PTN3341 High speed differential line driver Rev. 01 — 6 August 2002 Product data 1. Description The PTN3341 is a differential line driver that implements the electrical characteristics of Low-Voltage Differential Signaling (LVDS) that meets or exceeds the requirements of the ANSI TIA/EIA-644 Standard. LVDS is used to achieve higher data rates on commonly used media. LVDS overcomes the limitations of achievable slew rates and EMI restrictions of previous differential signaling techniques. The PTN3341 operates at 3.3 volt supply levels and current mode output drivers. The output drivers will deliver a minimum of 250 mV into a 50 Ω load when enabled. The intended application of this device is for point to point baseband transmission rates over a controlled impedance media of approximately 100 Ω. The maximum rates and distance of data transfer are dependent upon the attenuation characteristics of the media selected and the noise coupling to the environment. The PTN3341 is designed to function over the full industrial temperature range of −40 °C to +85 °C. 2. Features ■ Meets or exceeds the requirements of ANSI TIA/EIA-644 Standard ■ Low-Voltage Differential Signaling with output voltage of 350 mV across a 50 Ω load or 700 mV across a 100 Ω load ■ 200 ps maximum channel-to-channel output skew ■ 600 ps typical output voltage rise and fall times ■ Driver at high impedance when disabled or with VCC = 0 V ■ 5 volt tolerant inputs with Low Voltage TTL (LVTTL) logic input levels ■ Pin-compatible with AM26LS31, SN65LVDS31, SN65LVDM31 and PTN3331. 3. Applications ■ Low voltage, low EMI, high speed differential signaling ■ Point-to-point high speed data transmission ■ High performance switches and routers. PTN3341 Philips Semiconductors High speed differential line driver 4. Ordering information Table 1: Ordering information Type number Package Name Description Version PTN3341DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 PTN3341D SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 5. Functional diagram PTN3341 G G 4 12 2 1A 1 LVDS 3 6 2A 7 LVDS 5 10 3A 9 LVDS 11 14 4A 15 LVDS 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z 002aaa077 Fig 1. Functional diagram. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 2 of 14 PTN3341 Philips Semiconductors High speed differential line driver 6. Pinning information 6.1 Pinning 16 VCC 1A 1 16 VCC 1Y 2 15 4A 1Y 2 15 4A 1Z 3 14 4Y 1Z 3 14 4Y G 4 13 4Z G 4 2Z 5 12 G 2Z 5 2Y 6 11 3Z 2Y 6 11 3Z 2A 7 10 3Y 2A 7 10 3Y GND 8 9 3A GND 8 9 PTN3341D 1 PTN3341DH 1A 13 4Z 12 G 3A 002aaa079 002aaa078 Fig 2. TSSOP16 pin configuration. Fig 3. SO16 pin configuration. 6.2 Pin description Table 2: Pin description Symbol Pin Description 1A 1 LVTTL input 1Y 2 LVDS non-inverting output 1Z 3 LVDS inverting output G 4 Enable (active-HIGH) 2Z 5 LVDS inverting output 2Y 6 LVDS non-inverting output 2A 7 LVTTL input GND 8 Ground 3A 9 LVTTL input 3Y 10 LVDS non-inverting output 3Z 11 LVDS inverting output G 12 Enable (active-LOW) 4Z 13 LVDS inverting output 4Y 14 LVDS non-inverting output 4A 15 LVTTL input VCC 16 Supply © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 3 of 14 PTN3341 Philips Semiconductors High speed differential line driver 7. Functional description 7.1 Function table Table 3: Function table H = HIGH level; L = LOW level; X = irrelevant; Z = high impedance. Input Enables Outputs A G G Y Z H H X H L L H X L H H X L H L L X L L H X L H Z Z Open H X L H Open X L L H 8. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VCC supply voltage −0.5 4.0 V VI input voltage −0.5 6 V short circuit duration Continuous sec Tamb operating ambient temperature range −40 +85 °C Tj operating junction temperature −40 +150 °C Tstg storage temperature range −65 +150 °C ESD >2 - kV [1] Values beyond absolute maximum ratings can cause the device to be prematurely damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. 9. Recommended operating conditions Table 5: Recommended operating conditions Symbol Parameter Min Nom Max Unit VCC supply voltage 3 3.3 3.6 V VIH HIGH-level input voltage 2 - - V VIL LOW-level input voltage - - 0.8 V © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 4 of 14 PTN3341 Philips Semiconductors High speed differential line driver 10. Static characteristics Table 6: DC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol Parameter Conditions Min Typ [1] Max Unit VOD differential output voltage RL = 100 Ω See Figure 4. 480 700 860 mV RL = 50 Ω See Figure 4. 250 350 430 mV See Figure 4. −25 0 +25 mV ∆VOD change in differential voltage magnitude between logic states VOC(SS) Steady-state common-mode output voltage 1.0 1.2 1.5 V ∆VOC(SS) Change in steady-state common-mode output voltage between logic states −30 - +30 mV VOC(PP) Peak-to-peak common-mode output voltage - 70 100 mV ICC Supply current VI = 0.8 or 2 V; enabled, no load - 14 20 mA VI = 0.8 or 2 V; enabled, RL = 100 Ω − 35 40 mA VI = 0.8 or 2 V; enabled, RL = 50 Ω - 34 45 mA VI = 0 V or VCC; disabled - 0.5 0.7 mA µA IIH HIGH-level input current VIH = 3 V - 3 10 IIL LOW-level input current VIL = 0 V - 0.1 10 µA IOS Output short circuit current VO(Y) or VO(Z) = 0 V - 13 20 mA VOD = 0 V - 13 20 mA IOZ High-impedance output current VOD = 0 V −1 - +1 µA IO(OFF) Power-off output current VCC = 0 V; VO = 2.4 V −1 - +1 µA Ci Input capacitance - 3 - pF [1] All typical values are at Tamb = 25 °C and VCC = 3.3 V. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 5 of 14 PTN3341 Philips Semiconductors High speed differential line driver 11. Dynamic characteristics Table 7: AC switching characteristics Over recommended operating conditions, unless otherwise noted. All parameters are with RL = 100 Ω, CL = 10 pF, unless otherwise noted. Symbol Parameter Conditions Min Typ [1] Max Unit tPLH Propagation delay, LOW-to-HIGH level output 1.8 2.3 2.9 ns tPHL Propagation delay, HIGH-to-LOW level output RL = 100 Ω; CL = 10 pF See Figure 5. 1.8 2.3 2.9 ns tr Differential output rise time (20 to 80%) [2] 0.4 0.6 1.0 ns tf Differential output fall time (80 to 20%) [2] tsk(p) Pulse skew (tPHL − tPLH) tsk(o) Channel-to-channel output skew tsk(p-p) Part-to-part skew tPZH Propagation delay, high-impedance to HIGH-level output tPZL 0.4 0.6 1.0 ns - 0.05 - ns [2], [3] - 0 0.2 ns [2], [4] - - 1 ns - 6 15 ns Propagation delay, high-impedance to LOW-level output - 6 15 ns tPHZ Propagation delay, HIGH-level to high-impedance output - 6 15 ns tPLZ Propagation delay, LOW-level to high-impedance output - 6 15 ns [1] [2] [3] [4] See Figure 6. All typical values are at Tamb = 25 °C, and VCC = 3.3 V. Guaranteed by design and characterization. tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. tsk(p-p) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, same temperature, and have identical packages and test circuits. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 6 of 14 PTN3341 Philips Semiconductors High speed differential line driver 12. Test figures Y A R 100 Ω ±1% LVDS Z CL 10 pF VOD CL 10 pF A VOC VOC(PP) VOC(SS) Y A R = 49.9 Ω ±1% (2 PLACES) LVDS Z CL 10 pF CL 10 pF VOC 002aaa019 Fig 4. Test circuit and voltage definitions. 2V 1.4 V A INPUT 0.8 V tPHL tPLH 100% 80% VOD 20% 0% tf tr 002aaa020 Fig 5. Propagation delay definitions. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 7 of 14 PTN3341 Philips Semiconductors High speed differential line driver 2V G 1.4 V 0.8 V 2V 1.4 V G 0.8 V tPHZ tPZH 100%, ∼1.4 V 50% 0%, 1.2 V tPZL tPLZ 100%, 1.2 V 50% 0%, ∼1 V 002aaa021 Fig 6. Enable and disable time definitions. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 8 of 14 PTN3341 Philips Semiconductors High speed differential line driver 13. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 MO-153 Fig 7. TSSOP16 package outline (SOT403-1). © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 9 of 14 PTN3341 Philips Semiconductors High speed differential line driver SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.244 0.050 0.041 0.228 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ o 8 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 Fig 8. SO16 package outline (SOT109-1). © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 10 of 14 PTN3341 Philips Semiconductors High speed differential line driver 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C small/thin packages. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 11 of 14 PTN3341 Philips Semiconductors High speed differential line driver During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 14.5 Package related soldering information Table 8: Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method Reflow[2] Wave BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[3] suitable PLCC[4], SO, SOJ suitable suitable recommended[4][5] LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended[6] [1] [2] [3] [4] [5] [6] suitable suitable For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 15. Revision history Table 9: Revision history Rev Date 01 20020806 CPCN Description - Product data; initial version. Engineering Change Notice 853-2363 28702. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Product data Rev. 01 — 6 August 2002 12 of 14 PTN3341 Philips Semiconductors High speed differential line driver 16. Data sheet status Data sheet status[1] Product status[2] Definition Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 17. Definitions 18. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 08483 Rev. 01 — 6 August 2002 13 of 14 Philips Semiconductors PTN3341 High speed differential line driver Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Test figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12 Package related soldering information . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 © Koninklijke Philips Electronics N.V. 2002. Printed in the U.S.A All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 6 August 2002 Document order number: 9397 750 08483