TDA6107AJF Triple video output amplifier Rev. 02 — 28 April 2005 Product data sheet 1. General description The TDA6107AJF contains three video output amplifiers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. To obtain maximum performance, the amplifier should be used with black-current control. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p) High slew rate of 900 V/µs No external components required Very simple application Single supply voltage of 200 V Internal reference voltage of 2.5 V Fixed gain of 81 Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and current window from +100 µA to −10 mA ■ Thermal protection ■ Internal protection against positive flashover discharges appearing on the CRT 3. Ordering information Table 1: Ordering information Type number TDA6107AJF Package Name Description Version DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 TDA6107AJF Philips Semiconductors Triple video output amplifier 4. Block diagram VDD 6 MIRROR 5 MIRROR 1 TDA6107AJF CASCODE 1 3× MIRROR 4 CURRENT SOURCE 9, 8, 7 1× Voc(1), Voc(2), Voc(3) 1× THERMAL PROTECTION CIRCUIT Vi(1), Vi(2), Vi(3) 1, 2, 3 Rf VIP REFERENCE DIFFERENTIAL STAGE 5 MIRROR 3 Ri Iom Ra 3× CASCODE 2 MIRROR 2 4 mce457 Fig 1. Block diagram (one amplifier shown) 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 2 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 5. Pinning information 5.1 Pinning Vi(1) 1 Vi(2) 2 Vi(3) 3 GND 4 Iom 5 VDD 6 Voc(3) 7 Voc(2) 8 Voc(1) 9 TDA6107AJF 001aac587 Fig 2. Pin configuration 5.2 Pin description Table 2: Pin description Symbol Pin Description Vi(1) 1 inverting input 1 Vi(2) 2 inverting input 2 Vi(3) 3 inverting input 3 GND 4 ground (fin) Iom 5 black-current measurement output VDD 6 supply voltage Voc(3) 7 cathode output 3 Voc(2) 8 cathode output 2 Voc(1) 9 cathode output 1 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 3 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 6. Internal circuitry to cascode stage GND VDD 4 6 to black-current measurement circuit TDA6107AJF 1, 2, 3 (1) esd from input circuit flash 7, 8, 9 esd esd to black-current measurement circuit from input circuit from control circuit 5 esd 6.8 V Vbias from blackcurrent measurement circuit from control circuit esd esd to black-current measurement circuit to black-current measurement circuit mce458 (1) All pins have an energy protection for positive or negative overstress situations. Fig 3. Internal pin configuration 7. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specified in Figure 9; unless otherwise specified. Symbol Parameter Min Max Unit VDD supply voltage Conditions 0 250 V Vi input voltage at pins Vi(1), Vi(2) and Vi(3) 0 12 V Vom measurement output voltage 0 6 V |Iom(mean)| absolute value of mean current of measurement output (for three channels) - 5.6 mA Voc cathode output voltage 0 VDD V Tstg storage temperature −55 +150 °C Tj junction temperature Vesd electrostatic discharge voltage Voc = 0 V to VDD; Vom = 1.8 V to 6 V −20 +150 °C Human Body Model (HBM) - ±3000 V Machine Model (MM) - ±300 V 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 4 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 8. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient in free air Rth(j-fin) [1] Conditions [1] thermal resistance from junction to fin Typ Unit 56 K/W 11 K/W An external heatsink is necessary; see Application Note AN10227-01. mbh989 8 Ptot (W) (1) 6 4 (2) 2 0 −40 0 40 80 120 160 Tamb (°C) (1) Infinite heatsink. (2) No heatsink. Fig 4. Power derating curves 8.1 Thermal protection The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130 °C and 30 % decrease at 145 °C (typical values on the spot of the thermal protection circuit). outputs 5 K/W thermal protection circuit 6 K/W fin mgk279 Fig 5. Equivalent thermal resistance network 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 5 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 9. Characteristics Table 5: Characteristics Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Min Typ Max Unit Iq quiescent supply current Conditions 5.6 6 7.6 mA Vref(int) internal reference voltage (input stage) - 2.5 - V kΩ Ri input resistance - 2.1 - G gain of amplifier 73 81 89 ∆G gain difference −4.2 0 +4.2 - 55 - dB - −50 - dB µA PSRR power supply rejection ratio αct(DC) DC crosstalk between channels f < 50 kHz [1] Measurement output pin Iom; Voc = Voc(min) to Voc(max) Iom(offset) offset current of measurement output (for three channels) Ioc = 0 µA; Vom = 1.8 V to 6 V −50 - +50 ∆Iom/∆Ioc linearity of current transfer (for three channels) Ioc = −100 µA to +100 µA; Vom = 1.8 V to 6 V −0.9 −1.0 −1.1 Ioc = −100 µA to +10 mA; Vom = 1.8 V to 4 V −0.9 −1.0 −1.1 Output pins Voc(1), Voc(2), Voc(3) Voc(DC) DC output voltage Ii = 0 µA 76 87 97 V ∆Voc(DC)(offset) differential DC output offset Ii = 0 µA voltage between two output pins −5 0 +5 V ∆Voc(T) output voltage temperature drift - 10 - mV/K ∆Voc(T)(offset) differential output offset voltage temperature drift between two output pins - 0 - mV/K Ioc(max) maximum peak output current Voc = 50 V to VDD − 50 V - 20 - mA Voc(min) minimum output voltage Vi = 4.5 V; at Ioc = 0 mA [2] - - 10 V [2] VDD − 15 - - V - 5.5 - MHz Voc(max) maximum output voltage Vi = 0.5 V; at Ioc = 0 mA BS small signal bandwidth Voc = 60 V (p-p) BL large signal bandwidth Voc = 100 V (p-p) - 4.5 - MHz tco(p) cathode output propagation time Voc = 100 V (p-p) square 50 % input to 50 % output wave [3] - 60 - ns ∆tco(p) difference in cathode output propagation time 50 % input to 50 % output (between two output pins) Voc = 100 V (p-p) square wave [3] −10 0 +10 ns toc(r) cathode output rise time 10 % output to 90 % output Voc = 50 V to 150 V square wave [3] 67 91 113 ns toc(f) cathode output fall time 90 % output to 10 % output Voc = 150 V to 50 V square wave [3] 67 91 113 ns 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 6 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier Table 5: Characteristics …continued Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - - 350 ns tst settling time input (50 %) to output (99 % to 101 %) Voc = 100 V (p-p) square wave [3] SR slew rate between 50 V to VDD − 50 V Vi = 2.5 V (p-p) square wave [3] - 900 - V/µs Ov cathode output voltage overshoot Voc = 100 V (p-p) square wave [3] - 2 - % [1] The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. [2] See Figure 6 for the typical DC-to-DC transfer of Vi to Voc. [3] f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8. mce455 200 Voc (V) 160 120 80 40 0 0 1 2 3 4 Vi (V) Fig 6. Typical DC-to-DC transfer of Vi to Voc 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 7 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 2.96 Vi (V) 2.34 t 1.73 tst Ov (in %) 151 150 140 149 Voc (V) 100 60 50 t toc(r) tco(p) mce477 Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 8 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 2.96 Vi (V) 2.34 t 1.73 tst 150 140 Voc (V) 100 Ov (in %) 51 60 50 49 t toc(f) tco(p) mce476 Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC input signal 10. Application information 10.1 Cathode output The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash) of 3 A maximum with a charge content of 100 µC. External protection against higher currents is described in Application note AN10227-01. The cathode is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 6 A maximum with a charge content of 100 nC. External protection against higher currents is described in Application note AN10227-01. The DC voltage of pin VDD must be within the operating range of 180 V to 210 V during the peak currents. 10.2 Flashover protection The TDA6107AJF incorporates protection diodes against CRT flashover discharges that clamp the cathodes output voltage up to a maximum of VDD + Vd. 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 9 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier To limit the diode current an external 1.5 kΩ carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB). VDD must be decoupled to GND: 1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDD and GND and must be within 5 mm. 2. With a capacitor > 3.3 µF on the picture tube base print, depending on the CRT size. 10.3 Switch-off behavior The switch-off behavior of the TDA6107AJF is controllable. This is because the output pins of the TDA6107AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher). 