DISCRETE SEMICONDUCTORS DATA SHEET M3D391 KMI16/1 Integrated rotational speed sensor Product specification Supersedes data of 1998 May 15 2000 Sep 05 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 DESCRIPTION PINNING The KMI16/1 sensor detects rotational speed of ferrous gear wheels and reference marks. PIN The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a ferrite magnet. SYMBOL DESCRIPTION 1 VCC DC supply voltage 2 Vout open collector output 3 GND ground The frequency of the digital current output signal is proportional to the rotational speed of the target wheel. handbook, halfpage The open collector (OC) output allows for a high degree of flexibility in the design of subsequent conditioning electronics. CAUTION Do not press two or more products together against their magnetic forces. Do not expose products to strong magnetic fields of more than 30 kA/m. 1 2 3 MBK766 Fig.1 Simplified outline (SOT477B). QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC DC supply voltage 4.5 5 16 V ICC DC supply current (pin 1) 4 10 14 mA VCEsat OC saturation voltage − − 1 V dmax maximum sensing distance 2.4 2.9 − mm ft operating tooth frequency 0 − 25000 Hz Tamb ambient operating temperature −40 − +150 °C 2000 Sep 05 2 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL PARAMETER CONDITIONS DC operating supply voltage Tamb = −40 to +150 °C voltage pin 1 Vout VCC MIN. 4.5 MAX. UNIT 16 V Tamb = −40 to +150 °C; no wrong polarity −0.5 protection +16 V OC output voltage Tamb = −40 to +150 °C; no wrong polarity −0.5 protection; see Fig.5 +16 V Vout(max) peak OC output voltage Tamb = −40 to +40 °C; no wrong polarity protection; see Fig.5 −0.5 +26.5 V Iout(max) OC output current Tamb = −40 to +150 °C − 20 mA Iout(off) OC output leakage current Tamb = −40 to +150 °C − 100 µA Ptot total power dissipation Tamb = −40 to +150 °C − 200 mW Tsld soldering temperature t ≤ 10 s − 260 °C Tstg storage temperature −65 +150 °C Tamb ambient operating temperature −40 +150 °C CHARACTERISTICS Tamb = 25 °C; VCC = 5 V; d = 1.9 mm; ft = 2 kHz; test circuit see Fig.5; gear wheel: module 2.08 mm; material 9SMnPb28k; see Fig.6; centred sensor position; see notes 1, 2 and 3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. ICC supply current (pin 1) Tamb = −40 to +150 °C Vout (high) OC output voltage high OC = off state; Tamb = −40 to +150 °C 4.7 VCE sat OC saturation voltage OC = on state; Iout = 20 mA tr output signal rise time 10% to 90% tf output signal fall time 4 TYP. MAX. UNIT 10 14 mA 4.9 − V − 0.4 1 V 5 12 20 µs 10% to 90% 0.1 0.4 10 µs δ duty cycle Tamb = −40 to +150 °C 30 50 70 % dmin minimum sensing distance Tamb = −40 to +150 °C − 0.3 0.5 mm dmax maximum sensing distance Tamb = −40 to +150 °C 2.4 2.9 − mm Notes 1. High rotational wheel speeds reduce the maximum sensing distance because of eddy currents, depending on target wheel dimensions and materials used. 2. Output pins are designed for electrostatic sensitivity for more than 2000 V according to Human Body Model (HBM); MIL-STD-883; method 3015. 3. EMC behaviour depends greatly on design of application circuit. 2000 Sep 05 3 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 FUNCTIONAL DESCRIPTION The KMI16/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI16/1 is sensitive to movement in the ‘y’ direction in front of the sensor only (see Fig.2). handbook, halfpage x x magnet with direction of magnetization y The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt trigger in the conditioning integrated circuit (see Fig.4). The digital output signal level is independent of the sensing distance within the measuring range (see Fig.10). A (3-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see Fig.5). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures. z sensor IC MBK767 Fig.2 Component detail of the KMI16/1. gear wheel handbook, full pagewidth magnet z direction of motion magnetic field lines y sensor MRA957 (a) (b) (c) Fig.3 Functional principle. 