TDA3663 Very low dropout voltage/quiescent current 3.3 V voltage regulator Rev. 05 — 13 June 2005 Product data sheet 1. General description The TDA3663 is a fixed 3.3 V voltage regulator with a very low dropout voltage and quiescent current, which operates over a wide supply voltage range. 2. Features ■ ■ ■ ■ ■ ■ Fixed 3.3 V, 100 mA regulator Supply voltage range up to 45 V Very low quiescent current of 15 µA (typical value) Very low dropout voltage High ripple rejection Protections: ◆ Reverse polarity safe (down to −25 V without high reverse current) ◆ Negative transient of 50 V (RS = 10 Ω, t < 100 ms) ◆ Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) ◆ ESD protection on all pins ◆ DC short-circuit safe to ground and VP of the regulator output ◆ Temperature protection (at Tj > 150 °C) 3. Quick reference data Table 1: Quick reference data Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VP supply voltage regulator operating 3 14.4 45 V Iq quiescent supply VP = 14.4 V; IREG = 0 mA current - 15 30 µA 8 V ≤ VP ≤ 22 V; IREG = 0.5 mA 3.16 3.3 3.44 V 6 V ≤ VP ≤ 45 V; IREG = 0.5 mA; 3.13 3.3 3.47 V 0.5 mA ≤ IREG ≤ 100 mA 3.13 3.3 3.47 V VP = 3.1 V; IREG = 50 mA; Tamb ≤ 85 °C - 0.18 0.3 V Supply [1] Voltage regulator VREG output voltage VREG(drop) dropout voltage [1] The regulator output will follow VP if VP < VREG + VREG(drop). TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 4. Ordering information Table 2: Ordering information Type number Package Name Description Version TDA3663 SO4 plastic small outline package; 4 leads; body width 3.5 mm SOT223-1 TDA3663AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 5. Block diagram VP 1 (8) 3 (1) REGULATOR REG BAND GAP TDA3663 (TDA3663AT) THERMAL PROTECTION 2, 4 (2, 3, 6, 7) mgs584 GND Pin numbers in parenthesis refer to TDA3663AT. Fig 1. Block diagram 6. Pinning information 6.1 Pinning VP 1 GND 2 REG 1 GND 2 TDA3663 4 GND 3 001aac941 Fig 2. Pin configuration for SO4 9397 750 15047 Product data sheet REG 8 VP 7 GND TDA3663AT GND 3 6 GND n.c. 4 5 n.c. 001aac942 Fig 3. Pin configuration for SO8 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 2 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 6.2 Pin description Table 3: Symbol Pin description Pin Description SO4 SO8 VP 1 8 supply voltage GND 2 and 4 2, 3, 6 and 8 ground [1] REG 3 1 regulator output n.c. - 4 and 5 not connected [1] For he SO8 package all GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a heat spreader. 7. Functional description The TDA3663 is a fixed 3.3 V regulator which can deliver output currents up to 100 mA. The regulator is available in SO8 and SO4 packages. The regulator is intended for portable, mains and telephone applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. The device remains operational down to very low supply voltages and below this voltage it switches off. A temperature protection circuit is included which switches off the regulator output at a junction temperature above 150 °C. 8. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VP supply voltage - 45 V VP(rp) reverse polarity supply voltage non-operating - −25 V Ptot total power dissipation TDA3663 temperature of copper area is 25 °C - 4.1 W TDA3663AT Tamb = 25 °C - 5 W Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +125 °C Tj junction temperature operating −40 +150 °C 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 3 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 9. Thermal characteristics Table 5: Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient Rth(j-c) Conditions Typ Unit SO4 in free air; soldered 100 K/W SO8 in free air; soldered 155 K/W SO4 to center pins; soldered 25 K/W SO8 to center pins; soldered 30 K/W thermal resistance from junction to case 10. Characteristics Table 6: Characteristics VP = 14.4 V; Tamb = 25 °C; measured with test circuit of Figure 15; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 3 14.4 45 V - 10 - µA Supply voltage: pin VP VP supply voltage regulator operating Iq quiescent supply current VP = 4.5 V; IREG = 0 mA [1] VP = 14.4 V; IREG = 0 mA - 15 30 µA 6 V ≤ VP ≤ 22 V; IREG = 10 mA - 0.2 0.5 mA 6 V ≤ VP ≤ 22 V; IREG = 50 mA - 1.4 2.5 mA