PHILIPS KMI15/1

DISCRETE SEMICONDUCTORS
DATA SHEET
KMI15/1
Integrated rotational speed sensor
Preliminary specification
File under Discrete Semiconductors, SC17
1996 Dec 05
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
FEATURES
PINNING
• Digital current output signal
PIN
DESCRIPTION
• Zero speed capability
1
• Wide air gap
VCC
2
V−
• Wide temperature range
• Insensitive to vibration
• EMC resistant.
handbook, halfpage
DESCRIPTION
The KMI15/1 sensor detects rotational speed of ferrous
gear wheels and reference marks(1).
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a magnetized ferrite magnet.
The frequency of the digital current output signal is
proportional to the rotational speed of a gear wheel.
CAUTION
1
Do not press two or more products together against their
magnetic forces.
2
MBH781
(1) The sensor contains a customized integrated circuit. Usage in
hydraulic brake systems and in systems with active brake
control is forbidden.
Fig.1 Simplified outline; (SOT453B).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC
DC supply voltage
−
12
−
V
ICC (low)
current output signal low
−
7
−
mA
ICC (high)
current output signal high
−
14
−
mA
d
sensing distance
0 to 2.5
0 to 2.9
−
mm
ft
operating tooth frequency
0
−
25000
Hz
Tamb
ambient operating temperature
−40
−
+85
°C
1996 Dec 05
2
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
Tamb = −40 to +85 °C; RL = 115 Ω
MAX.
UNIT
VCC
DC supply voltage
−
16
V
Tstg
storage temperature
−40
+150
°C
Tamb
ambient operating temperature
−40
+85
°C
Tsld
soldering temperature
−
260
°C
t ≤ 10 s
output short-circuit duration to GND
continuous; note 1
Note
1. With RL = 115 Ω the device is continuously protected against wrong polarity of DC supply voltage (VCC) to GND
(see Fig.7).
CHARACTERISTICS
Tamb = 25 °C; VCC = 12 V; d = 2.1 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 Ω; sensor positioning: see Fig.15;
gear wheel: module 2 mm; material 1.0715; unless otherwise specified.
SYMBOL
PARAMETER
ICC (low)
current output signal low
ICC (high)
tr
CONDITIONS
MIN.
TYP.
7.0
MAX.
see Figs 6 and 8
5.6
current output signal high
see Figs 6 and 8
11.2
14.0
16.8
mA
output signal rise time
CL = 100 pF; see Fig.9; 10 to 90% value −
0.5
−
µs
tf
output signal fall time
CL = 100 pF; see Fig.9; 10 to 90% value −
0.7
−
µs
td
switching delay time
between stimulation pulse (generated
by a coil) and output signal
−
1
−
µs
ft
operating tooth frequency for both rotation directions
0
−
25000
Hz
d
sensing distance
see Fig.15 and note 1
0 to 2.5 0 to 2.9 −
mm
δ
duty cycle
see Fig.6
30
%
50
8.4
UNIT
70
Note
1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17).
1996 Dec 05
3
mA
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
FUNCTIONAL DESCRIPTION
handbook, halfpage
The KMI15/1 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI15/1 is sensitive
to movement in the ‘y’ direction in front of the sensor only
(see Fig.2).
x
x
magnet with
direction of
magnetization
y
The magnetoresistive sensor element signal is amplified,
temperature compensated and passed to a Schmitt trigger
in the conditioning integrated circuit (Figs 4 and 5).
The digital output signal level (see Fig.6) is independent of
the sensing distance within the measuring range (Fig.14).
A (2-wire) output current enables safe transfer of the
sensor signal to the detecting circuit (see Fig.7).
The integrated circuit housing is separated from the
sensor element housing to optimize the sensor behaviour
at high temperatures.
z
sensor
IC
MBH778
Fig.2 Component detail of the KMI15/1.
gear wheel
handbook, full pagewidth
direction
of
motion
magnetic
field lines
magnet
z
y
sensor
MRA957
(a)
(b)
(c)
Fig.3 Functional principle.
1996 Dec 05
4
(d)
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
handbook, full pagewidth
CONSTANT
CURRENT
SOURCE
VOLTAGE CONTROL
SENSOR
SCHMITT
TRIGGER
AMPLIFIER
V CC
SWITCHABLE
CURRENT
SOURCE
V
MRA958
Fig.4 Block diagram.
VCC
handbook, full pagewidth
constant
current source
switchable
current source
power supply
sensor
Vref
EMC
FILTER
preamplifier
GAP
Schmitttrigger
V
MRA959
Fig.5 Simplified circuit diagram.
1996 Dec 05
5
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
MRA960
handbook, halfpage
I CC
V
CC
T
14 mA
SENSOR
V
I CC
CL
RL
7 mA
tp
GND
MRA961
t
tp
δ = ---- × 100%
T
Fig.6 Output signal as a function of time.
Fig.7 Test and application circuit.
APPLICATION INFORMATION
MRA968
1
handbook, halfpage
MRA967
16
CC
(mA)
14
t
( µ s)
handbook,
halfpage
I
VCC = 20 V
0.8
VCC = 12 V
I CC(high)
tf
VCC = 8 V
12
0.6
tr
10
0.4
ICC
VCC = 20 V
8
VCC = 12 V
I CC(low)
6
0.2
tr
VCC = 8 V
t
0
4
50
0
50
100
150
tf
50
0
50
200
100
150
200
Tamb ( oC)
Tamb (oC)
VCC = 12 V; CL = 100 pF; RL = 115 Ω.
Fig.8
Output current levels as functions of
ambient temperature.
1996 Dec 05
Fig.9
6
Output current switching times as functions
of ambient temperature.
