2
3
MBK766
Fig.1 Simplified outline (SOT477B).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC
DC supply voltage
4.5
5
16
V
ICC
DC supply current (pin 1)
4
10
14
mA
VCEsat
OC saturation voltage
−
−
1
V
dmax
maximum sensing distance
2.4
2.9
−
mm
ft
operating tooth frequency
0
−
25000
Hz
Tamb
ambient operating temperature
−40
−
+150
°C
2000 Sep 05
2
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
PARAMETER
CONDITIONS
DC operating supply voltage
Tamb = −40 to +150 °C
voltage pin 1
Vout
VCC
MIN.
4.5
MAX.
UNIT
16
V
Tamb = −40 to +150 °C; no wrong polarity −0.5
protection
+16
V
OC output voltage
Tamb = −40 to +150 °C; no wrong polarity −0.5
protection; see Fig.5
+16
V
Vout(max)
peak OC output voltage
Tamb = −40 to +40 °C; no wrong polarity
protection; see Fig.5
−0.5
+26.5
V
Iout(max)
OC output current
Tamb = −40 to +150 °C
−
20
mA
Iout(off)
OC output leakage current
Tamb = −40 to +150 °C
−
100
µA
Ptot
total power dissipation
Tamb = −40 to +150 °C
−
200
mW
Tsld
soldering temperature
t ≤ 10 s
−
260
°C
Tstg
storage temperature
−65
+150
°C
Tamb
ambient operating temperature
−40
+150
°C
CHARACTERISTICS
Tamb = 25 °C; VCC = 5 V; d = 1.9 mm; ft = 2 kHz; test circuit see Fig.5; gear wheel: module 2.08 mm; material
9SMnPb28k; see Fig.6; centred sensor position; see notes 1, 2 and 3; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
ICC
supply current (pin 1)
Tamb = −40 to +150 °C
Vout (high)
OC output voltage high
OC = off state; Tamb = −40 to +150 °C 4.7
VCE sat
OC saturation voltage
OC = on state; Iout = 20 mA
tr
output signal rise time
10% to 90%
tf
output signal fall time
4
TYP.
MAX.
UNIT
10
14
mA
4.9
−
V
−
0.4
1
V
5
12
20
µs
10% to 90%
0.1
0.4
10
µs
δ
duty cycle
Tamb = −40 to +150 °C
30
50
70
%
dmin
minimum sensing distance
Tamb = −40 to +150 °C
−
0.3
0.5
mm
dmax
maximum sensing distance Tamb = −40 to +150 °C
2.4
2.9
−
mm
Notes
1. High rotational wheel speeds reduce the maximum sensing distance because of eddy currents, depending on target
wheel dimensions and materials used.
2. Output pins are designed for electrostatic sensitivity for more than 2000 V according to Human Body Model (HBM);
MIL-STD-883; method 3015.
3. EMC behaviour depends greatly on design of application circuit.
2000 Sep 05
3
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
FUNCTIONAL DESCRIPTION
The KMI16/1 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI16/1 is sensitive
to movement in the ‘y’ direction in front of the sensor only
(see Fig.2).
handbook, halfpage
x
x
magnet with
direction of
magnetization
y
The magnetoresistive sensor element signal is amplified,
temperature compensated and passed to a Schmitt trigger
in the conditioning integrated circuit (see Fig.4). The digital
output signal level is independent of the sensing distance
within the measuring range (see Fig.10). A (3-wire) output
current enables safe transfer of the sensor signal to the
detecting circuit (see Fig.5). The integrated circuit housing
is separated from the sensor element housing to optimize
the sensor behaviour at high temperatures.
z
sensor
IC
MBK767
Fig.2 Component detail of the KMI16/1.
gear wheel
handbook, full pagewidth
magnet
z
direction
of
motion
magnetic
field lines
y
sensor
MRA957
(a)
(b)
(c)
Fig.3 Functional principle.
2000 Sep 05
4
(d)
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
handbook, full pagewidth
VCC
VOLTAGE CONTROL
SENSOR
SCHMITT
TRIGGER
AMPLIFIER
Vout
open collector
output
GND
MGL348
Fig.4 Block diagram.
VCC
handbook, halfpage
2.7 kΩ
10 kΩ
SENSOR
Vout
2.2 nF
ICC
MGL347
Fig.5 Test and application circuit.