Regulator output: pin REG VREG output voltage 8 V ≤ VP ≤ 22 V; IREG = 0.5 mA 3.16 3.3 3.44 V 0.5 mA ≤ IREG ≤ 100 mA 3.13 3.3 3.47 V 6 V ≤ VP ≤ 45 V; IREG = 0.5 mA 3.13 3.3 3.47 V VREG(drop) dropout voltage VP = 3.1 V; Tamb ≤ 85 °C; IREG = 50 mA - 0.18 0.3 V VREG(stab) output voltage long-term stability per 1000 h - 20 - mV ∆VREG(line) line input regulation voltage 7 V ≤ VP ≤ 22 V; IREG = 0.5 mA - 1 30 mV 7 V ≤ VP ≤ 45 V; IREG = 0.5 mA - 1 50 mV ∆VREG(load) load output regulation voltage 0.5 mA ≤ IREG ≤ 50 mA - 10 50 mV SVRR supply voltage ripple rejection fi = 120 Hz; Vi(ripple) = 1 V (RMS); IREG = 0.5 mA 50 60 - dB IREG(crl) output current limit VREG > 2.8 V 0.17 0.25 - A ILO(rp) output leakage current at reverse polarity VP = −15 V; VREG ≤ 0.3 V - 1 500 µA [1] The regulator output will follow VP if VP < VREG + VREG(drop). 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 4 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 11. Application information 11.1 Noise The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz (see Table 7). Table 7: Noise figures Output current IREG (mA) Noise figure (µV) C2 = 10 µF C2 = 47 µF C2 = 100 µF 0.5 550 320 300 50 650 400 400 11.2 Stability For stable operation: • The output capacitor ESR should not exceed 22 Ω (worst-case) • A minimum ESR may be required; see Table 8 • It is recommended not to use below 1 mA output current because of reduced phase margin • Use electrolytic capacitors for output capacity values of 1 µF and above Table 8: Minimum ESR values required IREG (mA) C2 = 100 nF C2 = 1 µF C2 = 10 µF C2 = 100 µF 1 >0Ω > 1.5 Ω >0Ω >0Ω 5 >0Ω >0Ω >0Ω >0Ω 10 >0Ω >0Ω >0Ω >0Ω 100 >0Ω >0Ω >0Ω >0Ω 11.3 Application circuits The maximum output current of the regulator equals: 150 – T amb 150 – T amb I REG ( max ) = --------------------------------------------------------- = ---------------------------------------- ( mA ) 100 × ( V P – 3.3 ) R th ( j – a ) × ( V P – V REG ) When Tamb = 21 °C and VP = 14 V the maximum output current equals 116 mA. The total thermal resistance of the TDA3663 can be decreased from 155 K/W to 30 K/W for the SO8 version. For the SO4 version it can be decreased from 100 K/W to 25 K/W when GND pins 2 and 4 of the package are soldered to the printed-circuit board. 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 5 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 11.3.1 Application circuit with backup function Sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even −1 V). This function can easily be built with the TDA3663 by using an output capacitor with a large value. When the supply voltage is 0 V (or −1 V), only a small current will flow into pin REG from this output capacitor (a few µA). The application circuit is given in Figure 4. VP 1 VREG = 3.3 V 3 C1(1) 1 µF C2(2) TDA3663 2, 4 mgs587 (1) C1 is optional (to minimize supply noise only). (2) C2 ≤ 4700 µF. Fig 4. Application circuit with backup function (SO4 version) 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 6 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 11.4 Additional application information This section gives typical curves for various parameters measured on the TDA3663AT. Standard test conditions are: VP = 14.4 V; Tamb = 25 °C. mda947 25 mda949 4 Iq (µA) Iq (mA) 20 3 15 2 10 1 5 0 0 10 20 VP (V) 30 0 0 10 20 40 30 VP (V) 50 IREG = 0 mA. Fig 5. Quiescent current as a function of the supply voltage mda948 0.48 Iq (mA) Fig 6. Quiescent current increase as a function of the high supply voltage mda950 2 Iq (mA) 0.44 1.8 0.40 1.6 0.36 1.4 5 10 15 20 VP (V) 25 IREG = 10 mA. 5 15 20 VP (V) 25 IREG = 50 mA. Fig 7. Quiescent current as a function of the supply voltage Fig 8. Quiescent current as a function of the supply voltage 9397 750 15047 Product data sheet 10 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 7 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator mda951 2 mda952 4 Iq (mA) (1) Iq (mA) 1.5 3 1 2 0.5 1 (2) 0 −40 0 40 80 120 160 Tj (°C) 0 0 20 40 80 100 IREG (mA) 60 (1) Iq at 50 mA load. (2) Iq at 10 mA load. Fig 9. Quiescent current as a function of the junction temperature Fig 10. Quiescent current as a function of the output current mgs695 