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
Mounting conditions
Gear Wheel Dimensions
The recommended sensor position in front of a gear wheel
is shown in Fig.15. The distance ‘d’ is measured between
the sensor front and the tip of a gear wheel tooth.
The KMI15/1 senses ferrous indicators like gear wheels in
the ± y direction only (no rotational symmetry of the
sensor); see Fig.2. The effect of incorrect mounting
positions on sensing distance is shown in Figs 11, 12 and
13. The symmetrical reference axis of the sensor
corresponds to the axis of the ferrite magnet.
SYMBOL
DESCRIPTION
UNIT
German DIN
z
number of teeth
d
diameter
m
module m = d/z
mm
p
pitch p = π × m
mm
mm
ASA; note1
Environmental conditions
Due to eddy current effects the sensing distance depends
on the tooth frequency (Fig.17). The influence of gear
wheel module on the sensing distance is shown in Fig.16.
PD
pitch diameter (d in inch)
inch
DP
diametric pitch DP = z/PD
inch−1
CP
circular pitch CP = π/DP
inch
Note
1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm × CP.
MRA998
4
handbook, halfpage
d
(mm)
pitch
3
handbook, halfpage
2
y
pitch
diameter
d
MRA964
1
0
0
1
2
3
4
y (mm)
pitch diameter
module = -----------------------------------------number of teeth
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
pitch = module × π
Fig.11 Sensing distance as a function of positional
tolerance in the y-axis.
Fig.10 Gear wheel dimensions.
1996 Dec 05
7
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
MRA999
4
MRA982
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
(mm)
3
3
2
x
2
Θ
d
d
1
1
10 mm
0
0
1
2
3
Θ (deg)
0
4
−6
−4
−2
0
2
4
6
x (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.12 Sensing distance as a function of positional
tolerance.
Fig.13 Sensing distance as a function of positional
tolerance in the x-axis.
MRA962
4
handbook, halfpage
d
(mm)
handbook, halfpage
d
3
sensor
d
2
d
gear wheel
1
MRA963
0
−50
0
50
100
150
200
Tamb (oC)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.14 Sensing distance as a function of ambient
temperature.
1996 Dec 05
Fig.15 Sensor positioning.
8
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
MRA966
1.5
MRA965
4
handbook, halfpage
handbook, halfpage
d
(mm)
d
d0
3
1
2
tooth
frequency
d
ft
0.5
1
0
0
1
2
3
0
0
4
5
module m (mm)
1
2
3
4
f (kHz)
do = measuring distance for a gear wheel with module m = 2 mm.
VCC = 12 V; module = 2 mm.
Fig.16 Normalized maximum sensing distance as
a function of gear wheel module.
Fig.17 Sensing distance as a function of tooth
frequency.
1996 Dec 05
9
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
The board net often contains a central load dump
protection that makes such a device in the protection
circuit of the sensor module unnecessary.
EMC
Figure 18 shows a recommended application circuit for
automotive applications (wheel sensing ft < 5 kHz).
It provides a protection interface to meet Electromagnetic
Compatibility (EMC) standards and safeguard against
voltage spikes. Table 1 lists the tests which are applicable
to this circuit and the achieved class of functional status.
Protection against ‘load dump’ (test pulse 5 according to
“DIN 40839”) means a very high demand on the protection
circuit and requires a suitable suppressor diode with
sufficient energy absorption capability.
Table 1
Tests for electrostatic discharge (ESD) were conducted in
line with “IEC 801-2” to demonstrate the KMI15/1’s
handling capabilities. The “IEC 801-2” test conditions
were: C = 150 pF, R = 150 Ω, V = 2 kV.
Electromagnetic disturbances with fields up to 150 V/m
and f = 1 GHz (ref. “DIN 40839”) have no influence on
performance.
EMC test results
EMC REF. DIN 40839
SYMBOL
MIN. (V)
MAX. (V)
REMARKS
CLASS
Test pulse 1
VLD
−100
−
td = 2 ms
C
Test pulse 2
VLD
−
100
td = 0.2 ms
A
Test pulse 3a
VLD
−150
−
td = 0.1 µs
A
Test pulse 3b
VLD
−
100
td = 0.1 µs
A
Test pulse 4
VLD
−7
−
td = 130 ms
B
Test pulse 5
VLD
−
120
td = 400 ms
B
D1
handbook, halfpage
+V
VCC
1N4001/3
BZTO3G36
−V
D2
C1
100
nF
RL
115
Ω
SENSOR
CL
100
nF
MGD805
GND
Fig.18 Test/application circuit for the KMI15/1.
1996 Dec 05
10
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
PACKAGE OUTLINE
Package description
SOT453B
M1
v M A B
HE1
K
B
A
Q
E
A
L1
M2
bp1
D
L
v M A B
E1
M3
HE
D1
L2
(+)
(−)
bp
c
0
2.5
5 mm
e
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
bp1
c
D(1)
D1(1)
E(1)
E1(1)
e
HE
HE1
K
max.
L
L1
L2
M1
M2
M3
Q
v
mm
1.7
1.4
0.8
0.7
1.5
1.4
0.3
0.24
4.1
3.9
5.7
5.5
4.5
4.3
5.7
5.5
4.6
4.4
18.2
17.8
5.6
5.5
5.37
7.55
7.25
1.2
0.9
3.9
3.5
8.15
7.85
8.15
7.85
4.7
4.3
0.75
0.65
0.25
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
96-11-12
SOT453B
1996 Dec 05
EUROPEAN
PROJECTION
11
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Dec 05
12
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
NOTES
1996 Dec 05
13
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
NOTES
1996 Dec 05
14
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
NOTES
1996 Dec 05
15
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© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands
147021/1200/01/pp16
Date of release: 1996 Dec 05
Document order number:
9397 750 01315