2000 Sep 05 4 (d) Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 handbook, full pagewidth VCC VOLTAGE CONTROL SENSOR SCHMITT TRIGGER AMPLIFIER Vout open collector output GND MGL348 Fig.4 Block diagram. VCC handbook, halfpage 2.7 kΩ 10 kΩ SENSOR Vout 2.2 nF ICC MGL347 Fig.5 Test and application circuit. 2000 Sep 05 5 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 APPLICATION INFORMATION Gear Wheel Dimensions Mounting conditions SYMBOL The recommended sensor position in front of a gear wheel is shown in Fig.11. The distance ‘d’ is measured between the sensor front and the tip of a gear wheel tooth. The KMI16/1 senses ferrous indicators like gear wheels in the ‘y’ direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 7, 8 and 9. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. German DIN UNIT z number of teeth − d diameter mm m module m = d/z mm p pitch p = π × m mm PD pitch diameter (d in inch) inch DP diametric pitch DP = z/PD inch−1 CP circular pitch CP = π/DP inch ASA; note 1 Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (see Fig.13). The influence of the gear wheel module on the sensing distance is shown in Fig.12. handbook, full pagewidth DESCRIPTION Note 1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm × CP. 10.00 2.080 ± 0.01 8.00 6.535 ± 0.01 3.50 M3 see detail Z ∅ 8H7 ∅ 32 0.5 × 45 o ∅1 04 A ±0 .05 10 o −0.1 0.5 × 45 o 0.1 A 2.08 ± 0.1 R 0.5 0.5 × 45 o 0.05 A detail Z 0.5 × 45 o Fig.6 Gear wheel dimensions. 2000 Sep 05 6 MBL242 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 MRA998 4 MRA999 4 handbook, halfpage handbook, halfpage d (mm) d (mm) 3 3 2 2 Θ y d d 1 1 0 0 1 2 3 0 0 4 1 2 3 Θ (deg) 4 y (mm) VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm. VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.7 Sensing distance as a function of positional tolerance in the y-axis; typical values. Fig.8 MRA982 4 Sensing distance as a function of positional tolerance; typical values. MRA962 4 handbook, halfpage handbook, halfpage d (mm) d (mm) 3 3 x 2 2 d d 1 1 10 mm 0 −6 −4 −2 0 2 4 0 −50 6 x (mm) 0 50 100 150 200 Tamb (oC) VCC = 12 V; ft = 2 kHz; module = 2 mm. VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.9 Fig.10 Sensing distance as a function of ambient temperature; typical values. Sensing distance as a function of positional tolerance in the x-axis; typical values. 2000 Sep 05 7 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 MRA966 1.5 handbook, halfpage d d0 1 sensor handbook, halfpage d d 0.5 gear wheel 0 MRA963 0 1 2 3 4 5 module m (mm) do = measuring distance for a gear wheel with module m = 2 mm. Fig.12 Normalized maximum sensing distance as a function of gear wheel module; typical values. Fig.11 Sensor positioning. MRA965 4 handbook, halfpage d (mm) 3 2 tooth frequency d ft 1 0 0 1 2 3 4 f (kHz) VCC = 12 V; module = 2 mm. Fig.13 Sensing distance as a function of tooth frequency; typical values. 2000 Sep 05 8 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 PACKAGE OUTLINE Plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads M1 SOT477B v M A B HE1 K B A Q E A L1 M2 bp1 D L v M A B E1 M3 HE SENSOR DIE POSITION centre of reading point D1 * L2 1 2 e1 3 bp c 0 2.5 5 mm e scale DIMENSIONS (mm are the original dimensions) UNIT A(1) bp bp1 c D(2) mm 1.7 1.4 0.8 0.7 1.57 1.47 0.3 0.24 4.1 3.9 D1(2) E(2) 5.7 5.5 4.5 4.3 E1(2) e e1 HE HE1 K max. L L1 L2 M1 M2 M3(1) Q v 5.7 5.5 4.6 4.4 2.35 2.15 18.2 17.8 5.6 5.5 5.37 7.55 7.25 1.2 0.9 3.9 3.5 8.15 7.85 8.15 7.85 4.7 4.3 0.75 0.65 0.25 Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-09-23 00-08-31 SOT477B 2000 Sep 05 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 Sep 05 10 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 NOTES 2000 Sep 05 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 70 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613520/02/pp12 Date of release: 2000 Sep 05 Document order number: 9397 750 07248