4 VREG VREG(drop) (mV) (V) 3 400 2 300 1 200 0 −50 mda957 500 0 50 100 150 200 Tj (°C) 100 0 40 80 IREG (mA) 120 IREG = 0 mA. Fig 11. Output voltage thermal protection as a function of the junction temperature Fig 12. Dropout voltage as a function of the output current 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 8 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator mgs696 4 mda956 −30 VREG (1) SVRR (dB) (V) 3 −40 2 −50 (2) (3) (1) −60 1 (2) −70 10 0 0 200 100 300 (3) 102 103 IREG (mA) 104 f (Hz) 105 IREG = 10 mA; C2 = 10 µF. VP = 8 V and pulsed load. (1) SVRR at RL = 100 Ω. (2) SVRR at RL = 500 Ω. (3) SVRR at RL = 10 kΩ. Fig 13. Fold back protection mode Fig 14. Supply voltage ripple rejection as a function of the ripple frequency 12. Test information 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. 12.2 Test circuit VP 1 VREG = 3.3 V 3 C1(1) 1 µF C2 10 µF TDA3663 2, 4 mgs586 (1) C1 is optional (to minimize supply noise only). Fig 15. Test circuit (SO4) 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 9 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 13. Package outline SO4: plastic small outline package; 4 leads; body width 3.5 mm SOT223-1 D E A X c y HE v M A b1 4 Q A A2 (A3) A1 1 2 L bp e Z θ Lp 3 w M detail X e1 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp b1 c mm 1.8 0.10 0.02 1.7 1.5 0.25 0.85 0.65 3.15 2.95 0.35 0.25 (1) (1) D E 6.7 6.3 3.7 3.3 e e1 HE L Lp Q v w y Z θ 2.3 4.6 7.3 6.7 1.75 1.02 0.62 1.0 0.8 0.2 0.1 0.1 1.2 0.7 10° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT223-1 JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-15 03-02-19 TO-261 Fig 16. Package outline SOT223-1 (SO4) 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 10 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 17. Package outline SOT96-1 (SO8) 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 11 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 12 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 14.5 Package related soldering information Table 9: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 15047 Product data sheet not suitable © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 13 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 14 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 15. Revision history Table 10: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes TDA3663_5 20050613 Product data - TDA3663_4 Modifications: 9397 750 15047 • The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • • • • Section 1 “General description”: Removed automotive reference • • Section 11.2 “Stability”: Removed two figures and examples; added a new stability description Section 2 “Features”: Removed stability capacitor values and pin compatible products Section 3 “Quick reference data”: Added VP = 3.1 V to the VREG(drop) conditions Section 7 “Functional description”: Removed automotive reference and details on stability capacitors Section 11.4 “Additional application information”: Changed Figure 13 and removed former Figure 14 TDA3663_4 20001214 Product specification - 9397 750 07864 TDA3663_3 TDA3663_3 20001208 Preliminary specification - 9397 750 07555 TDA3663_2 TDA3663_2 20000201 Preliminary specification - 9397 750 06798 TDA3663_1 TDA3663_1 19990929 Preliminary specification - 9397 750 06068 - 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 15 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 19. Trademarks 18. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 15047 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 05 — 13 June 2005 16 of 17 TDA3663 Philips Semiconductors Very low dropout voltage/quiescent current 3.3 V voltage regulator 21. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 11.1 11.2 11.3 11.3.1 11.4 12 12.1 12.2 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application circuits . . . . . . . . . . . . . . . . . . . . . . 5 Application circuit with backup function . . . . . . 6 Additional application information . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 16 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 13 June 2005 Document number: 9397 750 15047 Published in The Netherlands