10.4 Bandwidth The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times. 10.5 Dissipation A distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6107AJF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: Pstat = VDD × IDD + 3 × Voc × Ioc Where: VDD = supply voltage IDD = supply current Voc = DC value of cathode output voltage Ioc = DC value of cathode output current The dynamic dissipation Pdyn equals: Pdyn = 3 × VDD × (CL + Cint) × fi × Voc(p-p) × δ Where: CL = load capacitance Cint = internal load capacitance (≈4 pF) fi = input frequency Voc(p-p) = cathode output voltage (peak-to-peak value) δ = non-blanking duty cycle The TDA6107AJF must be mounted on the picture tube base print to minimize the load capacitance. 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 10 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 11. Test information VDD J1 C1 22 µF 6 Rf Vi(1) 1 Ri C7 20 nF Vof C2 9 1 Ra Voc(1) C10 6.8 pF Iom 22 nF C8 10 µF R1 2 MΩ C9 3.2 pF J2 C3 22 µF Rf Vi(2) 2 Ri Vof C4 8 2 Ra C11 136 pF R2 100 kΩ C13 6.8 pF R3 2 MΩ C14 136 pF R4 100 kΩ C16 6.8 pF R5 2 MΩ C17 136 pF R6 100 kΩ Voc(2) Iom 22 nF probe 1 C12 3.2 pF J3 C5 22 µF Rf Vi(3) 3 Ri Vof C6 7 3 probe 2 Voc(3) Ra 22 nF C15 3.2 pF VIP REFERENCE 5 probe 3 Iom TDA6107AJF Vom 4 4V GND mce459 Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V. Fig 9. Test circuit 11.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 11 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 12. Package outline DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 D D1 A2 q P P1 Q A3 q2 q1 A seating plane A4 E pin 1 index c L 1 9 e2 b e Z b2 0 θ w M b1 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mm 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20 L P P1 3.9 3.4 2.75 2.50 3.4 3.2 Q q 1.75 15.1 1.55 14.9 q1 q2 w Z (1) max. θ 4.4 4.2 5.9 5.7 0.25 1 65o o 55 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-03-11 03-03-12 SOT111-1 Fig 10. Package outline SOT 111-1 (DBS9MPF) 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 12 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 13. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 14. Soldering 14.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 14.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. 14.4 Package related soldering information Table 6: Suitability of through-hole mount IC packages for dipping and wave soldering methods Package Soldering method Dipping Wave CPGA, HCPGA − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable [1] PMFP [2] − not suitable [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 13 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 15. Revision history Table 7: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes TDA6107AJF_2 20050428 Product data sheet - TDA6107AJF_1 Modifications: TDA6107AJF_1 • The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Changed data sheet status to product data sheet 20030919 Preliminary specification - 9397 750 14728 Product data sheet 9397 750 14728 9397 750 11632 - © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 14 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions 18. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 19. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 14728 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 28 April 2005 15 of 16 TDA6107AJF Philips Semiconductors Triple video output amplifier 20. Contents 1 2 3 4 5 5.1 5.2 6 7 8 8.1 9 10 10.1 10.2 10.3 10.4 10.5 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 9 Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9 Flashover protection . . . . . . . . . . . . . . . . . . . . . 9 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Quality information . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering by dipping or by solder wave . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 28 April 2005 Document number: 9397 750 14728 Published in The Netherlands