DISCRETE SEMICONDUCTORS DATA SHEET KMI15/1 Integrated rotational speed sensor Preliminary specification File under Discrete Semiconductors, SC17 1996 Dec 05 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 FEATURES PINNING • Digital current output signal PIN DESCRIPTION • Zero speed capability 1 • Wide air gap VCC 2 V− • Wide temperature range • Insensitive to vibration • EMC resistant. handbook, halfpage DESCRIPTION The KMI15/1 sensor detects rotational speed of ferrous gear wheels and reference marks(1). The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a magnetized ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. CAUTION 1 Do not press two or more products together against their magnetic forces. 2 MBH781 (1) The sensor contains a customized integrated circuit. Usage in hydraulic brake systems and in systems with active brake control is forbidden. Fig.1 Simplified outline; (SOT453B). QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC DC supply voltage − 12 − V ICC (low) current output signal low − 7 − mA ICC (high) current output signal high − 14 − mA d sensing distance 0 to 2.5 0 to 2.9 − mm ft operating tooth frequency 0 − 25000 Hz Tamb ambient operating temperature −40 − +85 °C 1996 Dec 05 2 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. Tamb = −40 to +85 °C; RL = 115 Ω MAX. UNIT VCC DC supply voltage − 16 V Tstg storage temperature −40 +150 °C Tamb ambient operating temperature −40 +85 °C Tsld soldering temperature − 260 °C t ≤ 10 s output short-circuit duration to GND continuous; note 1 Note 1. With RL = 115 Ω the device is continuously protected against wrong polarity of DC supply voltage (VCC) to GND (see Fig.7). CHARACTERISTICS Tamb = 25 °C; VCC = 12 V; d = 2.1 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 Ω; sensor positioning: see Fig.15; gear wheel: module 2 mm; material 1.0715; unless otherwise specified. SYMBOL PARAMETER ICC (low) current output signal low ICC (high) tr CONDITIONS MIN. TYP. 7.0 MAX. see Figs 6 and 8 5.6 current output signal high see Figs 6 and 8 11.2 14.0 16.8 mA output signal rise time CL = 100 pF; see Fig.9; 10 to 90% value − 0.5 − µs tf output signal fall time CL = 100 pF; see Fig.9; 10 to 90% value − 0.7 − µs td switching delay time between stimulation pulse (generated by a coil) and output signal − 1 − µs ft operating tooth frequency for both rotation directions 0 − 25000 Hz d sensing distance see Fig.15 and note 1 0 to 2.5 0 to 2.9 − mm δ duty cycle see Fig.6 30 % 50 8.4 UNIT 70 Note 1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17). 1996 Dec 05 3 mA Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 FUNCTIONAL DESCRIPTION handbook, halfpage The KMI15/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI15/1 is sensitive to movement in the ‘y’ direction in front of the sensor only (see Fig.2). x x magnet with direction of magnetization y The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt trigger in the conditioning integrated circuit (Figs 4 and 5). The digital output signal level (see Fig.6) is independent of the sensing distance within the measuring range (Fig.14). A (2-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see Fig.7). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures. z sensor IC MBH778 Fig.2 Component detail of the KMI15/1. gear wheel handbook, full pagewidth direction of motion magnetic field lines magnet z y sensor MRA957 (a) (b) (c) Fig.3 Functional principle. 1996 Dec 05 4 (d) Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 handbook, full pagewidth CONSTANT CURRENT SOURCE VOLTAGE CONTROL SENSOR SCHMITT TRIGGER AMPLIFIER V CC SWITCHABLE CURRENT SOURCE V MRA958 Fig.4 Block diagram. VCC handbook, full pagewidth constant current source switchable current source power supply sensor Vref EMC FILTER preamplifier GAP Schmitttrigger V MRA959 Fig.5 Simplified circuit diagram. 1996 Dec 05 5 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 MRA960 handbook, halfpage I CC V CC T 14 mA SENSOR V I CC CL RL 7 mA tp GND MRA961 t tp δ = ---- × 100% T Fig.6 Output signal as a function of time. Fig.7 Test and application circuit. APPLICATION INFORMATION MRA968 1 handbook, halfpage MRA967 16 CC (mA) 14 t ( µ s) handbook, halfpage I VCC = 20 V 0.8 VCC = 12 V I CC(high) tf VCC = 8 V 12 0.6 tr 10 0.4 ICC VCC = 20 V 8 VCC = 12 V I CC(low) 6 0.2 tr VCC = 8 V t 0 4 50 0 50 100 150 tf 50 0 50 200 100 150 200 Tamb ( oC) Tamb (oC) VCC = 12 V; CL = 100 pF; RL = 115 Ω. Fig.8 Output current levels as functions of ambient temperature. 1996 Dec 05 Fig.9 6 Output current switching times as functions of ambient temperature. Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 Mounting conditions Gear Wheel Dimensions The recommended sensor position in front of a gear wheel is shown in Fig.15. The distance ‘d’ is measured between the sensor front and the tip of a gear wheel tooth. The KMI15/1 senses ferrous indicators like gear wheels in the ± y direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 11, 12 and 13. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. SYMBOL DESCRIPTION UNIT German DIN z number of teeth d diameter m module m = d/z mm p pitch p = π × m mm mm ASA; note1 Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (Fig.17). The influence of gear wheel module on the sensing distance is shown in Fig.16. PD pitch diameter (d in inch) inch DP diametric pitch DP = z/PD inch−1 CP circular pitch CP = π/DP inch Note 1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm × CP. MRA998 4 handbook, halfpage d (mm) pitch 3 handbook, halfpage 2 y pitch diameter d MRA964 1 0 0 1 2 3 4 y (mm) pitch diameter module = -----------------------------------------number of teeth VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm. pitch = module × π Fig.11 Sensing distance as a function of positional tolerance in the y-axis. Fig.10 Gear wheel dimensions. 1996 Dec 05 7 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 MRA999 4 MRA982 4 handbook, halfpage handbook, halfpage d (mm) d (mm) 3 3 2 x 2 Θ d d 1 1 10 mm 0 0 1 2 3 Θ (deg) 0 4 −6 −4 −2 0 2 4 6 x (mm) VCC = 12 V; ft = 2 kHz; module = 2 mm. VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.12 Sensing distance as a function of positional tolerance. Fig.13 Sensing distance as a function of positional tolerance in the x-axis. MRA962 4 handbook, halfpage d (mm) handbook, halfpage d 3 sensor d 2 d gear wheel 1 MRA963 0 −50 0 50 100 150 200 Tamb (oC) VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.14 Sensing distance as a function of ambient temperature. 1996 Dec 05 Fig.15 Sensor positioning. 8 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 MRA966 1.5 MRA965 4 handbook, halfpage handbook, halfpage d (mm) d d0 3 1 2 tooth frequency d ft 0.5 1 0 0 1 2 3 0 0 4 5 module m (mm) 1 2 3 4 f (kHz) do = measuring distance for a gear wheel with module m = 2 mm. VCC = 12 V; module = 2 mm. Fig.16 Normalized maximum sensing distance as a function of gear wheel module. Fig.17 Sensing distance as a function of tooth frequency. 1996 Dec 05 9 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 The board net often contains a central load dump protection that makes such a device in the protection circuit of the sensor module unnecessary. EMC Figure 18 shows a recommended application circuit for automotive applications (wheel sensing ft < 5 kHz). It provides a protection interface to meet Electromagnetic Compatibility (EMC) standards and safeguard against voltage spikes. Table 1 lists the tests which are applicable to this circuit and the achieved class of functional status. Protection against ‘load dump’ (test pulse 5 according to “DIN 40839”) means a very high demand on the protection circuit and requires a suitable suppressor diode with sufficient energy absorption capability. Table 1 Tests for electrostatic discharge (ESD) were conducted in line with “IEC 801-2” to demonstrate the KMI15/1’s handling capabilities. The “IEC 801-2” test conditions were: C = 150 pF, R = 150 Ω, V = 2 kV. Electromagnetic disturbances with fields up to 150 V/m and f = 1 GHz (ref. “DIN 40839”) have no influence on performance. EMC test results EMC REF. DIN 40839 SYMBOL MIN. (V) MAX. (V) REMARKS CLASS Test pulse 1 VLD −100 − td = 2 ms C Test pulse 2 VLD − 100 td = 0.2 ms A Test pulse 3a VLD −150 − td = 0.1 µs A Test pulse 3b VLD − 100 td = 0.1 µs A Test pulse 4 VLD −7 − td = 130 ms B Test pulse 5 VLD − 120 td = 400 ms B D1 handbook, halfpage +V VCC 1N4001/3 BZTO3G36 −V D2 C1 100 nF RL 115 Ω SENSOR CL 100 nF MGD805 GND Fig.18 Test/application circuit for the KMI15/1. 1996 Dec 05 10 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 PACKAGE OUTLINE Package description SOT453B M1 v M A B HE1 K B A Q E A L1 M2 bp1 D L v M A B E1 M3 HE D1 L2 (+) (−) bp c 0 2.5 5 mm e scale DIMENSIONS (mm are the original dimensions) UNIT A bp bp1 c D(1) D1(1) E(1) E1(1) e HE HE1 K max. L L1 L2 M1 M2 M3 Q v mm 1.7 1.4 0.8 0.7 1.5 1.4 0.3 0.24 4.1 3.9 5.7 5.5 4.5 4.3 5.7 5.5 4.6 4.4 18.2 17.8 5.6 5.5 5.37 7.55 7.25 1.2 0.9 3.9 3.5 8.15 7.85 8.15 7.85 4.7 4.3 0.75 0.65 0.25 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-11-12 SOT453B 1996 Dec 05 EUROPEAN PROJECTION 11 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Dec 05 12 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 NOTES 1996 Dec 05 13 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 NOTES 1996 Dec 05 14 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI15/1 NOTES 1996 Dec 05 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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