2000 Sep 05
5
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
APPLICATION INFORMATION
Gear Wheel Dimensions
Mounting conditions
SYMBOL
The recommended sensor position in front of a gear wheel
is shown in Fig.11. The distance ‘d’ is measured between
the sensor front and the tip of a gear wheel tooth. The
KMI16/1 senses ferrous indicators like gear wheels in the
‘y’ direction only (no rotational symmetry of the sensor);
see Fig.2. The effect of incorrect mounting positions on
sensing distance is shown in Figs 7, 8 and 9. The
symmetrical reference axis of the sensor corresponds to
the axis of the ferrite magnet.
German DIN
UNIT
z
number of teeth
−
d
diameter
mm
m
module m = d/z
mm
p
pitch p = π × m
mm
PD
pitch diameter (d in inch)
inch
DP
diametric pitch DP = z/PD
inch−1
CP
circular pitch CP = π/DP
inch
ASA; note 1
Environmental conditions
Due to eddy current effects the sensing distance depends
on the tooth frequency (see Fig.13). The influence of the
gear wheel module on the sensing distance is shown in
Fig.12.
handbook, full pagewidth
DESCRIPTION
Note
1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm × CP.
10.00
2.080 ± 0.01
8.00
6.535 ± 0.01
3.50
M3
see detail Z
∅ 8H7 ∅ 32
0.5 × 45 o
∅1
04
A
±0
.05
10 o
−0.1
0.5 × 45 o
0.1 A
2.08 ± 0.1
R 0.5
0.5 × 45 o
0.05 A
detail Z
0.5 × 45 o
Fig.6 Gear wheel dimensions.
2000 Sep 05
6
MBL242
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
MRA998
4
MRA999
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
(mm)
3
3
2
2
Θ
y
d
d
1
1
0
0
1
2
3
0
0
4
1
2
3
Θ (deg)
4
y (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.7 Sensing distance as a function of positional
tolerance in the y-axis; typical values.
Fig.8
MRA982
4
Sensing distance as a function of positional
tolerance; typical values.
MRA962
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
(mm)
3
3
x
2
2
d
d
1
1
10 mm
0
−6
−4
−2
0
2
4
0
−50
6
x (mm)
0
50
100
150
200
Tamb (oC)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.9
Fig.10 Sensing distance as a function of ambient
temperature; typical values.
Sensing distance as a function of positional
tolerance in the x-axis; typical values.
2000 Sep 05
7
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
MRA966
1.5
handbook, halfpage
d
d0
1
sensor
handbook, halfpage
d
d
0.5
gear wheel
0
MRA963
0
1
2
3
4
5
module m (mm)
do = measuring distance for a gear wheel with module m = 2 mm.
Fig.12 Normalized maximum sensing distance as
a function of gear wheel module; typical
values.
Fig.11 Sensor positioning.
MRA965
4
handbook, halfpage
d
(mm)
3
2
tooth
frequency
d
ft
1
0
0
1
2
3
4
f (kHz)
VCC = 12 V; module = 2 mm.
Fig.13 Sensing distance as a function of tooth
frequency; typical values.
2000 Sep 05
8
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
PACKAGE OUTLINE
Plastic single-ended multi-chip package;
magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads
M1
SOT477B
v M A B
HE1
K
B
A
Q
E
A
L1
M2
bp1
D
L
v M A B
E1
M3
HE
SENSOR DIE POSITION
centre of reading point
D1
*
L2
1
2
e1
3
bp
c
0
2.5
5 mm
e
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
bp
bp1
c
D(2)
mm
1.7
1.4
0.8
0.7
1.57
1.47
0.3
0.24
4.1
3.9
D1(2) E(2)
5.7
5.5
4.5
4.3
E1(2)
e
e1
HE
HE1
K
max.
L
L1
L2
M1
M2
M3(1)
Q
v
5.7
5.5
4.6
4.4
2.35
2.15
18.2
17.8
5.6
5.5
5.37
7.55
7.25
1.2
0.9
3.9
3.5
8.15
7.85
8.15
7.85
4.7
4.3
0.75
0.65
0.25
Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
99-09-23
00-08-31
SOT477B
2000 Sep 05
EUROPEAN
PROJECTION
9
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Sep 05
10
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
NOTES
2000 Sep 05
11
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 70
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613520/02/pp12
Date of release: 2000
Sep 05
Document order number:
9397 750 07248